CN104465484A - 一种后固化夹具套件结构 - Google Patents

一种后固化夹具套件结构 Download PDF

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CN104465484A
CN104465484A CN201410823543.3A CN201410823543A CN104465484A CN 104465484 A CN104465484 A CN 104465484A CN 201410823543 A CN201410823543 A CN 201410823543A CN 104465484 A CN104465484 A CN 104465484A
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CN104465484B (zh
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庄文凯
张航宇
朱仲明
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JCET Group Co Ltd
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Jiangsu Changjiang Electronics Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
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Abstract

本发明涉及一种后固化夹具套件结构，属于半导体封装技术领域。它包括装载料盒（1），所述装载料盒（1）内设置有多个压合夹具（2），所述装载料盒（1）包括料盒本体（1.1），所述料盒本体（1.1）内左右两侧设置有多排装载隔断（1.2），所述压合夹具（2）放置于装载隔断（1.2）上，所述压合夹具（2）包括上盖板（2.1）和下载板（2.2），所述上盖板（2.1）和下载板（2.2）左侧通过第二铰接件（2.4）相连接，所述上盖板（2.1）右侧设置有固定卡扣（2.3）。本发明一种后固化夹具套件结构，它能够使基板或是金属引线框架在高温高压中充分释放应力，从而达到一定平整能力，为后续工序工作中提供平稳、安全、方便及自动化生产能力。

Description

一种后固化夹具套件结构
技术领域
本发明涉及一种后固化夹具套件结构，主要是用来固定基板或是金属引线框架在烘烤中完成应力释放使其平整，属于半导体封装技术领域。
背景技术
目前封装厂(Assembly house)中的基板类或是金属引线框类在包封后(After molding)的后固化，会因为包封后的收缩应力释放而产生塑封体翘曲问题，从而影响塑封体内电子芯片的伤害以及后续工序作业，因为基板或是金属引线框的翘曲而造成卡料的伤害及无法自动化生产等缺陷。
目前封装厂在处理基板或是金属引线框翘曲的方法，主要是将很多片的基板或是很多片的金属引线框，整叠放置在挂篮(Stack magazine)内，再外加重压块与高温企图释放应力的同时，压平基板或是金属引线框的工作方法；
而采用在挂篮(Stack magazine)内整叠基板或是引线框上放置重块镇压，再加以高温释放应力的工作手段却有以下的缺点：
1、基板或是金属引线框采多片叠放在高温高压镇压下，不易使每一片的基板或是金属引线框的翘曲，都能达到一定的平整度；
2、因为是多片基板或是金属引线框堆栈置放，在堆栈过程中容易在基板或是金属引线框的片与片之间夹杂了脏东西，而在释放应力的高温高压过程中，容易产生塑封体微小裂缝尤其是超薄封装体；严重时塑封体破裂；
3、目前对应不同翘曲情况选用不同重量的压块比较繁琐，型号多容易混淆。
发明内容
本发明的目的在于克服上述不足，提供一种后固化夹具套件结构，它能够在后固化工序中固定每一片基板或是金属引线框架，在高温高压中充分释放应力，使基板或金属引线框架达到一定平整能力，为后续工序工作中提供平稳、安全、方便及自动化生产能力。
本发明的目的是这样实现的：一种后固化夹具套件结构，它包括装载料盒，所述装载料盒内设置有多个压合夹具，所述装载料盒包括料盒本体，所述料盒本体内左右两侧设置有多排装载隔断，所述压合夹具放置于装载隔断上，所述压合夹具包括上盖板和下载板，所述上盖板和下载板左侧通过第二铰接件相连接，所述上盖板右侧设置有固定卡扣。
所述料盒本体前侧设置有左右两扇防漏门，所述防漏门通过第一铰接件与料盒本体相连接。
与现有技术相比，本发明具有以下有益效果：
1、本发明的后固化夹具针对单片基板或金属引线框封装进行高温高压下的压力释放，各条基板或金属引线框受到的压力均衡，平整度更好，可有效的解决框架翘曲而产生的后续工序很难进行的问题；
2、本发明的后固化套件利用夹具代替传统的压块，不需要针对不同翘曲度进行压块的调整，适用性更灵活；
3、本单片基板或金属引线框通过夹具进行后固化，避免传统多片堆叠基板或金属引线框之间的夹杂微粒造成高压下的塑封体破坏。
附图说明
    图1为本发明一种后固化夹具套件结构的示意图。
图2为图1中装载料盒的结构示意图。
图3为图1中压合夹具的结构示意图。
其中：
装载料盒1
料盒本体1.1
装载隔断1.2
防漏门1.3
第一铰接件1.4
压合夹具2
上盖板2.1
下载板2.2
固定卡扣2.3
第二铰接件2.4。
具体实施方式
参见图1，本发明一种后固化夹具套件结构，它包括装载料盒1，所述装载料盒1内设置有多个压合夹具2，所述装载料盒1包括料盒本体1.1，所述料盒本体1.1内左右两侧设置有多排装载隔断1.2，所述压合夹具2放置于装载隔断1.2上，所述料盒本体1.1前侧设置有左右两扇防漏门1.3，所述防漏门1.3通过第一铰接件1.4与料盒本体1.1相连接，当压合夹具全部放置完毕后将防漏门1.3通过第一铰接件1.4旋转合上，防止压合夹具因倾斜而掉出装载料盒，所述压合夹具2包括上盖板2.1和下载板2.2，所述上盖板2.1和下载板2.2左侧通过第二铰接件2.4相连接，上盖板2.1和下载板2.2通过第二铰接件2.4可转动开合，所述上盖板2.1右侧设置有固定卡扣2.3，当上盖板2.1与下载板2.2合上时可通过固定卡扣2.3进行固定，使夹具不会因框架翘曲而弹起变形。

Claims (2)

1.一种后固化夹具套件结构，其特征在于：它包括装载料盒（1），所述装载料盒（1）内设置有多个压合夹具（2），所述装载料盒（1）包括料盒本体（1.1），所述料盒本体（1.1）内左右两侧设置有多排装载隔断（1.2），所述压合夹具（2）放置于装载隔断（1.2）上，所述压合夹具（2）包括上盖板（2.1）和下载板（2.2），所述上盖板（2.1）和下载板（2.2）左侧通过第二铰接件（2.4）相连接，所述上盖板（2.1）右侧设置有固定卡扣（2.3）。
2.根据权利要求1所述的一种后固化夹具套件结构，其特征在于：所述料盒本体（1.1）前侧设置有左右两扇防漏门（1.3），所述防漏门（1.3）通过第一铰接件（1.4）与料盒本体（1.1）相连接。
CN201410823543.3A 2014-12-26 2014-12-26 一种后固化夹具套件结构 Active CN104465484B (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112652568A (zh) * 2020-12-17 2021-04-13 苏州远创达科技有限公司 一种微电子器件封装的自动化量产型夹具

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010056904A (ko) * 1999-12-17 2001-07-04 윤종용 반도체 패키지 경화 장치 및 그를 이용한 경화 방법
US20050136567A1 (en) * 2003-12-18 2005-06-23 Yuan Yuan Warpage control of array packaging
KR100848283B1 (ko) * 2006-08-11 2008-07-25 주식회사 피앤드엠 자동 큐어 오븐
CN101944489A (zh) * 2009-07-07 2011-01-12 株式会社村田制作所 复合基板的制造方法
CN204335166U (zh) * 2014-11-24 2015-05-13 北京半导体照明科技促进中心 一种软基板夹具
CN204375718U (zh) * 2014-12-26 2015-06-03 江苏长电科技股份有限公司 一种后固化夹具套件结构

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010056904A (ko) * 1999-12-17 2001-07-04 윤종용 반도체 패키지 경화 장치 및 그를 이용한 경화 방법
US20050136567A1 (en) * 2003-12-18 2005-06-23 Yuan Yuan Warpage control of array packaging
KR100848283B1 (ko) * 2006-08-11 2008-07-25 주식회사 피앤드엠 자동 큐어 오븐
CN101944489A (zh) * 2009-07-07 2011-01-12 株式会社村田制作所 复合基板的制造方法
CN204335166U (zh) * 2014-11-24 2015-05-13 北京半导体照明科技促进中心 一种软基板夹具
CN204375718U (zh) * 2014-12-26 2015-06-03 江苏长电科技股份有限公司 一种后固化夹具套件结构

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112652568A (zh) * 2020-12-17 2021-04-13 苏州远创达科技有限公司 一种微电子器件封装的自动化量产型夹具
CN112652568B (zh) * 2020-12-17 2023-11-03 苏州远创达科技有限公司 一种微电子器件封装的自动化量产型夹具

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