CN104417065B - 喷墨头制造方法、喷墨头及打印设备 - Google Patents
喷墨头制造方法、喷墨头及打印设备 Download PDFInfo
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- CN104417065B CN104417065B CN201310409423.4A CN201310409423A CN104417065B CN 104417065 B CN104417065 B CN 104417065B CN 201310409423 A CN201310409423 A CN 201310409423A CN 104417065 B CN104417065 B CN 104417065B
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- adhesive layer
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- manufacturing
- ink jet
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims abstract description 57
- 238000007639 printing Methods 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 31
- 238000011161 development Methods 0.000 claims abstract description 12
- 239000007921 spray Substances 0.000 claims abstract description 9
- 239000012790 adhesive layer Substances 0.000 claims description 148
- 239000010410 layer Substances 0.000 claims description 52
- 239000003292 glue Substances 0.000 claims description 18
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 18
- 230000008569 process Effects 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 11
- 239000011241 protective layer Substances 0.000 claims description 9
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 8
- 229910052697 platinum Inorganic materials 0.000 claims description 8
- 239000010936 titanium Substances 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 238000004518 low pressure chemical vapour deposition Methods 0.000 claims description 5
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 5
- 238000004544 sputter deposition Methods 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims description 4
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical group [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 2
- RJCRUVXAWQRZKQ-UHFFFAOYSA-N oxosilicon;silicon Chemical compound [Si].[Si]=O RJCRUVXAWQRZKQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- 238000003980 solgel method Methods 0.000 claims description 2
- 239000003513 alkali Substances 0.000 claims 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims 1
- 239000004926 polymethyl methacrylate Substances 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 10
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052681 coesite Inorganic materials 0.000 description 3
- 229910052906 cristobalite Inorganic materials 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052682 stishovite Inorganic materials 0.000 description 3
- 229910052905 tridymite Inorganic materials 0.000 description 3
- 239000007767 bonding agent Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229920002319 Poly(methyl acrylate) Polymers 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- NHVPKUVVLGHSBZ-UHFFFAOYSA-N formic acid;propane-1,2-diol Chemical compound OC=O.CC(O)CO NHVPKUVVLGHSBZ-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
Claims (16)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310409423.4A CN104417065B (zh) | 2013-09-10 | 2013-09-10 | 喷墨头制造方法、喷墨头及打印设备 |
Applications Claiming Priority (1)
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CN201310409423.4A CN104417065B (zh) | 2013-09-10 | 2013-09-10 | 喷墨头制造方法、喷墨头及打印设备 |
Publications (2)
Publication Number | Publication Date |
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CN104417065A CN104417065A (zh) | 2015-03-18 |
CN104417065B true CN104417065B (zh) | 2016-03-02 |
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CN201310409423.4A Active CN104417065B (zh) | 2013-09-10 | 2013-09-10 | 喷墨头制造方法、喷墨头及打印设备 |
Country Status (1)
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CN (1) | CN104417065B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6869675B2 (ja) * | 2016-09-23 | 2021-05-12 | 東芝テック株式会社 | インクジェットヘッドおよびインクジェットヘッドの製造方法 |
JP6977089B2 (ja) * | 2020-03-25 | 2021-12-08 | キヤノン株式会社 | 構造体の製造方法及び液体吐出ヘッドの製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1226478A (zh) * | 1998-02-19 | 1999-08-25 | 三星电机株式会社 | 制造喷墨头的微致动器的方法 |
CN1582090A (zh) * | 2003-08-05 | 2005-02-16 | 佳能株式会社 | 电路基板的制造方法 |
CN101456283A (zh) * | 2007-12-12 | 2009-06-17 | 三星电子株式会社 | 喷墨打印头及其制造方法 |
CN101495318A (zh) * | 2006-07-28 | 2009-07-29 | 惠普发展公司,有限责任合伙企业 | 流体喷射装置及其制造方法 |
CN102689518A (zh) * | 2011-03-23 | 2012-09-26 | 施乐公司 | 用于pzt印刷头制造的作为间隙充填物的光刻胶材料的使用 |
-
2013
- 2013-09-10 CN CN201310409423.4A patent/CN104417065B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1226478A (zh) * | 1998-02-19 | 1999-08-25 | 三星电机株式会社 | 制造喷墨头的微致动器的方法 |
CN1582090A (zh) * | 2003-08-05 | 2005-02-16 | 佳能株式会社 | 电路基板的制造方法 |
CN101495318A (zh) * | 2006-07-28 | 2009-07-29 | 惠普发展公司,有限责任合伙企业 | 流体喷射装置及其制造方法 |
CN101456283A (zh) * | 2007-12-12 | 2009-06-17 | 三星电子株式会社 | 喷墨打印头及其制造方法 |
CN102689518A (zh) * | 2011-03-23 | 2012-09-26 | 施乐公司 | 用于pzt印刷头制造的作为间隙充填物的光刻胶材料的使用 |
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CN104417065A (zh) | 2015-03-18 |
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Owner name: ZHUHAI SEINE PRINTING TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: ZHUHAI NASIDA ENTERPRISE MANAGEMENT CO., LTD. Effective date: 20150528 |
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Effective date of registration: 20150528 Address after: 519075, Guangdong, Xiangzhou District, Zhuhai Avenue, No. 01, building 1, 3883, 2, 4, 7, 02, 04, 1, 2, 3, 5, Zhuhai Applicant after: Zhuhai Seine Printing Technology Co., Ltd. Address before: 519075 Xiangzhou, Zhuhai, Pearl Road, North District, No. 63, No. Applicant before: Zhuhai Nasida Enterprise Management Co., Ltd. |
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Effective date of registration: 20200925 Address after: Room 105-60088, No. 6, Baohua Road, Hengqin New District, Zhuhai City, Guangdong Province Patentee after: Zhuhai Sanwei Technology Co.,Ltd. Address before: 519075, Guangdong, Xiangzhou District, Zhuhai Avenue, No. 01, building 1, 3883, 2, 4, 7, 02, 04, 1, 2, 3, 5, Zhuhai Patentee before: Zhuhai Saina Printing Technology Co.,Ltd. |
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