CN104403452B - Electric-conduction high-temperature-resistant anticorrosion chip - Google Patents
Electric-conduction high-temperature-resistant anticorrosion chip Download PDFInfo
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- CN104403452B CN104403452B CN201410642329.8A CN201410642329A CN104403452B CN 104403452 B CN104403452 B CN 104403452B CN 201410642329 A CN201410642329 A CN 201410642329A CN 104403452 B CN104403452 B CN 104403452B
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- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims abstract description 90
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims abstract description 87
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 61
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 claims abstract description 58
- 238000000576 coating method Methods 0.000 claims abstract description 50
- 239000011248 coating agent Substances 0.000 claims abstract description 48
- 239000002808 molecular sieve Substances 0.000 claims abstract description 37
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 claims abstract description 37
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 30
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 claims abstract description 28
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 claims abstract description 28
- 239000010425 asbestos Substances 0.000 claims abstract description 24
- 239000000835 fiber Substances 0.000 claims abstract description 24
- 229910052895 riebeckite Inorganic materials 0.000 claims abstract description 24
- 238000005260 corrosion Methods 0.000 claims description 68
- 229920000178 Acrylic resin Polymers 0.000 claims description 29
- 239000011863 silicon-based powder Substances 0.000 claims description 29
- AEJIMXVJZFYIHN-UHFFFAOYSA-N copper;dihydrate Chemical compound O.O.[Cu] AEJIMXVJZFYIHN-UHFFFAOYSA-N 0.000 claims description 26
- 230000007797 corrosion Effects 0.000 claims description 26
- 230000002401 inhibitory effect Effects 0.000 claims description 24
- 229920000742 Cotton Polymers 0.000 claims 6
- 239000004575 stone Substances 0.000 claims 6
- 239000000843 powder Substances 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 2
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 abstract 1
- 239000005750 Copper hydroxide Substances 0.000 abstract 1
- 229910001956 copper hydroxide Inorganic materials 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 14
- 239000000463 material Substances 0.000 description 14
- 238000002156 mixing Methods 0.000 description 14
- 238000003756 stirring Methods 0.000 description 14
- 238000005187 foaming Methods 0.000 description 12
- SIQZJFKTROUNPI-UHFFFAOYSA-N 1-(hydroxymethyl)-5,5-dimethylhydantoin Chemical compound CC1(C)N(CO)C(=O)NC1=O SIQZJFKTROUNPI-UHFFFAOYSA-N 0.000 description 10
- QPLDLSVMHZLSFG-UHFFFAOYSA-N CuO Inorganic materials [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 10
- 229960004643 cupric oxide Drugs 0.000 description 10
- 238000002360 preparation method Methods 0.000 description 8
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 7
- 235000019341 magnesium sulphate Nutrition 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical group [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 description 4
- 150000002431 hydrogen Chemical class 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- YZCKVEUIGOORGS-NJFSPNSNSA-N Tritium Chemical group [3H] YZCKVEUIGOORGS-NJFSPNSNSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 125000004494 ethyl ester group Chemical group 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000790917 Dioxys <bee> Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- DPXJVFZANSGRMM-UHFFFAOYSA-N acetic acid;2,3,4,5,6-pentahydroxyhexanal;sodium Chemical compound [Na].CC(O)=O.OCC(O)C(O)C(O)C(O)C=O DPXJVFZANSGRMM-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 235000019812 sodium carboxymethyl cellulose Nutrition 0.000 description 1
- 229920001027 sodium carboxymethylcellulose Polymers 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Inorganic Chemistry (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides an electric-conduction high-temperature-resistant anticorrosion chip. The chip is provided with a coating, and the coating comprises three layers of electric-conduction high-temperature-resistant anticorrosion coatings successively laminated from top to bottom. Each of the electric-conduction high-temperature-resistant anticorrosion coatings comprises the following compositions in parts by mass: 45-70 parts of acrylate resin, 20-40 parts of molecular sieve, 5-10 parts of asbestos fiber, 5-8 parts of manganese dioxide, 2-5 parts of copper hydroxide, 5-10 parts of silicon micro powder, 1-3 parts of nanometer aluminium oxide, 1.5-2.5 parts of benzimidazole, 0.5-2.5 parts of sodium polyacrylate, 25-40 parts of toluene, and 20-40 parts of ethyl acetate. The chip is excellent in electric conduction effect, and also possesses excellent anticorrosion high-temperature resistance.
Description
Technical field
The present invention relates to semiconductor applications, the anti-corrosion chip of especially a kind of conductive high temperature resistance.
Background technology
Chip in sensor is the general designation of semiconductor element product, is the carrier of integrated circuit, is split to form by wafer.
The coating being currently used on chip does not have conductive fire retardation well, and due in existing coating major part be epoxy
System, the ehter bond of its epoxy resin receives ultraviolet irradiation and is easy to rupture, and causes the aging of coating.
Application publication number is cn 103849297 a, and entitled " a kind of electrically-conducting paint " is main to be water by percentage by weight
Property polyester resin 15-20%, titania powder 10-15%, zinc sulfide semiconductor nanometer powder 10-15%, SiO 2 powder
5-8%, additive 9-15% and water 20-30% make through being in harmonious proportion, wherein: described additive is molten by wax assistant, modified urea
Liquid and dispersant composition.
Application publication number is cn 103773181 a, and entitled " magnetic screen electrically-conducting paint " is included according to mass fraction meter
As
Lower raw material: epoxy resin 30-35 part, silicone rubber 22-28 part, silver powder 5-9 part, carbon black 5-8 part,
Copper powder 4-6 part, ethyl acetate 5-8 part, glycerine 3-4 part, sodium carboxymethylcellulose 1-3 part, polyvinyl alcohol 2-4 part, ethanol
40-50 part, water 10-12 part.
Although above innovation and creation are to a certain degree can to improve electrical efficiency, conductive effect inconspicuous, and
Effect of corrosion-resistant high-temperature cannot be taken into account it is impossible to make the power of sensor get a promotion while chip conductive.
Content of the invention
The present invention is directed to the deficiencies in the prior art, provides a kind of conductive high temperature resistance anti-corrosion chip, not only conductive effect is good, and
And there is excellent corrosion-resistant high-temperature performance.
In order to solve above-mentioned technical problem, the technical scheme that the present invention provides is:
A kind of anti-corrosion chip of conductive high temperature resistance, described chip is provided with coating, and described coating includes from top to bottom folding successively
Plus three layers of conductive high temperature resistance corrosion-inhibiting coating, described three layers of conductive high temperature resistance corrosion-inhibiting coating all include according to mass fraction meter as
Lower component: acrylic resin 45-70 part, molecular sieve 20-40 part, asbestos fibre 5-10 part, manganese dioxide 5-8 part, Kocide SD
2-5 part, silicon powder 5-10 part, nano-aluminium oxide 1-3 part, benzimidazole 1.5-2.5 part, Sodium Polyacrylate 0.5-2.5 part,
Toluene 25-40 part, ethyl acetate 20-40 part；
A kind of anti-corrosion chip of conductive high temperature resistance, described three layers of conductive high temperature resistance corrosion-inhibiting coating being arranged on chip all include
Following component according to mass fraction meter: acrylic resin 46-70 part, molecular sieve 22-40 part, asbestos fibre 6-10 part, dioxy
Change manganese 6-8 part, Kocide SD 3-5 part, silicon powder 6-10 part, nano-aluminium oxide 1.5-3 part, benzimidazole 2-2.5 part, gather
PAA 1-2.5 part, toluene 26-40 part, ethyl acetate 22-40 part；
A kind of anti-corrosion chip of conductive high temperature resistance, described three layers of conductive high temperature resistance corrosion-inhibiting coating being arranged on chip all include
Following component according to mass fraction meter: 45 parts of acrylic resin, 20 parts of molecular sieve, 5 parts of asbestos fibre, 5 parts of manganese dioxide, hydrogen
2 parts of cupric oxide, 5 parts of silicon powder, 1 part of nano-aluminium oxide, 1.5 parts of benzimidazole, 0.5 part of Sodium Polyacrylate, 25 parts of toluene,
20 parts of ethyl acetate；
A kind of anti-corrosion chip of conductive high temperature resistance, described three layers of conductive high temperature resistance corrosion-inhibiting coating being arranged on chip all include
Following component according to mass fraction meter: 48 parts of acrylic resin, 22 parts of molecular sieve, 6 parts of asbestos fibre, 5 parts of manganese dioxide, hydrogen
2 parts of cupric oxide, 5 parts of silicon powder, 1.5 parts of nano-aluminium oxide, 1.8 parts of benzimidazole, 1 part of Sodium Polyacrylate, 28 parts of toluene,
22 parts of ethyl acetate；
A kind of anti-corrosion chip of conductive high temperature resistance, described three layers of conductive high temperature resistance corrosion-inhibiting coating being arranged on chip all include
Following component according to mass fraction meter: 50 parts of acrylic resin, 25 parts of molecular sieve, 7 parts of asbestos fibre, 6 parts of manganese dioxide, hydrogen
2.5 parts of cupric oxide, 6 parts of silicon powder, 2 parts of nano-aluminium oxide, 1.9 parts of benzimidazole, 1.5 parts of Sodium Polyacrylate, toluene 30
Part, 25 parts of ethyl acetate；
A kind of anti-corrosion chip of conductive high temperature resistance, described three layers of conductive high temperature resistance corrosion-inhibiting coating being arranged on chip all include
Following component according to mass fraction meter: 55 parts of acrylic resin, 28 parts of molecular sieve, 8 parts of asbestos fibre, 7 parts of manganese dioxide, hydrogen
3 parts of cupric oxide, 7 parts of silicon powder, 2 parts of nano-aluminium oxide, 2 parts of benzimidazole, 2 parts of Sodium Polyacrylate, 35 parts of toluene, acetic acid
28 parts of ethyl ester；
A kind of anti-corrosion chip of conductive high temperature resistance, described three layers of conductive high temperature resistance corrosion-inhibiting coating being arranged on chip all include
Following component according to mass fraction meter: 65 parts of acrylic resin, 32 parts of molecular sieve, 9 parts of asbestos fibre, 7 parts of manganese dioxide, hydrogen
4 parts of cupric oxide, 9 parts of silicon powder, 2.5 parts of nano-aluminium oxide, 2.2 parts of benzimidazole, 2.2 parts of Sodium Polyacrylate, toluene 38
Part, 35 parts of ethyl acetate；
A kind of anti-corrosion chip of conductive high temperature resistance, described three layers of conductive high temperature resistance corrosion-inhibiting coating being arranged on chip all include
Following component according to mass fraction meter: 70 parts of acrylic resin, 40 parts of molecular sieve, 10 parts of asbestos fibre, 8 parts of manganese dioxide,
5 parts of Kocide SD, 10 parts of silicon powder, 3 parts of nano-aluminium oxide, 2.5 parts of benzimidazole, 2.5 parts of Sodium Polyacrylate, toluene 40
Part, 40 parts of ethyl acetate.
The preparation method of above-mentioned conductive anti-corrosion chip coating comprises the steps:
Step is (1): Kocide SD and molecular sieve are worn into the fine powder that granularity is 100-150 mesh；
Step is (2): manganese dioxide, silicon powder, magnesium sulfate, nano-aluminium oxide, benzimidazole added in mixer,
Then it is added thereto to the step (1) Kocide SD of middle milled and molecular sieve, stir to mixing, obtain mixed material；
Step is (3): by step (2) in the mixed material that obtains, acrylic resin, asbestos fibre, Sodium Polyacrylate be added to
In toluene and ethyl acetate, stir to mixing, you can obtain the conduction anti-corrosion chip coating of the present invention.
By above technical scheme, with respect to prior art, the method have the advantages that
The anti-corrosion chip of a kind of conductive high temperature resistance that the present invention provides, not only conductive effect is good, and has excellent anti-corrosion
Resistance to elevated temperatures, preparation process is simple, suitable large area widely uses.
Specific embodiment
Explain technical scheme below with reference to embodiment.
Embodiment 1
A kind of anti-corrosion chip of conductive high temperature resistance, described three layers of conductive high temperature resistance corrosion-inhibiting coating being arranged on chip all include
Following component according to mass fraction meter: 45 parts of acrylic resin, 20 parts of molecular sieve, 5 parts of asbestos fibre, 5 parts of manganese dioxide, hydrogen
2 parts of cupric oxide, 5 parts of silicon powder, 1 part of nano-aluminium oxide, 1.5 parts of benzimidazole, 0.5 part of Sodium Polyacrylate, 25 parts of toluene,
20 parts of ethyl acetate；
The preparation method of above-mentioned conductive anti-corrosion chip coating comprises the steps:
Step is (1): Kocide SD and molecular sieve are worn into the fine powder that granularity is 100-150 mesh；
Step is (2): manganese dioxide, silicon powder, magnesium sulfate, nano-aluminium oxide, benzimidazole added in mixer,
Then it is added thereto to the step (1) Kocide SD of middle milled and molecular sieve, stir to mixing, obtain mixed material；
Step is (3): by step (2) in the mixed material that obtains, acrylic resin, asbestos fibre, Sodium Polyacrylate be added to
In toluene and ethyl acetate, stir to mixing, you can obtain the conduction anti-corrosion chip coating of the present invention.
Embodiment 2
A kind of anti-corrosion chip of conductive high temperature resistance, described three layers of conductive high temperature resistance corrosion-inhibiting coating being arranged on chip all include
Following component according to mass fraction meter: 48 parts of acrylic resin, 22 parts of molecular sieve, 6 parts of asbestos fibre, 5 parts of manganese dioxide, hydrogen
2 parts of cupric oxide, 5 parts of silicon powder, 1.5 parts of nano-aluminium oxide, 1.8 parts of benzimidazole, 1 part of Sodium Polyacrylate, 28 parts of toluene,
22 parts of ethyl acetate；
The preparation method of above-mentioned conductive anti-corrosion chip coating comprises the steps:
Step is (1): Kocide SD and molecular sieve are worn into the fine powder that granularity is 100-150 mesh；
Step is (2): manganese dioxide, silicon powder, magnesium sulfate, nano-aluminium oxide, benzimidazole added in mixer,
Then it is added thereto to the step (1) Kocide SD of middle milled and molecular sieve, stir to mixing, obtain mixed material；
Step is (3): by step (2) in the mixed material that obtains, acrylic resin, asbestos fibre, Sodium Polyacrylate be added to
In toluene and ethyl acetate, stir to mixing, you can obtain the conduction anti-corrosion chip coating of the present invention.
Embodiment 3
A kind of anti-corrosion chip of conductive high temperature resistance, described three layers of conductive high temperature resistance corrosion-inhibiting coating being arranged on chip all include
Following component according to mass fraction meter: 50 parts of acrylic resin, 25 parts of molecular sieve, 7 parts of asbestos fibre, 6 parts of manganese dioxide, hydrogen
2.5 parts of cupric oxide, 6 parts of silicon powder, 2 parts of nano-aluminium oxide, 1.9 parts of benzimidazole, 1.5 parts of Sodium Polyacrylate, toluene 30
Part, 25 parts of ethyl acetate；
The preparation method of above-mentioned conductive anti-corrosion chip coating comprises the steps:
Step is (1): Kocide SD and molecular sieve are worn into the fine powder that granularity is 100-150 mesh；
Step is (2): manganese dioxide, silicon powder, magnesium sulfate, nano-aluminium oxide, benzimidazole added in mixer,
Then it is added thereto to the step (1) Kocide SD of middle milled and molecular sieve, stir to mixing, obtain mixed material；
Step is (3): by step (2) in the mixed material that obtains, acrylic resin, asbestos fibre, Sodium Polyacrylate be added to
In toluene and ethyl acetate, stir to mixing, you can obtain the conduction anti-corrosion chip coating of the present invention.
Embodiment 4
A kind of anti-corrosion chip of conductive high temperature resistance, described three layers of conductive high temperature resistance corrosion-inhibiting coating being arranged on chip all include
Following component according to mass fraction meter: 55 parts of acrylic resin, 28 parts of molecular sieve, 8 parts of asbestos fibre, 7 parts of manganese dioxide, hydrogen
3 parts of cupric oxide, 7 parts of silicon powder, 2 parts of nano-aluminium oxide, 2 parts of benzimidazole, 2 parts of Sodium Polyacrylate, 35 parts of toluene, acetic acid
28 parts of ethyl ester；
The preparation method of above-mentioned conductive anti-corrosion chip coating comprises the steps:
Step is (1): Kocide SD and molecular sieve are worn into the fine powder that granularity is 100-150 mesh；
Step is (2): manganese dioxide, silicon powder, magnesium sulfate, nano-aluminium oxide, benzimidazole added in mixer,
Then it is added thereto to the step (1) Kocide SD of middle milled and molecular sieve, stir to mixing, obtain mixed material；
Step is (3): by step (2) in the mixed material that obtains, acrylic resin, asbestos fibre, Sodium Polyacrylate be added to
In toluene and ethyl acetate, stir to mixing, you can obtain the conduction anti-corrosion chip coating of the present invention.
Embodiment 5
A kind of anti-corrosion chip of conductive high temperature resistance, described three layers of conductive high temperature resistance corrosion-inhibiting coating being arranged on chip all include
Following component according to mass fraction meter: 65 parts of acrylic resin, 32 parts of molecular sieve, 9 parts of asbestos fibre, 7 parts of manganese dioxide, hydrogen
4 parts of cupric oxide, 9 parts of silicon powder, 2.5 parts of nano-aluminium oxide, 2.2 parts of benzimidazole, 2.2 parts of Sodium Polyacrylate, toluene 38
Part, 35 parts of ethyl acetate；
The preparation method of above-mentioned conductive anti-corrosion chip coating comprises the steps:
Step is (1): Kocide SD and molecular sieve are worn into the fine powder that granularity is 100-150 mesh；
Step is (2): manganese dioxide, silicon powder, magnesium sulfate, nano-aluminium oxide, benzimidazole added in mixer,
Then it is added thereto to the step (1) Kocide SD of middle milled and molecular sieve, stir to mixing, obtain mixed material；
Step is (3): by step (2) in the mixed material that obtains, acrylic resin, asbestos fibre, Sodium Polyacrylate be added to
In toluene and ethyl acetate, stir to mixing, you can obtain the conduction anti-corrosion chip coating of the present invention.
Embodiment 6
A kind of anti-corrosion chip of conductive high temperature resistance, described three layers of conductive high temperature resistance corrosion-inhibiting coating being arranged on chip all include
Following component according to mass fraction meter: 70 parts of acrylic resin, 40 parts of molecular sieve, 10 parts of asbestos fibre, 8 parts of manganese dioxide,
5 parts of Kocide SD, 10 parts of silicon powder, 3 parts of nano-aluminium oxide, 2.5 parts of benzimidazole, 2.5 parts of Sodium Polyacrylate, toluene 40
Part, 40 parts of ethyl acetate；
The preparation method of above-mentioned conductive anti-corrosion chip coating comprises the steps:
Step is (1): Kocide SD and molecular sieve are worn into the fine powder that granularity is 100-150 mesh；
Step is (2): manganese dioxide, silicon powder, magnesium sulfate, nano-aluminium oxide, benzimidazole added in mixer,
Then it is added thereto to the step (1) Kocide SD of middle milled and molecular sieve, stir to mixing, obtain mixed material；
Step is (3): by step (2) in the mixed material that obtains, acrylic resin, asbestos fibre, Sodium Polyacrylate be added to
In toluene and ethyl acetate, stir to mixing, you can obtain the conduction anti-corrosion chip coating of the present invention.
Performance test to embodiment of the present invention 1-6 products obtained therefrom, result is as shown in table 1.
Table 1 embodiment of the present invention 1-6 properties of product test data
| Test event | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 |
| Sheet resistance rate/(m ω/m2/ 12.5 μm) | 80 | 82 | 84 | 86 | 88 | 89 |
| Resistance to salt water (3%nacl, 100h) | Non-foaming, do not fall off | Non-foaming, do not fall off | Non-foaming, do not fall off | Non-foaming, do not fall off | Non-foaming, do not fall off | Non-foaming, do not fall off |
| Heat-resisting quantity (200 DEG C, 100h) | Non-foaming, do not fall off | Non-foaming, do not fall off | Non-foaming, do not fall off | Non-foaming, do not fall off | Non-foaming, do not fall off | Non-foaming, do not fall off |
As seen from the above table, the conduction of the present invention anti-corrosion chip coating, not only conducts electricity very well, and corrosion-and high-temp-resistant
Can be high.
Claims (8)
1. a kind of anti-corrosion chip of conductive high temperature resistance it is characterised in that: described chip is provided with coating, and described coating is included by up to
Under three layers of conductive high temperature resistance corrosion-inhibiting coating being sequentially overlapped, described three layers of conductive high temperature resistance corrosion-inhibiting coating all include according to mass parts
Number meter following components: acrylic resin 45-70 part, molecular sieve 20-40 part, asbestos fibre 5-10 part, manganese dioxide 5-8 part,
Kocide SD 2-5 part, silicon powder 5-10 part, nano-aluminium oxide 1-3 part, benzimidazole 1.5-2.5 part, Sodium Polyacrylate
0.5-2.5 part, toluene 25-40 part, ethyl acetate 20-40 part.
2. the anti-corrosion chip of conductive high temperature resistance according to claim 1 it is characterised in that: described three layers being arranged on chip
Conductive high temperature resistance corrosion-inhibiting coating all includes the following component according to mass fraction meter: acrylic resin 46-70 part, molecular sieve 22-
40 parts, asbestos fibre 6-10 part, manganese dioxide 6-8 part, Kocide SD 3-5 part, silicon powder 6-10 part, nano-aluminium oxide
1.5-3 part, benzimidazole 2-2.5 part, Sodium Polyacrylate 1-2.5 part, toluene 26-40 part, ethyl acetate 22-40 part.
3. the anti-corrosion chip of conductive high temperature resistance according to claim 1 it is characterised in that: described three layers being arranged on chip
Conductive high temperature resistance corrosion-inhibiting coating all includes the following component according to mass fraction meter: 45 parts of acrylic resin, 20 parts of molecular sieve, stone
5 parts of cotton fiber, 5 parts of manganese dioxide, 2 parts of Kocide SD, 5 parts of silicon powder, 1 part of nano-aluminium oxide, 1.5 parts of benzimidazole,
0.5 part of Sodium Polyacrylate, 25 parts of toluene, 20 parts of ethyl acetate.
4. the anti-corrosion chip of conductive high temperature resistance according to claim 1 it is characterised in that: described three layers being arranged on chip
Conductive high temperature resistance corrosion-inhibiting coating all includes the following component according to mass fraction meter: 48 parts of acrylic resin, 22 parts of molecular sieve, stone
6 parts of cotton fiber, 5 parts of manganese dioxide, 2 parts of Kocide SD, 5 parts of silicon powder, 1.5 parts of nano-aluminium oxide, benzimidazole 1.8
Part, 1 part of Sodium Polyacrylate, 28 parts of toluene, 22 parts of ethyl acetate.
5. the anti-corrosion chip of conductive high temperature resistance according to claim 1 it is characterised in that: described three layers being arranged on chip
Conductive high temperature resistance corrosion-inhibiting coating all includes the following component according to mass fraction meter: 50 parts of acrylic resin, 25 parts of molecular sieve, stone
7 parts of cotton fiber, 6 parts of manganese dioxide, 2.5 parts of Kocide SD, 6 parts of silicon powder, 2 parts of nano-aluminium oxide, benzimidazole 1.9
Part, 1.5 parts of Sodium Polyacrylate, 30 parts of toluene, 25 parts of ethyl acetate.
6. the anti-corrosion chip of conductive high temperature resistance according to claim 1 it is characterised in that: described three layers being arranged on chip
Conductive high temperature resistance corrosion-inhibiting coating all includes the following component according to mass fraction meter: 55 parts of acrylic resin, 28 parts of molecular sieve, stone
8 parts of cotton fiber, 7 parts of manganese dioxide, 3 parts of Kocide SD, 7 parts of silicon powder, 2 parts of nano-aluminium oxide, 2 parts of benzimidazole, poly-
2 parts of PAA, 35 parts of toluene, 28 parts of ethyl acetate.
7. the anti-corrosion chip of conductive high temperature resistance according to claim 1 it is characterised in that: described three layers being arranged on chip
Conductive high temperature resistance corrosion-inhibiting coating all includes the following component according to mass fraction meter: 65 parts of acrylic resin, 32 parts of molecular sieve, stone
9 parts of cotton fiber, 7 parts of manganese dioxide, 4 parts of Kocide SD, 9 parts of silicon powder, 2.5 parts of nano-aluminium oxide, benzimidazole 2.2
Part, 2.2 parts of Sodium Polyacrylate, 38 parts of toluene, 35 parts of ethyl acetate.
8. the anti-corrosion chip of conductive high temperature resistance according to claim 1 it is characterised in that: described three layers being arranged on chip
Conductive high temperature resistance corrosion-inhibiting coating all includes the following component according to mass fraction meter: 70 parts of acrylic resin, 40 parts of molecular sieve, stone
10 parts of cotton fiber, 8 parts of manganese dioxide, 5 parts of Kocide SD, 10 parts of silicon powder, 3 parts of nano-aluminium oxide, benzimidazole 2.5
Part, 2.5 parts of Sodium Polyacrylate, 40 parts of toluene, 40 parts of ethyl acetate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410642329.8A CN104403452B (en) | 2014-11-13 | 2014-11-13 | Electric-conduction high-temperature-resistant anticorrosion chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410642329.8A CN104403452B (en) | 2014-11-13 | 2014-11-13 | Electric-conduction high-temperature-resistant anticorrosion chip |
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| Publication Number | Publication Date |
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| CN104403452A CN104403452A (en) | 2015-03-11 |
| CN104403452B true CN104403452B (en) | 2017-01-25 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1541234A1 (en) * | 2003-12-08 | 2005-06-15 | Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. | Hybrid microfluidic chip and method of manufacture |
| CN102020897A (en) * | 2009-09-16 | 2011-04-20 | 北京有色金属研究总院 | Corrosion resistant paint for the inner surface of radiator and preparation method thereof |
| CN103159437A (en) * | 2011-12-15 | 2013-06-19 | 张国庆 | Temperature adjusting humidity adjusting coating and preparation method thereof |
| CN103642388A (en) * | 2013-12-01 | 2014-03-19 | 宁波深蓝智能房屋有限公司 | Anti-corrosion paint for intelligent house |
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2014
- 2014-11-13 CN CN201410642329.8A patent/CN104403452B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1541234A1 (en) * | 2003-12-08 | 2005-06-15 | Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. | Hybrid microfluidic chip and method of manufacture |
| CN102020897A (en) * | 2009-09-16 | 2011-04-20 | 北京有色金属研究总院 | Corrosion resistant paint for the inner surface of radiator and preparation method thereof |
| CN103159437A (en) * | 2011-12-15 | 2013-06-19 | 张国庆 | Temperature adjusting humidity adjusting coating and preparation method thereof |
| CN103642388A (en) * | 2013-12-01 | 2014-03-19 | 宁波深蓝智能房屋有限公司 | Anti-corrosion paint for intelligent house |
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| CN104403452A (en) | 2015-03-11 |
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