CN104466535A - Positioning mechanism of chip fixing structure - Google Patents
Positioning mechanism of chip fixing structure Download PDFInfo
- Publication number
- CN104466535A CN104466535A CN201410720739.XA CN201410720739A CN104466535A CN 104466535 A CN104466535 A CN 104466535A CN 201410720739 A CN201410720739 A CN 201410720739A CN 104466535 A CN104466535 A CN 104466535A
- Authority
- CN
- China
- Prior art keywords
- fixed
- block
- positioning
- chip
- location resilient
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/639—Additional means for holding or locking coupling parts together, after engagement, e.g. separate keylock, retainer strap
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
A positioning mechanism of a chip fixing structure is used for positioning a chip of an electronic device, and the electronic device is provided with a main board. The positioning mechanism comprises a butting push assembly and a positioning detection mechanism. The butting push assembly comprises a butting piece and a fixing block. The butting piece comprises a butting block, a guide rod and an iron block. The butting block is in a long bar shape and is fixed at one end of the guide rod, and the other end of the guide rod is fixedly connected with the iron block. The fixing block is fixed on the main board, and the fixing block is provided with a sliding groove allowing the guide rod to be arranged in sliding and penetrating modes. The positioning detection mechanism is located on the rear side of the fixing block, and the positioning detection mechanism comprises a first elastic positioning piece and a second elastic positioning piece which are arrayed in a spaced mode. Consequently, the positioning mechanism of the chip fixing structure is convenient to assemble and disassemble and capable of quickly positioning whether the chip arrives at a position or not conveniently.
Description
Technical field
The present invention relates to a kind of detent mechanism of chip fixing structure.
Background technology
Along with development that is economic and life, the application of electronic installation is more and more extensive, as one of the important component of electronic installation, and one of handling important feature becoming electronic installation of chip, and existing driving and fixing usual employing are manually carried out, operated inconvenience.
For this reason, designer of the present invention is because above-mentioned defect, and by concentrating on studies and designing, comprehensive experience and the achievement being engaged in related industry for a long time for many years, research and design goes out a kind of detent mechanism of chip fixing structure, to overcome above-mentioned defect.
Summary of the invention
The technical problem to be solved in the present invention is: one of handling important feature becoming electronic installation of chip, and existing driving and fixing usual employing are manually carried out, and operated inconvenience.
For solving the problem, the invention discloses a kind of detent mechanism of chip fixing structure, for the chip positioning of positioning electronic device, described electronic installation has mainboard, it is characterized in that:
Described detent mechanism comprises and pushes assembly and positioning detection mechanism, described in push assembly and comprise supporting piece and fixed block;
Described supporting piece comprises holding block, guide post and iron block, and described holding block is strip and is fixed on one end of guide post, and the other end of described guide post fixes described iron block;
Described fixed block is fixed on described mainboard, and described fixed block is provided with and slides the chute placed for described guide post;
Described positioning detection mechanism is positioned at the rear side of described fixed block, it comprises the first Location resilient piece and second Location resilient piece of spaced arrangement, described mainboard is fixed in one end of described first Location resilient piece, electromagnet is fixed with after the other end upwards extends, described mainboard is fixed in one end of described second Location resilient piece, the other end upwards extends rear bending camber, and the other end height of described first Location resilient piece is higher than the other end of described second Location resilient piece.
Wherein: described in push assembly and also comprise elastic component, described elastic component is sleeved on described guide post and between described holding block and fixed block.
Known by said structure, the detent mechanism of chip fixing structure of the present invention has following technique effect:
1, handling are convenient, can easily whether in-position is located fast to chip;
2, structure is simple, and practicality is good.
Detailed content of the present invention obtains by explanation described later and institute's accompanying drawing.
Accompanying drawing explanation
Fig. 1 shows the schematic diagram that have employed chip fixing structure of the present invention.
Fig. 2 shows the decomposing schematic representation of the detent mechanism of chip fixing structure of the present invention.
Fig. 3 shows use cutaway view of the present invention.
Embodiment
See Fig. 1 to Fig. 2, show the detent mechanism of chip fixing structure of the present invention.
The detent mechanism of described chip fixing structure is used for the chip 201 whether in-position of positioning electronic device 200, described electronic installation 200 has mainboard 203 and shell (not shown), described mainboard 203 is fixed in described shell, described mainboard 203 is fixed with frame section 205, and described frame section is provided with the perforation 2051 entered for chip 201.
See Fig. 2, described detent mechanism comprises and pushes assembly 50 and positioning detection mechanism 35, described in push assembly 50 and comprise supporting piece 51, elastic component 53 and fixed block 55.
Described supporting piece comprises holding block 511, guide post 513 and iron block 515, and described holding block 511 is strip and is fixed on one end of guide post 513, and the other end of described guide post 513 fixes described iron block 515.
Described fixed block 55 is fixed on described mainboard 203, and described fixed block 55 is provided with and slides the chute 551 placed for described guide post 513, and described elastic component 53 is sleeved on described guide post 513 and between described holding block 511 and fixed block 55.
Described positioning detection mechanism 35 is positioned at the rear side of described fixed block 55, it comprises the first Location resilient piece 351 and the second Location resilient piece 353 of spaced arrangement, described mainboard 203 is fixed in one end of described first Location resilient piece 351, electromagnet 57 is fixed with after the other end upwards extends, described mainboard 203 is fixed in one end of described second Location resilient piece 353, the other end upwards extends rear bending camber, and the other end height of described first Location resilient piece 351 is higher than the other end of described second Location resilient piece 353, thus, when chip 201 is resisted against described supporting piece 51, it is made to retreat against described electromagnet 57, thus the other end of the second Location resilient piece 353 described in the other end Receding Contact making described first Location resilient piece 351, produce an aligned contact signal (see Fig. 3).
And have employed chip fixing structure of the present invention and also comprise transport sector and control unit.
Described transport sector comprises driven unit and enters testing agency, described driven unit comprises the first motor, the second motor, the first cylinder 13 and second tin roller 17, described first cylinder 13 and second tin roller 17 are cylindric and are respectively in the inner side of described perforation 2051 up and down, described first cylinder 13 is driven by described first motor and rotates, described second tin roller is driven by the second motor and rotates, and described first cylinder 13 and the spaced certain distance of second tin roller 17 pass with driving chip 201.
Optionally, the surface of described first cylinder 13 and second tin roller 17 has frictional layer, to improve driving function.
Describedly enter the inner side that testing agency 33 is positioned at described perforation 2051, it comprises spaced first entrance shell fragment 331 and the second entrance shell fragment 333, described mainboard 203 is fixed in one end of described first entrance shell fragment 331, the other end upwards extend backward in be bent into arc, described mainboard 203 is fixed in one end of described second entrance shell fragment 333, the other end 3331 is bent inwardly into arc after upwards extending, and the other end height of described first entrance shell fragment 331 is higher than the other end of described second entrance shell fragment 333, thus, when chip 201 enters, after the other end of described first entrance shell fragment 331, make it contact the other end of described second entrance shell fragment 333, produce one and enter activation signal.
And described control unit is connected to described first motor, the second motor, enters testing agency, positioning detection mechanism and electromagnet, when entering testing agency and detecting that chip enters, start the first motor and the second motor drives the first cylinder 13 and second tin roller 17 to rotate, thus order about chip 201 and move backward, until after producing aligned contact signal, stop the first motor and the second motor, power to electromagnet simultaneously, effectively to keep chip.
When chip taken out by needs, control unit stops powering to electromagnet, and drives the first motor and the second motor reverse rotation.
Known by said structure, the detent mechanism tool of chip fixing structure of the present invention has the following advantages:
1, handling are convenient, can easily whether in-position is located fast to chip;
2, structure is simple, and practicality is good.
It is evident that, above description and record be only citing instead of in order to limit disclosure of the present invention, application or use.Although described in an embodiment and be described in the drawings embodiment, but the present invention do not limit by accompanying drawing example and describe in an embodiment as the optimal mode thought at present to implement the specific examples of instruction of the present invention, scope of the present invention will comprise any embodiment of specification and the appended claim fallen into above.
Claims (2)
1. a detent mechanism for chip fixing structure, for the chip positioning of positioning electronic device, described electronic installation has mainboard, it is characterized in that:
Described detent mechanism comprises and pushes assembly and positioning detection mechanism, described in push assembly and comprise supporting piece and fixed block;
Described supporting piece comprises holding block, guide post and iron block, and described holding block is strip and is fixed on one end of guide post, and the other end of described guide post fixes described iron block;
Described fixed block is fixed on described mainboard, and described fixed block is provided with and slides the chute placed for described guide post;
Described positioning detection mechanism is positioned at the rear side of described fixed block, it comprises the first Location resilient piece and second Location resilient piece of spaced arrangement, described mainboard is fixed in one end of described first Location resilient piece, electromagnet is fixed with after the other end upwards extends, described mainboard is fixed in one end of described second Location resilient piece, the other end upwards extends rear bending camber, and the other end height of described first Location resilient piece is higher than the other end of described second Location resilient piece.
2. detent mechanism as claimed in claim 1, is characterized in that: described in push assembly and also comprise elastic component, described elastic component is sleeved on described guide post and between described holding block and fixed block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410720739.XA CN104466535A (en) | 2014-12-02 | 2014-12-02 | Positioning mechanism of chip fixing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410720739.XA CN104466535A (en) | 2014-12-02 | 2014-12-02 | Positioning mechanism of chip fixing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104466535A true CN104466535A (en) | 2015-03-25 |
Family
ID=52912160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410720739.XA Pending CN104466535A (en) | 2014-12-02 | 2014-12-02 | Positioning mechanism of chip fixing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104466535A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08181470A (en) * | 1994-12-22 | 1996-07-12 | Advantest Corp | Insertion guide mechanism of printed board |
| CN104409923A (en) * | 2014-11-28 | 2015-03-11 | 成都安思科技有限公司 | Chip driving and fixing structure |
| CN204289899U (en) * | 2014-12-02 | 2015-04-22 | 成都深思科技有限公司 | The detent mechanism of chip fixing structure |
-
2014
- 2014-12-02 CN CN201410720739.XA patent/CN104466535A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08181470A (en) * | 1994-12-22 | 1996-07-12 | Advantest Corp | Insertion guide mechanism of printed board |
| CN104409923A (en) * | 2014-11-28 | 2015-03-11 | 成都安思科技有限公司 | Chip driving and fixing structure |
| CN204289899U (en) * | 2014-12-02 | 2015-04-22 | 成都深思科技有限公司 | The detent mechanism of chip fixing structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150325 |