CN104476486A - Assembling technical method for epoxy end enclosure of special film assembly - Google Patents
Assembling technical method for epoxy end enclosure of special film assembly Download PDFInfo
- Publication number
- CN104476486A CN104476486A CN201410641643.4A CN201410641643A CN104476486A CN 104476486 A CN104476486 A CN 104476486A CN 201410641643 A CN201410641643 A CN 201410641643A CN 104476486 A CN104476486 A CN 104476486A
- Authority
- CN
- China
- Prior art keywords
- sleeve
- assembling
- end socket
- end enclosure
- sealing head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004593 Epoxy Substances 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000007789 sealing Methods 0.000 claims abstract description 30
- 239000003292 glue Substances 0.000 claims abstract description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 239000012528 membrane Substances 0.000 claims description 7
- 241000237858 Gastropoda Species 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 6
- 235000008331 Pinus X rigitaeda Nutrition 0.000 claims 1
- 235000011613 Pinus brutia Nutrition 0.000 claims 1
- 241000018646 Pinus brutia Species 0.000 claims 1
- 238000012536 packaging technology Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses an assembling technical method for an epoxy end enclosure of a special film assembly. The method comprises the steps of fixing the end enclosure, applying glue to the end enclosure, adding a sleeve, adjusting the size, fixing a supporting sheet, and dismounting an assembling tool; the size is adjusted by enabling the difference between the depth from the end surface of the end enclosure to the end surface of a measuring barrel and the depth from the inner end surface of the sleeve to the end surface of the measuring barrel to be 0.46 to 0.54mm. With the adoption of the assembling technical method for the epoxy end enclosure of the special film assembly the problem of the assembling fitting of the epoxy end enclosure of the film assembly and the sleeve during producing and assembling the special film assembly can be solved, namely, the fitting size of the epoxy end enclosure and the assembling sleeve is quantitatively controlled during assembling, so as to avoid the problem that the sealing cannot be performed due to excessively large size and the problem that the end enclosure is pressed and damaged during use due to excessively small size; the product quality can be ensured; the product can be processed and produced by mass; therefore, the economic value is increased for an enterprise.
Description
Technical field
The invention belongs to technical field of membrane separation, be specifically related to a kind of certain films assembly epoxy sealing head assembling technique.
Background technology
In the middle of production and assembly certain films component process, there is the assembling matching problem of membrane module epoxy sealing head and sleeve, be difficult in an assembling process control the fit dimension between epoxy sealing head and frock sleeve, the oversize problem easily occurring sealing, the undersized end socket pressurized that easily in use makes is damaged.Product quality can not ensure, cannot batch machining produce.In sum, a kind of membrane module epoxy sealing head assembling technique that can overcome the above problems is needed at present.This process is researched and developed based on this theory.
Summary of the invention
The application provides a kind of certain films assembly epoxy sealing head assembling technique for prior art Problems existing, is intended to solve in certain films assembling components process, the problem such as to coordinate between epoxy sealing head with sleeve.Concrete technical scheme is as follows.
The certain films assembly epoxy sealing head assembling technique that the application provides comprises the steps,
1) fixed seal head;
2) end socket is played glue, is added sleeve: cleaned by end socket sealing surface after fixing end socket, smear silicon bonding, be then lifted on end socket by sleeve with crane, and add pretension dish in sleeve upper surface, fix with nut; Studdle on the tooling bracket of sleeve lower surface is fixed;
3) adjust size: add measuring cylinder in the inner core of sleeve, measuring cylinder end face divides three measurement points equally; A and the B of three or more measurement point is measured successively with depth gauge rule, A is the degree of depth of end socket end face to measuring cylinder end face, B is the degree of depth of sleeve inner end face to measuring cylinder end face, by adjusting the studdle of the pretension dish of sleeve upper end and/or lower end to make B-A=C, wherein C=0.46mm ~ 0.54mm; Then 24 hours are left standstill;
4) fixing supporting spring: after silicon bonding solidifies completely, the fixing supporting spring fixed seal head of installing sleeve lower surface and sleeve;
5) remove frock tool: pulled down by the pretension dish of measuring cylinder and sleeve upper surface, to sling film chipware with crane, tooling bracket is pulled down from shell separator; Complete the assembling of whole membrane module epoxy sealing head and sleeve.
Further, in above-mentioned steps 1) described in fixed seal head be: film chipware is lifted on the tooling bracket of shell separator, and adjusts film chipware end socket center and tooling bracket point coincides.
Further, in above-mentioned steps 2) described in end socket play glue, add in sleeve the thickness smearing silicon bonding and be preferably 0.2-0.5mm, the very few sealing effectiveness of silicon bonding does not reach, and crosses and easily damages end socket at most.
Further, the application's above-mentioned steps 3) give the standard of adjust size, even if B-A=C, and C=0.46mm ~ 0.54mm, and C is the height that end socket gives prominence to sleeve.
In concrete practice process, if B-A>C, then by the pretension valve snail cap of loose sleeve upper surface, and tight sleeve lower surface studdle carries out adjusting to make B-A=C; If there is the situation of B-A<C, then by the pretension valve snail cap of tight sleeve upper surface, and loose sleeve lower surface studdle carries out adjusting to make B-A=C; Namely adjust its height relative to end socket by the upper and lower pretension valve snail cap of adjustment sleeve, and then make between end socket and sleeve, to reach corresponding sealing effectiveness.
Beneficial effect: the certain films assembly epoxy sealing head assembling technique provided by the application, solve the assembling matching problem of membrane module epoxy sealing head and sleeve in the middle of production and assembly certain films component process, namely in an assembling process by the fit dimension between quantitative control epoxy sealing head and frock sleeve, avoid the oversize problem that cannot seal occurred, and the problem of end socket pressurized breakage in the undersized use procedure caused.Ensure that product quality, the batch machining of product is produced and becomes possibility, for enterprise creates economic worth.
Accompanying drawing explanation
The flow chart of Fig. 1 certain films assembly epoxy sealing head packaging technology;
Fig. 2 certain films assembly epoxy sealing head packaging technology procedure chart;
In Fig. 21: end socket, 2: pretension dish, 3: sleeve, 4: pretension valve snail cap, 5 studdles, 6 measuring cylinders.
Detailed description of the invention
Below by embodiment, the present invention is further elaborated.
In practical work process, first the flow process of certain films assembly epoxy sealing head packaging technology as depicted in figs. 1 and 2, namely gets out the end socket 1 and sleeve 3 and the corresponding instrument etc. that need assembling; Then fixed seal head, is lifted on the tooling bracket of shell separator by film chipware, as in Fig. 2
shown in, and adjust film chipware end socket center and tooling bracket point coincides; After fixing end socket, cleaned by end socket sealing surface, smear silicon bonding, control smearing thickness is 0.3mm, is then lifted on end socket with crane by sleeve, as in Fig. 2
shown in, and add pretension dish in sleeve upper surface, fix with spiral shell 4 cap, the studdle 5 on the tooling bracket of sleeve lower surface is fixed; Next be exactly adjust size: will add measuring cylinder 6 in the inner core of sleeve, measuring cylinder end face divides three or more measurement point equally; A and the B of three or more measurement point is measured successively with depth gauge rule, A is the degree of depth of end socket end face to measuring cylinder end face, B is the degree of depth of sleeve inner end face to measuring cylinder end face, by adjusting the top and bottom of sleeve to make B-A=C, wherein C=0.46mm ~ 0.54mm, if B-A is not equal to C, then to make B-A=C by the top and bottom adjusting sleeve, after adjusting, device need leave standstill 24 hours makes silicon bonding solidify completely, and the assembling fit clearance completing epoxy sealing head and sleeve adjusts; Then be exactly fix supporting spring and remove frock tool, as in Fig. 2
-
shown in, fixing supporting spring exactly after silicon bonding solidifies completely, the fixing supporting spring fixed seal head of installing sleeve lower surface and sleeve; Removing frock tool is exactly pulled down by the pretension dish of measuring cylinder and sleeve upper surface, to sling film chipware, pulled down by tooling bracket from shell separator with crane; Finally complete the assembling of whole membrane module epoxy sealing head and sleeve.
A, B value measured when table 1 is one group of real work, because 3 one sides in real work, measuring at 3 is just enough to reach good assembling effect.
Surveying record table: (unit: millimeter mm)
The above; be only the present invention's preferably detailed description of the invention; but protection scope of the present invention is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; be equal to according to technical scheme of the present invention and inventive concept thereof and replace or change, all should be encompassed within protection scope of the present invention.
Claims (5)
1. certain films assembly epoxy sealing head assembling technique, is characterized in that, comprise the steps:
1) fixed seal head;
2) end socket is played glue, is added sleeve: cleaned by end socket sealing surface after fixing end socket, smear silicon bonding, be then lifted on end socket by sleeve with crane, and add pretension dish in sleeve upper surface, fix with nut; Studdle on the tooling bracket of sleeve lower surface is fixed;
3) adjust size: add measuring cylinder in the inner core of sleeve, measuring cylinder end face divides three or more measurement point equally; A and the B of three or more measurement point is measured successively with depth gauge rule, A is the degree of depth of end socket end face to measuring cylinder end face, B is the degree of depth of sleeve inner end face to measuring cylinder end face, by adjusting the studdle of the pretension dish of sleeve upper end and/or lower end to make B-A=C, wherein C=0.46mm ~ 0.54mm; Then 24 hours are left standstill;
4) fixing supporting spring: after silicon bonding solidifies completely, the fixing supporting spring fixed seal head of installing sleeve lower surface and sleeve;
5) remove frock tool: pulled down by the pretension dish of measuring cylinder and sleeve upper surface, to sling film chipware with crane, tooling bracket is pulled down from shell separator; Complete the assembling of whole membrane module epoxy sealing head and sleeve.
2. certain films assembly epoxy sealing head assembling technique according to claim 1, it is characterized in that, step 1) described in fixed seal head be: film chipware is lifted on the tooling bracket of shell separator, and adjusts film chipware end socket center and tooling bracket point coincides.
3. certain films assembly epoxy sealing head assembling technique according to claim 1, is characterized in that, step 2) described end socket is played glue, is added in sleeve the thickness smearing silicon bonding is 0.2-0.5mm.
4. certain films assembly epoxy sealing head assembling technique according to claim 1, it is characterized in that, adjust size described in step 3), if during B-A>C, the pretension valve snail cap of pine sleeve upper surface, and tight sleeve lower surface studdle carries out adjusting to make B-A=C.
5. certain films assembly epoxy sealing head assembling technique according to claim 1, it is characterized in that, adjust size described in step 3), during B-A<C, the pretension valve snail cap of tight sleeve upper surface, and loose sleeve lower surface studdle carries out adjusting to make B-A=C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410641643.4A CN104476486B (en) | 2014-11-14 | 2014-11-14 | Certain films assembly epoxy sealing head assembling technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410641643.4A CN104476486B (en) | 2014-11-14 | 2014-11-14 | Certain films assembly epoxy sealing head assembling technique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104476486A true CN104476486A (en) | 2015-04-01 |
| CN104476486B CN104476486B (en) | 2016-03-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410641643.4A Active CN104476486B (en) | 2014-11-14 | 2014-11-14 | Certain films assembly epoxy sealing head assembling technique |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1063054A (en) * | 1991-01-09 | 1992-07-29 | 中国科学院大连化学物理研究所 | The preparation of hollow fiber membrane separator epoxy sealing head |
| JP2008238068A (en) * | 2007-03-28 | 2008-10-09 | Nok Corp | Hollow fiber membrane module |
| CN201329255Y (en) * | 2008-11-05 | 2009-10-21 | 北京科泰兴达高新技术有限公司 | Hollow-fiber membrane component for elastic end |
| CN201329256Y (en) * | 2008-12-25 | 2009-10-21 | 南昌航空大学 | Glue pouring device for hollow-fiber membrane module packing |
| CN101579582A (en) * | 2009-06-15 | 2009-11-18 | 重庆钢铁(集团)有限责任公司 | Assembly technique for head sealing cover and kettle of stock solution crystallizer |
| CN201529492U (en) * | 2009-07-27 | 2010-07-21 | 上海生物医学工程研究中心 | Membrane component sealing head |
| CN102819629A (en) * | 2012-06-26 | 2012-12-12 | 上海森松环境技术工程有限公司 | Automatic assembly method and system of three-dimensional models |
| CN103495344A (en) * | 2013-09-23 | 2014-01-08 | 杭州天创环境科技股份有限公司 | Packaging method of hollow fiber curtain type membrane assembly |
-
2014
- 2014-11-14 CN CN201410641643.4A patent/CN104476486B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1063054A (en) * | 1991-01-09 | 1992-07-29 | 中国科学院大连化学物理研究所 | The preparation of hollow fiber membrane separator epoxy sealing head |
| JP2008238068A (en) * | 2007-03-28 | 2008-10-09 | Nok Corp | Hollow fiber membrane module |
| CN201329255Y (en) * | 2008-11-05 | 2009-10-21 | 北京科泰兴达高新技术有限公司 | Hollow-fiber membrane component for elastic end |
| CN201329256Y (en) * | 2008-12-25 | 2009-10-21 | 南昌航空大学 | Glue pouring device for hollow-fiber membrane module packing |
| CN101579582A (en) * | 2009-06-15 | 2009-11-18 | 重庆钢铁(集团)有限责任公司 | Assembly technique for head sealing cover and kettle of stock solution crystallizer |
| CN201529492U (en) * | 2009-07-27 | 2010-07-21 | 上海生物医学工程研究中心 | Membrane component sealing head |
| CN102819629A (en) * | 2012-06-26 | 2012-12-12 | 上海森松环境技术工程有限公司 | Automatic assembly method and system of three-dimensional models |
| CN103495344A (en) * | 2013-09-23 | 2014-01-08 | 杭州天创环境科技股份有限公司 | Packaging method of hollow fiber curtain type membrane assembly |
Non-Patent Citations (1)
| Title |
|---|
| 朱文俊: "一种浇注中空纤维膜封头的办法", 《科技致富向导》 * |
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| CN104476486B (en) | 2016-03-09 |
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