CN104446001A - Production method of electromagnetic shielding glass based on conductive grid structure - Google Patents
Production method of electromagnetic shielding glass based on conductive grid structure Download PDFInfo
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- CN104446001A CN104446001A CN201410751929.8A CN201410751929A CN104446001A CN 104446001 A CN104446001 A CN 104446001A CN 201410751929 A CN201410751929 A CN 201410751929A CN 104446001 A CN104446001 A CN 104446001A
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- glass
- powder
- electromagnetic shielding
- lattice
- making method
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
- C03C17/008—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character comprising a mixture of materials covered by two or more of the groups C03C17/02, C03C17/06, C03C17/22 and C03C17/28
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B27/00—Tempering or quenching glass products
- C03B27/012—Tempering or quenching glass products by heat treatment, e.g. for crystallisation; Heat treatment of glass products before tempering by cooling
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/40—Coatings comprising at least one inhomogeneous layer
- C03C2217/43—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/40—Coatings comprising at least one inhomogeneous layer
- C03C2217/43—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase
- C03C2217/46—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase
- C03C2217/47—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase consisting of a specific material
- C03C2217/475—Inorganic materials
- C03C2217/479—Metals
Abstract
The invention relates to a production method of electromagnetic shielding glass based on conductive grid structure. The production method comprises the following steps: (a) preparing a printing sizing agent, mixing nickel-coated copper powder, glass powder, boron powder and an organic binder evenly; (b) preparing grid patterns by utilizing the printing sizing agent; (c) transferring the grid patterns onto the surface of the glass; and (d) toughening the glass. According to the method, the conductive grid patterns are pre-printed on transfer paper, then the transfer paper with the conductive grid patterns are transferred onto the surface of the glass, and toughening treatment is performed, so that the conductive grids are sintered on the surface of the glass, and the high-strength electromagnetic shielding glass can be produced. The electromagnetic shielding glass not only has stable electromagnetic shielding property, but also has extremely high safety performance. As only one piece of glass is needed, so that the weight and thickness of the electromagnetic shielding glass can be greatly reduced, the product cost can be lowered, and the transparency is also improved under the situation that the shielding effect is close to that of the existing wire mesh clamping method.
Description
Technical field
The present invention relates to electromagnetic shielding glass field, particularly relate to a kind of making method of the electromagnetic shielding glass based on conductive grid structure.
Background technology
Electromagnetic shielding glass is that one can suppress hertzian wave to penetrate, and has again the special glass of certain visual function.Because glass itself there is no the function of shielding electromagnetic wave, normally by glass and electromagnetic shield produced with combination electromagnetic shielding glass.Existing making method mainly contains three kinds: between two sheet glass, press from both sides wire cloth, at glass surface plating conductive film, in glassy phase, mix conducting particles.
First method uses maximum methods at present; the electromagnetic shielding glass typical structure that the method makes is: glass+resin film+wire cloth+resin film+glass; wire cloth is wherein electromagnetic shield; be bonded between two sheet glass by resin film, glass plays clamping and protection silk screen.The common step of the method is: prepare wire cloth---close sheet, by wire cloth, plateholder between two sheet glass---preheating precompressed, bubble in preliminary discharge interlayer, and film and glass, silk screen are tentatively bondd---and send into autoclave and carry out high temperature high pressure process, make glass, film and silk screen be bonded as one---obtain electromagnetic shielding glass.
Wire cloth is in fact a kind of conductive grid structure, and conductive grid structure has reflection, sorption to hertzian wave, and the eddy-current loss that induction produces is also very large.The order number of grid, wire diameter have a direct impact shield effectiveness, each mesh all can regard waveguide as, and when the limiting frequency of wave frequency higher than waveguide, hertzian wave can freely pass through, when wave frequency is lower than limiting frequency, conductive grid plays the effect of shielding.This electromagnetic shielding glass based on conductive grid structure has good effectiveness of shielding and certain transparence.
Although the method for existing folder wire cloth method extensively adopts, also there is following shortcoming: (1), due to the clamping of needs two panels glass, cause the weight of product large, thickness is large; (2) close silk screen in sheet process yielding, cause product effectiveness of shielding to decline.Due to the flexible material that wire cloth itself is frivolous, when the excessive tensile when closing sheet and being laid or the gauffer of generation, the became uneven of film or excessive tensile and high temperature high pressure process, the film shrinkage strain etc. that causes of temperature inequality all can cause silk screen to be out of shape; (3) finished product easily comes unglued, and makes wire cloth be subject to the erosion of air and steam, causes effectiveness of shielding to decline.Coming unglued is the comparatively common quality problems of method of laminating glass, and humid environment, glass surface are unholiness, sandwich material is unholiness, high temperature high pressure process process temperature is low etc. all can cause sandwich structure to come unglued; (4), when making wire cloth, easily there is the problem of loose contact in silk screen point of crossing, causes effectiveness of shielding to decline.
Summary of the invention
The present invention aims to provide a kind of making method of the electromagnetic shielding glass based on conductive grid structure, when not changing effectiveness of shielding and translucent effect, compared with existing folder wire cloth method, effectively can alleviate weight and the thickness of product, improve the stability of the quality and performance of product.
In order to reach above-mentioned purpose, providing a kind of making method of the electromagnetic shielding glass based on conductive grid structure, comprising the following steps (a) and prepare printing slurry, by nickel coated copper powder, glass powder, boron powder, and organic binder bond mixing and stirring; B () utilizes described printing slurry to make lattice; C described lattice is posted at glass surface by (); And (d) make described glass tempering.
In some embodiments, described nickel coated copper powder, glass powder, boron powder, and organic binder bond is by mass percentage (55 ~ 75%): (1 ~ 7%): (10 ~ 20%): (14 ~ 16%) ratio mixing and stirring.
In some embodiments, described nickel coated copper powder be select particle diameter to be the nickel coated copper powder of 60 ~ 90nm and particle diameter to be the nickel coated copper powder of 0.8 ~ 1.2 μm with 8: 1 ratio mix.
In some embodiments, described glass powder is B
2o
3-SiO
2-Bi
2o
3system glass, mass percent is SiO
215 ~ 35%, B
2o
310 ~ 50%, Bi
2o
320 ~ 55%, surplus is A1
2o
3+ ZnO+MgO.
In some embodiments, the particle diameter of described glass powder is 3.0 ~ 5.0 μm.
In some embodiments, the particle diameter of described boron powder is 1.0 ~ 3.0 μm.
In some embodiments, utilize described printing slurry to make lattice and comprise the printing screen plate of making lattice and lattice is printed on water-transfer printing paper.
In some embodiments, described glass tempering is comprised the glass being printed on lattice is sent into annealing furnace, after the high temperature homogeneous heating of about 600 DEG C, described glass chilling becomes toughened glass.
In some embodiments, adjust order number and the wire diameter of described lattice, to reach the masking value of the electromagnetic shielding glass of needs.
In some embodiments, the conductive grid order number of described lattice is 16 ~ 100 orders, and wire diameter is 85 ~ 500 μm.
Conductive grid pattern is printed on transfer paper by method provided by the invention in advance, is then posted at glass surface, then through tempering process, conductive grid is sintered at glass surface, obtained high-strength magnetic shield glass.This electromagnetic shielding glass not only has stable capability of electromagnetic shielding, but also has high safety performance.Owing to only needing a sheet glass, significantly reduce weight and the thickness of product, reduce product cost, when shield effectiveness is close with existing folder wire cloth method, transparence also increases.In addition, when lattice is posted, arbitrary cutting can be carried out according to the size of glass and face shaping to transfer paper, or even splicing, have height flexibility of operation, this also existing folder wire cloth method cannot accomplish.
Below in conjunction with accompanying drawing, the description of purport of the present invention is described by example, to know other aspects of the present invention and advantage.
Accompanying drawing explanation
By reference to the accompanying drawings, by detailed description hereafter, above-mentioned and other feature and advantage of the present invention more clearly can be understood, wherein:
Fig. 1 is the schema of the making method of the electromagnetic shielding glass in conductive grid structure according to the embodiment of the present invention.
Embodiment
See the accompanying drawing of the specific embodiment of the invention, hereafter in more detail the present invention will be described.But the present invention can realize in many different forms, and should not be construed as by the restriction in the embodiment of this proposition.On the contrary, it is abundant and complete open in order to reach for proposing these embodiments, and makes those skilled in the art understand scope of the present invention completely.
Refer now to Fig. 1, describe the making method according to a kind of electromagnetic shielding glass based on conductive grid structure of the embodiment of the present invention in detail.
In step S101, prepare printing slurry, by nickel coated copper powder, glass powder, boron powder, and organic binder bond mixing and stirring.Described nickel coated copper powder, glass powder, boron powder, and organic binder bond is by mass percentage (55 ~ 75%): (1 ~ 7%): (10 ~ 20%): (14 ~ 16%) ratio mixing and stirring.Described nickel coated copper powder is conductive phase, is the main body of printing slurry, be select the nickel coated copper powder of the nickel coated copper powder of particle diameter 60 ~ 90nm and particle diameter 0.8 ~ 1.2 μm with 8: 1 ratio mix obtained.
Described glass powder is B
2o
3-SiO
2-Bi
2o
3system glass, mass percent is SiO
215 ~ 35%, B
2o
310 ~ 50%, Bi
2o
320 ~ 55%, surplus is A1
2o
3+ ZnO+MgO.Found out frit by formula, be then milled down to particle diameter 3.0 ~ 5.0 μm for subsequent use.The effect of glass powder is by high-temperature sintering process, makes conductive particle be attached to glass surface securely.
The particle diameter of described boron powder is 1.0 ~ 3.0 μm.Boron powder is antioxidant, plays a part to suppress metal-powder to be oxidized in sintering process.
In step S102, described printing slurry is utilized to make lattice; Utilize described printing slurry to make lattice comprise the printing screen plate of making lattice and lattice is printed on water-transfer printing paper.
In step S103, described lattice is posted at glass surface.
In step S104, make described glass tempering.Glass tempering, grid sinters, and the glass being printed on lattice is sent into annealing furnace, after the high temperature homogeneous heating of about 600 DEG C, glass chilling becomes toughened glass, and conductive grid also sinters at glass surface in pyroprocess, become to be integrated with glass, obtained high-strength magnetic shield glass.
In some embodiments, adjust order number, the wire diameter of described lattice, to reach the masking value of the electromagnetic shielding glass of needs.The conductive grid order number of such as described lattice is 16 ~ 100 orders, and wire diameter is 85 ~ 500 μm.
Nickel coated copper powder is a kind of composite material, is to carry out Nickel Plating Treatment acquisition to Copper Powder Surface, the advantage such as have linear, distinguishing with its obtained printing slurry and printing performance is good.The high conductivity that metallic copper can be kept excellent by the conductive grid that nickel-plated copper powder sintering is obtained and the function of shielding to high resistance electric field, having again the good resistance of oxidation of metallic nickel and the function of shielding to low resistance magnetic field, is a kind of electromagnetic shielding material having good effectiveness of shielding in wider frequency range.
B
2o
3-SiO
2-Bi
2o
3glass powder belongs to borosilicate system glass, SiO wherein
2, B
2o
3form glass body material, B
2o
3can also glass melting be promoted, suppress glass excessive thermal expansion, and under making high temperature, melten glass have good mobility.Bi is adjacent with Pb in the periodic table of elements, and character is close, and fusing point is low, replaces Pb to can be made into crown glass, meet environmental requirement, add Bi in right amount with it
2o
3glass transition temperature can be made lower than 560 DEG C, make print material can complete sintering under tempering temperature.A1
2o
3adjustable physical strength, chemical stability and temperature of fusion.ZnO can reduce glass softening point, make to have during glass high temperature melting the effect of good mobility and adjustment glass thermal expansion.Diatomic base metal oxide has adjustment and controls thermal expansion coefficient of glass, makes its performance meet the requirement of sintering temperature, sheet resistance and adhesion strength simultaneously.
In high-temperature sintering process, B
2o
3-SiO
2-Bi
2o
3the melting expansion of system glass powder, infiltrate conductive particle and glass substrate, conductive phase granule is uniformly distributed, surface tension effects by liquid phase makes conductive particle reunite, close contact, forms good ohmic contact, low-resistance conductive path is formed through fully sintering, melten glass can enter the small spaces between conductive particle simultaneously, combines together after solidification, thus make conductive particle be attached to glass surface securely with substrate.
After toughening process starts, along with the rising of temperature, the outer nickel film surface of nickel coated copper powder can be oxidized gradually, but oxidizable boron powder is preferential and oxygen reaction, the strongly inhibited process of nickel film oxidation, the B of oxidation generation
2o
3be frit, it and glass powder composition are melt into new glass composition mutually, along with glass powder melting gradually, and B
2o
3form eutectic mixture with melten glass and soak nickel film, and the partial oxidation nickel on eating away nickel film surface can be melted, thus achieve nickel coated copper powder at aerial anti-oxidant sintering.
Organic binder bond as the carrier of nickel coated copper powder, glass powder, boron powder, plays the viscosity of adjustment slurry, rheological, thixotropic effect in electrocondution slurry, progressively volatilization burning removing in high-temperature sintering process.
Under normal circumstances, the particle of metal-powder is thinner, specific surface area is larger, and surface energy is also higher, therefore also more easily reunites.The phenomenon that nano level nickel coated copper powder has dispersion uneven in sintering process, easily has the hole be separated from each other and non-continuous event between conductive particle, and the defect on these microcosmic result in material macroscopic view electroconductibility and declines, and finally makes the effectiveness of shielding of grid decline.A certain proportion of micron powder is mixed in nano level nickel coated copper powder, the effect that conduction breakpoint is filled or connected can be played to a certain extent, add the ohmic contact between conductive particle, facilitate the formation of conductive path, thus be conducive to the raising of grid shielding properties.
The present invention does not adopt mode conductive grid pattern being directly printed on glass surface, is because glass surface state is unsuitable for the meticulous printing of micron order fine rule.The main component of glass is SiO
2, silicon is mainly at inside glass, and Sauerstoffatom is at glass surface, and this structure has very high surface energy, and the moisture easily in air is combined, and forms hydrophilic group because floating over glass surface, makes printing slurry adhere to difficulty.Glass surface also has basic ion, and the Na-O key of formation is easy at empty G&W break key, and printing slurry also can be caused to be difficult to attachment.In addition, glass surface belongs to non-absorbent surface, easily causes the stream of printing fine line to plow distortion or alligatoring.And lattice is printed on the good paper substrate of water-absorbent, be then very easy to realize meticulous printing.In addition, meticulous printing requires high to environmental factorss such as humidity, dust, electrostatic, and tempering factory is difficult to the condition reaching commercial printing factory.
Specific embodiment 1
Method provided by the invention is specifically implemented according to the following steps:
(1) preparation conduction printing slurry
Select particle diameter to be the nickel coated copper powder of 60 ~ 90nm and particle diameter to be the nickel coated copper powder of 0.8 ~ 1.2 μm, in the ratio mixing for standby use of 8: 1;
Preparation B
2o
3-SiO
2-Bi
2o
3system glass powder, by SiO
225%, B
2o
332%, Bi
2o
327%, A1
2o
3+ ZnO+MgO=16% mass percent fusion cast glass material, is then milled down to particle diameter 3.0 ~ 5.0 μm for subsequent use;
Particle diameter is selected to be that the boron powder of 1.0 ~ 3.0 μm is for subsequent use;
Organic binder bond is by Terpineol 350, ethyl cellulose and hydroxyl alcohol, and adding organic acid is curtain coating agent, adds special salt and makes as thixotropic agent.
By above-mentioned ready nickel coated copper powder, B
2o
3-SiO
2-Bi
2o
3system glass powder, boron powder and organic binder bond by mass percentage 65%:4%:15%:16% ratio mix, through fully stirring, make that component is even, thixotropy good, modest viscosity, curtain coating is good, evaporation rate is desirable, printing performance is good slurry.
(2) make the printing screen plate of lattice, the order number of grid is 30 orders;
(3) lattice is printed on water-transfer printing paper;
(4) be posted at glass surface by lattice, select window with 6mm glass as pattern carrier, soaked by glass surface, graphics is at glass surface, and after paper substrate departs from, throw off paper substrate, lattice stays glass surface;
(5) glass is sent into annealing furnace, through the tempering temperature of about 600 DEG C, after glass homogeneous heating completes, become toughened glass through chilling, pattern also sinters at glass surface in pyroprocess, obtained electromagnetic shielding glass.
Specific embodiment 2
The concrete implementation step of this example is with specific embodiment 1, and the order number of the printing screen plate grid of making is 80 orders.
Two kinds of obtained electromagnetic shielding glass are detected:
Embodiment 1: conductive grid order number 30 order, wire diameter 300 μm, in the band limits of 30MHz ~ 1000MHz, masking value 75 ~ 45dB, transparence is greater than 73%, glass surface stress 105Mp.
Embodiment 2: conductive grid order number 80 order, wire diameter 160 μm, in the band limits of 30MHz ~ 1000MHz, masking value 90 ~ 58dB, transparence is greater than 70%, glass surface stress 105Mp.
Detected result shows, the product that the masking value of two panels electromagnetic shielding glass and existing folder wire cloth method make is suitable, transparence increases, and shock resistance and the cold-and-heat resistent impact property of glass improve greatly, meets the service requirements as electromagnetic shielding glass completely.
Conductive grid pattern is printed on transfer paper by method provided by the invention in advance, is then posted at glass surface, then through tempering process, conductive grid is sintered at glass surface, obtained high-strength magnetic shield glass.This electromagnetic shielding glass not only has stable capability of electromagnetic shielding, but also has high safety performance.Owing to only needing a sheet glass, significantly reduce weight and the thickness of product, reduce product cost, when shield effectiveness is close with existing folder wire cloth method, transparence also increases.In addition, when lattice is posted, arbitrary cutting can be carried out according to the size of glass and face shaping to transfer paper, or even splicing, have height flexibility of operation, this also existing folder wire cloth method cannot accomplish.
More than describe preferred embodiment of the present invention in detail.Should be appreciated that those of ordinary skill in the art just design according to the present invention can make many modifications and variations without the need to creative work.All technician in the art, all should by the determined protection domain of claims under this invention's idea on the basis of existing technology by the available technical scheme of logical analysis, reasoning, or a limited experiment.
Claims (10)
1. based on a making method for the electromagnetic shielding glass of conductive grid structure, it is characterized in that, comprise the following steps:
A () prepares printing slurry, by nickel coated copper powder, and glass powder, boron powder, and organic binder bond mixing and stirring;
B () utilizes described printing slurry to make lattice;
C described lattice is posted at glass surface by (); And
D () makes described glass tempering.
2. making method according to claim 1, it is characterized in that, described nickel coated copper powder, glass powder, boron powder, and organic binder bond is by mass percentage (55 ~ 75%): (1 ~ 7%): (10 ~ 20%): (14 ~ 16%) ratio mixing and stirring.
3. making method according to claim 2, is characterized in that, described nickel coated copper powder be select particle diameter to be the nickel coated copper powder of 60 ~ 90nm and particle diameter to be the nickel coated copper powder of 0.8 ~ 1.2 μm with 8: 1 ratio mix.
4. making method according to claim 1, is characterized in that, described glass powder is B
2o
3-SiO
2-Bi
2o
3system glass, mass percent is SiO
215 ~ 35%, B
2o
310 ~ 50%, Bi
2o
320 ~ 55%, surplus is A1
2o
3+ ZnO+MgO.
5. making method according to claim 4, is characterized in that, the particle diameter of described glass powder is 3.0 ~ 5.0 μm.
6. making method according to claim 1, is characterized in that, the particle diameter of described boron powder is 1.0 ~ 3.0 μm.
7. making method according to claim 1, is characterized in that, utilizes described printing slurry to make lattice and comprises the printing screen plate of making lattice and be printed on water-transfer printing paper by lattice.
8. making method according to claim 1, is characterized in that, described glass tempering is comprised the glass being printed on lattice is sent into annealing furnace, after the high temperature homogeneous heating of about 600 DEG C, described glass chilling becomes toughened glass.
9. making method according to claim 1, is characterized in that, adjusts order number and the wire diameter of described lattice, to reach the masking value of the electromagnetic shielding glass of needs.
10. making method according to claim 9, is characterized in that, the conductive grid order number of described lattice is 16 ~ 100 orders, and wire diameter is 85 ~ 500 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410751929.8A CN104446001A (en) | 2014-12-10 | 2014-12-10 | Production method of electromagnetic shielding glass based on conductive grid structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410751929.8A CN104446001A (en) | 2014-12-10 | 2014-12-10 | Production method of electromagnetic shielding glass based on conductive grid structure |
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|---|---|
| CN104446001A true CN104446001A (en) | 2015-03-25 |
Family
ID=52892851
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|---|---|---|---|
| CN201410751929.8A Pending CN104446001A (en) | 2014-12-10 | 2014-12-10 | Production method of electromagnetic shielding glass based on conductive grid structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106659107A (en) * | 2017-03-01 | 2017-05-10 | 索曼电子（深圳）有限公司 | Nanoimprint shielding glass and manufacturing method therefor |
| CN107635388A (en) * | 2017-08-25 | 2018-01-26 | 北京精密机电控制设备研究所 | A kind of high transmission rate self-adaptive electromagnetic screening arrangement |
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