CN104412472B - 负载总线组件和制作这种组件的方法 - Google Patents
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Abstract
一种制作负载总线阵列组件(4)的方法,包括:将多个负载导体(2)置于导热基板(6)内;将负载连接器(14)的一部分置于导热基板内;以及将负载导体电气连接到导热基板内负载连接器的那一部分上。
Description
相关申请的交叉引用
本申请要求2012年7月12日提交的美国临时专利申请(序列号No.61/670,741)的优先权,该申请并入本文,以作引用。
技术领域
本公开概念一般涉及负载模块,特别涉及这种负载模块的负载总线组件(loadbuss assemblies)。本公开概念进一步涉及制作负载总线组件的方法。
背景技术
美国专利No.8,094,436公开了一种***式断路器面板(circuit breakerpanel),包括壳体,耦接至该壳体的电气总线结构,以及耦接至该电气总线结构的数个第一***式构件。多个断路器包括第一表面和与第一表面相对的第二***构件。所述多个断路器中的每一个的第二***构件与对应的多个第一***构件中的其中一个相配合。一种板状构件可拆开地耦接至壳体上。板状构件包括第一表面和与之相对的第二表面。所述多个断路器的第一表面与板状构件的相对的第二表面啮合,以保持所述多个断路器中的每一个与对应的所述多个第一***构件中的其中一个相配合。
***式断路器面板的后部包括三相交流电(AC)***的第一和第二馈线(feeders)。通常,对于每个馈线来讲,都设有用于三相中的每一相的单一的三极AC断路器和多个单极AC断路器。例如,每个馈线都是一种带有三个电源端子的三端子接线盒,适用于对应馈线的三相。电气总线结构的第一表面在多个第一***构件附近,而馈线和其电源端子则与多个负载连接器一同耦接至与之相对的第二表面上。负载连接器包括来自与各个馈线相联的对应的断路器的负载输出端(例如,负载)。同样,对应断路器的电源输入端(例如,电源线)则与各个馈线相联。电气总线结构(例如,其多个内部电源层)适时地将输入功率输送至各个断路器。
尽管馈线是直接耦接到电气总线结构上的相应接线盒及其电源端子上,断路器的负载输出端通过若干独立导体或带状电缆电气连接在电气总线结构和对应的负载连接器之间。因此,需要手工操作以在电气总线结构和对应的负载连接器之间电气连接负载输出端。另外,负载连接器和独立的导体或带状电缆则明显增加了***式断路器面板的尺寸。
为此,断路器面板还存在改进空间。
另外,断路器面板的负载总线组件还存在改进空间。
制造断路器面板的负载总线组件的方法还有改进的空间。
发明内容
这些及其它需求可通过本公开概念的各个方面而得到满足,这些公开概念将多个负载导体置于导热基板内;将负载连接器的一部分置于导热基板内;以及将负载导体电气连接至导热基板内的所述负载连接器的那一部分上。
根据本公开概念的一个方面,负载总线阵列组件包括:导热基板;置于导热基板内的多个负载导体;以及置于导热基板内的一部分负载连接器,其中,所述负载导体电气连接至导热基板内的负载连接器的那一部分上。
根据本公开概念的另一个方面,制作负载总线阵列组件的方法包括:将多个负载导体置于导热基板内;将负载连接器的一部分置于导热基板内;以及将负载导体电气连接至导热基板内的负载连接器的那一部分上。
附图说明
通过结合附图阅读如下优选实施方式的描述,可全面理解本公开概念,附图如下:
图1A为根据本公开概念的实施方式的负载总线阵列组件的多个微型导电迹线(miniature conductive traces)的等距视图。
图1B为图1A所示的微型导电迹线的分解等距视图,根据本公开概念的另一个实施方式的负载总线阵列组件的导热基板和负载连接器。
图1C为图1B所示的微型导电迹线和负载连接器的等距视图。
图2A和2B分别为等距视图和侧向垂直正视图,示出了根据本公开概念另一个实施方式的负载模块组件的负载总线阵列组件的导电迹线。
图3A和3B分别为断路器面板的等距视图和侧向垂直正视图,该断路器面板包括带有嵌入馈线层的负载模块组件和图2A所示负载总线阵列组件。
图4为图3A所示的断路器面板的平面图,所示为盖板撤去,可看到负载连接器。
图5A和5B分别为背板模块的等距视图和侧向垂直正视图,包括嵌入的馈线层和图2A所示负载总线阵列组件。
图6为图5A所示的背板模块的嵌入馈线层的平面图,所示负载总线阵列组件已被撤去。
具体实施方式
本文中使用的术语“数量”系指一个或大于一个的整数(即,多个)。
本文中使用的两个或多个部件“连接”或“耦接”在一起的描述系指所述部件直接或通过一个或多个中间部件结合在一起。此外,本文中使用的两个或多个部件“附着在一起”的描述系指所述部件直接结合在一起。
本公开概念将嵌入在导热基板内的微型导电迹线视为将负载连接器建立及自动电气连接至多个负载总线阵列微型导电迹线的方法的组成部分。与已知的线路互联(wiring interconnect)封装方法相比,该方法简化了负载模块的结构,并在尺寸、深度和重量方面具有相当大的有利之处。
本公开概念优选提供:(1)100%导热背板;以及(2)100%嵌入负载导体解决方案。
微型导电迹线的材料可以是(例如)铜或铝。
导热基板材料可以是耐热相对较高的树脂,例如液晶聚合物(LCP)或聚醚醚酮(PEEK)。
本公开概念结合超小型或飞机断路器来介绍,尽管本公开概念适用于多种不同用途的各种不同断路器。例如(但不限于),这种断路器可以用在典型频率大约为400Hz的飞机交流电(AC)***,但也可用于直流电(DC)***。另外,显然,本公开概念适用于包括在以其它频率工作的AC***中的其它类型断路器面板;适用于较大型断路器,诸如微型住宅或商用断路器;以及适用于各种用途范围的断路器,诸如,住宅、商用、工业、航天,和汽车。作为进一步的非限定性示例,可以是使用不同频率(例如,但不限于,50,60,120,400 Hz以上或以下频率)的AC(例如,但不限于,120,220,480-600 VAC),和DC(例如,但不限于,42VDC)。还是作为进一步非限定性示例,在单相和多相(例如,但不限于,三相)条件下操作都是可以的。
负载总线阵列组件4(图1B和1C)的微型导电迹线2适合嵌入到导热基板6(图1B)内。例如,但不限于,导热基板6适合模制或加工成带有沟槽8和孔眼10的基板,以容纳微型导电迹线2,如图1B所示。相应的负载模块12(图2A和2B)取代已知的现有技术模块(图中未示),后者的独立连线被包胶模制(over-mold)压到聚氨酯上并通过插座连接到嵌入馈线部分上。例如,参见美国专利(No.8,094,436),该专利并入本文,以作引用。
本公开概念简化了负载总线阵列组件4的结构,并从而简化了负载模块12。例如,这样,起负载导体作用的微型导电迹线2就可以嵌入到模制导热基板6(例如,但不限于,液晶聚合物(LCP),诸如美国罗得岛州北金斯敦的酷聚合物公司(Cool Polymers,Inc.)销售的E-系列导热塑料;一种合适的导热和电绝缘环氧树脂)上,基板可密封并绝缘负载导体。
或者,如果导热基板6由机械加工制成,那么,负载导体可以使用合适的密封材料(图中未示)进行密封并绝缘(例如,将导体置于槽道内并密封,使该导体与其它导体和外部环境隔离)。该密封材料诸如,但不限于,胶带、胶或环氧树脂。例如,该材料可在两侧用粘合剂来电气绝缘,而且,也相对较薄(例如,但不限于,0.005吋),并与基板6和迹线2相一致。
微型导电迹线2可以通过固定件和采用传统波峰焊接工艺自动耦接到负载连接器14及其负载管脚15(图1B和图1C)上。例如,在模制期间,将负载导体置于导热基板6内,并将负载连接器14固定到精确部位并装配。然后,将负载总线阵列组件4送入合适的波峰焊台(图中未示),从而将连接器负载管脚15和负载连接器14电气耦接到负载导体迹线2上。或者,这个工作也可手动操作,但在成本上并不一定合算。这省略了点对点布线连接(例如,但不限于,压接、手工焊接)。本公开概念另外将负载导热基板层16的深度增加了大约0.25",适用于,该导热基板层直接耦接到负载模块12的馈线层18上(图2A,2B,3A和3B)。另外,对于相应的断路器面板20(图3A,3B和图4),基线整体深度显著下降,从大约4”至大约5”降低到大约1”至大约2”。
图4示出了断路器面板20,其盖22(图3A和3B所示)已撤去,可看到负载连接器14。
图5A和5B示出了断路器面板20的背板模块24。
将负载导体置于导热基板6内的各种可能的方法包括:(1)将微型导电迹线2包胶模制入导热基板6内;(2)将微型导电迹线2手动置入导热基板6内;以及(3)如果微型导电迹线2的横截面合适(例如,但不限于,扁平、圆形、方形)时,可采用自动线轴缠绕置放。例如,对于后一种方法,采用CNC(x,y,z)控制的绕线机(图中未示)来置放未涂层的负载导体(图中未示),这样,就无需手动操作来切割和置放所放入的线导体(例如,图2A中的2)。自动缠绕置放方式适合大批量生产,很像送线机一样。这种方法可精确地将按长度切割的线(图中未示)送到喷嘴(图中未示)上,后者采用CNC控制来将导体(例如,图1A中的2)置入导热基板6(图1B)上的沟槽8(图1B)内。
尽管上面详细介绍了本公开概念的具体实施方式,但所属领域技术人员都很清楚,根据本公开内容的整体思想,仍可对这些详细描述进行各种改进,开发出各种不同实施方式。为此,所公开的具体布置形式系仅为示例性的,并非限定性的,所附权利要求和任何及全部等同部分全面涵盖了本公开概念的范围。
Claims (15)
1.一种负载总线阵列组件(4),包括:
导热基板(6);
置于所述导热基板内的多个负载导体(2);以及
负载连接器(14)的一部分置于所述导热基板内,其中,负载连接器包括断路器的负载输出端;
其中,所述负载导体电气连接到所述导热基板内的负载连接器的那一部分上。
2.根据权利要求1所述的负载总线阵列组件(4),其中,所述负载导体为多个微型导电迹线(2)。
3.根据权利要求2所述的负载总线阵列组件(4),其中,所述微型导电迹线采用包胶模制置入所述导热基板内。
4.根据权利要求2所述的负载总线阵列组件(4),其中,所述微型导电迹线带有扁平横截面。
5.根据权利要求2所述的负载总线阵列组件(4),其中,所述微型导电迹线带有圆形横截面。
6.根据权利要求2所述的负载总线阵列组件(4),其中,所述微型导电迹线带有方形横截面。
7.一种负载模块(12),包括权利要求1所述的负载总线阵列组件(4)。
8.一种断路器面板(20),包括:
盖(22);以及
背板模块(24),包括权利要求1所述的负载总线阵列组件。
9.一种制作负载总线阵列组件(4)的方法,包括:
将多个负载导体(2)置于导热基板(6)内;
将一部分负载连接器(14)置于所述导热基板内;其中,负载连接器包括断路器的负载输出端;以及
将所述负载导体电气连接到所述导热基板内的负载连接器的那一部分上。
10.根据权利要求9所述的方法,进一步包括:
将多个微型导电迹线(2)用作所述多个负载导体。
11.根据权利要求10所述的方法,进一步包括:
将所述微型导电迹线包胶模制置入所述导热基板内。
12.根据权利要求10所述的方法,进一步包括:
将所述微型导电迹线手动置入所述导热基板内。
13.根据权利要求10所述的方法,进一步包括:
将所述微型导电迹线自动置入所述导热基板内。
14.根据权利要求13所述的方法,进一步包括:
采用带有扁平、圆形或方形横截面的所述微型导电迹线;以及
采用自动线轴缠绕置放方式作为所述自动置入的方式。
15.根据权利要求10所述的方法,进一步包括:
通过固定件和通过波峰焊接,将所述微型导电迹线自动耦接到负载连接器的那一部分上。
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US201261670741P | 2012-07-12 | 2012-07-12 | |
US61/670,741 | 2012-07-12 | ||
PCT/US2013/032927 WO2014011243A1 (en) | 2012-07-12 | 2013-03-19 | Load buss assembly and method of manufacturing the same |
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CN104412472B true CN104412472B (zh) | 2016-12-14 |
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US (1) | US9997895B2 (zh) |
EP (1) | EP2873125A1 (zh) |
JP (1) | JP6199383B2 (zh) |
CN (1) | CN104412472B (zh) |
BR (1) | BR112014029924A2 (zh) |
CA (1) | CA2872753A1 (zh) |
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CA2872753A1 (en) | 2014-01-16 |
EP2873125A1 (en) | 2015-05-20 |
CN104412472A (zh) | 2015-03-11 |
RU2639315C2 (ru) | 2017-12-21 |
WO2014011243A1 (en) | 2014-01-16 |
BR112014029924A2 (pt) | 2017-06-27 |
RU2015104663A (ru) | 2016-08-27 |
US9997895B2 (en) | 2018-06-12 |
JP6199383B2 (ja) | 2017-09-20 |
US20150194794A1 (en) | 2015-07-09 |
JP2015534424A (ja) | 2015-11-26 |
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