CN104462735A - Method for simulating coaxially-packaged TOSA temperature distribution - Google Patents
Method for simulating coaxially-packaged TOSA temperature distribution Download PDFInfo
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- CN104462735A CN104462735A CN201510023479.5A CN201510023479A CN104462735A CN 104462735 A CN104462735 A CN 104462735A CN 201510023479 A CN201510023479 A CN 201510023479A CN 104462735 A CN104462735 A CN 104462735A
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Abstract
The invention provides a method for simulating coaxially-packaged TOSA temperature distribution. The method includes the following steps that a coaxially-packaged TOSA model is established through 3D modeling software SolidWorks according to acquired TOSA model parameters; an optimization algorithm for simulation analysis is designed based on ANSYS, and the step size and thermal loads are changed and analyzed in real time in the simulation analysis process; simulation under various conditions is achieved through a design program; a curve reflecting the change of the temperature of monitoring points along with time and a model internal temperature distribution graph are drawn. Thermodynamics simulation is conducted through the ANSYS, the stepping gradient is changed in real time through the step size optimization algorithm in the analysis and calculation process, the simulation speed is increased, final simulation accuracy is improved through control over the temperature close to that in a steady state, and the method has a guiding significance in TOSA packaging and internal optimization.
Description
Technical field
The present invention relates to a kind of emulation mode of coaxial packaging TOSA Temperature Distribution, belong to the technical field of optical communication.
Background technology
Coaxial packaging light emission module (TOSA) because it is low in energy consumption, be easy to aim at, coupling efficiency is high, be convenient to the advantages such as modulation and low cost of manufacture can be mass-produced, be widely used in optical fiber communication.In the past in 10 years, the TOSA of coaxial packaging 10Gbit/s occupies most market with its high-quality cost performance.But along with the proposition of next-generation communication network standard, the optical-fibre channel of 21Gbit/s transfer rate and gigabit ten thousand mbit ethernet become the development trend of fiber optic network, the TOSA of 10Gbit/s can not meet the demand of people gradually.At present, the manufacturing technology of distributed feedback (DFB) laser instrument is day by day ripe, and its modulation rate can more than 40Gbit/s, and the principal element affecting TOSA module communication speed is encapsulating structure and high-temperature behavior.Along with the increase of traffic rate, the output power of semiconductor laser also increases considerably.Because the duty temperature influence of laser instrument is very large, its high-temperature working performance directly affects stability and the reliability of TOSA, thermal accumlation and temperature can be caused to raise if do not carry out temperature control, and then affect the performance such as power, luminescence efficiency, wavelength that it exports light, and the serviceable life of device can be greatly reduced.For ensureing the steady operation of laser instrument, need to pay close attention to its temperature characterisitic under various conditions, thus heat management becomes the inner requisite part of TOSA.The thermal model set up close to real devices predicts that the thermal behavior of TOSA optimizes the packing forms of TOSA and the important means of inner structure.
Summary of the invention
For existing technical deficiency, the invention provides a kind of emulation mode of coaxial packaging TOSA Temperature Distribution.The present invention has the advantages such as simulation velocity is fast, counting accuracy is high, parameter is controlled, real-time monitored.
Technical scheme of the present invention is as follows:
An emulation mode for coaxial packaging TOSA Temperature Distribution, comprises step as follows:
1) adopt 3D modeling software SolidWorks to set up coaxial packaging TOSA model according to the TOSA model parameter obtained, described TOSA model parameter comprises Distributed Feedback Laser, substrate, thermistor, L-type substrate, thermoelectric refrigerating unit (TEC), pedestal, the device-structure dimensions of coupled lens and device material attribute;
2) based on the optimized algorithm of ANSYS Software for Design simulation analysis, in simulation analysis process, step-length and thermal force is analyzed by changing in real time; Accelerate simulation velocity, improve the degree of accuracy of simulation result;
3) programming parametric is designed program, according to step 2) optimized algorithm that designs writes and designs program, and realizes the adjustment to initial temperature, ambient temperature, laser power and thermoelectric refrigerating unit load parameter in simulation process; The emulation under various condition is realized by designing program;
4) by extracting the temperature data of monitoring point and each emulation device on described TOSA model, monitoring point temperature change curve and model interior temperature distribution figure is in time drawn out.
Preferred according to the present invention, in step 2)-4) the middle emulation adopting the ANSYS software based on finite element method to carry out temperature field; In analytical calculation process, by using step 2) temperature simulation that the step-length optimized algorithm that designs realizes coaxial packaging TOSA fast, step is as follows: described step-length optimized algorithm comprises successively:
Step one: the device-structure dimensions importing the solid model of coaxial packaging TOSA in ANSYS software, comprises and is directed in ANSYS by the device-structure dimensions of Distributed Feedback Laser, substrate, thermistor, L-type substrate, thermoelectric refrigerating unit (TEC), pedestal, coupled lens and space structure;
Step 2: carry out FEM meshing to described TOSA solid model, forms hardware unit:
First, in definition step one, the material properties of each device and cell type, select thermal analyses cell S OLID279;
Then, stress and strain model is carried out to described hardware model, take the mode of manually picking up hardware, namely choose device one by one by the entity number of entering apparatus; The principle of model pickup is first little rear large middle again, namely first picks up the minimum hardware of dimensional structure, then the hardware that pick-up structure size is maximum, and then the hardware of pick-up structure moderate dimensions, is connected between described hardware unit;
Step 3: arranging analysis type is transient state; Add heat-carrying production rate load and boundary condition, set the initial temperature Temp0 of all device cells, setting steady temperature TempTar; Setting-up time starting point Time0, setting initial time step delta T are the minimum time step-length in ANSYS;
Step 4: the temperature value Temp1 calculating future time point Time1=Time0+ Δ T; Difference size between accounting temperature value Temp1 and steady temperature TempTar, if | Temp1-TempTar|≤0.05, then definition time point Time1 be finishing temperature constant time time EndTime, read the result of final step, draw temperature profile; If | Temp1-TempTar| > 0.05, then run lower step 5;
Step 5: stepping slope k=(Temp1-Temp0)/(Time1-Time0) of calculation procedure four, utilizes this slope to set time step next time as Δ T=(TempTar-Tepm1)/k;
Step 6: make Time0=Time1, Temp0=Temp1, returns step 4 and circulates.
Advantage of the present invention:
The emulation mode of a kind of coaxial packaging TOSA Temperature Distribution of the present invention, adopts CAD modeling software SolidWorks to establish the 3D model of the inner real structure of reflection TOSA and thermal characteristic.
The emulation mode of a kind of coaxial packaging TOSA Temperature Distribution of the present invention, finite element analysis software ANSYS is adopted to carry out thermodynamics emulation, and in analytical calculation process, use step-length optimized algorithm to change stepping slope in real time accelerate simulation velocity, simultaneously also improving final emulation degree of accuracy close to control during steady temperature, there is directive significance to the encapsulation of TOSA and interior optimization.Step-length optimized algorithm can Optimal Step Size flexibly, has taken into account the degree of accuracy of calculation times and result.The super large calculated amount caused under avoiding fixing little step-length situation and the excessive result of calculation caused of fixed step size inaccurate.
Accompanying drawing explanation
Fig. 1 is the structural drawing of coaxial packaging TOSA model;
Fig. 2 is the sectional view of coaxial packaging TOSA model;
Fig. 3 is the operational flowchart of step-length optimized algorithm of the present invention;
Fig. 4 is fixed step size transient temperature curve when being 0.001s, comprises laser instrument thermal source, thermistor, TEC cold junction and four, TEC hot junction temperature curve;
Fig. 5 is the transient temperature curve using step-length optimized algorithm of the present invention to obtain;
In Fig. 4, Fig. 5,1, laser heat source temperature curve; 2, thermistor temp curve; 3, TEC cold junction temperature curve; 4, TEC hot-side temperature curve;
The temperature profile of coaxial packaging TOSA when Fig. 6 is fixed step size 0.01s;
The temperature profile of coaxial packaging TOSA when Fig. 7 is fixed step size 0.01s;
Fig. 8 is the coaxial packaging TOSA interior temperature distribution figure using step-length optimized algorithm of the present invention to obtain;
Fig. 9 is the coaxial packaging TOSA substrate surface temperature distribution plan using step-length optimized algorithm of the present invention to obtain.
Embodiment
Below in conjunction with accompanying drawing and embodiment, the invention will be further described, but be not limited thereto.
Embodiment
An emulation mode for coaxial packaging TOSA Temperature Distribution, comprises step as follows:
1) adopt 3D modeling software SolidWorks to set up coaxial packaging TOSA model according to the TOSA model parameter obtained, described TOSA model parameter comprises Distributed Feedback Laser, substrate, thermistor, L-type substrate, thermoelectric refrigerating unit (TEC), pedestal, the device-structure dimensions of coupled lens and device material attribute; The present invention adopts CAD modeling software SolidWorks to set up the 3D model of the inner real structure of reflection TOSA and thermal characteristic, and cut-away view and sectional view are as shown in Figure 1 and Figure 2;
2) based on the optimized algorithm of ANSYS Software for Design simulation analysis, in simulation analysis process, step-length and thermal force is analyzed by changing in real time;
3) programming parametric is designed program, according to step 2) optimized algorithm that designs writes and designs program, and realizes the adjustment to initial temperature, ambient temperature, laser power and thermoelectric refrigerating unit load parameter in simulation process;
4) by extracting the temperature data of monitoring point and each emulation device on described TOSA model, monitoring point temperature change curve and model interior temperature distribution figure is in time drawn out.
As shown in Figure 3, in step 2)-4) the middle emulation adopting the ANSYS software based on finite element method to carry out temperature field; In analytical calculation process, by using step 2) the step-length optimized algorithm that designs realizes to coaxial packaging TOSA temperature simulation fast, step is as follows: be-20 DEG C for initial temperature and ambient temperature, the temperature of laser instrument is measured with thermistor, during setting thermistor stable state, temperature is 43 DEG C, and temperature deviation is less than 0.1 DEG C for example:
Step one: the device-structure dimensions importing the solid model of coaxial packaging TOSA in ANSYS software, comprises and is directed in ANSYS by the device-structure dimensions of Distributed Feedback Laser, substrate, thermistor, L-type substrate, thermoelectric refrigerating unit (TEC), pedestal, coupled lens and space structure;
Step 2: carry out FEM meshing to described TOSA solid model, forms hardware unit:
First, in definition step one, the material properties of each device and cell type, select thermal analyses cell S OLID279;
Then, stress and strain model is carried out to described hardware model, take the mode of manually picking up hardware, namely choose device one by one by the entity number of entering apparatus; The principle of model pickup is first little rear large middle again, namely first picks up the minimum hardware of dimensional structure, then the hardware that pick-up structure size is maximum, and then the hardware of pick-up structure moderate dimensions, is connected between described hardware unit;
Step 3: arranging analysis type is transient state; Add heat-carrying production rate load and boundary condition, set the initial temperature Temp0 of all device cells as-20 DEG C, setting steady temperature TempTar is 43 DEG C; Setting-up time starting point Time0 is 0s, and setting initial time step delta T is the minimum time step-length 0.001s in ANSYS;
Step 4: the temperature value Temp1 calculating future time point Time1=Time0+ Δ T; Difference size between accounting temperature value Temp1 and steady temperature TempTar, if | Temp1-TempTar|≤0.05, then definition time point Time1 be finishing temperature constant time time EndTime, read the result of final step, draw temperature profile; If | Temp1-TempTar| > 0.05, then run lower step 5;
Step 5: stepping slope k=(Temp1-Temp0)/(Time1-Time0) of calculation procedure four, utilizes this slope to set time step next time as Δ T=(TempTar-Tepm1)/k;
Step 6: make Time0=Time1, Temp0=Temp1, returns step 4 and circulates.
Found out by comparison diagram 4 and Fig. 5, adopt step-length optimized algorithm can greatly shorten the simulation calculating time compared to fixing minimum step; Seen by comparison diagram 6, Fig. 7 and Fig. 8, Fig. 9, step-length optimized algorithm is adopted to considerably increase emulation degree of accuracy compared to fixed step size 0.01s, the simulation result identification of Fig. 6, Fig. 7 is not high, high-temperature part cannot show, and Fig. 8, Fig. 9 can show the Temperature Distribution cloud atlas of TOSA inside clearly, and avoid internal temperature higher part and divide the situation that cannot show.
By reference to the accompanying drawings the specific embodiment of the present invention is described although above-mentioned; but not limiting the scope of the invention; one of ordinary skill in the art should be understood that; on the basis of technical scheme of the present invention, those skilled in the art do not need to pay various amendment or distortion that creative work can make still within protection scope of the present invention.
Claims (2)
1. an emulation mode for coaxial packaging TOSA Temperature Distribution, is characterized in that, it is as follows that the method comprising the steps of:
1) adopt 3D modeling software SolidWorks to set up coaxial packaging TOSA model according to the TOSA model parameter obtained, described TOSA model parameter comprises Distributed Feedback Laser, substrate, thermistor, L-type substrate, thermoelectric refrigerating unit, pedestal, the device-structure dimensions of coupled lens and device material attribute;
2) based on the optimized algorithm of ANSYS Software for Design simulation analysis, in simulation analysis process, step-length and thermal force is analyzed by changing in real time;
3) programming parametric is designed program, according to step 2) optimized algorithm that designs writes and designs program, and realizes the adjustment to initial temperature, ambient temperature, laser power and thermoelectric refrigerating unit load parameter in simulation process;
4) by extracting the temperature data of monitoring point and each emulation device on described TOSA model, monitoring point temperature change curve and model interior temperature distribution figure is in time drawn out.
2. the emulation mode of a kind of coaxial packaging TOSA Temperature Distribution according to claim 1, is characterized in that, in step 2)-4) in adopt the ANSYS software based on finite element method to carry out the emulation in temperature field; In analytical calculation process, by using step 2) temperature simulation that the step-length optimized algorithm that designs realizes coaxial packaging TOSA fast, step is as follows: described step-length optimized algorithm comprises successively:
Step one: the device-structure dimensions importing the solid model of coaxial packaging TOSA in ANSYS software, comprises and is directed in ANSYS by the device-structure dimensions of Distributed Feedback Laser, substrate, thermistor, L-type substrate, thermoelectric refrigerating unit (TEC), pedestal, coupled lens and space structure;
Step 2: carry out FEM meshing to described TOSA solid model, forms hardware unit:
First, in definition step one, the material properties of each device and cell type, select thermal analyses cell S OLID279;
Then, stress and strain model is carried out to described hardware model, take the mode of manually picking up hardware, namely choose device one by one by the entity number of entering apparatus; The principle of model pickup is first little rear large middle again, namely first picks up the minimum hardware of dimensional structure, then the hardware that pick-up structure size is maximum, and then the hardware of pick-up structure moderate dimensions, is connected between described hardware unit;
Step 3: arranging analysis type is transient state; Add heat-carrying production rate load and boundary condition, set the initial temperature Temp0 of all device cells, setting steady temperature TempTar; Setting-up time starting point Time0, setting initial time step delta T are the minimum time step-length in ANSYS;
Step 4: the temperature value Temp1 calculating future time point Time1=Time0+ Δ T; Difference size between accounting temperature value Temp1 and steady temperature TempTar, if | Temp1-TempTar|≤0.05, then definition time point Time1 be finishing temperature constant time time EndTime, read the result of final step, draw temperature profile; If | Temp1-TempTar| > 0.05, then run lower step 5;
Step 5: stepping slope k=(Temp1-Temp0)/(Time1-Time0) of calculation procedure four, utilizes this slope to set time step next time as Δ T=(TempTar-Tepm1)/k;
Step 6: make Time0=Time1, Temp0=Temp1, returns step 4 and circulates.
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Cited By (4)
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| CN105024276A (en) * | 2015-06-16 | 2015-11-04 | 山东大学 | Semiconductor laser temperature simulation method based on TEC temperature control |
| CN107153724A (en) * | 2017-04-20 | 2017-09-12 | 西安电子科技大学 | Chip temperature analysis method based on iterative algorithm |
| CN107220406A (en) * | 2017-04-25 | 2017-09-29 | 西安电子科技大学 | A kind of method for predicting semiconductor device temperature distribution |
| CN109657414A (en) * | 2019-01-29 | 2019-04-19 | 中国电子科技集团公司第二十九研究所 | A kind of electromagnetic field and temperature field joint simulation method of highly integrated system |
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| CN101178747A (en) * | 2007-12-18 | 2008-05-14 | 东北大学 | Method for forecasting transient state temperature field with S type step length changing method in the process of plate belt hot rolling |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105024276A (en) * | 2015-06-16 | 2015-11-04 | 山东大学 | Semiconductor laser temperature simulation method based on TEC temperature control |
| CN105024276B (en) * | 2015-06-16 | 2018-03-09 | 山东大学 | A kind of temperature simulation method of the semiconductor laser based on TEC temperature controls |
| CN107153724A (en) * | 2017-04-20 | 2017-09-12 | 西安电子科技大学 | Chip temperature analysis method based on iterative algorithm |
| CN107153724B (en) * | 2017-04-20 | 2020-10-30 | 西安电子科技大学 | Chip temperature analysis method based on iterative algorithm |
| CN107220406A (en) * | 2017-04-25 | 2017-09-29 | 西安电子科技大学 | A kind of method for predicting semiconductor device temperature distribution |
| CN109657414A (en) * | 2019-01-29 | 2019-04-19 | 中国电子科技集团公司第二十九研究所 | A kind of electromagnetic field and temperature field joint simulation method of highly integrated system |
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Application publication date: 20150325 |