CN104427770A - Method for manufacturing power line of modular power supply controller on printed circuit board - Google Patents
Method for manufacturing power line of modular power supply controller on printed circuit board Download PDFInfo
- Publication number
- CN104427770A CN104427770A CN201310407752.5A CN201310407752A CN104427770A CN 104427770 A CN104427770 A CN 104427770A CN 201310407752 A CN201310407752 A CN 201310407752A CN 104427770 A CN104427770 A CN 104427770A
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- China
- Prior art keywords
- power line
- circuit board
- printed circuit
- supply controller
- power supply
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
Abstract
The invention discloses a method for manufacturing a power line of a modular power supply controller on a printed circuit board. The method comprises the following steps: S1, screening a power line from an outgoing line of the modular power supply controller; S2, finding out the width of each power line and the thickness of a copper foil from a relation curve of wire width, cross section and permissible current according to current of each power line; S3, connecting other lines except the power line; and S4, coating copper on a printed circuit board according to the width of each power line and the thickness of the copper foil to form the power line. According to the method for manufacturing the power line of the modular power supply controller on the printed circuit board, the traditional process of binding power lines is improved to coat the copper on each printed circuit board, so that the weight of a module can be largely reduced, the size of the module is reduced, and the heat radiation efficiency is improved; in addition, the method for manufacturing the power line of the modular power supply controller on the printed circuit board is very important to the loss of weight of a satellite.
Description
Technical field
The present invention relates to Modular electrical source controller, particularly relate to the method for the power line printed board of Modular electrical source controller, the cabling of power line printed circuit board (pcb board) bundled for tradition replaces by the method.
Background technology
The power density improving power-supply controller of electric is the trend of satellite power supply development now, and power-supply controller of electric modularized design improves an effective breach of power density just.Because the power-supply controller of electric rigidity of structure of modularized design is high, lighter in weight, easy to maintenance.And be with good expansibility, for the development of product seriation provides strong guarantee.Modular product can be used in multiple model, and ripe technology does not need again to research and develop and verify, substantially reduces the cost of Space Industry, has stepped major step in the direction of generalization and commercialization.
Refer to Fig. 1, in power-supply controller of electric modular design in the past, general employing outside cabling binding method, power cabling is screened, with wire (this wire connects power points, is also referred to as power line), power points 1A with 1B is connected, and is bundled into together, outside along power-supply controller of electric module completes cabling, illustrates three power line 1A, 1B, 1C in Fig. 1.But along with the development of space technology, load is to the improve of power requirement, and power cable needs the electric current that bears increasing, and cooling requirements becomes more and more higher, thus becomes more and more higher to the requirement of cabling.Thus, the wire of a wisp originally, is increased to tens up to a hundred a bundles.The wire weight increased is that power-supply controller of electric adds very large burden, at present, in power-supply controller of electric design, adopts SMD components to become a kind of trend.The maximum feature of SMD components is that components and parts volume is little, highly low, thus module can be allowed to become thinner.And the excessive sectional area of bundle conductor is often thicker than circuit board, directly increasing the thickness of module, is the thickness of power-supply controller of electric module, unit volume bottleneck, causes the advantage of SMD components greatly to reduce.And cluster cabling, as long as its heat radiation is by the surface area of wire self.Be bundled into a branch of wire, surface area can be very limited naturally, directly causes the low of radiating efficiency, such as: agreement: ambient temperature is up to 65 DEG C, and wire must bear the electric current of 30A.Outside cabling is selected to bundle method in this case.Because ambient temperature is up to 65 DEG C, and the maximum temperature that printed board can be born is 125 DEG C.Heat on wire will be transmitted in printed board, so the maximum temperaturerise that this wire can bear is 60 DEG C.As exceeded this temperature, printed board will damage.According to above condition, select No. 20 lines that can bear 150 DEG C.Because No. 20 line sub-thread lowest high-current values are 6.5A.By: wire must bear the electric current of 30A, and by derate requirement, if derating factor is 0.26, then per share wire can cross the electric current of 1.67A.So, altogether need 18 strands of wires.The diameter of this wire is 1.4mm; Unit Weight is 6.7g/m.So total cross section is 27.69mm2.Because the volume bundling wire is excessive, so can only walk along the edge of module, thus the length that wire needs is often very long.If this wire needed the length of 20mm, then the volume of this bundle conductor was 553.8mm3; Area of dissipation (surface area) is 118.8 mm2; Weight is 24.12g.
Summary of the invention
The problem that the present invention solves is the Heavy Weight of the Modular electrical source controller that existing outside cabling binding method is formed, volume is large and radiating efficiency is low problem.
For solving the problem, the invention provides a kind of method of power line printed board of Modular electrical source controller, the method comprises the steps: S1, from the cabling of Modular electrical source controller, filters out power line; S2, the relation curve of electric current is searched at conductor width, cross section and allowing the live width and the thickness of Copper Foil that every bar power line needs according to the electric current in every bar power line; S3, other lines connected except power line; S4, in printed board, cover copper to form power line according to the thickness of described live width and Copper Foil.
Compared with prior art, the present invention has the following advantages:
Because the cabling realized on the wire pcb board of power line function in tradition binding method replaces by the method for the power line printed board of Modular electrical source controller of the present invention, that is, the power line of traditional bundled colligation is improved to each layer of printed board and covers copper, significantly can reduce the weight of module, reduce the volume of module, improve radiating efficiency, significant to the loss of weight of satellite.
Accompanying drawing explanation
Fig. 1 is the structural representation of the Modular electrical source controller that traditional binding method is formed;
Fig. 2 is the flow chart of the method for the power line printed board of Modular electrical source controller of the present invention.
Embodiment
By describing technology contents of the present invention, structural feature in detail, reached object and effect, accompanying drawing is coordinated to be described in detail below in conjunction with embodiment.
Refer to Fig. 2, the method for the power line printed board of Modular electrical source controller of the present invention comprises the steps:
S1, from the cabling of Modular electrical source controller, filter out power line;
S2, the relation curve of electric current is searched at conductor width, cross section and allowing the live width and the thickness of Copper Foil that every bar power line needs according to the electric current in every bar power line; In this step, the relation curve of described conductor width, cross section and permission electric current belongs to known technology, do not repeat them here, namely live width corresponding to this electric current and cross-sectional area can be found in above-mentioned relation curve according to the electric current in every bar power line, and then, obtain live width and copper thickness.
S3, other lines connected except power line; When connecting other cablings, reserve position for superficial layer power cabling, for the power network of other layers reserved hole site as far as possible.
S4, in printed board, cover copper to form power line according to the thickness of described live width and Copper Foil.Printed board described in this step refers to the base material with other structures such as PCB, forms the PCB that namely cabling forms finished product on the substrate according to the thickness of described live width and Copper Foil.Described power line refers to the cabling on pcb board, and the function that just this cabling realizes is the function of power line.In this step, when cabling is connected by via hole between the different layers, the notably watt level of cabling.If it is large to walk linear heat generation rate, then number of vias must be increased.
In sum, because the cabling realized on the wire pcb board of power line function in tradition binding method replaces by the method for the power line printed board of Modular electrical source controller of the present invention, that is, the power line of traditional bundled colligation is improved to each layer of printed board and covers copper, significantly can reduce the weight of module, reduce the volume of module, improve radiating efficiency, significant to the loss of weight of satellite.Such as, arrange: ambient temperature is up to 65 DEG C, and wire must bear the electric current of 30A.Because ambient temperature is up to 65 DEG C, and the maximum temperature that printed board can be born is 125 DEG C.Heat on wire will be transmitted in printed board, so the maximum temperaturerise that this wire can bear is 60 DEG C.As exceeded this temperature, printed board will damage.When selecting method of the present invention in this case, selection sectional area is the Copper Foil of 0.37 mm2.If Copper Foil height is 0.007mm, then the width needed is 5.29mm.At intralamellar part cabling owing to covering copper itself, thus the length covering copper equal a little with the direct beeline of point.If length is 20mm, then the volume covering copper is 0.67mm3; Weight is 6.58g.Heat on Copper Foil first conducts to pcb board, is then dispelled the heat by pcb board.So the area of dissipation of method of the present invention should be the surface area of monoblock pcb board.In general, the breadth length ratio of power-supply controller of electric module can not more than 1:2, so, if this power-supply controller of electric module long be 20mm, then, its surface area can not be less than 200 mm
2.So in general the area of dissipation of method of the present invention is greater than outside cabling binding method.Also proved, compared with this method bundlees method with outside cabling, to there is lightweight, that volume is little and area of dissipation is large advantage by this example.
Claims (1)
1. a method for the power line printed board of Modular electrical source controller, is characterized in that: the method comprises the steps:
S1, from the cabling of Modular electrical source controller, filter out power line;
S2, the relation curve of electric current is searched at conductor width, cross section and allowing the live width and the thickness of Copper Foil that every bar power line needs according to the electric current in every bar power line;
S3, other lines connected except power line;
S4, in printed board, cover copper to form power line according to the thickness of described live width and Copper Foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310407752.5A CN104427770A (en) | 2013-09-10 | 2013-09-10 | Method for manufacturing power line of modular power supply controller on printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310407752.5A CN104427770A (en) | 2013-09-10 | 2013-09-10 | Method for manufacturing power line of modular power supply controller on printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104427770A true CN104427770A (en) | 2015-03-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310407752.5A Pending CN104427770A (en) | 2013-09-10 | 2013-09-10 | Method for manufacturing power line of modular power supply controller on printed circuit board |
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| CN (1) | CN104427770A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109040909A (en) * | 2018-07-10 | 2018-12-18 | 合肥联宝信息技术有限公司 | Power regulating method and device, the electronic equipment of signal wire |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040168314A1 (en) * | 2000-11-06 | 2004-09-02 | Giuseppe Pedretti | Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer |
| CN201984104U (en) * | 2010-11-19 | 2011-09-21 | 宁波信泰机械有限公司 | Heavy-current detection device for electrical equipment |
| CN102230841A (en) * | 2011-03-23 | 2011-11-02 | 长春理工大学 | Controlled infrared planar radiative heat source with high degree of homogeneity |
-
2013
- 2013-09-10 CN CN201310407752.5A patent/CN104427770A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040168314A1 (en) * | 2000-11-06 | 2004-09-02 | Giuseppe Pedretti | Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer |
| CN201984104U (en) * | 2010-11-19 | 2011-09-21 | 宁波信泰机械有限公司 | Heavy-current detection device for electrical equipment |
| CN102230841A (en) * | 2011-03-23 | 2011-11-02 | 长春理工大学 | Controlled infrared planar radiative heat source with high degree of homogeneity |
Non-Patent Citations (1)
| Title |
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| 郗焕: "航天用直流电源模块的研究", 《中国优秀硕士学位论文数据库信息科技辑》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109040909A (en) * | 2018-07-10 | 2018-12-18 | 合肥联宝信息技术有限公司 | Power regulating method and device, the electronic equipment of signal wire |
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Application publication date: 20150318 |