CN104407735B - Lead of touch screen conducting wire and preparation method thereof and touch-screen mobile phone - Google Patents
Lead of touch screen conducting wire and preparation method thereof and touch-screen mobile phone Download PDFInfo
- Publication number
- CN104407735B CN104407735B CN201410630763.4A CN201410630763A CN104407735B CN 104407735 B CN104407735 B CN 104407735B CN 201410630763 A CN201410630763 A CN 201410630763A CN 104407735 B CN104407735 B CN 104407735B
- Authority
- CN
- China
- Prior art keywords
- electrically conductive
- conductive ink
- conducting wire
- lead
- touch screen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
The present invention provides a kind of production method of lead of touch screen conducting wire, including：Prepare nanometer copper alloy powder and the electrically conductive ink of Nano glass powder；Electrically conductive ink is applied to formation electrically conductive ink coating on touch screen base plate；Electrically conductive ink coating is subjected to prebake conditions；It will need to form the part of lead conducting wire pattern in the electrically conductive ink coating after baking, be sintered；Remove the un-sintered part of electrically conductive ink coating.Preparation method using the present invention forms lead of touch screen conducting wire by way of selective sintering electrically conductive ink, has very good adhesive effect with the ITO pattern on touch screen base plate, touch screen base plate；Whole preparation method is simple for process, of low cost without the equipment of complex and expensive, and environmental protection, and product reliability improves.
Description
Technical field
The invention belongs to touch-controls to show preparing technical field, and in particular to a kind of lead of touch screen conducting wire and its making
Method and touch-screen mobile phone.
Background technology
During smart mobile phone is manufactured, the making of touch-screen is one of committed step therein.Wherein, touch-screen draws
Line is the conducting wire turned between touch chip I/O port and ITO (tin indium oxide) pattern, it is required that resistivity is low, circuit is smart
Carefully, and on high-end touch-screen mobile phone line width line-spacing is required to be less than 50 microns.At present, one kind of lead of touch screen conducting wire
Production method is mainly Vacuum Deposition molybdenum/aluminium/molybdenum conductive film, then forms conducting wire by chemical etching；Another method is silk
Conductive silver paste is printed, the conducting wire less than 50 microns of line widths is being formed by laser ablation.However the equal technique of both approaches is answered
It is the miscellaneous, wasting of resources, of high cost.
The content of the invention
The above-mentioned deficiency for aiming to overcome that the prior art of the embodiment of the present invention solves lead of touch screen conducting wire
Production method there are complex process and it is of high cost the problem of, and one kind is provided and can be more fine and simply prepare touch-screen and draws
The method of line conducting wire.
In order to realize foregoing invention purpose, the technical solution of the embodiment of the present invention is as follows：
A kind of production method of lead of touch screen conducting wire, which is characterized in that include the following steps：
Prepare copper alloy powder containing nanometer and the electrically conductive ink of Nano glass powder；
The electrically conductive ink is applied to formation electrically conductive ink coating on touch screen base plate；
The electrically conductive ink coating is subjected to prebake conditions；
It will need to form the part of lead conducting wire pattern in the electrically conductive ink coating after baking, be sintered place
Reason；
Remove the un-sintered part of the electrically conductive ink coating.
Preparation method using the present invention forms lead of touch screen conductor wire by way of selective sintering electrically conductive ink
ITO pattern on road, with touch screen base plate, touch screen base plate has very good adhesive effect；Whole preparation method technique letter
It is single, it is of low cost without the equipment of complex and expensive, and also environmental protection, product reliability improve.
Present invention further propose that the lead of touch screen conducting wire being prepared by the above method.
The lead of touch screen conducting wire above method using the present invention of the present invention prepares gained, forms lead of touch screen
The adhesive effect of ITO pattern in conducting wire, with touch screen base plate, touch screen base plate is more excellent, and is prepared compared to conventional
Lead of touch screen conducting wire, the quality of lead conducting wire is finer, greatly reduce short circuit situation；Product can
It is improved by property.
The present invention further also proposes a kind of touch-screen mobile phone product using above-mentioned lead of touch screen conducting wire.
The touch-screen mobile phone product of the present invention is made, lead of touch screen conductor wire of above-mentioned lead of touch screen conducting wire
Road and the bonding force of the ITO pattern on touch screen base plate, touch screen base plate are stronger, using effect and quality higher；The essence of circuit
The problems such as thin degree higher, the short circuit occurred in use, substantially reduces, and improves the quality of product.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to embodiments, to the present invention
It is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not used to
Limit the present invention.
The embodiment of the present invention provides a kind of production method of lead of touch screen conducting wire, includes the following steps：
S10 prepares copper alloy powder containing nanometer and the electrically conductive ink of Nano glass powder；
Electrically conductive ink is applied to formation electrically conductive ink coating on touch screen base plate by S20；
S30 carries out prebake conditions to electrically conductive ink coating；
S40, will need to form the position of lead conducting wire pattern in electrically conductive ink coating and is sintered；
S50 removes the un-sintered part of electrically conductive ink coating.
Wherein integral vertical is intended to electrically conductive ink being first prepared into a coating shape on touch screen base plate in the present invention
State, then according to required lead conducting wire pattern to be formed on touch-screen, the sintering to making choice property of coating, sintering
Part is finally formed by curing conducting wire；The lead that can obtain after non-sintered part is removed again in touch screen base plate is led
Electric line pattern.Integral production method is simple for process, can form the fine leads conducting wire that line width line-spacing is less than 50 microns, draw
Line conducting wire forms very good adhesive effect, product reliability with the ITO pattern on touch screen base plate, touch screen base plate
It improves.
Meanwhile the present invention replaces fine silver material using copper alloy, compared with the method for traditional silk-screen silver paste laser ablation again,
Material cost significantly reduces, and the short circuit caused by silver ion migration under hot and humid environment of silver-colored fine-line can be avoided to ask
Topic；Compared with Vacuum Deposition molybdenum/aluminium/molybdenum again method for chemially etching, the equipment of method of the invention without complex and expensive, it is not required that
Developer solution, etching solution and the remover largely used in chemical etching process, chemical waste fluid is few, thus equipment cost is low, technique
Simply, it is environmentally protective.
It wherein realizes to enable to be formed the method for conductive ink coating in the present invention and ensures quality, in the present invention
The above-mentioned step S10 for preparing conductive ink in, wherein using molecular weight in the range of 500~10000, have polyether backbone bone
Dispersion effect of the polymer of frame and Amino End Group as dispersant improving material may be employed following structural formula and represent：
In formula, R1Represent hydrogen atom or methyl, R2Represent hydrogen atom or alkyl, R3Represent alkyl, alkoxy, hydroxyl and aldehyde
One kind in base；X and y represents 0 or positive integer, and x+y >=2；N represents the positive integer more than 1, and m represents positive integer.
In the usual preparation process of existing conductive ink, nano raw material solvent and dispersion aids are disperseed into mixing.At this
The polymer with polyether backbone skeleton and Amino End Group more prominent compared to effect in existing method is used in invention as scattered
Agent.Reason is：
The Amino End Group of the polymer can form firm anchorage effect with nanometer copper alloy powder and Nano glass powder surface,
Their dispersion stabilization is led in raising；Polyether backbone skeleton is by ethyoxyl (EO) and/or propoxyl group (PO) structural unit group simultaneously
Into, have and good flexibility and be easy to swing, form good steric hindrance effect, be conducive to prevent nanometer copper alloy powder and
The reunion of Nano glass powder, so as to improve their dispersed stability.The improvement of electrically conductive ink dispersion stabilization is conducive to subtract
Few the defects of being generated in coating process, the final quality and yield for improving product.And it more importantly, is used in the present invention
Meta-alkalescence on the group and bulk property of the dispersant, can to avoid high acid value dispersant (rich in carboxylic group, phosphate group,
The dispersant of the acidic-groups such as sulfonic acid group) equally the resistance value of ITO pattern on touch screen base plate is had an impact.
In actual implementation, there is the polymeric dispersant that (A) structural formula represents, such as the polyethers of HUNTSMAN companies of the U.S.
AmineB-60, B-200, L-100, L-200, L-207, L-300 etc..It is represented with (B) structural formula
Polymeric dispersant, such as methoxy poly (ethylene glycol) amine, α-aldehyde radical-omega-amino polyethylene glycol, alpha-amido-ω-hydroxyl polyethylene glycol
Deng such as：
(methoxy poly (ethylene glycol) amine)；
(α-aldehyde radical-omega-amino polyethylene glycol)；
(alpha-amido-ω-hydroxyl polyethylene glycol) etc..
The preparation process of electrically conductive ink is carried out in the present invention using above-mentioned powder, it can be by nanometer copper alloy powder, nanometer glass
Glass powder, dispersant and solvent are mixed to form electrically conductive ink slurry, and electrically conductive ink is applied to touch in order to by coating method
On panel glass substrate.Wherein, nanometer copper alloy powder is the functional material of electrically conductive ink, nothing of the Nano glass powder as electrically conductive ink
Machine adhesive, dispersant, which is then used in a solvent mix nanometer copper alloy powder and Nano glass powder, to be disperseed to form uniform ink
Or slurry.Wherein,
Nanometer copper alloy powder is nanometer copper-silver alloyed powder, and grain size is in the range of 1~100nm.Compared to nanometer pure copper powder, nanometer
Cu-ag alloy powders can realize sintering at a lower energy, be conducive to protect touched panel glass substrate and touched panel glass substrate
On ITO pattern it is injury-free in sintering process, promote product quality and yield.Copper is effective scavenger of silver ion, silver
Introducing will not cause silver ion migration problem.
Inorganic bond of the Nano glass powder as electrically conductive ink, it is preferred to use grain size is unleaded in the range of 1~100nm
Glass dust, by weight hundred scores are represented comprising following components：
Wherein, SiO2It is the important component to form glass, makes glass that there is excellent mechanical strength, chemical stability
With thermal stability etc.；B2O3And the component of glass is formed, make glass dust that there is relatively low softening point, and inhibit coefficient of expansion mistake
Divide increase, also with good fluxibility, improve the mobility of glass at high temperature；Bi2O3With reduction glass dust softening point
Effect makes glass dust, with appropriate mobility, adjust glass with suitable coefficient of thermal expansion in fusing；ZnO energy
Improve the corrosion resistance of glass；Al2O3The tendency towards devitrification of glass can be reduced, improves chemical stability and mechanical strength, improves heat
Stability；X2O(Li2O+Na2O+K2O it is) good cosolvent, promotes the fusing of glass dust；YO (MgO+CaO+SrO+BaO) energy
The high temperature viscosity of glass is reduced, promotes the fusing of glass dust.By the ratio and nanometer that adjust the Nano glass powder each component
The particle size of glass dust can make Nano glass powder have relatively low fusing point and the suitable coefficient of expansion, solve electrically conductive ink and exist
To the adhesion problem and crack problem of glass substrate present in sintering process.
As for the preparation method of Nano glass powder, can Nano glass powder be prepared by high-energy ball milling method, i.e., first weighed each
Oxide component carries out batch mixing, high melt, quenching, high-energy ball milling refinement, drying and processing, nano-glass is finally made successively
Powder.Can also Nano glass powder be prepared by vaporize-condensation law, i.e., use plasma-arc under vacuo by Si, B, Bi, Zn etc.
The simple substance of element is heated to high temperature and evaporates together, and obtained gas will be evaporated by being passed through the mixed gas containing inert gas and oxygen
Body atom is condensed into Nano glass powder.
The Nano glass powder that the present invention uses, advantage are that softening temperature is low, during electrically conductive ink is sintered, nanometer
Glass dust can occur to melt and be sintered together with nanometer copper-silver alloyed powder.When touch screen base plate most commonly uses glass substrate,
Glass dust belongs to similar substance with touched panel glass substrate and ITO, based on similar compatibility principle, is easily interpenetrated in interface,
Thus glass dust can improve Kufil and the bonding of the ITO pattern on touched panel glass substrate and touched panel glass substrate is imitated
Fruit promotes the reliability of product；The coefficient of expansion of glass dust and the expansion coefficient similar of touched panel glass substrate, can avoid being sintered
Dramatic temperature changes interfacial stress caused by with deformation too greatly in the process, cracks or damaged, influences product quality.
And the solvent in conductive ink preparation process, the in the present invention condition based on coating and selective sintering
Technique, using at least one of alcohols solvent of the boiling point under normal pressure in the range of 100~250 DEG C or alcohol ethers solvent.
It is possible to further according to purposes needs, suitably added in electrically conductive ink a small amount of resin component, levelling agent,
Antifoaming agent, reducing agent etc., as long as not damaging the dispersion stabilization of electrically conductive ink and the quality of lead conducting wire.It is preparing
In the process, during Nano glass powder can be uniformly dispersed with nanometer copper-silver alloyed powder using solvent and dispersant, can also adopt
With the means by ultrasonic wave, scattered effect is promoted.
Further in step S20 by above-mentioned electrically conductive ink using coating by the way of, formed electrically conductive ink coating, coating
Method can be rotary coating, slit coating, scraper coating, bar coating, spraying coating, print roll coating, silk-screen, gravure,
Offset printing etc., as long as the uniform electrically conductive ink coating of a layer thickness can be formed on the touched panel glass substrate.
After electrically conductive ink coating in forming step S20, further step S30 by electrically conductive ink coating 80~
Prebake conditions are carried out in air atmosphere in the range of 150 DEG C, to remove the solvent in the electrically conductive ink coating.It prevents remaining molten
Acutely gasification occurs during follow-up sintering and lead conducting wire is caused to form stomata or crackle for agent, so as to reduce circuit
Quality.
Further, the touch screen base plate that step S40 will have electrically conductive ink coating after pre-sintering, needed on touch-screen
Lead conducting wire pattern to be formed, the sintering to making choice property of coating, the part of sintering are finally formed by curing conductor wire
Road.Selective laser sintering or the sintering of selectivity UV light may be employed in the method for selective sintering.Wherein,
Selective laser sintering under control of the computer, is made a reservation for for laser beam by the circuit setting of conducting wire pattern
Mobile route is scanned the electrically conductive ink coating on touch screen base plate.Nanometer copper-silver alloyed powder in electrically conductive ink coating
It is melted with Nano glass powder under laser irradiation, and is sintered the circuit to form continuous conduction.By adjusting laser facula
Size, the lead conducting wire that line width and line-spacing are less than 50 microns can be obtained.
Alternatively property sintering method, selective UV light sintering is that photomask is covered in touched panel glass base
On the electrically conductive ink coating of plate, then electrically conductive ink coating is irradiated using pulse UV light, is illuminated the nanometer in region
Copper alloy powder and Nano glass powder are melted and are sintered, and form lead conducting wire.By portraying specific leads pattern in light
On mask plate, the lead conducting wire of line width and line-spacing less than 50 microns can be sintered out on touched panel glass substrate.Pass through
Selective sintering obtains the fine-line that line width line-spacing is less than 50 microns, relatively direct inkjet printing or intaglio printing the methods of system
Make the fine pattern that line width line-spacing is less than 50 microns, be technically more easily controlled, and the effect and quality of the conducting wire formed
Higher.
The electrically conductive ink of un-sintered part is removed in final step S50, the mode of cleaning solution cleaning may be employed in implementation
Carry out, due to the electrically conductive ink coating in un-sintered region can not be formed with touched panel glass substrate it is effective bonding, thus easily
It is washed to remove, is led so as to be left on touched panel glass substrate and be sintered the curing lead strong with touch screen base plate bonding force
Electric line.The method of cleaning, can use elution, rinse, ultrasonic cleaning the methods of, no particular/special requirement.Cleaning solution selection has
Solvent, and one or more mixtures preferably in alcohols, ketone, alcohol ethers, ether-ether class or amide solvent.Not
In the case of damaging lead conducting wire, surfactant can also be contained in cleaning solution, promotes cleaning performance.
Present invention further propose that have the above method prepare obtain lead of touch screen conducting wire.The touch-screen of the present invention
The lead conducting wire above method using the present invention prepares gained, forms lead of touch screen conducting wire, with touch screen base plate,
ITO pattern on touch screen base plate has that very good adhesive effect is more excellent, and compared to the lead of touch screen routinely prepared
Conducting wire, the quality of silver-colored conducting wire is finer, greatly reduces the situation of short circuit；Product reliability improves.
The present invention further also protects a kind of touch-screen mobile phone product by using above-mentioned lead of touch screen conducting wire.This hair
Bright touch-screen mobile phone product is made of above-mentioned lead of touch screen conducting wire, lead of touch screen conducting wire and touch-screen base
The bonding force of ITO pattern on plate, touch screen base plate is stronger, using effect and quality higher；The fine degree higher of circuit, makes
It is substantially reduced with the problems such as short circuit of middle appearance, the entrant sound quality of product.
To make the more clear implementation that is complete, being easy to those skilled in the art of the implementation detail of above method process of the present invention
With reference to and make the present invention protrusion progressive effect it is more notable, by the following examples to the implementation of the above process into
Row concrete example explanation.
Embodiment 1
The raw material used in the present embodiment 1：(average grain diameter 45nm, silver-colored mass percent are nanometer copper-silver alloyed powder
10%), (average grain diameter 70nm, each component mass percent are SiO to Nano glass powder25%, B2O312%, Bi2O3
80%, Na2O 3%), polyetheramine dispersantL-207 (weight average molecular weight 2000, the U.S.
HUNTSMAN companies), mixed solvent (press 1 by 1,2- propylene glycol and propylene glycol monobutyl ether:2 weight ratio is prepared, the two boiling point point
It Wei not be 188 DEG C and 171 DEG C).
Lead of touch screen conducting wire is prepared in accordance with the following steps：
S10 takes 19.4g nanometer copper-silvers alloyed powder, 0.6g Nano glass powders, 1g polyetheramine dispersantsL-207 and 79g mixed solvents are uniformly dispersed their mechanical mixtures and using ultrasonic wave,
The electrically conductive ink that solid content is 20% or so is made；
Electrically conductive ink is applied on touched panel glass substrate by S20 by electrically conductive ink using rotary coating mode；
S30, the touched panel glass substrate for being coated with electrically conductive ink move in oven and prebake conditions 15 are carried out at 100 DEG C divide
Clock removes organic solvent；
S40 according to the pattern form of predetermined conducting wire, selects the electrically conductive ink coating on substrate using laser
Selecting property sintering processes form the lead conducting wire that line width is 30 microns；
S50 moves to the touched panel glass substrate for forming lead conducting wire in the container for filling methyl iso-butyl ketone (MIBK), into
Row ultrasonic cleaning, removes the electrically conductive ink coating in un-sintered region on touched panel glass substrate, and touch-screen is prepared in technical ability
Lead conducting wire.
Embodiment 2
The raw material used in the present embodiment 2：(average grain diameter 80nm, silver-colored mass percent are nanometer copper-silver alloyed powder
20%), (average grain diameter 70nm, each component mass percent are SiO to Nano glass powder25%, B2O312%, Bi2O3
80%, Na2O 3%), polyetheramine dispersantL-207 (weight average molecular weight 2000, the U.S.
HUNTSMAN companies), mixed solvent (press 1 by 1,2- propylene glycol and propylene glycol monobutyl ether:2 weight ratio is prepared, the two boiling point point
It Wei not be 188 DEG C and 171 DEG C).
Lead of touch screen conducting wire is prepared in accordance with the following steps：
S10 takes 19.4g nanometer copper-silvers alloyed powder, 0.6g Nano glass powders, 0.8g polyetheramine dispersantsL-207 and 79.2g mixed solvents are disperseed by their mechanical mixtures and using ultrasonic wave
It is even, the electrically conductive ink that solid content is 20% or so is made；
Electrically conductive ink is applied on touched panel glass substrate by S20 using rotary coating mode；
S30, the touched panel glass substrate for being coated with electrically conductive ink move in oven and prebake conditions 15 are carried out at 100 DEG C divide
Clock removes organic solvent；
S40 according to the pattern form of predetermined conducting wire, selects the electrically conductive ink coating on substrate using laser
Selecting property sintering processes form the lead conducting wire that line width is 30 microns；
S50 moves to the touched panel glass substrate for forming lead conducting wire in the container for filling methyl iso-butyl ketone (MIBK), into
Row ultrasonic cleaning removes the electrically conductive ink coating in un-sintered region on touched panel glass substrate.
Embodiment 3
The raw material used in the present embodiment 3：(average grain diameter 80nm, silver-colored mass percent are nanometer copper-silver alloyed powder
20%), (average grain diameter 50nm, each component mass percent are SiO to Nano glass powder26%, B2O37%, ZnO 6%,
Bi2O380%, BaO 1%), methoxy poly (ethylene glycol) amine (molecular weight 2000, Jiaxing Bo Mei Bioisystech Co., Ltd) with
And mixed solvent (presses 1 by 1,2- propylene glycol and propylene glycol monobutyl ether:2 weight ratio is prepared, the two boiling point be respectively 188 DEG C and
171℃)。
Lead of touch screen conducting wire is prepared in accordance with the following steps：
S10, take 19.4g nanometer copper-silvers alloyed powder, 0.6g Nano glass powders, 0.8g methoxy poly (ethylene glycol)s amine and
79.2g mixed solvents are uniformly dispersed their mechanical mixtures and using ultrasonic wave, and the conduction that solid content is 20% or so is made
Ink；
Electrically conductive ink is applied on touched panel glass substrate by S20 using rotary coating mode；
S30, the touched panel glass substrate for being coated with electrically conductive ink move in oven and prebake conditions 15 are carried out at 100 DEG C divide
Clock removes organic solvent；
S40 using laser to electrically conductive ink coating the making choice property sintering processes on substrate, forms line width as 30 microns
The lead conducting wire of left and right；
S50 moves to the touched panel glass substrate for forming lead conducting wire in the container for filling methyl iso-butyl ketone (MIBK), into
Row ultrasonic cleaning removes the electrically conductive ink coating in un-sintered region on touched panel glass substrate.
Embodiment 4
The raw material used in the present embodiment 4：(average grain diameter 80nm, silver-colored mass percent are nanometer copper-silver alloyed powder
20%), (average grain diameter 70nm, each component mass percent are SiO to Nano glass powder25%, B2O312%, Bi2O3
80%, Na2O 3%), polyetheramine dispersantL-207 (weight average molecular weight 2000, the U.S.
HUNTSMAN companies) and mixed solvent (press 1 by 1,2- propylene glycol and propylene glycol monobutyl ether:2 weight ratio is prepared, the two boiling
Point is respectively 188 DEG C and 171 DEG C).
Lead of touch screen conducting wire is prepared in accordance with the following steps：
S10 takes 19.4g nanometer copper-silvers alloyed powder, 0.6g Nano glass powders, 0.8g polyetheramine dispersantsL-207 and 79.2g mixed solvents are disperseed by their mechanical mixtures and using ultrasonic wave
It is even, the electrically conductive ink that solid content is 20% or so is made；
Electrically conductive ink is applied on touched panel glass substrate by S20 using rotary coating mode；
S30, the touched panel glass substrate for being coated with electrically conductive ink move in oven and prebake conditions 15 are carried out at 100 DEG C divide
Clock removes organic solvent
Then the photomask for portraying leaded conducting wire pattern is covered in the conduction of touched panel glass substrate by S40
On ink coating, electrically conductive ink coating is irradiated using pulse UV light, is illuminated the nanometer copper-silver alloyed powder in region and nanometer glass
Glass powder is melted and is sintered, and forms the lead conducting wire that line width is 30 microns；
S50 moves to the touched panel glass substrate for forming lead conducting wire in the container for filling methyl iso-butyl ketone (MIBK), into
Row ultrasonic cleaning removes the electrically conductive ink coating in un-sintered region on touched panel glass substrate.
Comparative example 1
The functional component of the synergy of Nano glass powder is deleted in the comparative example, using the following raw material：Nanometer copper-silver closes
Bronze (average grain diameter 80nm, silver-colored mass percent for 20%), polyetheramine dispersantL-207
(weight average molecular weight 2000, HUNTSMAN companies of the U.S.), mixed solvent (press 1 by 1,2-PD and propylene glycol monobutyl ether:2
Weight ratio prepare, the two boiling point is respectively 188 DEG C and 171 DEG C).
Lead of touch screen conducting wire is made by following step：
S10 takes 20g nanometer copper-silvers alloyed powder, 0.8g polyetheramine dispersantsL-207 and
79.2g mixed solvents are uniformly dispersed their mechanical mixtures and using ultrasonic wave, and the conduction that solid content is 20% or so is made
Ink；
Electrically conductive ink is applied on touched panel glass substrate by S20 using rotary coating mode；
S30, the touched panel glass substrate for being coated with electrically conductive ink move in oven and prebake conditions 15 are carried out at 100 DEG C divide
Clock removes organic solvent；
Then the photomask for portraying leaded conducting wire pattern is covered in the conduction of touched panel glass substrate by S40
On ink coating, electrically conductive ink coating is irradiated using pulse UV light, is illuminated the nanometer copper-silver alloyed powder in region and nanometer glass
Glass powder is melted and is sintered, and forms the lead conducting wire that line width is 30 microns；
S50 moves to the touched panel glass substrate for forming lead conducting wire in the container for filling methyl iso-butyl ketone (MIBK), into
Row ultrasonic cleaning removes the electrically conductive ink coating in un-sintered region on touched panel glass substrate.
The lead of touch screen conducting wire of making is low to glass substrate adhesive force, easily comes off.Improve the energy of pulse UV light
Amount, can promote Kufil with glass substrate merging in interface, promotion adhesive force, but glass substrate damages, lead
Conducting wire cracks, and reduces product quality.
Comparative example 2
The following raw material is used in the comparative example 2：(average grain diameter 80nm, silver-colored mass percent are nanometer copper-silver alloyed powder
20%), polyester resin, polyetheramine dispersantL-207 (weight average molecular weight 2000, the U.S.
HUNTSMAN companies manufacture) and mixed solvent (press 1 by 1,2- propylene glycol and propylene glycol monobutyl ether:2 weight ratio is prepared, and two
Person's boiling point is respectively 188 DEG C and 171 DEG C).
Lead of touch screen conducting wire is made by following step：
S10 takes 20g nanometer copper-silvers alloyed powder, the polyester resin of 1.5g, 0.8g polyetheramine dispersantsL-207 and 79.2g mixed solvents are disperseed by their mechanical mixtures and using ultrasonic wave
It is even, the electrically conductive ink that solid content is 20% or so is made；
Electrically conductive ink is applied on touched panel glass substrate by S20 using rotary coating mode；
S30, the touched panel glass substrate for being coated with electrically conductive ink move in oven and prebake conditions 15 are carried out at 100 DEG C divide
Clock removes organic solvent；
Then the photomask for portraying leaded conducting wire pattern is covered in the conduction of touched panel glass substrate by S40
On ink coating, electrically conductive ink coating is irradiated using pulse UV light, is illuminated the nanometer copper-silver alloyed powder in region and nanometer glass
Glass powder is melted and is sintered, and forms the lead conducting wire that line width is 30 microns；
S50 moves to the touched panel glass substrate for forming lead conducting wire in the container for filling methyl iso-butyl ketone (MIBK), into
Row ultrasonic cleaning removes the electrically conductive ink coating in un-sintered region on touched panel glass substrate.
Since polyester resin is just cured in pre-bake step, and to the good bonding of touched panel glass substrate production
Effect so that the electrically conductive ink coating in un-sintered region is difficult to be cleaned.Simultaneously because the presence of polyester resin, influences to receive
The sintering of rice cu-ag alloy powders, the resistivity of lead conducting wire is higher, reaches 10-2~10-3The Ω cm orders of magnitude.
From the various embodiments described above and comparative example finally preparation-obtained product, it can be seen that by leading in the present invention
The improvement of electric ink composition so that the sintering side in the quality of the product of selective sintering generation with conventional electrically conductive ink
Formula is significantly improved in final adhesive property, line pattern quality etc..Meanwhile the present invention in by cleaning after
Obtained recycling conductive oil ink can be further processed Posterior circle use.And selective laser is used in integrated artistic
Sintering or the sintering of selectivity UV light, equipment of the simple process without complex and expensive；Fine silver is replaced using Kufil simultaneously, is avoided
Fine silver migration and it is of high cost the defects of；Compared to the way of existing " printing process forms the circuit under 50 microns ", present invention side
Method has more significant production effect.
Meanwhile also without developer solution, etchant, remover, cleaning agent etc. in entire technique, compared to another Vacuum Deposition molybdenum/
The preparation method that aluminium/molybdenum etches again is generated without substantial amounts of chemical waste fluid, compared to more environmentally-friendly；Equipment cost is cheaper.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc. should all be included within protection scope of the present invention.
Claims (7)
1. a kind of production method of lead of touch screen conducting wire, which is characterized in that include the following steps：
Prepare copper alloy powder containing nanometer and the electrically conductive ink of Nano glass powder；
The electrically conductive ink is applied to formation electrically conductive ink coating on touch screen base plate；
The electrically conductive ink coating is subjected to prebake conditions；
It will need to form the part of lead conducting wire pattern in the electrically conductive ink coating after baking, be sintered；
Remove the un-sintered part of the electrically conductive ink coating；Wherein, the copper alloy powder containing nanometer and Nano glass powder are prepared
Electrically conductive ink step in, the nanometer copper alloy powder, Nano glass powder, dispersant and solvent are mixed to form the conductive oil
Ink；
Wherein, the dispersant is the polymer with polyether backbone skeleton and Amino End Group；The Nano glass powder includes：
SiO21%~30%
B2O31%~50%
Bi2O30%~90%
ZnO 0%~40%
Al2O30%~5%
X2O 0%~20%
YO 0%~15%；
Wherein, at least one of X Li, Na, K, at least one of Y Mg, Ca, Sr, Ba；It is described that there is polyether backbone bone
The polymer of frame and Amino End Group is
In formula, R1
Represent hydrogen atom or methyl, R2Represent hydrogen atom or alkyl, R3Represent one kind in alkyl, alkoxy, hydroxyl and aldehyde radical；X and y
Represent 0 or positive integer, and x+y >=2；N represents the positive integer more than 1, and m represents positive integer；
And the polymer molecular weight with polyether backbone skeleton and Amino End Group is 500~10000.
2. the production method of lead of touch screen conducting wire as described in claim 1, which is characterized in that the Nano glass powder
Grain size is 1~100nm.
3. the production method of lead of touch screen conducting wire as described in claim 1, which is characterized in that controlled in the prebake conditions
Temperature conditionss processed are 80~150 DEG C；
And/or the sintering process is sintered using selective laser sintering or selectivity UV light.
4. the production method of lead of touch screen conducting wire as described in claim 1, which is characterized in that the solvent is normal pressure
At least one of the alcohols solvent or alcohol ethers solvent of boiling point in the range of 100~250 DEG C.
5. the production method of lead of touch screen conducting wire as described in claim 1, which is characterized in that remove the conductive oil
In the un-sintered part steps of black coating, the un-sintered portion of the electrically conductive ink coating is removed by the way of cleaning solution cleaning
Point；Wherein,
The cleaning solution is one or more mixtures in alcohols, ketone, alcohol ethers, ether-ether class or amide solvent.
6. a kind of lead of touch screen conducting wire, which is characterized in that touch-screen according to any one of claims 1 to 5 draws
The production method of line conducting wire prepares.
7. a kind of touch-screen mobile phone of the lead of touch screen conducting wire comprising described in claim 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410630763.4A CN104407735B (en) | 2014-11-11 | 2014-11-11 | Lead of touch screen conducting wire and preparation method thereof and touch-screen mobile phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410630763.4A CN104407735B (en) | 2014-11-11 | 2014-11-11 | Lead of touch screen conducting wire and preparation method thereof and touch-screen mobile phone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104407735A CN104407735A (en) | 2015-03-11 |
| CN104407735B true CN104407735B (en) | 2018-05-22 |
Family
ID=52645371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410630763.4A Active CN104407735B (en) | 2014-11-11 | 2014-11-11 | Lead of touch screen conducting wire and preparation method thereof and touch-screen mobile phone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104407735B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104750311B (en) * | 2015-03-16 | 2018-02-13 | 深圳市宇顺电子股份有限公司 | Preparation method, metal grill conducting film and the contact panel of metal grill conducting film |
| TWI668709B (en) | 2017-07-25 | 2019-08-11 | 日商千住金屬工業股份有限公司 | Method for synthesizing copper-silver alloy, forming method of conducting part, copper-silver alloy and conducting part |
| CN109982516A (en) * | 2019-03-15 | 2019-07-05 | 广东石油化工学院 | Vacuum-sintering precipitation and separation glass circuit substrate plate and preparation method thereof |
| CN109743837A (en) * | 2019-03-15 | 2019-05-10 | 北京印刷学院 | Glass substrate bimetallic chromatography LED light source circuit plate and preparation method thereof |
| CN111142702B (en) * | 2019-11-28 | 2023-07-14 | 东莞市越丰光电有限公司 | Preparation method of conductive circuit for touch screen |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1395739A (en) * | 2000-01-17 | 2003-02-05 | 汤姆森等离子体公司 | Use of glass capable of recrystallization as mineral binder of electrode paste for plasma panel |
| CN101209903A (en) * | 2007-12-21 | 2008-07-02 | 东华大学 | High-temperature resistant lead-less glass powder for glass fiber net printing ink, preparation and application thereof |
| CN101801674A (en) * | 2007-05-18 | 2010-08-11 | 应用纳米技术控股股份有限公司 | metallic ink |
| CN102686777A (en) * | 2009-03-24 | 2012-09-19 | 耶路撒冷希伯来大学伊森姆研究发展公司 | Process for sintering nanoparticles at low temperatures |
-
2014
- 2014-11-11 CN CN201410630763.4A patent/CN104407735B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1395739A (en) * | 2000-01-17 | 2003-02-05 | 汤姆森等离子体公司 | Use of glass capable of recrystallization as mineral binder of electrode paste for plasma panel |
| CN101801674A (en) * | 2007-05-18 | 2010-08-11 | 应用纳米技术控股股份有限公司 | metallic ink |
| CN101209903A (en) * | 2007-12-21 | 2008-07-02 | 东华大学 | High-temperature resistant lead-less glass powder for glass fiber net printing ink, preparation and application thereof |
| CN102686777A (en) * | 2009-03-24 | 2012-09-19 | 耶路撒冷希伯来大学伊森姆研究发展公司 | Process for sintering nanoparticles at low temperatures |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104407735A (en) | 2015-03-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104407735B (en) | Lead of touch screen conducting wire and preparation method thereof and touch-screen mobile phone | |
| CN101609850B (en) | Lead-free silver conductive paste used for positive electrode of solar battery and preparation technique thereof | |
| TWI518123B (en) | Metal oxide microparticle dispersible paste | |
| TWI603342B (en) | Composition for forming electroconductive film and method of producing electroconductive film by using the same | |
| CN103985431B (en) | A kind of high intensity printed circuit board (PCB) conductive silver paste and preparation method thereof | |
| JP4828269B2 (en) | Manufacturing method of conductive pattern | |
| CN1870180A (en) | Environment pretection leadless surface silver coating for PTC ceramic and its preparation method | |
| JP2011076899A (en) | Conductive paste | |
| KR20130045326A (en) | Conductive paste for offset printing | |
| JP5569733B2 (en) | Conductive silver paste, conductive pattern forming method, and printed conductive pattern | |
| JP6924203B2 (en) | Method for forming conductive paste and conductive trace | |
| WO2018139463A1 (en) | Electrically conductive composition | |
| CN104078097B (en) | A kind of grout printed circuit board (PCB) silver slurry and preparation method thereof | |
| JP5819751B2 (en) | Conductive laminate, manufacturing method and precursor thereof | |
| JP2010113912A (en) | High-temperature calcination type silver paste, and electromagnetic wave shield using the same | |
| CN104143377A (en) | PCB conductive silver paste and preparing method thereof | |
| CN114783652B (en) | Gold conductor wiring slurry co-fired with microwave dielectric ceramic at low temperature and preparation method thereof | |
| JP2005263859A (en) | Electroconductive ink paste | |
| CN113707359B (en) | Electrode paste, conductive thick film and preparation method thereof | |
| CN112635096B (en) | Silver paste for sheet resistor | |
| CN1065876A (en) | Encapulant composition | |
| CN103985432B (en) | PCB silver paste and preparing method thereof | |
| CN104053308B (en) | The preparation method of lead of touch screen conducting wire | |
| CN114930467A (en) | Conductive paste, electrode, and chip resistor | |
| TWI597319B (en) | Dispersant, metal particle dispersion for electroconductive substrate, and method for producing electroconductive substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |