CN104399644A - Z-axis glue-dispensing mechanism - Google Patents
Z-axis glue-dispensing mechanism Download PDFInfo
- Publication number
- CN104399644A CN104399644A CN201410663525.3A CN201410663525A CN104399644A CN 104399644 A CN104399644 A CN 104399644A CN 201410663525 A CN201410663525 A CN 201410663525A CN 104399644 A CN104399644 A CN 104399644A
- Authority
- CN
- China
- Prior art keywords
- axis
- dispensing valve
- glue
- glue dispensing
- mount pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
Landscapes
- Coating Apparatus (AREA)
- Valve Housings (AREA)
Abstract
The invention relates to a Z-axis glue-dispensing mechanism. A Z-axis linear module is mounted on a Z-axis mounting plate; a Z-axis motor is mounted on a Z-axis motor mounting plate; the Z-axis motor and the Z-axis linear module are connected together through a Z-axis shaft coupler; a Z-axis linear module slide block is mounted on the Z-axis linear module; a Z-axis connecting block is fixedly mounted on the Z-axis linear module slide block; a glue-dispensing valve mounting plate is fixedly mounted on the Z-axis connecting block; a glue-dispensing valve mounting base and a glue-dispensing valve mounting block are fixedly mounted on the glue-dispensing valve mounting plate; a glue-dispensing valve is fixedly mounted on the glue-dispensing valve mounting base and the glue-dispensing valve mounting block; the glue-dispensing valve is communicated with a glue pipe head; the lower end of the glue-dispensing valve is communicated with a glue-dispensing needle. The glue-dispensing valve is firmly fixed, and can control the moving distance of the glue-dispensing needle in the Z-axis direction to convey the glue-dispensing needle to a standard position.
Description
Technical field:
The present invention relates to glue applying mechanism apparatus field, relate to a kind of Z axis glue applying mechanism in particular.
Background technology:
In pcb board manufacturing process, a lot of place can be applied to a glue.During point glue, need, by X-axis mechanism, Y-axis mechanism, Z-axis mechanism, a plastic pin is moved to standard operation position; In order to make glue smooth plastic emitting in a plastic pin, a kind of some glue pressing mechanism is also needed to pressurize to the glue in glue dispensing valve; Need glue position, accurate control point and gel quantity, the precision of guarantee point adhesive process simultaneously.All manual operation in prior art, not accurate to the control of a glue position and gel quantity, also affect yield rate.The error of manual operation is simultaneously large, and efficiency is low, and labour intensity is large.A kind of Z axis glue applying mechanism for pcb board is now just needed to realize the movement of a plastic pin in Z-direction.
Summary of the invention:
The object of the invention is for the deficiencies in the prior art part, a kind of Z axis glue applying mechanism is provided, can control point plastic pin displacement in the Z-axis direction, a plastic pin is transported to normal place.
Technology solution of the present invention is as follows:
A kind of Z axis glue applying mechanism, it comprises Z axis installing plate, Z axis motor, Z axis motor mounting plate, Z axis shaft coupling, z axis module, z axis module slide block and Z axis contiguous block, described z axis module is arranged on Z axis installing plate, described Z axis motor is arranged on Z axis motor mounting plate, and Z axis motor is linked together by Z axis shaft coupling and z axis module; Described z axis module is provided with z axis module slide block, Z axis contiguous block is fixedly mounted on z axis module slide block, described Z axis contiguous block is installed with a glue dispensing valve installing plate, described glue dispensing valve installing plate is installed with glue dispensing valve mount pad and glue dispensing valve mounting blocks; Glue dispensing valve mount pad and glue dispensing valve mounting blocks are installed with glue dispensing valve; Described glue dispensing valve is communicated with a sebific duct head, glue dispensing valve lower end is communicated with some plastic pins.
As preferably, the side of described Z axis contiguous block connects a Z axis sensing chip, and the left surface of Z axis installing plate is provided with a mounting bar, and mounting bar is provided with three groups of Z axis photoelectric sensors, Z axis sensing chip matches with Z axis photoelectric sensor.
As preferably, described glue dispensing valve mount pad is provided with one group of through hole and two groups and the integrated dead bolt of glue dispensing valve mount pad, often organize dead bolt and be provided with a lateral connection hole, glue dispensing valve passes from through hole, utilizes screw rod glue dispensing valve can be locked on glue dispensing valve mount pad by two lateral connection holes.
As preferably, described glue dispensing valve mounting blocks is provided with an arc groove, and glue dispensing valve bottom is connected in arc groove.
Beneficial effect of the present invention is:
Glue dispensing valve of the present invention is fixed, Z axis motor drives and z axis module slide block can be driven to move up and down in the Z-axis direction, thus drive glue dispensing valve to move up and down, by Z axis photoelectric sensor control point plastic pin displacement in the Z-axis direction, a plastic pin is transported to normal place.
Accompanying drawing illustrates:
Below in conjunction with accompanying drawing, the present invention is described further:
Fig. 1 is structural representation of the present invention.
Detailed description of the invention:
Embodiment, see accompanying drawing 1, a kind of Z axis glue applying mechanism, it comprises Z axis installing plate 1, Z axis motor 2, Z axis motor mounting plate 3, Z axis shaft coupling 4, z axis module 5, z axis module slide block 6 and Z axis contiguous block 7, described z axis module is arranged on Z axis installing plate, described Z axis motor is arranged on Z axis motor mounting plate, and Z axis motor is linked together by Z axis shaft coupling and z axis module; Described z axis module is provided with z axis module slide block, Z axis contiguous block is fixedly mounted on z axis module slide block, described Z axis contiguous block is installed with a glue dispensing valve installing plate 8, described glue dispensing valve installing plate is installed with glue dispensing valve mount pad 9 and glue dispensing valve mounting blocks 10; Glue dispensing valve mount pad and glue dispensing valve mounting blocks are installed with glue dispensing valve 11; Described glue dispensing valve is communicated with a sebific duct head 12, glue dispensing valve lower end is communicated with some plastic pins 13.
The side of described Z axis contiguous block connects a Z axis sensing chip 14, and the left surface of Z axis installing plate is provided with a mounting bar 15, and mounting bar is provided with three groups of Z axis photoelectric sensors 16, Z axis sensing chip matches with Z axis photoelectric sensor.
Described glue dispensing valve mount pad is provided with one group of through hole and two groups and the integrated dead bolt of glue dispensing valve mount pad, often organize dead bolt and be provided with a lateral connection hole, glue dispensing valve passes from through hole, utilizes screw rod glue dispensing valve can be locked on glue dispensing valve mount pad by two lateral connection holes.
Described glue dispensing valve mounting blocks is provided with an arc groove, and glue dispensing valve bottom is connected in arc groove.
Above-described embodiment is the specific descriptions of carrying out the present invention; just the present invention is further described; can not be interpreted as limiting the scope of the present invention, those skilled in the art makes some nonessential improvement according to the content of foregoing invention and adjustment all falls within protection scope of the present invention.
Claims (4)
1. a Z axis glue applying mechanism, it comprises Z axis installing plate, Z axis motor, Z axis motor mounting plate, Z axis shaft coupling, z axis module, z axis module slide block and Z axis contiguous block, described z axis module is arranged on Z axis installing plate, described Z axis motor is arranged on Z axis motor mounting plate, and Z axis motor is linked together by Z axis shaft coupling and z axis module; Described z axis module is provided with z axis module slide block, Z axis contiguous block is fixedly mounted on z axis module slide block, it is characterized in that: described Z axis contiguous block is installed with a glue dispensing valve installing plate, described glue dispensing valve installing plate is installed with glue dispensing valve mount pad and glue dispensing valve mounting blocks; Glue dispensing valve mount pad and glue dispensing valve mounting blocks are installed with glue dispensing valve; Described glue dispensing valve is communicated with a sebific duct head, glue dispensing valve lower end is communicated with some plastic pins.
2. a kind of Z axis glue applying mechanism according to claim 1, it is characterized in that: the side of described Z axis contiguous block connects a Z axis sensing chip, the left surface of Z axis installing plate is provided with a mounting bar, mounting bar is provided with three groups of Z axis photoelectric sensors, Z axis sensing chip matches with Z axis photoelectric sensor.
3. a kind of Z axis glue applying mechanism according to claim 1, it is characterized in that: described glue dispensing valve mount pad is provided with one group of through hole and two groups and the integrated dead bolt of glue dispensing valve mount pad, often organize dead bolt and be provided with a lateral connection hole, glue dispensing valve passes from through hole, utilizes screw rod glue dispensing valve can be locked on glue dispensing valve mount pad by two lateral connection holes.
4. a kind of Z axis glue applying mechanism according to claim 1, is characterized in that: described glue dispensing valve mounting blocks is provided with an arc groove, and glue dispensing valve bottom is connected in arc groove.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410663525.3A CN104399644A (en) | 2014-11-19 | 2014-11-19 | Z-axis glue-dispensing mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410663525.3A CN104399644A (en) | 2014-11-19 | 2014-11-19 | Z-axis glue-dispensing mechanism |
Publications (1)
Publication Number | Publication Date |
---|---|
CN104399644A true CN104399644A (en) | 2015-03-11 |
Family
ID=52637347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410663525.3A Pending CN104399644A (en) | 2014-11-19 | 2014-11-19 | Z-axis glue-dispensing mechanism |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104399644A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105234049A (en) * | 2015-10-29 | 2016-01-13 | 苏州凡特斯测控科技有限公司 | Dispensing mechanism capable of accurately locating products |
CN105251662A (en) * | 2015-10-29 | 2016-01-20 | 苏州凡特斯测控科技有限公司 | Dispensing assembly |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8066049B1 (en) * | 2010-07-22 | 2011-11-29 | Cheng Uei Precision Industry Co., Ltd. | Automatic gluing mechanism |
CN202667081U (en) * | 2012-07-04 | 2013-01-16 | 吴江市博众精工科技有限公司 | Adjusting module for gluing and solidifying product part |
CN203540804U (en) * | 2013-10-31 | 2014-04-16 | 刘飞 | Motion mechanism of Z-shaft of dispensing machine |
CN203738341U (en) * | 2014-03-18 | 2014-07-30 | 郑祥模 | Clamp spring assembling and oiling module for automatic assembling machine |
CN104096659A (en) * | 2014-07-17 | 2014-10-15 | 苏州博众精工科技有限公司 | Glue dispensing mechanism |
CN204320595U (en) * | 2014-11-19 | 2015-05-13 | 苏州博众精工科技有限公司 | A kind of Z axis glue applying mechanism |
-
2014
- 2014-11-19 CN CN201410663525.3A patent/CN104399644A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8066049B1 (en) * | 2010-07-22 | 2011-11-29 | Cheng Uei Precision Industry Co., Ltd. | Automatic gluing mechanism |
CN202667081U (en) * | 2012-07-04 | 2013-01-16 | 吴江市博众精工科技有限公司 | Adjusting module for gluing and solidifying product part |
CN203540804U (en) * | 2013-10-31 | 2014-04-16 | 刘飞 | Motion mechanism of Z-shaft of dispensing machine |
CN203738341U (en) * | 2014-03-18 | 2014-07-30 | 郑祥模 | Clamp spring assembling and oiling module for automatic assembling machine |
CN104096659A (en) * | 2014-07-17 | 2014-10-15 | 苏州博众精工科技有限公司 | Glue dispensing mechanism |
CN204320595U (en) * | 2014-11-19 | 2015-05-13 | 苏州博众精工科技有限公司 | A kind of Z axis glue applying mechanism |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105234049A (en) * | 2015-10-29 | 2016-01-13 | 苏州凡特斯测控科技有限公司 | Dispensing mechanism capable of accurately locating products |
CN105251662A (en) * | 2015-10-29 | 2016-01-20 | 苏州凡特斯测控科技有限公司 | Dispensing assembly |
CN105234049B (en) * | 2015-10-29 | 2018-01-09 | 苏州凡特斯测控科技有限公司 | A kind of glue applying mechanism for being accurately positioned product |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104307699B (en) | A kind of Full-automatic quantitative glue applying mechanism | |
CN202667081U (en) | Adjusting module for gluing and solidifying product part | |
CN103693441B (en) | A kind of draw frame machine of Z axis band jaw | |
CN102847646B (en) | Dispensing and curing device | |
CN102740668B (en) | Motion module | |
CN104324855B (en) | The device of glue position, a kind of control point and some glue amount | |
CN103379820B (en) | A kind of automatic aligning parts mount mechanism | |
CN203791144U (en) | Automatic dispensing machine | |
CN103496590A (en) | Material sucking mechanism | |
CN104440069A (en) | Integrated equipment used for installation and detection of screws | |
CN103878775B (en) | A kind of Part suction mechanism | |
CN104324860B (en) | A kind of dispensing pressing mechanism | |
CN103009034A (en) | Fixing piece mounting mechanism for camera of electronic product | |
CN103596417B (en) | A kind of automatic pressing device | |
CN204338424U (en) | A kind of Full-automatic quantitative glue applying mechanism | |
CN103009035A (en) | Button mounting mechanism for electronic product | |
CN104399644A (en) | Z-axis glue-dispensing mechanism | |
CN206343358U (en) | Antioverloading formula hitch feed mechanism for LED support | |
CN104002292B (en) | A kind of complementary type robot device | |
CN204320595U (en) | A kind of Z axis glue applying mechanism | |
CN205056385U (en) | Point gum machine of chip mounting machine constructs | |
CN105127053A (en) | Dispensing mechanism of chip assembling machine | |
CN203399478U (en) | Automatic-alignment part installation mechanism | |
CN103522080A (en) | XY axis adjusting mechanism | |
CN202985015U (en) | Mounting mechanism of camera fixing piece for electronic product |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150311 |
|
RJ01 | Rejection of invention patent application after publication |