CN104393327B - Heat-conducting glue board fixing structure and end socket - Google Patents
Heat-conducting glue board fixing structure and end socket Download PDFInfo
- Publication number
- CN104393327B CN104393327B CN201410641090.2A CN201410641090A CN104393327B CN 104393327 B CN104393327 B CN 104393327B CN 201410641090 A CN201410641090 A CN 201410641090A CN 104393327 B CN104393327 B CN 104393327B
- Authority
- CN
- China
- Prior art keywords
- low head
- screw
- heat
- offset plate
- heat conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/058—Construction or manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings, jackets or wrappings of a single cell or a single battery
- H01M50/183—Sealing members
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The open a kind of heat-conducting glue board fixing structure of the present invention, in order to heat conduction offset plate to be releasably secured in the end face of low head, heat-conducting glue board fixing structure includes keeper and screw, low head offers accommodating hole and screw accordingly, accommodating hole is offered in the end face of low head and is downwardly extended, screw is offered in the side of low head and extends inwardly to connect with accommodating hole, keeper includes fixed part and hook part, fixed part inserts in accommodating hole, and fixed part has the inclined-plane towards screw, the upper end of fixed part is fixed in one end of hook part, hook part extends to heat-conducting glue plate, and the other end of hook part bends downwards and protrudes out and compress heat conduction offset plate, screw thread is connected in screw and is resisted against inclined-plane.This fixed structure makes heat conduction offset plate contact with low head closely, and heat conductivity is good, and screw horizontally set, lug, and fast and easy when changing heat conduction offset plate will not be scalded.Correspondingly, the invention also discloses there is the end socket of this heat-conducting glue board fixing structure.
Description
Technical field
The present invention relates to lithium battery encapsulation apparatus field, particularly relate to a kind of heat-conducting glue board fixing structure and have
The end socket of this fixed structure.
Background technology
Along with various portable electric appts and the extensive of electric automobile are applied and fast-developing, to its dynamical system
The demand of system electrochmical power source lithium ion battery is continuously increased, and it is current state-of-the-art commercialization secondary cell.
Lithium ion battery is with its high power capacity, high voltage, high cyclical stability, high-energy-density, non-environmental-pollution etc.
Excellent performance enjoys favor, is referred to as the green energy resource of 21 century and leading power supply.Wherein, flexible-packaged lithium
Ion battery has that energy density is high, lightweight, metamorphosis is many, can make the advantages such as thin battery, because of
This current electronic mobile product substantially uses flexible packing lithium ion battery as the energy.
Aluminum-plastic composite membrane in flexible packing material generally comprises five-layer structure, inside and outside each two layers of polyethylene layer (PE)
And polypropylene layer (PP), middle one layer of aluminium foil layer.During encapsulation use closedtop packaging machine include by upper cover with under
End socket composition end socket, generally core is loaded in type composite membrane, certain temperature, the time,
Use closedtop packaging machine by the tab and the aluminum film that are similar to packaging aluminium film PP material on lug under pressure effect
Layer PP or PE grips and makes its melted by heat, is bonded together after cooling, reaches the effect sealed.
Closedtop encapsulation at present uses soft envelope and firmly seals two ways, and the softest envelope mode is at closedtop packaging machine end socket
Low head surface be fixed with one block of silica gel plate (or other heat conduction offset plates), the commonly used screw of fixed form by
Upper and under be screwed into silica gel plate and be fixed with low head, its shortcoming is as follows: one, tab pole in encapsulation process
Easily scalded by fixed screw cap, affect product quality；Two, this fixed form cannot ensure silica gel plate with under
The contact of end socket surface is intact, affects heat conductivity, and the closedtop encapsulation bad risk of colloidal sol is higher；Three, silica gel plate breaks
Damage replacing relatively complicated, and limited due to upper and lower end socket spacing when changing, need end socket integral demounting
After turn on again screw take out silica gel plate, affect production efficiency to a certain extent.
Therefore, it is badly in need of one and silica gel plate location can be made firm, keep thermal conductive resin, and change quickly
Fixed structure is to overcome drawbacks described above.
Summary of the invention
It is an object of the invention to provide one can make silica gel plate location firm, keeps thermal conductive resin, and
Change quick fixed structure to overcome drawbacks described above.
It is a further object of the present invention to provide a kind of end socket with this fixed structure.
To achieve these goals, the invention provides a kind of heat-conducting glue board fixing structure, in order to by heat-conducting glue
Plate is releasably secured in the end face of low head, described heat-conducting glue board fixing structure include at least one keeper and
At least one screw, described low head offers at least one accommodating hole and at least one screw accordingly, described
Accommodating hole is offered in the end face of described low head and is downwardly extended, and described screw is in the side opening of described low head
And if extend inwardly to connect with described accommodating hole, described keeper includes fixed part and hook part, described solid
Determine portion to be downwardly in described accommodating hole, and described fixed part have an inclined-plane towards described screw, described tiltedly
Face from top to bottom extends in the inclination laterally offering described screw near described low head, described hook part
The upper end of described fixed part is fixed in one end, and described hook part extends to described heat conduction offset plate, and described snap fit
The other end in portion bends downwards and protrudes out and compress described heat conduction offset plate, and described screw thread is connected to described screw
In and be resisted against described inclined-plane.
Compared with prior art, owing to the present invention has offered described accommodating hole and screw on described low head,
And it has been inserted into described keeper at described accommodating hole, connecting at described screw female thread has screw, and described
Keeper includes described fixed part and described hook part, after described low head loaded onto by described heat conduction offset plate, by institute
Stating the described screw tightening in screw, described screw is driven by described the supporting of inclined-plane to described fixed part
Making described keeper decline in described accommodating hole, described hook part follows decline and by described heat conduction offset plate pressure
Tight on described low head, described screw is twisted the tightest, and described heat conduction offset plate is the tightest with contacting of low head
Close, firm, therefore heat conductivility is the best, and beneficially packaging process completes.Meanwhile, described screw is in described
The side of low head is offered, and the most described screw is also horizontally set at described low head without being exposed to heat-conducting glue
On plate, therefore will not scald cell polar ear in encapsulation process.During it addition, be intended to change described heat conduction offset plate,
Only need to be unscrewed by described screw from the side of described low head, described screw releases described fixed part inclined-plane
Supporting, compress described heat conduction offset plate so that described keeper loosens and releases, described heat conduction offset plate is not
Compressed by described hook part again, it is possible to extract out between upper cover and low head easily, changed quickly,
Do not affect production efficiency.
It is preferred that the end face depression of described heat conduction offset plate forms groove, described hook part bends downwards and protrudes out
Part presses on the bottom surface of described groove.
Specifically, the end face of described low head includes the first plane and the second of the most described first planar projections
Plane, is connected between described first plane and the second plane and has vertical plane, and described heat conduction offset plate is carried on described
First plane.
More specifically, described heat conduction offset plate has, to be positioned at the bottom surface of described groove side the most described groove convex
The locating flange risen, described hook part bends downwards the part protruded out and supports described locating flange and make described heat conduction
Offset plate is against described vertical plane.Described hook part compresses downwards described heat conduction offset plate described fixed to supporting simultaneously
Position flange makes described heat conduction offset plate against described vertical plane, then can enter described heat conduction offset plate from both direction
Row location so that it is more firm.
It is preferred that the quantity of described keeper and screw is three, described low head correspondence offers three institutes
State accommodating hole and three described screws.
Specifically, three described accommodating holes are spaced setting along the length direction of described low head, three institutes
State screw and be the most correspondingly spaced setting along the length direction of described low head.
It is preferred that described heat conduction offset plate is silica gel plate.
Correspondingly, present invention also offers a kind of end socket, including upper cover, low head, be arranged at described under
The heat conduction offset plate of the end face of end socket and described heat-conducting glue board fixing structure.Described upper cover is presented with low head
Under be oppositely arranged, the lower end of described upper cover is formed with the upper encapsulation flange protruded out downwards, described heat conduction offset plate
It is raised up to be formed with the lower encapsulation flange relative with described upper encapsulation flange.
Compared with prior art, end socket of the present invention has and makes described heat conduction offset plate location firm and heat conductivity
Good, screw will not scald cell polar ear, change quick advantage during described heat conduction offset plate.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of end socket of the present invention.
Fig. 2 is the exploded view of end socket of the present invention.
Fig. 3 is the three-dimensional cutaway view after the present invention hides upper cover.
Detailed description of the invention
Below in conjunction with the Figure of description provided, presently preferred embodiments of the present invention is made description.
As shown in Figure 1 to Figure 3, the invention discloses a kind of end socket, including upper cover 1, low head 2, lead
Hot glue plate 3 and described heat conduction offset plate 3 is releasably secured in the heat conduction offset plate of described low head 2 end face fixes
Structure.Described heat-conducting glue board fixing structure includes three keepers 4 and three screw (not shown).
Described upper cover 1 and low head 2 are in being oppositely arranged up and down, and the lower end of described upper cover 1 is formed oriented
Under the upper encapsulation flange 11 that protrudes out.
The end face of described low head 2 includes the first plane 21 and the second of the most described first plane 21 projection
Plane 22, is connected between described first plane 21 and the second plane 22 and has vertical plane 23, it is seen that described lower envelope
The end face of 2 is step-like in be made up of described first plane 21, vertical plane 23 and the second plane 22.Institute
State low head 2 and offer three accommodating holes downwardly extended 24, described low head in described second plane 22
2 also offer three on the one side of adjacent described first plane 21 extends inwardly to described with three accommodating
The screw 25 that hole 24 is respectively communicated with, three described accommodating holes 24 are spaced along the length direction of described low head 2
Spread configuration, three described screws 25 are the most correspondingly spaced setting along the length direction of described low head 2.
Described heat conduction offset plate 3 is carried on described first plane 21, and the end face depression of described heat conduction offset plate 3 is formed
Groove 30, described heat conduction offset plate 3 has both sides the most described groove 30 laying respectively at described groove 30
The protruding locating flange 31 in bottom surface and lower encapsulation flange 32, described locating flange 31 and described vertical plane 23
Contact, described lower encapsulation flange 32 is relative with described upper encapsulation flange 11, in described upper cover 1 and lower envelope
After 2-in-1, described upper encapsulation flange 11 jointly grips the aluminum of packaging battery core with lower encapsulation flange 32
Mould composite membrane.The face that described upper encapsulation flange 11 is relative with lower encapsulation flange 32 can be plane, it is also possible to
It is intermeshing male and fomale(M&F) or the flank of tooth.What described heat conduction offset plate 3 was concrete can use silica gel plate.
The entirety of described keeper 4 is substantially in inverted L-shaped, and described keeper 4 includes fixed part 41 and card
Hook part 42, described fixed part 41 is downwardly in described accommodating hole 24, and described fixed part 41 have towards
The inclined-plane 411 of described screw 25, described inclined-plane 411 is from top to bottom described in offering near described low head 2
The inclination laterally of screw 25 extends, and the upper end of the most described fixed part 41 is relatively thin and lower end is the most thicker.Institute
State the another side that fixed part 41 and described inclined-plane 411 phase deviate to be plane and described accommodating hole 24 can be close to
Inwall.The upper end of described fixed part 41 is fixed in one end of described hook part 42, and described hook part 42 is parallel
Extend to described heat conduction offset plate 3 in described second plane 22 ground, and the other end of described hook part 42 is downward
Bend in protruding into described groove 30 and press on the bottom surface of described groove 30, meanwhile, described hook part 42
Bend downwards the part protruded out also to contact with the medial surface of described locating flange 31.
Terminate in described first plane 21 by anti-for described heat conduction offset plate 3 and three described keepers 4 are inserted respectively
After three described accommodating holes 24, three described screws are inserted respectively in three described screws 25, described spiral shell
Silk inwardly supports described inclined-plane 411 by with the threaded engagement of described screw 25, and described screw is to described inclined-plane
The decline of described fixed part 41 (keeper 4), described hook part 42 during decline are ordered about in 411 support
Compress described groove 30 bottom surface, described heat conduction offset plate 3 is pressed in described first plane 21.Meanwhile,
Described hook part 42 bends downwards the part protruded out and also can support described locating flange 31 and make described heat conduction offset plate 3
Against described vertical plane 23, described hook part 42 to described locating flange 31 support it is not necessary to,
Only by described downward the supporting of heat conduction offset plate 3 has been able to realize the location of described heat conduction offset plate 3, and institute
It is convex by rationally arranging under the bending of described hook part 42 for stating hook part 42 to supporting of described locating flange 31
The width of part realizes.
When being intended to change described heat conduction offset plate 3, only from the side of described low head 2, described screw need to be unscrewed,
Described screw releases supporting described fixed part 41 inclined-plane 411, so that described keeper 4 loosens and solves
Except compressing described heat conduction offset plate 3, described heat conduction offset plate 3 is no longer influenced by compressing of described hook part 42,
Can extract out between upper cover 1 and low head 2 easily.
Certainly, the quantity of described keeper 4, screw, accommodating hole 24 and screw 25 is not limited to three,
Its quantity can select according to needs of production.The screw used in the present embodiment can carry with other
Threaded connector such as stud, screw etc. replace, certainly, with the connector of tack to described fixed part
It is preferable that effect is supported on the described inclined-plane 411 of 41.Owing to screw is standard component, the most do not draw.
The present invention compared with prior art, owing to the heat conduction offset plate 3 in end socket of the present invention passes through heat-conducting glue
Compact siro spinning technology on the real presently described low head 2 of board fixing structure, heat conductivility is good, the most described screw
It is arranged at the side of described low head 2 rather than is exposed to the end face of described heat conduction offset plate 3, therefore in envelope
Process of assembling will not be scalded cell polar ear.Again due to the improvement on heat-conducting glue board fixing structure so that heat-conducting glue
The replacing of plate 3 is quick, does not affect production efficiency.
The above disclosed preferred embodiments being only the present invention, its effect is to facilitate those skilled in the art
Member understands and also implements according to this, certainly can not limit the interest field of the present invention with this, therefore according to Shen of the present invention
Please the equivalent variations made of the scope of the claims, still fall within the scope that the present invention is contained.
Claims (8)
1. a heat-conducting glue board fixing structure, in order to heat conduction offset plate to be releasably secured in the end face of low head, its
It is characterised by: described heat-conducting glue board fixing structure includes at least one keeper and at least one screw, described
Low head offers at least one accommodating hole and at least one screw accordingly, and described accommodating hole is in described low head
End face offer and downwardly extend, described screw is offered in the side of described low head and extends inwardly to and institute
Stating accommodating hole connection, described keeper includes that fixed part and hook part, described fixed part are downwardly into described appearance
Putting in hole, and described fixed part has the inclined-plane towards described screw, described inclined-plane is from top to bottom near institute
Stating low head and offer the extension of inclination laterally of described screw, one end of described hook part is fixed on described fixing
The upper end in portion, described hook part extends to described heat conduction offset plate, and the other end of described hook part bends downwards
Protruding out and compress described heat conduction offset plate, described screw thread is connected in described screw and is resisted against described inclined-plane.
2. heat-conducting glue board fixing structure as claimed in claim 1, it is characterised in that: the top of described heat conduction offset plate
Face depression forms groove, and described hook part bends downwards the part protruded out and presses on the bottom surface of described groove.
3. heat-conducting glue board fixing structure as claimed in claim 2, it is characterised in that: the end face of described low head
Including the first plane and the second plane of the most described first planar projections, described first plane and the second plane
Between connect have vertical plane, described heat conduction offset plate to be carried on described first plane.
4. heat-conducting glue board fixing structure as claimed in claim 3, it is characterised in that: described heat conduction offset plate has
Being positioned at the locating flange that the bottom surface of described groove side the most described groove is protruding, described hook part is turned under
The part that folding protrudes out supports described locating flange makes described heat conduction offset plate against described vertical plane.
5. heat-conducting glue board fixing structure as claimed in claim 1, it is characterised in that: described keeper and screw
Quantity be three, described low head correspondence offers three described accommodating holes and three described screws.
6. heat-conducting glue board fixing structure as claimed in claim 5, it is characterised in that: three described accommodating hole edges
The length direction of described low head is spaced setting, and three described screws are the most correspondingly along described low head
Length direction is spaced setting.
7. heat-conducting glue board fixing structure as claimed in claim 1, it is characterised in that: described heat conduction offset plate is silicon
Offset plate.
8. an end socket, including the heat conduction offset plate of upper cover, low head and the end face being arranged at described low head,
Described upper cover and low head are in being oppositely arranged up and down, and the lower end of described upper cover is formed with protrude out downwards upper
Encapsulation flange, it is convex that described heat conduction offset plate is raised up to be formed with the lower encapsulation relative with described upper encapsulation flange
Edge, it is characterised in that: also include the heat-conducting glue board fixing structure as described in any one of claim 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410641090.2A CN104393327B (en) | 2014-11-13 | 2014-11-13 | Heat-conducting glue board fixing structure and end socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410641090.2A CN104393327B (en) | 2014-11-13 | 2014-11-13 | Heat-conducting glue board fixing structure and end socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104393327A CN104393327A (en) | 2015-03-04 |
| CN104393327B true CN104393327B (en) | 2016-11-23 |
Family
ID=52611190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410641090.2A Active CN104393327B (en) | 2014-11-13 | 2014-11-13 | Heat-conducting glue board fixing structure and end socket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104393327B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201508882U (en) * | 2009-10-28 | 2010-06-16 | 惠州市赛能电池有限公司 | Flexible package lithium ion battery electrode lug encapsulating device |
| CN202601795U (en) * | 2012-05-25 | 2012-12-12 | 浙江振龙电源股份有限公司 | Polymer soft-packed lithium ion electric core packaging system |
| CN203721836U (en) * | 2013-11-26 | 2014-07-16 | 新余英泰能科技有限公司 | Seal head device |
| CN204216149U (en) * | 2014-11-13 | 2015-03-18 | 东莞市久森新能源有限公司 | Heat-conducting glue board fixing structure and end socket |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070094865A1 (en) * | 2002-01-10 | 2007-05-03 | Ji-Guang Zhang | Packaged thin film batteries and methods of packaging thin film batteries |
-
2014
- 2014-11-13 CN CN201410641090.2A patent/CN104393327B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201508882U (en) * | 2009-10-28 | 2010-06-16 | 惠州市赛能电池有限公司 | Flexible package lithium ion battery electrode lug encapsulating device |
| CN202601795U (en) * | 2012-05-25 | 2012-12-12 | 浙江振龙电源股份有限公司 | Polymer soft-packed lithium ion electric core packaging system |
| CN203721836U (en) * | 2013-11-26 | 2014-07-16 | 新余英泰能科技有限公司 | Seal head device |
| CN204216149U (en) * | 2014-11-13 | 2015-03-18 | 东莞市久森新能源有限公司 | Heat-conducting glue board fixing structure and end socket |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104393327A (en) | 2015-03-04 |
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Effective date of registration: 20190605 Address after: 424300 Luxury Vehicle Inspection Company on Industrial Avenue, Wushuizhen County Industrial Park, Linwu County, Hunan Province Patentee after: Hunan Jiusun New Energy Co., Ltd. Address before: 523470 Waterfront Industrial Park, Hengli Town, Dongguan City, Guangdong Province, 21 Patentee before: DONGGUAN JOYSUN NEW ENERGY CO., LTD. |