CN104482500A - LED (Light Emitting Diode) lamp of small size - Google Patents
LED (Light Emitting Diode) lamp of small size Download PDFInfo
- Publication number
- CN104482500A CN104482500A CN201410801199.8A CN201410801199A CN104482500A CN 104482500 A CN104482500 A CN 104482500A CN 201410801199 A CN201410801199 A CN 201410801199A CN 104482500 A CN104482500 A CN 104482500A
- Authority
- CN
- China
- Prior art keywords
- led
- epoxy resin
- small size
- resin layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED (Light Emitting Diode) lamp of a small size. The LED lamp of small size comprises a translucent protective film as the outermost layer, a luminous coating layer as the middle layer and an epoxy resin layer as the lowermost layer, wherein the translucent protective film, the luminous coating layer and the epoxy resin layer are adhered together in sequence; the thickness of the translucent protective film is 2 mm; the thickness of the luminous coating layer is 1 mm; the thickness proportion of the translucent protective film, the luminous coating layer and the epoxy resin layer is 1:1:1. The LED lamp of small size has the advantages of small size, low power consumption and long service life.
Description
Technical field
The present invention relates to the LED that a kind of volume is little.
Background technology
LED(Light Emitting Diode), light emitting diode is a kind of can be the solid-state semiconductor devices of visible ray by electric energy conversion, and it directly can be converted into light electricity.The heart of LED is the wafer of a semiconductor, and one end of wafer is attached on a support, and one end is negative pole, and the other end connects the positive pole of power supply, makes whole wafer by epoxy encapsulation.Semiconductor wafer is made up of two parts, and a part is P-type semiconductor, and inside it, occupy an leading position in hole, and the other end is N-type semiconductor, at this side mainly electronics.But time these two kinds of semiconductors couple together, between them, just form a P-N junction.When electric current acts on this wafer by wire time, electronics will be pushed to P district, and in P district, electronics is with hole-recombination, then will send energy with the form of photon, the principle of LED luminescence that Here it is.And the wavelength of light i.e. the color of light, be determined by the material forming P-N junction.
Initial LED is used as the instruction light source of instrument and meter, and various photochromic LED was widely applied in traffic lights and large-area displays screen afterwards, created good economic benefit and social benefit.For the red traffic light of 12 inches, be adopt the long-life originally in the U.S., 140 watts of incandescent lamps of low luminous efficacy are as light source, and it produces the white light of 2000 lumens.After Red lightscreening plate, light loss 90%, the only ruddiness of remaining 200 lumens.And in newly-designed lamp, Lumileds company have employed 18 red LED light source, comprise circuit loss, power consumption 14 watts altogether, can produce same light efficiency.Automobile signal light is also the key areas of LED light source application.
For general illumination, people more need the light source of white.The LED emitted white light for 1998 succeeds in developing.GaN chip and yttrium-aluminium-garnet (YAG) are packaged together to make by this LED.GaN chip blue light-emitting (λ p=465nm, Wd=30nm), the YAG fluorescent powder containing Ce3+ that high temperature sintering is made sends sodium yellow after being subject to this blue-light excited and penetrates, peak value 550nLED lamp m.Blue-ray LED substrate is arranged in bowl-type reflection cavity, covers the thin resin layer being mixed with YAG, about 200-500nm.The blue light components that LED substrate sends is absorbed by fluorescent material, the yellow light mix that another part blue light and fluorescent material send, and can obtain obtaining white light.For InGaN/YAG White LED, by changing the chemical composition of YAG fluorescent powder and regulating the thickness of phosphor powder layer, the assorted white light of colour temperature 3500-10000K can be obtained.This method being obtained white light by blue-ray LED, simple structure, with low cost, technology maturity is high, therefore uses at most.
Summary of the invention
The invention provides and a kind of there is the LED that volume is little, power consumption is low and the volume of long service life advantage is little.
Technical scheme of the present invention is: the LED that a kind of volume is little; the LED that described volume is little comprises outermost light transmission protecting film, the noctilucent coating in intermediate layer and undermost epoxy resin layer; described light transmission protecting film, noctilucent coating and epoxy resin layer stick together successively; the thickness of described light transmission protecting film is 2mm; the thickness of described noctilucent coating is 1mm, and the thickness proportion of described light transmission protecting film, noctilucent coating and epoxy resin layer is 1:1:1.
In a preferred embodiment of the present invention, described epoxy resin layer is thermoplastic resin.
In a preferred embodiment of the present invention, described light transmission protecting film is high density polyethylene (HDPE) diaphragm.
The LED that a kind of volume of the present invention is little, has that volume is little, power consumption is low and the advantage of long service life.
Accompanying drawing explanation
Accompanying drawing 1 is the perspective view of LED one preferred embodiment that volume of the present invention is little.
In accompanying drawing, the mark of each parts is as follows: 1, the superiors, and 2, intermediate layer, 3, orlop.
Detailed description of the invention
Be described in detail below in conjunction with the preferred embodiment of accompanying drawing to invention, can be easier to make advantages and features of the invention be readily appreciated by one skilled in the art, thus more explicit defining is made to protection scope of the present invention.
Wherein, the LED that described volume is little comprises the epoxy resin layer of the light transmission protecting film of outermost layer 1, the noctilucent coating in intermediate layer 2 and orlop 3; described light transmission protecting film, noctilucent coating and epoxy resin layer stick together successively; the thickness of described light transmission protecting film is 2mm; the thickness of described noctilucent coating is 1mm; the thickness proportion of described light transmission protecting film, noctilucent coating and epoxy resin layer is 1:1:1; described epoxy resin layer is thermoplastic resin, and described light transmission protecting film is high density polyethylene (HDPE) diaphragm.
Further illustrate, the maximum advantage of high density polyethylene (HDPE) diaphragm be protected product in production and processing, transport; storage and use procedure in not contaminated, corrosion, scuffing; protect original bright and clean glossy surface, thus improve quality and the market competitiveness of product.For 1. hardware industries: computer chassis, galvanized sheet punching press, aluminium sheet, corrosion resistant plate, titanium plate, plastic-steel board, glass plate, solar panel etc.2. photovoltaic industry: LCD liquid crystal display, backlight, cold light film, thin film switch, mobile phone screen etc.3. plastic cement industry: ABS, PP injection-molded item, PVC board, acrylic board, instrument, plastic lens, part surface protection etc. of spraying paint.4. printing industry: PVC, PC plate, aluminium sheet, the printing such as film inscription plate surface protection etc.5. wires and cables industry: the protection of axle dress copper cash, semi-finished product, finished product, clot finished product, effectively can prevent contamination by dust, has anti-oxidation, anti-dirty effect.6. electron trade, when production, generally all will use the finished product and semi-finished product protecting and do, streamline is not easy occur scratching and breaking.7. mobile phone digital industry, sticking film for mobile phone, also known as mobile phone cosmetic membrane, safeguard film for cellular phone, is the cold pellicle of one that can be used for dress table handset, screen.The surface of high density polyethylene (HDPE) diaphragm to protected material is inertia.High density polyethylene (HDPE) diaphragm has good adhesion property to protected material, and in materials handling and process, diaphragm can not warp, come off; High density polyethylene (HDPE) diaphragm has good weatherability and hold tack stability, not significantly, being easy to throw off, when throwing off, protected surface not having cull to retain through a few days or subsides peeling force growth for a long time, without staying.
Further illustrating, epoxy resin has secondary hydroxyl and epoxy radicals, secondary hydroxyl can with isocyanate reaction.Epoxy resin directly adds in the component of adhesive for polyurethane hydroxyl as polyalcohol, and use the method to only have hydroxyl to participate in reaction, epoxy radicals fails to react.With acidic resins, carboxyl, make epoxy addition, then with the isocyanate reaction in adhesive for polyurethane.Can also be dissolved in ethyl acetate by epoxy resin, add phosphoric acid and to heat reaction, its addition product adds in adhesive for polyurethane; The first of glue sticks; Heat-resisting and hydrolytic stability etc. can improve 0 r also available hydramine or amine reaction generation polyalcohol, has the existence of tertiary N atom, can accelerate NCO reaction in addition product.Combine the advantage of polyurethane and epoxy resin with epoxy resin as polyhydroxy component, have good adhesive strength and chemical-resistance, the epoxy resin manufacturing adhesive for polyurethane use generally adopts the kinds such as EP-12, EP-13, EP-16 and EP-20.The invention provides the LED that a kind of volume is little, have that volume is little, power consumption is low and the advantage of long service life.
The specific embodiment of the present invention; but protection scope of the present invention is not limited thereto; any those of ordinary skill in the art are in the technical scope disclosed by the present invention, and the change can expected without creative work or replacement, all should be encompassed within protection scope of the present invention.Therefore, the protection domain that protection scope of the present invention should limit with claims is as the criterion.
Claims (3)
1. the LED that a volume is little; it is characterized in that: the LED that described volume is little comprises outermost light transmission protecting film, the noctilucent coating in intermediate layer and undermost epoxy resin layer; described light transmission protecting film, noctilucent coating and epoxy resin layer stick together successively; the thickness of described light transmission protecting film is 2mm; the thickness of described noctilucent coating is 1mm, and the thickness proportion of described light transmission protecting film, noctilucent coating and epoxy resin layer is 1:1:1.
2. the LED that volume according to claim 1 is little, is characterized in that: described epoxy resin layer is thermoplastic resin.
3. the LED that volume according to claim 1 is little, is characterized in that: described light transmission protecting film is high density polyethylene (HDPE) diaphragm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410801199.8A CN104482500A (en) | 2014-12-22 | 2014-12-22 | LED (Light Emitting Diode) lamp of small size |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410801199.8A CN104482500A (en) | 2014-12-22 | 2014-12-22 | LED (Light Emitting Diode) lamp of small size |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104482500A true CN104482500A (en) | 2015-04-01 |
Family
ID=52757072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410801199.8A Pending CN104482500A (en) | 2014-12-22 | 2014-12-22 | LED (Light Emitting Diode) lamp of small size |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104482500A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109400074A (en) * | 2018-12-20 | 2019-03-01 | 石家庄市矿区宏源混凝土搅拌有限公司 | A kind of energy conservation anti-crack concrete |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080000580U (en) * | 2006-10-17 | 2008-04-22 | 익스플로잇 테크놀로지 컴퍼니 리미티드 | Light Emission and Diffusion Element |
| CN101294364A (en) * | 2007-04-29 | 2008-10-29 | 林原 | Structure of fluorescent adhesive paper and producing method thereof |
| CN203859114U (en) * | 2013-12-31 | 2014-10-01 | 厦门乾照光电股份有限公司 | LED light source structure excited by using phosphor module |
-
2014
- 2014-12-22 CN CN201410801199.8A patent/CN104482500A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080000580U (en) * | 2006-10-17 | 2008-04-22 | 익스플로잇 테크놀로지 컴퍼니 리미티드 | Light Emission and Diffusion Element |
| CN101294364A (en) * | 2007-04-29 | 2008-10-29 | 林原 | Structure of fluorescent adhesive paper and producing method thereof |
| CN203859114U (en) * | 2013-12-31 | 2014-10-01 | 厦门乾照光电股份有限公司 | LED light source structure excited by using phosphor module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109400074A (en) * | 2018-12-20 | 2019-03-01 | 石家庄市矿区宏源混凝土搅拌有限公司 | A kind of energy conservation anti-crack concrete |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150401 |