CN104416161A - Method for quickly producing uniform core-shell type alloy solder balls - Google Patents
Method for quickly producing uniform core-shell type alloy solder balls Download PDFInfo
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- CN104416161A CN104416161A CN201310395973.5A CN201310395973A CN104416161A CN 104416161 A CN104416161 A CN 104416161A CN 201310395973 A CN201310395973 A CN 201310395973A CN 104416161 A CN104416161 A CN 104416161A
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Abstract
The invention discloses a method for quickly producing uniform core-shell type alloy solder balls. The method includes the following steps: weighing Cu, Sn and Bi alloys in the appropriate proportion prior to putting the alloy into a crucible, and closing the crucible and a vacuum chamber; heating to enable the metal to melt; jetting out the molten metal from holes in the bottom of the crucible, and performing jet breaking to form uniform small droplets under the condition of oscillation of a piezoelectric oscillator; feeding the uniform droplets into a spiral liquid nitrogen cooling device to form the core-shell type solder balls. The core-shell type solder balls produced by the one-step method have the advantages of high uniformity and high finished product ratio. The defects of complicated original preparation technology and particle nonuniformity are overcome. The requirements on electronic packaging of existing integrated circuits can be met, reliability in solder joint connection is improved, and application and popularization prospect is high.
Description
Technical field
The invention belongs to alloyed metal powder preparing technical field, more particularly, relate to a kind of nucleus shell-type composite alloy soldered ball preparation method.
Background technology
Now in the electronics industry, BGA Package (BGA package) becomes the main flow of Electronic Encapsulating Technology gradually, this technology is exactly the Electronic Packaging mode adopting alloys welding balls replacement pin in the past to require to the mechanically interconnected and electric signal transmission met between electronic devices and components, and its core technology is exactly the preparation of high-quality alloys welding balls.But this technology also exists the unmanageable shortcoming of coplanarity in encapsulation process, easily forms stress in solder joint and causes its short circuit or open circuit.
Core-shell type soldered ball can solve the problem of BGA solder joint coplanarity difference.Core-shell type soldered ball Shi You center is Cu core, the outer combined type solder joint be made up of solder alloy.Because the Cu core at center can not melt in welding process, thus ensure that coplanarity.And because Cu has better electricity, calorifics and mechanical performance, thus make core-shell type solder joint have good reliability more.But traditional handicraft process is more complicated, to first prepare Cu particulate, then at outer plated solder.The people such as Wang Cuiping study discovery, and the Cu-Sn-Bi alloy of special component also exists the phenomenon of stratified liquid, and in process of setting, under Marangoni motion, the center of rich Cu alloys welding balls is in opposite directions moved, and the periphery of rich Sn-Bi alloys welding balls is in opposite directions moved, thus forms core shell structure.But the aerosolization method that the people such as Wang Cuiping uses to there is yield rate low, the problem [C.P.Wang, X.J.Liu, I.Ohnuma, et al., Science, 297-9 (2002) 990] that particle size is uneven.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of method preparing homogeneous nucleus shell-type soldered ball fast, this soldered ball has more excellent electricity relative to traditional soldered ball, heat and mechanical performance.And The method reduces processing step and cost, improve uniformity and the yield rate of soldered ball.
Technical purpose of the present invention is achieved by following technical proposals:
A preparation method for Quick uniform core-shell type alloys welding balls, carries out according to following step:
1) Cu of proper proportion, Sn and Bi alloy is weighed and put into crucible, close crucible and vacuum chamber;
2) crucible and vacuum chamber are vacuumized, and be filled with protectiveness Ar gas;
3) heating makes metal molten;
4) air valve between closing crucible and vacuum chamber, pours protectiveness Ar gas in crucible, controls its flow velocity to reach the stable pressure reduction of crucible and vacuum chamber, thus is gone out by the small hole injection of the metal of melting from crucible bottom; Meanwhile, under the vibration of piezoelectric oscillator, jet breakup becomes even droplet, and by below add battery lead plate time bring the electric charge of equal electricity, prevent its adhesion;
5) symmetrical liquid drop enters liquid nitrogen spiral cooling device, forms core-shell type soldered ball.
In technique scheme, the fracture of jet is that the ceramic oscillation bar passed through completes, and its frequency of oscillation is 5-20KHz.
In technique scheme, observed size and the flow velocity of drop by image monitoring system, thus feedback regulation draught head and frequency of oscillation, obtain the drop of size uniform.
In technique scheme, the pressure differential of crucible and vacuum chamber is 0.5-2Pa.
In technique scheme, the aperture of crucible bottom and the distance of cooling device are 10mm-100mm.
In technique scheme, the degree of supercooling that droplet solidification becomes required for core-shell type soldered ball is provided by liquid nitrogen spiral cooling device.
In technique scheme, the mass ratio of described Cu, Sn and Bi is 24:16:80.
In technique scheme, the equipment of use comprises as follows:
1) vacuum chamber, is connected with vavuum pump by the appendix with vacuum valve.
2) silica crucible with heating system, is positioned at the top of vacuum chamber.
3) image monitoring system, comprises one and dodges device, a video camera and a Control System of Microcomputer frequently.
4) two with the protectiveness Ar gas induction system of pneumatic control valve, connects crucible respectively, vacuum chamber and air.
5) a piezoelectric vibration system, wherein ceramic oscillation bar distance crucible bottom distance is 0.3-2mm.
6) one adds battery lead plate, is positioned at the below of crucible nozzle, and is just leaving opening to the position of nozzle, so that drop passes through.
7) a liquid nitrogen spiral cooling gathering-device, makes drop cool in the apparatus and forms core-shell type soldered ball.
8) baffle plate, stops that the drop before stablizing enters cooling device.
The core-shell type soldered ball that the present invention is prepared by one-step method, has uniformity good, the feature that yield rate is high.Improve complicated process of preparation originally, the defect that particle is uneven.The demand of contemporary integrated circuits Electronic Packaging can be met, and improve the reliability of solder joint connection, there is good application and promotion prospect.
Accompanying drawing explanation
Fig. 1 is the device preparing core-shell type soldered ball that the present invention uses; wherein 1 is silica crucible, and 2 is vacuum chamber, and 3 is heating system; 4 is piezoelectric vibration system; 5 for adding battery lead plate, and 6 is liquid nitrogen spiral cooling gathering-device, and 7 is vavuum pump; 8 is baffle plate; 9 is image monitoring system, and 10 is the protective gas induction system connecting crucible, and 11 is the protective gas induction system connecting vacuum chamber.
Fig. 2 is the section back scattering picture (BSED) of the alloys welding balls utilizing the present invention program to prepare.
Detailed description of the invention
Technical scheme of the present invention is further illustrated below in conjunction with specific embodiment.
As shown in Figure 1, the device preparing core-shell type soldered ball that the present invention uses, wherein 1 is silica crucible; 2 is vacuum chamber; 3 is heating system, and 4 is piezoelectric vibration system, and 5 for adding battery lead plate; 6 is liquid nitrogen spiral cooling gathering-device; 7 is vavuum pump, and 8 is baffle plate, and 9 is image monitoring system; 10 for connecting the protective gas induction system of crucible, and 11 is the protective gas induction system connecting vacuum chamber.
The equipment used comprises as follows:
1) vacuum chamber, is connected with vavuum pump by the appendix with vacuum valve.
2) silica crucible with heating system, is positioned at the top of vacuum chamber.
3) image monitoring system, comprises one and dodges device, a video camera and a Control System of Microcomputer frequently.
4) two with the protectiveness Ar gas induction system of pneumatic control valve, connects crucible respectively, vacuum chamber and air.
5) a piezoelectric vibration system, wherein ceramic oscillation bar distance crucible bottom distance is 0.3-2mm.
6) one adds battery lead plate, is positioned at the below of crucible nozzle, and is just leaving opening to the position of nozzle, so that drop passes through.
7) a liquid nitrogen spiral cooling gathering-device, makes drop cool in the apparatus and forms core-shell type soldered ball.
8) baffle plate, stops that the drop before stablizing enters cooling device.
When being prepared, carry out according to following step:
1) check the air-tightness of cylindrical inside spin cooling device, and add liquid nitrogen in liquid nitrogen storage device;
2) open crucible upper cover, in crucible, add the alloy material needing melting, and seal;
3) sealed vacuum chamber, and check the air-tightness of vacuum chamber;
4) vacuum chamber is vacuumized, and inert protective gas is filled with to crucible and vacuum chamber;
5) metal alloy compositions in heat fused crucible, the mass ratio of Cu, Sn and Bi is 24:16:80;
6) piezoelectric oscillator is opened, voltage is added to adding battery lead plate, inert protective gas is inputted in crucible, pressure controller is utilized to make between crucible and vacuum chamber, to reach stable pressure reduction, thus molten metal alloy is penetrated from the micropore of crucible bottom with the form of laminar jet, under the effect of piezoelectric oscillator vibration head, the metal alloy jet breakup of outflow is uniform drop, and when by adding battery lead plate middle opening, each drop brings charge equivalence;
7) utilize monitoring system to obtain the diameter of drop, the flow velocity of liquid nitrogen and oscillator frequency in feedback regulation cooling device, thus obtain symmetrical liquid drop.
8) symmetrical liquid drop of fracture is made to be cooled by spirality cooling device, coagulation forming, the most laggard collector.
9) collection, cleaning, drying
Ovum formula compound soldered ball supersonic cleaning machine cleaning after shaping 3 ~ 5 times, ultrasonic cleaning agent is ethanol; Then be 50 ~ 100 DEG C in temperature, vacuum is dry 20 ~ 40 minutes under 5 ~ 10KPa condition;
10) sieve, select and labeling
Filtered out the alloys welding balls of suitable diameter by screening machine or hand screen, vacuum be 2 ~ 3KPa condition lower seal packaging and labelled;
The compound soldered ball of preparation is cut open and carries out the micro-test of backscattered electron, to observe the Entropy density deviation situation of the compound soldered ball inside of preparation, the NovaNanosem430 that the electron microscope model used is FEI Co. of the U.S., its back scattering is used to pop one's head in (BSED), adjustment vacuum (condition of high vacuum degree), operating distance (4.8mm), operating voltage (15KeV), beam spot diameter, (3.5) and multiplication factor (600X), result is by shown in accompanying drawing 2, the dark colour region being positioned at section center in figure is copper-rich phase (i.e. Cu-rich), around light areas is rich tin bismuth phase [i.e. (Sn, Bi)-rich], this explanation utilizes technical scheme of the present invention successfully to prepare compound soldered ball.
Above to invention has been exemplary description; should be noted that; when not departing from core of the present invention, any simple distortion, amendment or other those skilled in the art can not spend the equivalent replacement of creative work all to fall into protection scope of the present invention.
Claims (8)
1. a preparation method for Quick uniform core-shell type alloys welding balls, is characterized in that, carries out according to following step:
1) Cu of proper proportion, Sn and Bi alloy is weighed and put into crucible, close crucible and vacuum chamber;
2) crucible and vacuum chamber are vacuumized, and be filled with protectiveness Ar gas;
3) heating makes metal molten;
4) air valve between closing crucible and vacuum chamber, pours protectiveness Ar gas in crucible, controls its flow velocity to reach the stable pressure reduction of crucible and vacuum chamber, thus is gone out by the small hole injection of the metal of melting from crucible bottom; Meanwhile, under the vibration of piezoelectric oscillator, jet breakup becomes even droplet, and by below add battery lead plate time bring the electric charge of equal electricity, prevent its adhesion;
5) symmetrical liquid drop enters liquid nitrogen spiral cooling device, forms core-shell type soldered ball.
2. the preparation method of a kind of Quick uniform core-shell type alloys welding balls according to claim 1, is characterized in that, the fracture of jet is that the ceramic oscillation bar passed through completes, and its frequency of oscillation is 5-20KHz.
3. the preparation method of a kind of Quick uniform core-shell type alloys welding balls according to claim 1, is characterized in that, is observed size and the flow velocity of drop by image monitoring system, thus feedback regulation draught head and frequency of oscillation, obtain the drop of size uniform.
4. the preparation method of a kind of Quick uniform core-shell type alloys welding balls according to claim 1, is characterized in that, the pressure differential of crucible and vacuum chamber is 0.5-2Pa.
5. the preparation method of a kind of Quick uniform core-shell type alloys welding balls according to claim 1, it is characterized in that, the aperture of crucible bottom and the distance of cooling device are 10mm-100mm.
6. the preparation method of a kind of Quick uniform core-shell type alloys welding balls according to claim 1, it is characterized in that, the degree of supercooling that droplet solidification becomes required for core-shell type soldered ball is provided by liquid nitrogen spiral cooling device.
7. the preparation method of a kind of Quick uniform core-shell type alloys welding balls according to claim 1, is characterized in that, the mass ratio of described Cu, Sn and Bi is 24:16:80.
8. realize a device for method described in claim 1, it is characterized in that, comprising:
1) vacuum chamber, is connected with vavuum pump by the appendix with vacuum valve;
2) silica crucible with heating system, is positioned at the top of vacuum chamber;
3) image monitoring system, comprises one and dodges device frequently, a video camera and a Control System of Microcomputer;
4) two with the protectiveness Ar gas induction system of pneumatic control valve, connects crucible respectively, vacuum chamber and air;
5) a piezoelectric vibration system, wherein ceramic oscillation bar distance crucible bottom distance is 0.3-2mm;
6) one adds battery lead plate, is positioned at the below of crucible nozzle, and is just leaving opening to the position of nozzle, so that drop passes through;
7) a liquid nitrogen spiral cooling gathering-device, makes drop cool in the apparatus and forms core-shell type soldered ball;
8) baffle plate, stops that the drop before stablizing enters cooling device.
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| CN201310395973.5A CN104416161A (en) | 2013-09-03 | 2013-09-03 | Method for quickly producing uniform core-shell type alloy solder balls |
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| CN201310395973.5A CN104416161A (en) | 2013-09-03 | 2013-09-03 | Method for quickly producing uniform core-shell type alloy solder balls |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105057688A (en) * | 2015-08-10 | 2015-11-18 | 宁波广博纳米新材料股份有限公司 | Method for producing superfine lead-free solder powder |
| CN105826207A (en) * | 2016-03-17 | 2016-08-03 | 大连理工大学 | Method and device for manufacturing core-shell structure bump |
| CN107052355A (en) * | 2017-05-02 | 2017-08-18 | 西安赛隆金属材料有限责任公司 | A kind of high-temperature metal powder quickly cooling device |
| CN107511603A (en) * | 2017-09-30 | 2017-12-26 | 北京康普锡威科技有限公司 | A kind of compound welding powder of core shell structure bimetallic and preparation method thereof |
| CN110102759A (en) * | 2019-05-28 | 2019-08-09 | 武汉理工大学 | A kind of preparation method of electromagnetism compacting core-shell structure solder weld tabs |
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| CN102210998A (en) * | 2011-05-19 | 2011-10-12 | 天津大学 | Device and method for preparing egg-type alloy welded ball |
| CN102672365A (en) * | 2011-03-07 | 2012-09-19 | 三星半导体(中国)研究开发有限公司 | Solder ball and manufacturing method thereof |
| CN103008660A (en) * | 2012-12-21 | 2013-04-03 | 大连理工大学 | Method for preparing shape-controlled core-shell uniform particles |
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2013
- 2013-09-03 CN CN201310395973.5A patent/CN104416161A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102672365A (en) * | 2011-03-07 | 2012-09-19 | 三星半导体(中国)研究开发有限公司 | Solder ball and manufacturing method thereof |
| CN102210998A (en) * | 2011-05-19 | 2011-10-12 | 天津大学 | Device and method for preparing egg-type alloy welded ball |
| CN103008660A (en) * | 2012-12-21 | 2013-04-03 | 大连理工大学 | Method for preparing shape-controlled core-shell uniform particles |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105057688A (en) * | 2015-08-10 | 2015-11-18 | 宁波广博纳米新材料股份有限公司 | Method for producing superfine lead-free solder powder |
| CN105826207A (en) * | 2016-03-17 | 2016-08-03 | 大连理工大学 | Method and device for manufacturing core-shell structure bump |
| CN105826207B (en) * | 2016-03-17 | 2018-05-04 | 大连理工大学 | A kind of core shell structure salient point preparation method and device |
| CN107052355A (en) * | 2017-05-02 | 2017-08-18 | 西安赛隆金属材料有限责任公司 | A kind of high-temperature metal powder quickly cooling device |
| CN107511603A (en) * | 2017-09-30 | 2017-12-26 | 北京康普锡威科技有限公司 | A kind of compound welding powder of core shell structure bimetallic and preparation method thereof |
| CN110102759A (en) * | 2019-05-28 | 2019-08-09 | 武汉理工大学 | A kind of preparation method of electromagnetism compacting core-shell structure solder weld tabs |
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Application publication date: 20150318 |