CN104425304B - Wafer position detecting device - Google Patents
Wafer position detecting device Download PDFInfo
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- CN104425304B CN104425304B CN201310407311.5A CN201310407311A CN104425304B CN 104425304 B CN104425304 B CN 104425304B CN 201310407311 A CN201310407311 A CN 201310407311A CN 104425304 B CN104425304 B CN 104425304B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
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Abstract
The present invention relates to a kind of wafer position detecting devices.It includes multiple detection units, and each detection unit is detecting its relative position relation between chip；Wafer position detecting device is according to the relative position relation between multiple detection units and the preset standard position of chip, and the relative position relation between the multiple detection units and chip of multiple detection unit detections, judge whether chip is in the preset standard position of chip.Wafer position detecting device provided by the invention, it detects its relative position relation between chip by each detection unit, and combine the relative position relation between multiple detection units and the preset standard position of chip, it can determine whether chip is in the preset standard position of chip, operating personnel is allow to be modified when wafer position detecting device detects that chip is not in the preset standard position of chip to the position of chip, prevent chip from coming off on hand from machinery in its transmission process.
Description
Technical field
The present invention relates to semiconductor equipment manufacturing fields, and in particular, to a kind of wafer position detecting device.
Background technology
Fig. 1 is the composition schematic diagram of semiconductor processing equipment.As shown in Figure 1, semiconductor processing equipment includes loading chamber
1st, transmission chamber 2 and reaction chamber 3, wherein, chamber 1 is loaded for loading the film magazine equipped with multiple chips, and transmission chamber 2 is set
Loading between chamber 1 and reaction chamber 3, and be connected with the two, and transmission chamber 2 is internally provided with manipulator, to
Load transferring wafer between chamber 1 and reaction chamber 3.
During robotic transfer chip, the designated position that is not accurately placed due to chip on manipulator
And/or relative motion is generated between chip and manipulator, chip is easy to deviate the specific bit on manipulator in transmission process
It puts so that chip may on hand come off in transmission process from machinery, be crushed in transmission chamber 2 or reaction chamber 3, this causes
It needs often to open transmission chamber 2 and reaction chamber 3 is maintained, so as to reduce production efficiency；In addition, chip is broken
Piece is also possible to damage the devices such as molecular pump, the gate valve inside reaction chamber 3.
The content of the invention
It is contemplated that at least solve one of technical problem in the prior art, it is proposed that a kind of wafer position detection
Device can detect the preset standard the position whether chip being loaded on manipulator is in chip exactly, easy to operation
Personnel are modified the position of chip when chip deviates the preset standard position of chip, are transmitted at it so as to preventing chip
It comes off on hand from machinery in the process.
Purpose to realize the present invention and a kind of wafer position detecting device is provided, including multiple detection units, each
The detection unit is detecting its relative position relation between chip；The wafer position detecting device is according to described more
Relative position relation and the detection of the multiple detection unit between a detection unit and the preset standard position of the chip
The multiple detection unit and chip between relative position relation, judge whether the chip default in the chip
Normal place.
Wherein, locating piece is provided on the hand of the manipulator for loading chip, to prevent chip to manipulator
Orientation arm moves, and prevents chip from for linear motion in the direction of the arm perpendicular to manipulator；And the multiple inspection
Surveying unit includes first detection unit and second detection unit；The first detection unit corresponds to the preset standard of the chip
The inside of position, and close to the position at its edge；The second detection unit corresponds to the preset standard position of the chip
Outside, and close to the position at its edge；And the second detection unit is with the locating piece respectively positioned at the pre- of the chip
If the both sides of normal place.
Wherein, the quantity of the first detection unit is one, and the quantity of the second detection unit is one；And
And the center of circle of the preset standard position of the first detection unit, second detection unit and the chip is not in a perpendicular
It is interior；Or the quantity of the first detection unit is multiple, the quantity of the second detection unit is one or more；Or institute
The quantity of first detection unit is stated as one, the quantity of the second detection unit is multiple.
Wherein, the multiple detection unit includes at least three first detection units；And each first detection unit
Corresponding to the inside of the preset standard position of the chip, and close to the position at its edge；And the preset standard of the chip
The center of circle of position is located at the polygonal internal that the multiple first detection unit is in turn connected to form.
Wherein, the multiple detection unit includes at least three first detection units；And each first detection unit
Corresponding to the outside of the preset standard position of the chip, and close to the position at its edge；And the preset standard of the chip
The center of circle of position is located at the polygonal internal that the multiple first detection unit is in turn connected to form.
Wherein, the multiple detection unit includes at least two first detection units and at least one second detection unit；
Each first detection unit corresponds to the inside of the preset standard position of the chip, and close to the position at its edge；Institute
Outside of each second detection unit corresponding to the preset standard position of the chip is stated, and close to the position at its edge；And
The center of circle of the preset standard position of the chip is located at the first detection unit and second detection unit is in turn connected to form
Outside of polygon.
Wherein, the multiple detection unit includes at least two first detection units and at least one second detection unit；
Each first detection unit corresponds to the outside of the preset standard position of the chip, and close to the position at its edge；Institute
Inside of each second detection unit corresponding to the preset standard position of the chip is stated, and close to the position at its edge；And
The center of circle of the preset standard position of the chip is located at the first detection unit and second detection unit is in turn connected to form
Outside of polygon.
Wherein, the detection unit be photoelectric sensor, laser sensor or fibre optical sensor, the photoelectric sensor,
Laser sensor or fibre optical sensor are arranged on above or below the preset standard position of the chip；Or the detection unit
For signal transmitter-receiver device, including sender unit and signal receiving device, the sender unit and signal
Reception device is respectively arranged on the both sides up and down of the preset standard position of the chip.
Wherein, the wafer position detecting device further includes judging unit；The detection unit to judging unit to send
Relative position relation between the detection unit and chip that the mode of signal is detected is sent to judging unit；It is described
Judging unit according to the relative position relation between the multiple detection unit and the preset standard position of the chip and its
Relative position relation between the detection unit and chip that receive judges whether the chip is pre- in the chip
If normal place.
Wherein, the wafer position detecting device further includes warning device；The judging unit judges the chip at it
When being not in the preset standard position of the chip, signal is sent to warning device, the warning device is receiving this
After signal, alarm signal is sent.
The invention has the advantages that：
It is opposite between chip to detect it by each detection unit for wafer position detecting device provided by the invention
Position relationship, and combine the relative position relation between multiple detection units and the preset standard position of chip, it may be determined that it is brilliant
Whether piece is in the preset standard position of chip, and operating personnel is allow to detect that chip is not in wafer position detecting device
The position of chip is modified during the preset standard position of chip, prevents chip from being taken off on hand from machinery in its transmission process
Fall.
Description of the drawings
Fig. 1 is the composition schematic diagram of semiconductor processing equipment；
Fig. 2 is the schematic diagram for the wafer position detecting device that first embodiment of the invention provides；
Fig. 3 a are examined for wafer position detecting device shown in Fig. 2 by a first detection unit and a second detection unit
Survey the schematic diagram that chip is in the preset standard position of the chip；
Fig. 3 b are examined for wafer position detecting device shown in Fig. 2 by a first detection unit and a second detection unit
Survey chip is not in the schematic diagram of the first situation of the preset standard position of the chip；
Fig. 3 c are examined for wafer position detecting device shown in Fig. 2 by a first detection unit and a second detection unit
Survey chip is not in the schematic diagram of the second case of the preset standard position of the chip；
Fig. 3 d are examined for wafer position detecting device shown in Fig. 2 by a first detection unit and a second detection unit
Survey chip is not in the schematic diagram of the third situation of the preset standard position of the chip；
Fig. 3 e are examined for wafer position detecting device shown in Fig. 2 by a first detection unit and a second detection unit
Survey chip is not in the schematic diagram of the 4th kind of situation of the preset standard position of the chip；
Fig. 4 a are examined for wafer position detecting device shown in Fig. 2 by two first detection units and two second detection units
Survey the schematic diagram that chip is in the preset standard position of the chip；
Fig. 4 b are examined for wafer position detecting device shown in Fig. 2 by two first detection units and two second detection units
Survey chip is not in the schematic diagram of the first situation of the preset standard position of the chip；
Fig. 4 c are examined for wafer position detecting device shown in Fig. 2 by two first detection units and two second detection units
Survey chip is not in the schematic diagram of the second case of the preset standard position of the chip；
Fig. 4 d are examined for wafer position detecting device shown in Fig. 2 by two first detection units and two second detection units
Survey chip is not in the schematic diagram of the third situation of the preset standard position of the chip；
Fig. 4 e are examined for wafer position detecting device shown in Fig. 2 by two first detection units and two second detection units
Survey chip is not in the schematic diagram of the 4th kind of situation of the preset standard position of the chip；
Fig. 4 f are examined for wafer position detecting device shown in Fig. 2 by two first detection units and two second detection units
Survey chip is not in the schematic diagram of the 5th kind of situation of the preset standard position of the chip；
Fig. 4 g are examined for wafer position detecting device shown in Fig. 2 by two first detection units and two second detection units
Survey chip is not in the schematic diagram of the 6th kind of situation of the preset standard position of the chip；
Fig. 5 is the structure diagram for the wafer position detecting device that second embodiment of the invention provides；
Fig. 6 a are that wafer position detecting device shown in Fig. 5 detects the signal that chip is in the preset standard position of the chip
Figure；
Fig. 6 b are that wafer position detecting device shown in Fig. 5 detects chip is not in the preset standard position of the chip the
A kind of schematic diagram of situation；
Fig. 6 c are that wafer position detecting device shown in Fig. 5 detects chip is not in the preset standard position of the chip the
The schematic diagram of two kinds of situations；
Fig. 6 d are that wafer position detecting device shown in Fig. 5 detects chip is not in the preset standard position of the chip the
The schematic diagram of three kinds of situations；
Fig. 6 e are that wafer position detecting device shown in Fig. 5 detects chip is not in the preset standard position of the chip the
The schematic diagram of four kinds of situations；
Fig. 7 is a kind of structure diagram of alternate embodiments of wafer position detecting device shown in Fig. 5；
Fig. 8 is the structure diagram for the wafer position detecting device that third embodiment of the invention provides；
Fig. 9 a are that wafer position detecting device shown in Fig. 8 detects the signal that chip is in the preset standard position of the chip
Figure；
Fig. 9 b are that wafer position detecting device shown in Fig. 8 detects chip is not in the preset standard position of the chip the
A kind of schematic diagram of situation；
Fig. 9 c are that wafer position detecting device shown in Fig. 8 detects chip is not in the preset standard position of the chip the
The schematic diagram of two kinds of situations；
Fig. 9 d are that wafer position detecting device shown in Fig. 8 detects chip is not in the preset standard position of the chip the
The schematic diagram of three kinds of situations；
Fig. 9 e are that wafer position detecting device shown in Fig. 8 detects chip is not in the preset standard position of the chip the
The schematic diagram of four kinds of situations；And
Figure 10 is a kind of structure diagram of alternate embodiments of wafer position detecting device shown in Fig. 8.
Specific embodiment
For those skilled in the art is made to more fully understand technical scheme, come below in conjunction with the accompanying drawings to the present invention
The wafer position detecting device of offer is described in detail.
Fig. 2 is refer to, Fig. 2 is the schematic diagram for the wafer position detecting device that first embodiment of the invention provides.Chip position
Putting detection device includes multiple detection units, wherein each detection unit is closed to detect its relative position between chip 11
System, and wafer position detecting device is then according to the opposite position between above-mentioned multiple detection units and the preset standard position of chip 11
The relative position relation between relation and multiple detection units of above-mentioned multiple detection unit detections and chip 11 is put, is judged
Whether chip 11 is in the preset standard position of chip.Wherein, the preset standard position of chip 11 refers to that manipulator is brilliant in transmission
During piece 11, chip 11 corresponds to the designated position on manipulator.
In the present embodiment, load and be provided with locating piece 100 on the hand of the manipulator of chip 11, which has
Have the cambered surface to match with chip 11, to prevent orientation arm from chip 11 to manipulator move, and prevent chip 11 from
It is for linear motion perpendicular to the direction of the arm of manipulator.But in practical applications, can also make locating piece 100 tool there are two or
Multiple positioning regions being in contact with the preset standard position of chip, to substitute the arc to match with chip 11 in the present embodiment
Face.
Specifically, as shown in Fig. 2, multiple detection units include one or more first detection units 12 and one or more
Second detection unit 13, wherein, first detection unit 12 corresponds to the inside of the preset standard position of chip 11, and close to its side
The position of edge；Second detection unit 13 corresponds to the outside of the preset standard position of chip 11, and close to the position at its edge；And
And second detection unit 13 is located at the both sides of the preset standard position of chip 11 with locating piece 100 respectively, so that the second detection
Unit 13 is by detecting its relative position relation between chip 11, it may be determined that whether chip 11 is to remotely located part 100
Direction on deflect away from the preset standard position of chip 11.
In the present embodiment, setting first detection unit 12 is detecting its corresponding chip 11 with second detection unit 13
Preset standard position on corresponding position export signal 1 when having a chip 11, detecting the default of its corresponding chip 11
Corresponding position in normal place does not have to export signal 0 during chip 11.
With wafer position detecting device provided in this embodiment tool, there are one first detection units 12, one the separately below
First embodiment of the invention is provided exemplified by 12, two second detection units 13 of two detection units 13 and two first detection units
Wafer position detecting device detection chip 11 whether the principle of preset standard position in chip 11 is described in detail.
For example, in the present embodiment, the quantity of first detection unit 12 is one, the quantity of second detection unit 13 is one
It is a, and the center of circle of the preset standard position of first detection unit 12, second detection unit 13 and chip 11 is not vertical one
In plane, as shown in Figure 3a.
In the case, it is if first detection unit 12 detects its relative position relation between chip 11：With
Corresponding position on the preset standard position of one detection unit, 12 corresponding chip 11（Using the position as A）There is chip 11 at place, the
Two detection units 13 detect that its relative position relation between chip 11 is：With 13 corresponding chip 11 of second detection unit
Preset standard position on corresponding position（Using the position as B）Locate no chip 11, then first detection unit 12 exports signal
1, second detection unit 13 exports signal 0, as shown in Figure 3a, in the case, then can determine that chip 11 is in chip 11
Preset standard position；If first detection unit 12 detects its relative position relation between chip 11 and is：There is chip at A
11, second detection unit 13 detects that its relative position relation between chip 11 is：There is chip 11 at B, then the first detection
Unit 12 exports signal 1, and second detection unit 13 exports signal 1, as shown in Figure 3b, in the case, then can determine chip
11 are not in the preset standard position of chip 11, and it is slightly deflected away to the direction of remotely located part 100；If first detection unit
12 detect that its relative position relation between chip 11 is：No chip 11 at A, second detection unit 13 detect its with
Relative position relation between chip 11 is：There is chip 11 at B, then first detection unit 12 exports signal 0, second detection unit
13 output signals 1, as shown in Figure 3c, in the case, then can determine that chip 11 is not in the preset standard position of chip 11,
And its deflected away to the direction of remotely located part 100 it is more；If first detection unit 12 detects that it is opposite between chip 11
Position relationship is：No chip 11 at A, second detection unit 13 detect that its relative position relation between chip 11 is：B
Locate no chip 11 or have chip 11, then first detection unit 12 export signal 0, second detection unit 13 export signal 0 or
1, as shown in Figure 3d, in the case, then it can determine that chip 11 is not in the preset standard position of chip 11, and it is to Fig. 3 d
In upper right side deflect away from；If first detection unit 12 detects its relative position relation between chip 11 and is：There is chip at A
11, second detection unit 13 detects that its relative position relation between chip 11 is：There is chip 11 at B, then the first detection
Unit 12 exports signal 1, and second detection unit 13 exports signal 1, as shown in Figure 3 e, in the case, then can determine chip
11 are not in the preset standard position of chip 11, and its lower right into Fig. 3 e is deflected away from.
As described above, when chip 11 is in the preset standard position of chip 11, first detection unit 12 exports signal
1, and second detection unit 13 exports signal 0, wafer position detecting device provided in this embodiment determines therefrom that chip 11 is in
The preset standard position of chip 11；When chip 11 deflects away from the preset standard position of chip 11 from any direction, first detection unit
12 output signals 0 and/or second detection unit output signal 1, wafer position detecting device provided in this embodiment determine therefrom that
Chip 11 is not in the preset standard position of chip 11.
For another example, in the present embodiment, the quantity of first detection unit 12 is two, is respectively 12a and 12b, and second detects
The quantity of unit 13 is 2, is respectively 13a and 13b, as shown in fig. 4 a.
In the case, if first detection unit（12a、12b）Detect its relative position relation between chip 11
For：With first detection unit（12a、12b）Corresponding position on the preset standard position of corresponding chip 11（Distinguished with the position
For Aa, Ab）There are chip 11, second detection unit in place（13a、13b）Detect its relative position relation between chip 11
For：With second detection unit（13a、13b）Corresponding position on the preset standard position of corresponding chip 11（Distinguished with the position
For Ba, Bb）Locate equal non-wafer 11, then first detection unit（12a、12b）Export signal 1, second detection unit（13a、13b）It is defeated
Go out signal 0, as shown in fig. 4 a, in the case, then can determine that chip 11 is in the preset standard position of chip 11；If first
Detection unit 12a, 12b detects that its relative position relation between chip 11 is：There are chip 11, the second inspection at Aa, Ab
It surveys unit 13a, 13b and detects that its relative position relation between chip 11 is：There is chip 11 at Ba, Bb, then the first inspection
Unit 12a, 12b output signal 1 are surveyed, second detection unit 13a, 13b exports signal 1, as shown in Figure 4 b, in the case, then
It can determine that chip 11 is not in the preset standard position of chip 11, and it is slightly deflected away to the direction of remotely located part 100；If
First detection unit 12a, 12b detects that its relative position relation between chip 11 is：Equal non-wafer 11 at Aa, Ab, the
Two detection units 13a, 13b detect that its relative position relation between chip 11 is：There is chip 11 at Ba, Bb, then
One detection unit 12a, 12b exports signal 0, second detection unit 13a, 13b output signal 1, as illustrated in fig. 4 c, in this situation
Under, then can determine that chip 11 is not in the preset standard position of chip 11, and its to the direction of remotely located part 100 deflect away from compared with
It is more；If first detection unit 12a detects its relative position relation between chip 11 and is：There are chip 11, the first inspection at Aa
It surveys unit 12b and detects that its relative position relation between chip 11 is：No chip 11 at Ab, second detection unit 13a,
13b detects that its relative position relation between chip 11 is：Ba, Bb have chip 11, then first detection unit 12a is exported
Signal 1, first detection unit 12b output signals 0, second detection unit 13a, 13b output signal 1, as shown in figure 4d, in this feelings
Under condition, then it can determine that chip 11 is not in the preset standard position of chip 11, and its upper right side into Fig. 4 d is slightly deflected away from；If
First detection unit 12a detects that its relative position relation between chip 11 is：There are chip 11, first detection unit at Aa
12b detects that its relative position relation between chip 11 is：No chip 11, second detection unit 13a are detected at Ab
Its relative position relation between chip 11 is：Have chip 11 at Ba, second detection unit 13b detect itself and chip 11 it
Between relative position relation be：No chip at Bb, then first detection unit 12a outputs signal 1, first detection unit 12b are defeated
Go out signal 0, second detection unit 13a output signals 1, second detection unit 13b output signals 0, as shown in fig 4e, in this situation
Under, then can determine that chip 11 is not in the preset standard position of chip 11, and its upper right side into Fig. 4 e deflect away from it is more；If the
One detection unit 12a detects that its relative position relation between chip 11 is：No chip 11, first detection unit at Aa
12b detects that its relative position relation between chip 11 is：There are chip 11, the detection of second detection unit 13a, 13b at Ab
It is to its relative position relation between chip 11：Ba, Bb have chip 11, then first detection unit 12a exports signal 0,
First detection unit 12b exports signal 1, and second detection unit 13a, 13b exports signal 1, as shown in fig. 4f, in the case,
It can then determine that chip 11 is not in the preset standard position of chip 11, and its lower right into Fig. 4 f is slightly deflected away from；If first
Detection unit 12a detects that its relative position relation between chip 11 is：No chip 11, first detection unit at Aa
12b detects that its corresponding position relation between chip 11 is：There is chip 11 at Ab, second detection unit 13a detects it
Relative position relation between chip 11 is：No chip 11 at Ba, second detection unit 13b detect itself and chip 11 it
Between relative position relation be：There is chip at Bb, then first detection unit 12a exports signal 0, first detection unit 12b outputs
Signal 1, second detection unit 13a output signals 0, second detection unit 13b output signals 1, as shown in figure 4g, in this situation
Under, then can determine that chip 11 is not in the preset standard position of chip 11, and its lower right into Fig. 4 g deflect away from it is more.
As described above, when chip 11 is in the preset standard position of chip 11, the output of first detection unit 12a, 12b
Signal 1, second detection unit 13a, 13b output signal 0, wafer position detecting device provided in this embodiment determine therefrom that chip
11 are in the preset standard position of chip 11；And chip 11 is when deflecting away from the preset standard position of chip 11 from any direction, one
Or multiple first detection unit output signals 0 and/or one or more second detection units export signal 1, the present embodiment provides
Wafer position detecting device determine therefrom that chip 11 is not in the preset standard position of chip 11.
In conclusion wafer position detecting device provided in this embodiment, itself and crystalline substance are detected by each detection unit
Relative position relation between piece 11, and combine the relative position between multiple detection units and the preset standard position of chip 11
Relation, determines whether chip 11 is in the preset standard position of chip 11, allows operating personnel in wafer position detecting device
It detects that chip 11 is not in being modified the position of chip 11 during the preset standard position of chip 11, prevents chip 11 at it
It comes off on hand from machinery in transmission process.
In this embodiment, it is preferred that when the quantity of first detection unit 12 is multiple, the plurality of first detection unit
12 are uniformly arranged along the circumferential direction of the preset standard position of chip 11；It is the plurality of when the quantity of second detection unit 13 is multiple
Second detection unit 13 is uniformly arranged along the one side opposite with locating piece 100 of the preset standard position of chip 11；So set
Can making wafer position detecting device, whether the detection of the preset standard position in chip 11 more accurately reflects to chip 11
Relative position relation between chip 11 and the preset standard position of chip 11.
In the present embodiment, detection unit can be sensor, be arranged at the top of the preset standard position of chip 11
Or lower section, specifically, detection unit can be the detection devices such as photoelectric sensor, laser sensor or fibre optical sensor.
In the present embodiment, wafer position detecting device further includes judging unit and warning device；Wherein, detection unit with
Relative position relation between the detection unit and chip 11 that the mode of judging unit transmission signal is detected is sent to
Judging unit；Judging unit according to the relative position relation between multiple detection units and the preset standard position of chip 11 and
Relative position relation between received detection unit and chip 11, judges whether chip 11 is in the pre- bidding of chip 11
Level is put；If judging unit judges that chip 11 is not in the preset standard position of chip 11, signal, report are sent to warning device
Alarm device prompts operating personnel to be modified the position of chip 11 upon receipt of the signal, to send alarm signal.
Preferably, in the present embodiment, multiple detection units can also include one or more 3rd detection units 14, should
3rd detection unit 14 can correspond to fringe region, central area and the chip of the inside of the preset standard position of chip 11
The outside of 11 preset standard position.It is detected by one or more 3rd detection units 14 corresponding with the 3rd detection unit 14
Chip 11 preset standard position on corresponding position have non-wafer 11, the pre- bidding of chip 11 can be deflected away from chip 11
The distance that chip 11 deflects away from is judged when level is put exactly.
It should be noted that in the present embodiment, first detection unit 12 corresponds to the preset standard position of chip 11
Inside, and close to the region at its edge；Second detection unit 13 corresponds to the outside of the preset standard position of chip 11, and close
The region at its edge；But the present invention is not limited thereto, in practical applications, can also detect first detection unit 12 and second
Unit 13 is corresponding with the region apart from its edge farther out on the preset standard position of chip 11, although so setting can cause pair
Whether the accuracy in detection of the preset standard position in chip 11 reduces chip 11, but accuracy in detection is required not some
In the case of height, the needs for meeting detection are remained able to.
It should also be noted that, in the present embodiment, detection unit is photoelectric sensor, laser sensor or Fibre Optical Sensor
Device is arranged above or below the preset standard position of chip 11, but the present invention is not limited thereto, in practical applications,
Detection unit can also be signal transmitter-receiver device, including sender unit and signal receiving device, and the signal
Emitter and signal receiving device are respectively positioned at the both sides up and down of the preset standard position of chip 11.
Fig. 5 is the structure diagram for the wafer position detecting device that second embodiment of the invention provides.As shown in figure 5, this
The wafer position detecting device that embodiment provides is compared with first embodiment, equally including multiple detection units, due to above-mentioned more
The function of a detection unit there has been detailed description in the first embodiment, and details are not described herein.
Only the difference of the present embodiment and first embodiment is described in detail below.In the present embodiment, it is multiple
Detection unit includes at least three first detection units 12 ', and each first detection unit 12 ' corresponds to the pre- bidding of chip 11
The inside that level is put, and close to the position at its edge, also, the center of circle of the preset standard position of chip 11 is located at the multiple first inspections
Survey the polygonal internal that unit 12 ' is in turn connected to form.
Specifically, in the present embodiment, as shown in figure 5, the quantity of first detection unit 12 ' is three, respectively 12a ',
12b ' and 12c '.
In the present embodiment, first detection unit is passed through（12a ', 12b ' and 12c '）Detect its phase between chip 11
The preset standard position whether chip 11 is in chip 11 can be accurately determined to position relationship.
If for example, first detection unit（12a ', 12b ' and 12c '）Detect that its relative position between chip 11 is closed
It is to be：With first detection unit（12a ', 12b ' and 12c '）Corresponding position on the preset standard position of corresponding chip 11
（It is respectively Aa ', Ab ' and Ac ' with the position）There is chip 11 at place, then first detection unit（12a ', 12b ' and 12c '）Output
Signal 1 as shown in Figure 6 a, in the case, then can determine that chip 11 is in the preset standard position of chip 11；If the first inspection
It surveys unit 12a ', 12b ' and 12c ' and detects that its relative position relation between chip 11 is respectively：There is chip 11 at Aa ',
Having at Ab ' does not have chip 11 at chip 11, Ac ', then first detection unit（12a’、12b’）Export signal 1, first detection unit
12c ' exports signal 0, as shown in Figure 6 b, in the case, then can determine that chip 11 is not in the preset standard position of chip 11
It puts；If first detection unit 12a ', 12b ' and 12c ' detect its relative position relation between chip 11 and are respectively：Aa’
Place has at chip 11, Ab ' and does not have have chip 11 at chip 11, Ac ', then first detection unit 12a ' exports signal 1, the first detection
Unit 12b ' exports signal 0, and first detection unit 12c ' output signals 1 as fig. 6 c, in the case, then can determine
Chip 11 is not in the preset standard position of chip 11；If first detection unit 12a ', 12b ' and 12c ' detect itself and chip
Relative position relation between 11 is respectively：Having at Aa ' at chip 11, Ab ' does not have do not have chip 11 at chip 11, Ac ', then and
One detection unit 12a ' exports signal 1, first detection unit 12b ' output signals 0, and first detection unit 12c ' exports signal 0,
As shown in fig 6d, in the case, then it can determine that chip 11 is not in the preset standard position of chip 11；If the first detection is single
First 12a ', 12b ' and 12c ' detect that its relative position relation between chip 11 is respectively：There is no chip 11, Ab ' at Aa '
Place has and has chip 11 at chip 11, Ac ', then first detection unit 12a ' exports signal 0, first detection unit 12b ' output signals
1, first detection unit 12c ' export signal 1, as shown in fig 6e, in the case, then can determine that chip 11 is not in chip
11 preset standard position.
As described above, when chip 11 is in the preset standard position of chip 11, each first detection unit exports
Signal 1, wafer position detecting device provided in this embodiment determine therefrom that chip 11 is in the preset standard position of chip 11；And
When chip 11 deflects away from the preset standard position of chip 11 from any direction, one or more first detection units export signal 0, this
The wafer position detecting device that embodiment provides determines therefrom that chip 11 is not in the preset standard position of chip 11.
Preferably, in the present embodiment, as shown in figure 5, multiple detection units can also include the second inspection of one or more
Unit 13 ' is surveyed, which corresponds to the fringe region of the inside of the preset standard position of chip 11, center
Domain and the outside of the preset standard position of chip 11.Itself and chip 11 are detected by one or more second detection units 13 '
Between relative position relation, can judge that chip 11 deflects away from exactly when chip 11 deflects away from the preset standard position of chip 11
Distance.
It should be noted that in the present embodiment, at least three first detection units 12 ' both correspond to the default of chip 11
The inside of normal place, and close to the position at its edge, but the present invention is not limited thereto, in practical applications, as shown in fig. 7,
At least three first detection units 12 ' are also can correspond to the outside of the preset standard position of chip 11, and close to its edge
Position, and make the preset standard position of chip 11 the center of circle be located at multiple first detection units 12 ' be in turn connected to form it is more
Inside the shape of side.It is readily appreciated that, in this case, when each first detection unit 12 ' exports signal 0, it may be determined that brilliant
Piece 11 is in the preset standard position of chip 11；It, can when one or more first detection unit 12 ' exports signal 1
To determine that chip 11 is not in the preset standard position of chip 11.
Fig. 8 is refer to, Fig. 8 is the structure diagram for the wafer position detecting device that third embodiment of the invention provides.This
The wafer position detecting device that embodiment provides equally includes multiple detection units, since the function of above-mentioned multiple detection units exists
It there has been detailed description in first, second embodiment, details are not described herein.
Only the present embodiment and the difference of first, second embodiment are described in detail below.In the present embodiment,
Multiple detection units include at least two first detection units 12 " and at least one second detection unit 13 ", wherein, Mei Ge
One detection unit 12 " corresponds to the inside of the preset standard position of chip 11, and close to the position at its edge；Each second detection
Unit 13 " corresponds to the outside of the preset standard position of chip 11, and close to the position at its edge；Also, in the present embodiment,
The center of circle of the preset standard position of chip 11 is located at what first detection unit 12 " was in turn connected to form with second detection unit 13 "
Outside of polygon.
Specifically, the quantity of first detection unit 12 " is two, is respectively 12a " and 12b ", second detection unit 13 "
Quantity is one.
In the present embodiment, first detection unit is passed through（12a " and 12b "）It is detected respectively with second detection unit 13 "
Relative position relation between chip 11 can accurately determine the preset standard position whether chip 11 is in chip 11.
If for example, first detection unit（12a " and 12b "）Detect its difference of relative position relation between chip 11
For with the first detection unit（12a " and 12b "）Corresponding position on the preset standard position of corresponding chip 11（With the position
Respectively Aa " and Ab "）There is chip 11 at place, and second detection unit 13 " detects that the relative position relation of itself and chip 11 is and this
Corresponding position on the preset standard position of the corresponding chip 11 of second detection unit 13 "（Using the position as B "）Locate no chip
11, then first detection unit（12a " and 12b "）Signal 1 is exported, second detection unit 13 " exports signal 0, as illustrated in fig. 9,
In this case, it can then determine that chip 11 is in the preset standard position of chip 11；If first detection unit 12a ", 12b " and
Two detection units 13 " detect that its relative position relation between chip 11 is respectively：There is chip 11 at Aa " places, and Ab " places do not have
Chip 11, B " places do not have chip 11, then first detection unit 12a " exports signal 1, and first detection unit 12b " exports signal 0,
Second detection unit 13 " exports signal 0, as shown in figure 9b, in the case, then can determine that chip 11 is not in chip 11
Preset standard position；If first detection unit 12a ", 12b " and second detection unit 13 " detect its phase between chip 11
It is not to position relation：Aa " places do not have chip 11, and there is chip 11 at Ab " places, and B " places do not have chip 11, then first detection unit
12a " exports signal 0, first detection unit 12b " output signals 1, and second detection unit 13 " exports signal 0, as is shown in fig. 9 c,
In the case, then it can determine that chip 11 is not in the preset standard position of chip 11；If first detection unit 12a ", 12b "
And second detection unit 13 " detects that its relative position relation between chip 11 is respectively：There are chip 11, Ab " places in Aa " places
There is chip 11, there is chip 11 at B " places, then first detection unit 12a " exports signal 1, and first detection unit 12b " exports signal 1,
Second detection unit 13 " exports signal 1, as shown in figure 9d, in the case, then can determine that chip 11 is not in chip 11
Preset standard position；If first detection unit 12a ", 12b " and second detection unit 13 " detect its phase between chip 11
It is not to position relation：Aa " places do not have chip 11, and Ab " places do not have chip 11, and B " places do not have chip 11, then the first detection is single
First 12a " exports signal 0, and first detection unit 12b " output signals 0, second detection unit 13 " exports signal 0, such as Fig. 9 e institutes
Show, in the case, then can determine that chip 11 is not in the preset standard position of chip 11.
As described above, when chip 11 is in the preset standard position of chip 11, first detection unit 12a " and 12b "
Signal 1 is exported, second detection unit 13 " exports signal 0, and wafer position detecting device provided in this embodiment determines therefrom that chip
11 are in the preset standard position of chip 11；And chip 11 is when deflecting away from the preset standard position of chip 11 from any direction, one
Or multiple first detection unit output signals 0 and/or second detection unit 13 " export signal 1, chip position provided in this embodiment
It puts detection device and determines therefrom that chip 11 is not in the preset standard position of chip 11.
Preferably, in the present embodiment, as shown in figure 8, multiple detection units can also include the 3rd inspection of one or more
Unit 14 " is surveyed, the 3rd detection unit 14 " corresponds to the fringe region of the inside of the preset standard position of chip 11, center
Domain and the outside of the preset standard position of chip 11.Itself and chip 11 are detected by the 3rd detection unit 14 " of one or more
Between relative position relation, can judge that chip 11 deflects away from exactly when chip 11 deflects away from the preset standard position of chip 11
Distance.
It should be noted that in the present embodiment, first detection unit 12 " corresponds to the preset standard position of chip 11
Inside, and close to the position at its edge；Second detection unit 13 " corresponds to the outside of the preset standard position of chip 11, and leans on
The position at its nearly edge；But the present invention is not limited thereto, and in practical applications, as shown in Figure 10, first detection unit 12 " may be used also
To correspond to the outside of the preset standard position of chip 11, and close to the position at its edge；Second detection unit 13 " can also be right
Should in the inside of the preset standard position of chip 11, and close to its edge position；And make the preset standard position of chip 11
The center of circle be located at first detection unit 12 " and outside of polygon that second detection unit 13 " is in turn connected to form.In such case
Under, each first detection unit 12 " exports signal 0, and during each output of second detection unit 13 " signal 1, it may be determined that chip
11 are in the preset standard position of chip 11；Conversely, one or more first detection units 12 " export signals 1 and/or one or
When multiple second detection units 13 " export signal 0, it may be determined that chip 11 deflects away from the preset standard position of chip 11.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, the essence of the present invention is not being departed from
In the case of refreshing and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (8)
1. a kind of wafer position detecting device, which is characterized in that including multiple detection units, each detection unit is examining
Survey its relative position relation between chip；
The wafer position detecting device is according to the phase between the multiple detection unit and the preset standard position of the chip
Relative position between the multiple detection unit and chips that detected to position relationship and the multiple detection unit is closed
System, judges whether the chip is in the preset standard position of the chip；
The multiple detection unit includes：
At least two first detection units and at least one second detection unit；Each first detection unit corresponds to described
The inside of the preset standard position of chip, and close to the position at its edge；Each second detection unit corresponds to the crystalline substance
The outside of the preset standard position of piece, and close to the position at its edge；And the center of circle position of the preset standard position of the chip
In the outside of polygon that the first detection unit and second detection unit are in turn connected to form；Or at least two first detection it is single
First and at least one second detection unit；Each first detection unit corresponds to the outer of the preset standard position of the chip
Portion, and close to the position at its edge；Each second detection unit corresponds to the inside of the preset standard position of the chip,
And close to the position at its edge；And the center of circle of the preset standard position of the chip is located at the first detection unit and second
The outside of polygon that detection unit is in turn connected to form.
2. wafer position detecting device according to claim 1, which is characterized in that load the hand of the manipulator of the chip
Locating piece is provided in portion, to prevent chip from being moved to the orientation arm of manipulator, and prevents chip from perpendicular to machinery
The direction of the arm of hand is for linear motion；And
The multiple detection unit includes first detection unit and second detection unit；
The first detection unit corresponds to the inside of the preset standard position of the chip, and close to the position at its edge；
The second detection unit corresponds to the outside of the preset standard position of the chip, and close to the position at its edge；And
And the second detection unit is located at the both sides of the preset standard position of the chip with the locating piece respectively.
3. wafer position detecting device according to claim 2, which is characterized in that the quantity of the first detection unit is
Multiple, the quantity of the second detection unit is one or more.
4. wafer position detecting device according to claim 1, which is characterized in that the multiple detection unit is included at least
Three first detection units；And each first detection unit corresponds to the inside of the preset standard position of the chip, and
Close to the position at its edge；And
The center of circle of the preset standard position of the chip is located at the polygon that the multiple first detection unit is in turn connected to form
It is internal.
5. wafer position detecting device according to claim 1, which is characterized in that the multiple detection unit is included at least
Three first detection units；And each first detection unit corresponds to the outside of the preset standard position of the chip, and
Close to the position at its edge；And
The center of circle of the preset standard position of the chip is located at the polygon that the multiple first detection unit is in turn connected to form
It is internal.
6. wafer position detecting device according to claim 1, which is characterized in that the detection unit is photoelectric sensing
Device, laser sensor or fibre optical sensor, the photoelectric sensor, laser sensor or fibre optical sensor are arranged on the chip
Above or below preset standard position；Or
The detection unit is signal transmitter-receiver device, including sender unit and signal receiving device, the letter
Number emitter and signal receiving device are respectively arranged on the both sides up and down of the preset standard position of the chip.
7. wafer position detecting device according to claim 1, which is characterized in that the wafer position detecting device also wraps
Include judging unit；
Between the detection unit from signal to judging unit and chip that the detection unit is detected in a manner of sending
Relative position relation be sent to judging unit；The judging unit is according to the default of the multiple detection unit and the chip
The relative position relation between relative position relation and the received detection unit and chip between normal place
Judge whether the chip is in the preset standard position of the chip.
8. wafer position detecting device according to claim 7, which is characterized in that the wafer position detecting device also wraps
Include warning device；
The judging unit is sent when it judges that the chip is not in the preset standard position of the chip to warning device
Signal, the warning device is upon receipt of the signal, sending alarm signal.
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| CN104802168B (en) * | 2015-04-20 | 2016-08-24 | 深圳市文鼎创数据科技有限公司 | A kind of boundary detection method and system |
| CN105236141B (en) * | 2015-10-13 | 2017-07-28 | 武汉华星光电技术有限公司 | Substrate transfer approach |
| CN106426209B (en) * | 2016-11-09 | 2019-01-22 | 上海华力微电子有限公司 | A kind of robot arm device for finding out wafer sliding |
| CN108878307B (en) * | 2017-05-11 | 2020-12-08 | 北京北方华创微电子装备有限公司 | Chip detection system and chip detection method |
| CN110797277B (en) * | 2018-08-01 | 2022-05-27 | 北京北方华创微电子装备有限公司 | Silicon wafer position detection method and device and semiconductor processing equipment |
| CN110864814B (en) * | 2018-08-27 | 2021-08-13 | 北京北方华创微电子装备有限公司 | Automatic alignment device, alignment method and reaction chamber |
| CN111645064A (en) * | 2019-03-04 | 2020-09-11 | 北京北方华创微电子装备有限公司 | Manipulator position calibration device and method and manipulator control system |
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| JP5132904B2 (en) * | 2006-09-05 | 2013-01-30 | 東京エレクトロン株式会社 | Substrate positioning method, substrate position detection method, substrate recovery method, and substrate position deviation correction apparatus |
| JP2011003695A (en) * | 2009-06-18 | 2011-01-06 | Nikon Corp | Substrate transfer apparatus |
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