CN104479607A - Low-stress transparent epoxy resin adhesive capable of curing fast at room temperature - Google Patents
Low-stress transparent epoxy resin adhesive capable of curing fast at room temperature Download PDFInfo
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Abstract
The invention belongs to the technical field of adhesives, and in particular relates to a low-stress transparent epoxy resin adhesive capable of curing fast at room temperature. The low-stress transparent epoxy resin adhesive is prepared by mixing an epoxy resin component A and a curing agent component B at the volume ratio of 1:1, wherein the epoxy resin component A comprises hydrogenated bisphenol A epoxy resin, bisphenol A glycidyl ether epoxy resin, functional acrylate monomer, an acrylate diluent, a tackifying accelerator and a silane coupling agent; the curing agent component B comprises polymercaptan, a tertiary amine accelerator, a vulcanizing accelerator, a stabilizer, a curing accelerator I and a curing accelerator II. While keeping 5-minute fast curing, high transparency and better bonding strength, the adhesive prepared by the invention has low exothermal temperature and small stress during curing, achieves better applicability in assembly of electronic devices, and has excellent electric insulativity, voltage breakdown resistance, shock resistance and aging resistance, and the application range of mercaptan-epoxy resin type adhesives in manufacturing of electronic devices is greatly expanded.
Description
Technical field
The invention belongs to sizing agent technical field, particularly relate to a kind of room temperature fast-curing low-stress transparent epoxy resin sizing agent.
Background technology
Epoxyn, because cohesive strength is high, cross-linking density large, has excellent adhesiveproperties, electrical insulation capability and chemical resistance to most of rigid material; Take polythiol as 5 minutes solidified type epoxy resin adhesives of solidifying agent, can rapid link and fixing under room temperature; Because polythiol has sulfur-bearing soft segment, there is higher specific refractory power and light transmission rate, be applicable to rapid link and the encapsulation of the clear hard such as glass and PC plastics and electronic component, adapt to high-efficient production line operation, be widely used in modern manufacturing industry.But polythiol releases a large amount of heats when reacting with epoxy resin, and heat release can produce higher solidification internal stress, cause stress deformation, crackle and contraction, electrical insulation capability declines, the bonding meeting Yin Gaore of accurate device and stress deformation affect setting accuracy, and the encapsulation of chip and element even therefore can be out of shape, damage; Relatively other types of resilient seal gum, its cured article is also aobvious hard and matter is crisp, not reworkable, thus limits its application in chip, electronic component and accurate device manufacture.
The modified epoxies such as prior art many employing ends carboxylic (hydroxyl) base paracril, urethane, acrylate, or adopt the inert substance such as dibutyl phthalate, fluid rubber epoxy binder modified, effectively can improve the toughness of epoxy resin, reduce the Young's modulus of epoxy resin cured product; But these method of modifying are in polythiol-epoxy curing systems; because curing reaction is quick, phase-splitting is incomplete in usual meeting; or make cured article devitrification because of the particle that is separated during solidification; again or cured article can, xanthochromia aging because of the migration of inert substance, affect light transmission; thus cause these routines toughness reinforcing, to increase soft way Practical significance in polythiol-epoxy curing systems little, and these methods all can not solve the problem that polythiol-epoxy resin solidifying system exothermic temperature is too high, solidification internal stress is large.
Summary of the invention
The present invention is directed to the deficiency that above-mentioned prior art exists, the transparent epoxy resin sizing agent of a kind of room temperature fast-curing, low heat release, low-stress is provided.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind of room temperature fast-curing low-stress transparent epoxy resin sizing agent, is made up of by volume epoxy resin component A and solidifying agent B component for 1:1 mixes;
Wherein said epoxy resin component A is counted by weight and is comprised: 55-70 part hydrogenated bisphenol A epoxy resin, 10-30 part bis-phenol A glycidyl ether epoxy resin, 5-15 part acrylate-functional monomer, 2-5 part acrylate diluent, 2-4 part thickening promotor and 0.5-1.5 part silane coupling agent;
Described solidifying agent B component is counted by weight and is comprised: 75-85 part polythiol, 5-10 part Tertiary amine accelerators, 5-10 part secondary accelerator, 0.5-1.5 part stablizer, 2-4 part curing catalyst one and 1-3 part curing catalyst two.
Using method of the present invention is: respectively A, each 25ml of B component are loaded 50ml 1:1 sebific duct, install static mixer, load glue rifle, cocking, two components can mix in static mixer, inject size application point.
The invention has the beneficial effects as follows: the present invention adopts the resin system based on hydrogenated bisphenol A epoxy resin, hydrogenated bisphenol A epoxy resin viscosity is low, be convenient to applying glue, it is relative with polythiol curing reaction gentle, and cured article has the features such as arc resistance, resistance to optical radiation, ageing resistance be good; Employing can with the acrylate-functional of polythiol conjugate addition reaction, the reaction of itself and epoxy-polythiol forms interpenetrating(polymer)networks elastomer structure; Adopt stablizer and promotor can balance the contradiction of fast setting and low heat release, low-stress.Fast setting low-stress transparent epoxy tackiness agent prepared by the present invention, cured at room temperature exothermic heat of reaction temperature controls (1cm below 60 DEG C
3), Hardness Control is at shore A 60-80, and elongation at break reaches 50-100%, and maintains 5 minutes fast setting, high transparency and good bonding strengths, and cured article has good snappiness and serviceability energy; And water-repellancy, electrical insulating property, reactance voltage puncture, shock resistance and ageing-resistant performance excellent, have greatly expanded the application of mercaptan-epoxy resin adhesive at electron device manufacture view.
On the basis of technique scheme, the present invention can also do following improvement.
Further, described hydrogenated bisphenol A epoxy resin is the low viscosity epoxy resin of a kind of oxirane value 0.40 ~ 0.45mol/100g, and its structural formula is
Adopt the beneficial effect of above-mentioned further scheme to be, compared with bisphenol A type epoxy resin, not containing double bond in the molecular chain of hydrogenated bisphenol A epoxy resin, resistance to optical radiation, weather-proof and ageing resistance is excellent, arc resistance, resists excellent electrical property such as wearing.The exothermic temperature of itself and thiol reactant, solidification internal stress and cured article snappiness thereof, elongation at break are all better than bisphenol A type epoxy resin.
Further, described bis-phenol A glycidyl ether epoxy resin to be epoxy equivalent (weight) be 185 ~ 191 electronic-grade bis-phenol A glycidyl ether, its hydrolyzable chloride content < 400ppm.
Further, described acrylate-functional monomer is poly-(propylene glycol) 4-nonyl phenylate acrylate or PEG 4-nonyl phenylate acrylate, and the structural formula of wherein said poly-(propylene glycol) 4-nonyl phenylate acrylate is:
The beneficial effect of above-mentioned further scheme is adopted to be, this type of reactive acrylate monomer and liquid epoxies consistency good, with polythiol by michael addition reaction, be cross-linked to form acrylic elastomer, form the elastomer structure of interpenetrating(polymer)networks with polythiol-epoxy resin.
Further, described acrylate diluent is 1,4 butanediol diacrylate or 1,6 hexanediol diacrylate.
Further, described thickening promotor is three (2-hydroxyethyl) isocyanuric acid triacrylate.
Adopt the beneficial effect of above-mentioned further scheme to be that itself and polythiol have very fast speed of response, tackiness agent can be improved to the sticking power of bonding base material and initial bonding strength.
Further, described silane coupling agent is γ-glycidyl ether oxygen propyl trimethoxy silicane KH560.
Further, described polythiol is polypropylene glycol-2-hydroxy thiol (Capcure 3800LC).
Adopt the beneficial effect of above-mentioned further scheme to be, this polythiol can at room temperature fast-curing epoxy resin by adding that tertiary amine promotes.
Further, described Tertiary amine accelerators is 2,4,6-tri-(dimethylamino methyl) phenol (DMP-30).
Further, described secondary accelerator is phenylcarbinol.
Adopt the beneficial effect of above-mentioned further scheme to be, adopt phenylcarbinol to reduce viscosity, and alcoholic extract hydroxyl group has epoxy resin cure reaction and helps promoter action.
Further, described stablizer is Thiovanic acid or Thiovanic acid isooctyl.
Adopt the beneficial effect of above-mentioned further scheme to be that the reaction of mercaptan ion and epoxy resin can be stablized and relax to stablizer, the large calorimetric of too fast, the too violent generation of inhibited reaction and thermal stresses thereof, reduce exothermic temperature.Thiovanic acid restraining effect is comparatively strong, and addition is few; Thiovanic acid isooctyl is comparatively stable, can suitably increase.
Further, described curing catalyst one is the two dimethylamino ethyl ether benzyl alcohol solution of 50wt%.
Further, described curing catalyst two is the two heterocycle benzyl alcohol solution of 50wt% phenodiazine.
Adopt the beneficial effect of above-mentioned further scheme to be, curing catalyst two and DMP-30 with the use of, and good with the organism consistency such as mercaptan, addition is few, lighter color, and smell is low.
Embodiment
Be described principle of the present invention and feature below in conjunction with example, example, only for explaining the present invention, is not intended to limit scope of the present invention.
Embodiment 1
A kind of room temperature fast-curing low-stress transparent epoxy resin sizing agent, is mixed by epoxy resin component A and solidifying agent B component and forms; (every 1 part by 10g)
Wherein said epoxy resin component A comprises: 680g hydrogenated bisphenol A epoxy resin, 150g bis-phenol A glycidyl ether epoxy resin, 100g gather (propylene glycol) 4-nonyl phenylate acrylate, 30g1,4-butylene glycol diacrylate, 30g tri-(2-hydroxyethyl) isocyanuric acid triacrylate and 10g KH560; By 680g hydrogenated bisphenol A epoxy resin, 150g bis-phenol A glycidyl ether epoxy resin, 100g PEG phenyl ether acrylate and 30g1,4-butylene glycol diacrylate is placed in 2L double star action edge mixing kettle, high-speed stirring 30 minutes, add 30g tri-(2-hydroxyethyl) isocyanuric acid triacrylate again and 10g KH560 stirs 30 minutes, stirring at low speed vacuumizing and defoaming 30 minutes, decompression, filtration, discharging;
Described solidifying agent B component comprises: the two heterocycle benzyl alcohol solution of 800g part polythiol Capcure 3800LC, 70g DMP-30,60g phenylcarbinol, 10g Thiovanic acid, 40g 50% pair of dimethylamino ethyl ether benzyl alcohol solution and 20g 50% phenodiazine; 800g part polythiol Capcure 3800LC, 70g DMP-30,40g 50% pair of dimethylamino ethyl ether benzyl alcohol solution, the two heterocycle benzyl alcohol solution of 20g 50% phenodiazine and 60g phenylcarbinol are placed in 2L double-planet dynamic mixing still, high-speed stirring 30 minutes, add 10g Thiovanic acid again, high-speed stirring 20 minutes, low speed vacuumizing and defoaming 30 minutes, decompression, filtration, discharging.
The sizing agent using method that the present embodiment obtains is: respectively A, each 25ml of B component are loaded 50ml, 1:1 sebific duct, install static mixer, load glue rifle, cocking, two components can mix, inject size application point in static mixer.
Embodiment 2
A kind of room temperature fast-curing low-stress transparent epoxy resin sizing agent, is mixed by epoxy resin component A and solidifying agent B component and forms; (every 1 part by 10g)
Wherein said epoxy resin component A comprises: 550g hydrogenated bisphenol A epoxy resin, 200g bis-phenol A glycidyl ether epoxy resin, 150g PEG 4-nonyl phenylate acrylate, 50g 1,6 hexanediol diacrylate, 35g tri-(2-hydroxyethyl) isocyanuric acid triacrylate and 15g KH560; By 550g hydrogenated bisphenol A epoxy resin, 200g bis-phenol A glycidyl ether epoxy resin, 150g PEG phenyl ether acrylate and 50g 1,6-hexanediyl ester is placed in 2L double star action edge mixing kettle, high-speed stirring 30 minutes, add 35g tri-(2-hydroxyethyl) isocyanuric acid triacrylate again and 15g KH560 stirs 30 minutes, stirring at low speed vacuumizing and defoaming 30 minutes, decompression, filtration, discharging;
Described solidifying agent B component comprises: the two heterocycle benzyl alcohol solution of 750g part polythiol Capcure 3800LC, 90g DMP-30,100g phenylcarbinol, 15g isooctyl mercaptoacetate, 30g 50% pair of dimethylamino ethyl ether benzyl alcohol solution and 15g 50% phenodiazine; 750g part polythiol Capcure 3800LC, 90gDMP-30,30g 50% pair of dimethylamino ethyl ether benzyl alcohol solution, the two heterocycle benzyl alcohol solution of 15g 50% phenodiazine and 100g phenylcarbinol are placed in 2L double-planet dynamic mixing still, high-speed stirring 30 minutes, add 15g isooctyl mercaptoacetate again, high-speed stirring 20 minutes, low speed vacuumizing and defoaming 30 minutes, decompression, filtration, discharging.
The sizing agent using method that the present embodiment obtains is identical with embodiment 1.
Embodiment 3
A kind of room temperature fast-curing low-stress transparent epoxy resin sizing agent, is mixed by epoxy resin component A and solidifying agent B component and forms; (every 1 part by 10g)
Wherein said epoxy resin component A comprises: 700g hydrogenated bisphenol A epoxy resin, 100g bis-phenol A glycidyl ether epoxy resin, 130g gather (propylene glycol) 4-nonyl phenylate acrylate, 25g 1,4 butanediol diacrylate, 40g tri-(2-hydroxyethyl) isocyanuric acid triacrylate and 5g KH560; By 700g hydrogenated bisphenol A epoxy resin, 100g bis-phenol A glycidyl ether epoxy resin, 130g PEG phenyl ether acrylate and 25g 1,4-butylene glycol diacrylate is placed in 2L double star action edge mixing kettle, high-speed stirring 30 minutes, add 40g tri-(2-hydroxyethyl) isocyanuric acid triacrylate again and 5g KH560 stirs 30 minutes, stirring at low speed vacuumizing and defoaming 30 minutes, decompression, filtration, discharging;
Described solidifying agent B component comprises: the two heterocycle benzyl alcohol solution of 780g part polythiol Capcure 3800LC, 75g DMP-30,75g phenylcarbinol, 5g Thiovanic acid, 35g 50% pair of dimethylamino ethyl ether benzyl alcohol solution and 30g 50% phenodiazine; 780g part polythiol Capcure 3800LC, 75g DMP-30,35g 50% pair of dimethylamino ethyl ether benzyl alcohol solution, the two heterocycle benzyl alcohol solution of 30g 50% phenodiazine and 75g phenylcarbinol are placed in 2L double-planet dynamic mixing still, high-speed stirring 30 minutes, add 5g Thiovanic acid again, high-speed stirring 20 minutes, low speed vacuumizing and defoaming 30 minutes, decompression, filtration, discharging.
The sizing agent using method that the present embodiment obtains is identical with embodiment 1.
Embodiment 4
A kind of room temperature fast-curing low-stress transparent epoxy resin sizing agent, is mixed by epoxy resin component A and solidifying agent B component and forms; (every 1 part by 10g)
Wherein said epoxy resin component A comprises: 650g hydrogenated bisphenol A epoxy resin, 200g bis-phenol A glycidyl ether epoxy resin, 70g PEG 4-nonyl phenylate acrylate, 50g 1,6 hexanediol diacrylate, 20g tri-(2-hydroxyethyl) isocyanuric acid triacrylate and 10g KH560; By 650g hydrogenated bisphenol A epoxy resin, 200g bis-phenol A glycidyl ether epoxy resin, 70g PEG phenyl ether acrylate and 50g 1,6-hexanediyl ester is placed in 2L double star action edge mixing kettle, high-speed stirring 30 minutes, add 20g tri-(2-hydroxyethyl) isocyanuric acid triacrylate again and 10g KH560 stirs 30 minutes, stirring at low speed vacuumizing and defoaming 30 minutes, decompression, filtration, discharging;
Described solidifying agent B component comprises: the two heterocycle benzyl alcohol solution of 810g part polythiol Capcure 3800LC, 100g DMP-30,50g phenylcarbinol, 10g isooctyl mercaptoacetate, 20g 50% pair of dimethylamino ethyl ether benzyl alcohol solution and 10g 50% phenodiazine; 810g part polythiol Capcure 3800LC, 100gDMP-30,20g 50% pair of dimethylamino ethyl ether benzyl alcohol solution, the two heterocycle benzyl alcohol solution of 10g 50% phenodiazine and 50g phenylcarbinol are placed in 2L double-planet dynamic mixing still, high-speed stirring 30 minutes, add 10g isooctyl mercaptoacetate again, high-speed stirring 20 minutes, low speed vacuumizing and defoaming 30 minutes, decompression, filtration, discharging.
The sizing agent using method that the present invention obtains is identical with embodiment 1.
Embodiment 5
A kind of room temperature fast-curing low-stress transparent epoxy resin sizing agent, is mixed by epoxy resin component A and solidifying agent B component and forms; (every 1 part by 10g)
Wherein said epoxy resin component A comprises: 610g hydrogenated bisphenol A epoxy resin, 190g bis-phenol A glycidyl ether epoxy resin, 120g gather (propylene glycol) 4-nonyl phenylate acrylate, 40g 1,4 butanediol diacrylate, 30g tri-(2-hydroxyethyl) isocyanuric acid triacrylate and 10g KH560; By 610g hydrogenated bisphenol A epoxy resin, 190g bis-phenol A glycidyl ether epoxy resin, 120g PEG phenyl ether acrylate and 40g 1,4-butylene glycol diacrylate is placed in 2L double star action edge mixing kettle, high-speed stirring 30 minutes, add 30g tri-(2-hydroxyethyl) isocyanuric acid triacrylate again and 10g KH560 stirs 30 minutes, stirring at low speed vacuumizing and defoaming 30 minutes, decompression, filtration, discharging;
Described solidifying agent B component comprises: the two heterocycle benzyl alcohol solution of 850g part polythiol Capcure 3800LC, 70g DMP-30,50g phenylcarbinol, 5g Thiovanic acid, 20g 50% pair of dimethylamino ethyl ether benzyl alcohol solution and 15g 50% phenodiazine; 850g part polythiol Capcure 3800LC, 70g DMP-30,20g 50% pair of dimethylamino ethyl ether benzyl alcohol solution, the two heterocycle benzyl alcohol solution of 15g 50% phenodiazine and 50g phenylcarbinol are placed in 2L double-planet dynamic mixing still, high-speed stirring 30 minutes, add 5g Thiovanic acid again, high-speed stirring 20 minutes, low speed vacuumizing and defoaming 30 minutes, decompression, filtration, discharging.
The sizing agent using method that the present embodiment obtains is identical with embodiment 1.
For difference with the prior art of the present invention is described better, the polythiol-epoxyn of prior art is generally formed and enumerates following two comparative examples.
Comparative example 1
A kind of polythiol-epoxyn, is mixed by component A and solidifying agent B component and forms; (every 1 part by 10g)
Wherein said component A comprises: the polyurethane-modified bisphenol A epoxide resin of 450g bisphenol A epoxide resin, 400g, 90g polyethyleneglycol diglycidylether thinner, 50g nonylphenol and 10g KH560; 450g bisphenol A epoxide resin, the polyurethane-modified bisphenol A epoxide resin of 400g, 90g polyethyleneglycol diglycidylether thinner, 50g nonylphenol and 10g KH560 are placed in 2L double-planet dynamic mixing still, high-speed stirring 30 minutes; Low speed vacuumizing and defoaming 30 minutes, decompression, filtration, discharging;
Described solidifying agent B component comprises: 900g polythiol Capcure3800LC, 90g DMP-30 and 10g KH550 silane coupling agent; 900g polythiol Capcure3800LC, 90g DMP-30 and 10g KH550 silane coupling agent is placed in 2L double-planet dynamic mixing still, high-speed stirring 30 minutes, low speed vacuumizing and defoaming 30 minutes, decompression, filtration, discharging.
The sizing agent using method that this comparative example obtains is identical with embodiment 1.
Comparative example 2
A kind of polythiol-epoxyn, is mixed by component A and solidifying agent B component and forms; (every 1 part by 10g)
Wherein said component A comprises: 810g bisphenol A epoxide resin, 125g dibutyl phthalate, 55g nonylphenol and 10g KH560; 810g bisphenol A epoxide resin, 125g dibutyl phthalate, 55g nonylphenol and 10g KH560 are placed in 2L double-planet dynamic mixing still, high-speed stirring 30 minutes; Low speed vacuumizing and defoaming 30 minutes, decompression, filtration, discharging;
Described solidifying agent B component comprises: 950g catalytic type polythiol, 40g phenylcarbinol and 10g KH550 silane coupling agent; 950g catalytic type polythiol 3380S, 40g phenylcarbinol and 10g KH550 silane coupling agent are placed in 2L double-planet dynamic mixing still, high-speed stirring 30 minutes, low speed vacuumizing and defoaming 30 minutes, decompression, filtration, discharging.
The sizing agent using method that this comparative example obtains is identical with embodiment 1.
The room temperature fast-curing low-stress transparent epoxy resin tackiness agent obtained by above-described embodiment 1-5 and comparative example 1-2 carry out mechanical property, exothermic temperature, thermal shock circulation weathering test by tackiness agent touchstone, and data are as table 1 and table 2.
Table 1
Note *: be 45# steel-45# steel sandblasting test piece;
Note * *: making regulation exemplar is the thick dumbbell test piece of 1mm.
Table 2
Show that the mercaptan-epoxy resin adhesive that the epoxy resin adhesive that embodiment of the present invention 1-5 obtains generally forms relative to prior art has lower viscosity and better mobility by table 1, table 2 analysis, be applicable to the encapsulation of Miniature component; Keeping quick-setting while, lower curing exotherm temperature, stress modification is little, is applicable to the embedding of electronic chip encapsulating and frivolous plastic casing device; Have suitable hardness after solidification, good snappiness and low elastic modulus, reworkable property, shock resistance, high/low temperature aging resistance, resistance to optical radiation and weather resistance all obtain larger raising; Hydrogenated bisphenol A epoxy resin is adopted to have good dielectric strength, good arc resistance and insulating property; The high transparent that sizing agent has and good bonding strength, be applicable to the bonding of the transparent devices such as glass, PC and material; Fast setting low-stress transparent epoxy tackiness agent prepared by the present invention, has expanded the application of mercaptan-epoxy resin adhesive in electronic components greatly.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. a room temperature fast-curing low-stress transparent epoxy resin sizing agent, is characterized in that, is made up of by volume epoxy resin component A and solidifying agent B component for 1:1 mixes;
Wherein said epoxy resin component A is counted by weight and is comprised: 55-70 part hydrogenated bisphenol A epoxy resin, 10-30 part bis-phenol A glycidyl ether epoxy resin, 5-15 part acrylate-functional monomer, 2-5 part acrylate diluent, 2-4 part thickening promotor and 0.5-1.5 part silane coupling agent;
Described solidifying agent B component is counted by weight and is comprised: 75-85 part polythiol, 5-10 part Tertiary amine accelerators, 5-10 part secondary accelerator, 0.5-1.5 part stablizer, 2-4 part curing catalyst one and 1-3 part curing catalyst two.
2. epoxy resin adhesive according to claim 1, is characterized in that, described hydrogenated bisphenol A epoxy resin is the low viscosity epoxy resin of a kind of oxirane value 0.40 ~ 0.45mol/100g, and its structural formula is:
3. epoxy resin adhesive according to claim 1, is characterized in that, described bis-phenol A glycidyl ether epoxy resin to be epoxy equivalent (weight) be 185 ~ 191 electronic-grade bis-phenol A glycidyl ether, its hydrolyzable chloride content < 400ppm.
4. epoxy resin adhesive according to claim 1, it is characterized in that, described acrylate-functional monomer is poly-(propylene glycol) 4-nonyl phenylate acrylate or PEG 4-nonyl phenylate acrylate, and the structural formula of wherein said poly-(propylene glycol) 4-nonyl phenylate acrylate is:
5. epoxy resin adhesive according to claim 1, is characterized in that, described acrylate diluent is 1,4 butanediol diacrylate or 1,6 hexanediol diacrylate; Described thickening promotor is three (2-hydroxyethyl) isocyanuric acid triacrylate; Described silane coupling agent is γ-glycidyl ether oxygen propyl trimethoxy silicane KH560.
6. epoxy resin adhesive according to claim 1, is characterized in that, described polythiol is polypropylene glycol-2-hydroxy thiol Capcure 3800LC; Described Tertiary amine accelerators is 2,4,6-tri-(dimethylamino methyl) phenol DMP-30; Described secondary accelerator is phenylcarbinol; Described stablizer is Thiovanic acid or Thiovanic acid isooctyl.
7. epoxy resin adhesive according to claim 1, is characterized in that, described curing catalyst one is the two dimethylamino ethyl ether benzyl alcohol solution of 50wt%.
8. epoxy resin adhesive according to claim 1, is characterized in that, described curing catalyst two is the two heterocycle benzyl alcohol solution of 50wt% phenodiazine.
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| CN105647432A (en) * | 2016-01-21 | 2016-06-08 | 南京诺邦新材料有限公司 | Fast setting epoxy system for bonding engineering plastic and preparing method of fast setting epoxy system |
| CN106243290A (en) * | 2016-05-11 | 2016-12-21 | 杭州乐新材料科技有限公司 | A kind of rubber-type photocuring 3D printed material and preparation method thereof |
| CN106243290B (en) * | 2016-05-11 | 2018-10-09 | 杭州乐一新材料科技有限公司 | A kind of rubber-type photocuring 3D printing material and preparation method thereof |
| CN107090260A (en) * | 2017-06-01 | 2017-08-25 | 上海应用技术大学 | A kind of high transmission adhesive and preparation method thereof |
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| CN112646521A (en) * | 2020-12-18 | 2021-04-13 | 深圳市彩田化工有限公司 | Preparation process of low-heat-release epoxy resin adhesive |
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| CN113150700A (en) * | 2021-03-25 | 2021-07-23 | 湖南神力铃胶粘剂制造有限公司 | Epoxy stone repair face adhesive with yellowing resistance, low viscosity and hydrophilic curing and preparation method thereof |
| CN115011074A (en) * | 2021-08-20 | 2022-09-06 | 广东四会互感器厂有限公司 | Epoxy resin composition, preparation method and application thereof |
| CN114015020A (en) * | 2021-10-13 | 2022-02-08 | 瑞奇新材料(广州)有限公司 | Curing agent and preparation method and application thereof |
| CN114015020B (en) * | 2021-10-13 | 2023-10-03 | 瑞奇新材料(广州)有限公司 | Curing agent and preparation method and application thereof |
| CN114524655A (en) * | 2022-01-28 | 2022-05-24 | 广东铁科灌浆科技有限公司 | High-strength epoxy polymer modified cement mortar and preparation method thereof |
| CN114524655B (en) * | 2022-01-28 | 2022-09-09 | 广东铁科灌浆科技有限公司 | High-strength epoxy polymer modified cement mortar and preparation method thereof |
| CN115820182A (en) * | 2022-12-09 | 2023-03-21 | 湖南肆玖科技有限公司 | Adhesive capable of being cured in low-temperature and humid environment and using method |
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