CN104393197B - Pressing device for laser packaging device, laser packaging device and packaging and pressing method - Google Patents
Pressing device for laser packaging device, laser packaging device and packaging and pressing method Download PDFInfo
- Publication number
- CN104393197B CN104393197B CN201410574990.XA CN201410574990A CN104393197B CN 104393197 B CN104393197 B CN 104393197B CN 201410574990 A CN201410574990 A CN 201410574990A CN 104393197 B CN104393197 B CN 104393197B
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- substrate
- laser
- pressure
- pressure adjusting
- exerting
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention relates to the manufacturing technology field of display devices, and discloses a pressing device for a laser packaging device, a laser packaging device and a packaging and pressing method. The pressing device comprises a supporting seat, a through hole arranged on the supporting seat for enabling a laser beam to penetrate through and at least one pressure adjusting rod arranged on the supporting seat in a sliding mode, wherein one end, far away from the supporting seat, of each pressure adjusting rod is provided with a pressing wheel. In the above technical scheme, two substrates are squeezed and attached via the pressing wheel so as to ensure frame packaging adhesives on the first substrate and the second substrate to be contacted, and in the case of laser sintering, the first substrate and the second substrate are sintered together via the frame packaging adhesives. Meanwhile, as physical pressing of the pressing wheel is adopted, the former frame packaging adhesive pressing procedure can be omitted, procedures can be reduced, and the production cost is shortened. In addition, the pressing area of the pressing wheel is only limited to partial laser sintering area, and influences on an organic light emitting diode display device are few.
Description
Technical field
The present invention relates to the manufacturing technology field of display device, the pressure dress of more particularly, to a kind of laser package device
Put, laser package device and envelope pressure method.
Background technology
The method for packing of frit is at present：Step one：Frit is printed onto on second substrate, step 2：Baking print
Second substrate after brush；Step 3：First substrate and second substrate laminating are made by sealed plastic box pressing mode；Step 4：Laser
Sintering pressing first substrate and second substrate.
Frit and first are simply temporarily protected and made to device to 3rd step role of method for packing at present
Substrate contacts, but due to vacuum pressing-combining, leads to cause crush injury to organic LED display device part.And this
Step needs to be pressed using automatic double surface gluer and press equipment, takes longer, and production cost is high.
In addition with using fluid bundle, air pressure is applied to the substrate after laminating, so that first substrate is fitted with frit, and
It is sintered with laser, the noble gases needing exist for high pressure are pressed (expend high it is not easy to control dynamics), and need
Consider chamber pressure tolerances.
Content of the invention
The invention provides a kind of device for exerting of laser package device, laser package device and envelope pressure method, in order to carry
The high packaging process simplifying organic light emitting diodde desplay device, improves packaging efficiency.
The invention provides a kind of device for exerting of laser package device, this device for exerting includes support base, is arranged on institute
The through hole stated on support base and pass through for laser beam；And at least one pressure being slidably arranged on described support base is adjusted
Bar, on each pressure adjusting lever, the one end away from described support base is provided with pressure wheel.
In technique scheme, gripper shoe is connected with laser beam emitting device, and the laser energy of laser beam emitting device transmitting
It is irradiated on substrate after being enough threaded through.Between laser sintered sealed plastic box, the length of adjustment pressure adjusting lever is so that pressure is adjusted
Two substrate extruding can be adjacent to by the pressure wheel on pole, and afterwards, laser moves along the position that sealed plastic box is arranged, thus gradually
Sealed plastic box is sintered.By pressure wheel, two substrate extruding are adjacent to, thus ensure that the envelope on first substrate and second substrate
Frame glue can closely contact, and when laser sintered, first substrate is sintered together by sealed plastic box with second substrate.Meanwhile, adopt
With the physics pressure of pressure wheel, previous sealed plastic box process for pressing can be saved, decrease technique, reduce production cost.Additionally, applying
The pressure area of pinch roller is only limitted to laser sintered subregion, and the impact to organic LED display device part is less.
Preferably, the number of described pressure adjusting lever is two, and the company of the set location of described two pressure adjusting lever
Line passes through the center of described through hole.There is provided pressure using two pressure adjusting levers.
Preferably, the number of described pressure adjusting lever is four, and described four pressure adjusting levers set around described through hole
Put.There is provided pressure using four this pressure adjusting levers.
Preferably, the intersection point of the cross-connect cable of described four pressure adjusting lever set locations is located at the circle of described through hole
The heart.Improve the deformation quantity of the substrate of laser sintered position.
Preferably, the set location of each pressure adjusting lever is less than setpoint distance apart from the distance of described through hole.Ensure
The deformation quantity of the substrate of laser sintered position.
Preferably, described support base is provided with the chute corresponding with each pressure adjusting lever, described pressure adjusting lever
It is slidedly assemblied in described chute and may be locked in setting position.Can be adjusted according to different organic LED display device parts
The position of whole pressure wheel.
Preferably, described pressure wheel is universal wheel.Improve the degree of freedom in pressure for the pressure wheel.
Preferably, the wheel face of described universal wheel is made for elastomeric material.Avoid and in pressure, substrate is caused to damage
Bad.
Present invention also offers a kind of laser package device, this laser package device includes the pressure described in any of the above-described
Device and generating laser, the laser that described laser transmitter projects go out passes through described through hole.
In technique scheme, the support base of device for exerting is connected with generating laser, and device for exerting is assembled into
In laser package device, when specifically used, by device for exerting, two substrates are pressed together, thus ensure that laser exists
During sintering, two substrates can closely bonding fit together.This device for exerting structure is simple, and the pressure providing is reliable, has
Simplifying the operation of two substrate extruding during encapsulation of effect, can be ensured by above-mentioned device for exerting when laser is mobile
The effect of bonding.
Present invention also offers a kind of method for packing, the method comprises the following steps：
Sealed plastic box is coated on second substrate；
Second substrate after baking printing sealed plastic box；
By first substrate and second substrate laminating, by pressure wheel pressure, first substrate and second substrate are adjacent to, are used in combination
Laser is sintered.
In technique scheme, by pressure wheel, the extruding of two substrates being adjacent to, thus ensure that first substrate and the
Sealed plastic box on two substrates can closely contact, and when laser sintered, first substrate is sintered in by sealed plastic box with second substrate
Together.Meanwhile, using the physics pressure of pressure wheel, previous sealed plastic box process for pressing can be saved, decrease technique, reduction produces
Cost.Additionally, the pressure area of pressure wheel is only limitted to laser sintered subregion, to organic LED display device part
Impact less.
Preferably, also include：When sealed plastic box is coated on second substrate, the cutting edge position of second substrate applies
It is covered with the sealed plastic box of positioning；
Before being adjacent to first substrate and second substrate by pressure wheel pressure, and being sintered with laser, by swashing
The sealed plastic box of light sintering positioning, first substrate and second substrate are fixed.
Sealed plastic box by the positioning of setting, it is to avoid in pressure wheel pressing, first substrate and second substrate appearance
Relatively slide it is ensured that sealing the effect of frame.
Brief description
Fig. 1 is a kind of upward view of the device for exerting of structure provided in an embodiment of the present invention；
Fig. 2 is device for exerting provided in an embodiment of the present invention schematic diagram operationally；
Fig. 3 be device for exerting provided in an embodiment of the present invention operationally press wheel pressure effect top view；
Fig. 4 is the upward view of the device for exerting of another kind structure provided in an embodiment of the present invention；
Fig. 5 is device for exerting provided in an embodiment of the present invention schematic diagram operationally；
Fig. 6 be device for exerting provided in an embodiment of the present invention operationally press wheel pressure effect top view.
Reference：
10- device for exerting 11- support base 111- through hole
112- chute 12- pressure adjusting lever 13- pressure wheel
20- first substrate 30- second substrate 40- sealed plastic box
Specific embodiment
In order to improve the packaging efficiency of organic LED display device part, embodiments provide a kind of laser
The device for exerting of packaging system, laser package device and envelope pressure method, in the technical scheme of the embodiment of the present invention, by adopting
Pressure wheel is adjacent to so that the sealed plastic box after sintering can be clinged with substrate to by two substrate extruding, simplifies the operation of envelope frame,
Improve envelope frame efficiency.For making the object, technical solutions and advantages of the present invention clearer, below with non-limiting embodiment
As a example the present invention is described in further detail.
As shown in Figures 1 and 2, Fig. 1 shows the upward view of the device for exerting of the embodiment of the present invention；Fig. 2 is that the present invention is real
The device for exerting schematic diagram operationally of example offer is provided.
Embodiments provide a kind of device for exerting of laser package device, this device for exerting 10 includes support base
11, the through hole 111 being arranged on support base 11 and passing through for laser beam；And it is slidably arranged on support base 11 at least one
Individual pressure adjusting lever 12, on each pressure adjusting lever 12, the one end away from support base 11 is provided with pressure wheel 13.
In the above-described embodiments, gripper shoe is connected with laser beam emitting device, and the laser of laser beam emitting device transmitting can
It is irradiated on substrate after being threaded through.Between laser sintered sealed plastic box 40, the length of adjustment pressure adjusting lever 12 is so that pressure
Two substrate extruding can be adjacent to by the pressure wheel 13 on adjusting rod 12, and afterwards, laser moves along the position that sealed plastic box 40 is arranged,
Thus gradually sintering to sealed plastic box 40.In above-mentioned specific work process, by pressure wheel 13, two substrate extruding are adjacent to, from
And ensure that first substrate 20 can closely be contacted with the sealed plastic box 40 on second substrate 30, and when laser sintered, first substrate
20 are sintered together by sealed plastic box 40 with second substrate 30.Meanwhile, using the physics pressure of pressure wheel 13, can save previously
Sealed plastic box process for pressing, decreases technique, reduces production cost.Additionally, pressure wheel 13 pressure area be only limitted to laser sintered
Subregion, the impact to organic LED display device part is less.
Pressure adjusting lever 12 therein can such as adopt expansion link, by the change of the height of expansion link from different bars
Change and 13 be applied to the power on substrate adjusting pressure wheel.Following structure can also be adopted：This pressure adjusting lever 12 includes two spiral shells
The contrary threaded rod of the stricture of vagina hand of spiral, is sleeved on two threaded rods and is respectively screw, with two threaded rods, the regulating part being connected,
Can achieve the adjustment of the length to whole pressure adjusting lever 12 by rotating regulating part.Thus realizing adjustment pressure wheel 13 applying
Power on substrate.
Pressure wheel 13 can be from different rollers, preferably, pressure wheel 13 is universal wheel, thus avoiding pressure wheel 13 to exist
During rolling, there is limiting the freedom of motion it is ensured that when pressure wheel 13 rolls in the direction of motion, such as in the position of sealed plastic box 40 bending
Put, universal wheel can quickly change the direction of motion.Additionally, in order to avoid universal wheel causes to substrate when extruding substrate to hinder
Evil, preferably, the wheel face of universal wheel is made for elastomeric material.Thus being effectively protected substrate.
In concrete setting, the number of pressure adjusting lever 12 can be from different quantity, below with specific embodiment
It is described.Describe for convenience, two substrates are respectively designated as first substrate 20 and second substrate 30, wherein with pressure
One substrate of wheel 13 contact is first substrate 20, and another is second substrate 30.
Embodiment 1
As shown in Figure 1, Figure 2 and Figure 3, Fig. 1 shows the structure of the device for exerting using two pressure adjusting levers.Fig. 2 shows
Go out its working effect figure, Fig. 3 shows the top view in pressure for the pressure wheel.
Specifically, the number of the pressure adjusting lever 12 of device for exerting 10 that the present embodiment provides is two, and two pressure
The line of the set location of adjusting rod 12 passes through the center of through hole 111.
When specifically used, two pressure adjusting levers 12 are located in sealed plastic box 40, the through hole 111 on setting support base 11
Between two pressure adjusting levers 12, and three is located on the same line, and between laser sintered sealed plastic box 40, adjusts first
The length of pressure adjusting lever 12, so that pressure wheel 13 can provide appropriate pressure extrusion two substrates, enables first substrate 20
Enough closely fit with the sealed plastic box 40 on second substrate 30.Because laser sintered position is located between two pressure wheels 13,
And two pressure wheels 13 are less than the distance setting, during ensureing laser sintered, first substrate 20 energy apart from the distance between laser
Enough closely bond together with the sealed plastic box 40 on second substrate 30.Meanwhile, (the direction with laser movement on rear side of laser
For front side) pressure wheel 13 pass through to extrude two substrates and sealed plastic box 40 so that melt the sealed plastic box 40 opened can be with the first base
Even closer the bonding together of plate 20, effectively raises the adhesive strength between substrate.
Embodiment 2
As shown in Fig. 4, Fig. 5 and Fig. 6, Fig. 3 shows the structure using four pressure adjusting levers, and Fig. 4 shows its work
Design sketch, Fig. 6 discloses pressure wheel top view operationally.Specifically, the pressure of the device for exerting 10 that the present embodiment provides
The number of adjusting rod 12 is four, and four pressure adjusting levers 12 are arranged around through hole 111.
The device for exerting 10 that the present embodiment provides increased two pressure adjusting levers 12 compared with Example 1.And four pressures
Draft control lever 12 is arranged around through hole 111, thus further ensure that the pressure that pressure wheel 13 provides ensure that two
Combining closely between substrate and sealed plastic box 40.
The intersection point of the cross-connect cable of four pressure adjusting lever 12 set locations providing with continued reference to Fig. 3, the present embodiment
The center of circle positioned at through hole 111.Specifically, the line of two pressure adjusting levers 12 being separated by four pressure adjusting levers 12 both passes through
Through hole 111, when using this structure, because substrate has certain ability of anti-deformation, in pressure wheel 13 two substrates of extruding,
The position of pressure wheel 13 contact is the maximum position of deformation quantity on substrate, and on substrate, the distance of distance pressure wheel 13 is more remote, substrate
Deformation quantity also less, therefore, using four pressure wheel 13 extruding substrates it is ensured that be located at four pressure wheel 13 between portions
The substrate of position has enough deformation quantities so that first substrate 20 is adjacent to the sealed plastic box 40 on second substrate 30.And be embodied as
When, two pressure wheels 13 are located in sealed plastic box 40, and another two pressure wheel 13 is located at the both sides of sealed plastic box 40 respectively, with continued reference to figure
3, the gap due to existing between the substrate of sealed plastic box 40 both sides is larger, therefore, in the specific implementation, can adjust positioned at envelope frame
The pressure wheel 13 of glue 40 both sides can provide larger extruding force so that being located at sealed plastic box 40 both sides pressure wheel 13, so that first
Substrate 20 has a larger deformation quantity, drives first substrate 20 closely to fit with sealed plastic box 40 by its deformation quantity, thus
Ensure that the effect of whole encapsulation.
Preferably, the company of the line between two pressure wheels 13 being located in sealed plastic box 40 and the pressure wheel 13 positioned at both sides
Line is mutually perpendicular to, and four pressure wheels 13 are identical apart from the horizontal range of through hole 111, thus effectively improve applying positioned at four
The deformation quantity of the first substrate 20 between pinch roller 13 is it is ensured that it can be so that first substrate 20 and sealed plastic box when laser sintered
Can be stable between 40 bond together.
Additionally, the deformation quantity in order to ensure to take turns the first substrate 20 between 13 positioned at four pressures can have certain shape
Variable extruding sealed plastic box 40 and second substrate 30 it is ensured that adhesive strength between two substrates, in concrete setting, each pressure
The set location of draft control lever 12 is less than setpoint distance apart from the distance of through hole 111.This setpoint distance can according to being actually subjected to plus
The size of the organic LED display device part of work, to adjust, takes turns the too small or mistake of spacing between 13 to avoid two to press
The big and deformation quantity of first substrate 20 that causes not it is impossible to make the appearance of the situation of two substrates into intimate bondings, effectively
Ensure that the effect after bonding.
In concrete setting, using being slidably connected between pressure adjusting lever 12 and support base 11, specifically, on support base 11
It is provided with the chute 112 corresponding with each pressure adjusting lever 12, pressure adjusting lever 12 is slidedly assemblied in chute 112 and can lock
It is scheduled on setting position.By the slide construction of setting, the distance between pressure adjusting lever 12 can be adjusted, i.e. adjustment pressure wheel 13
The distance between with laser, thus ensure that the first substrate 20 for different size size and thickness adopts different spacing,
Ensure that two substrates, in specific bonding, can firmly bond together.Locking mechanism therein can be locking screw
The common retaining mechanism such as bolt, lock-screw.
It should be appreciated that the device for exerting 10 that the present embodiment provides is not limited only to above-mentioned specific embodiment 1 and embodiment 2
The two kinds of specific pressure wheels 13 providing and pressure adjusting lever 12 structure, other any enforceable structures can also be applied to this
In embodiment, the number of such as pressure adjusting lever 12 can be using three, five, other numbers, its principle and the above-mentioned tools such as six
The principle of body embodiment is identical, and this is no longer going to repeat them.
The embodiment of the present invention additionally provides a kind of laser package device, and this laser package device includes applying of any of the above-described
Pressure device 10 and generating laser, the laser that laser transmitter projects go out passes through through hole 111.
In the above-described embodiments, the support base 11 of device for exerting 10 is connected with generating laser, by 10 groups of device for exerting
It is attached in laser package device, when specifically used, by device for exerting 10, two substrates are pressed together, thus ensure that
In sintering, two substrates can closely bonding fit together laser.This device for exerting 10 structure is simple, the pressure providing
Reliable, effectively simplify by the operation of two substrate extruding during encapsulation, can be by above-mentioned pressure when laser is mobile
Device 10 ensures the effect of bonding.
The embodiment of the present invention additionally provides a kind of method for packing, and the method comprises the following steps：
Sealed plastic box 40 is coated on second substrate 30；
Second substrate 30 after baking printing sealed plastic box 40；
First substrate 20 and second substrate 30 are fitted, is pressed first substrate 20 and second substrate 30 by pressure wheel 13
It is adjacent to, and be sintered with laser.
In the above-described embodiments, by the pressure wheel 13 using device for exerting 10, two substrate extruding are adjacent to, thus protecting
Demonstrate,proved first substrate 20 can closely contact with the sealed plastic box 40 on second substrate 30, when laser sintered, first substrate 20 with
Second substrate 30 is sintered together by sealed plastic box 40.Meanwhile, using the physics pressure of pressure wheel 13, previous envelope frame can be saved
Glue process for pressing, decreases technique, reduces production cost.Additionally, the pressure area of pressure wheel 13 is only limitted to laser sintered portion
Subregion, the impact to organic LED display device part is less.
More preferably, the method also includes：When sealed plastic box is coated on second substrate, in the cutting edge position of second substrate
Put the sealed plastic box that painting is covered with positioning；
Before being adjacent to first substrate and second substrate by pressure wheel pressure, and being sintered with laser, by swashing
The sealed plastic box of light sintering positioning, first substrate and second substrate are fixed.
Sealed plastic box by the positioning of setting, it is to avoid in pressure wheel pressing, first substrate and second substrate appearance
Relatively slide it is ensured that sealing the effect of frame.
Obviously, those skilled in the art can carry out the various changes and modification essence without deviating from the present invention to the present invention
God and scope.So, if these modifications of the present invention and modification belong to the scope of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to comprise these changes and modification.
Claims (11)
1. a kind of device for exerting of laser package device, it is characterised in that including support base, is arranged on and is used in combination on described support base
The through hole passing through in laser beam；And it is slidably arranged at least two pressure adjusting levers on described support base, each pressure is adjusted
On pole, the one end away from described support base is provided with pressure wheel；Wherein, along the direction of laser movement described in sintering process, extremely
A few pressure adjusting lever is located at the front of described laser, and at least one pressure adjusting lever is located at the rear of described laser.
2. device for exerting as claimed in claim 1 is it is characterised in that the number of described pressure adjusting lever is two and described
The line of the set location of two pressure adjusting levers passes through the center of described through hole.
3. device for exerting as claimed in claim 1 is it is characterised in that the number of described pressure adjusting lever is four and described
Four pressure adjusting levers are arranged around described through hole.
4. device for exerting as claimed in claim 3 is it is characterised in that the intersection of described four pressure adjusting lever set locations connects
The intersection point of wiring is located at the center of circle of described through hole.
5. the device for exerting as described in any one of Claims 1 to 4 is it is characterised in that the set location of each pressure adjusting lever
Distance apart from described through hole is less than setpoint distance.
6. device for exerting as claimed in claim 5 is it is characterised in that be provided with and each pressure adjusting lever on described support base
Corresponding chute, described pressure adjusting lever is slidedly assemblied in described chute and may be locked in setting position.
7. device for exerting as claimed in claim 5 is it is characterised in that described pressure is taken turns as universal wheel.
8. device for exerting as claimed in claim 7 is it is characterised in that the wheel face of described universal wheel is for elastomeric material makes
Become.
9. a kind of laser package device is it is characterised in that including the device for exerting as described in any one of claim 1～6 and swashing
Optical transmitting set, the laser that described laser transmitter projects go out passes through described through hole.
10. a kind of method for packing is it is characterised in that comprise the following steps：
Sealed plastic box is coated on second substrate；
Second substrate after baking printing sealed plastic box；
By first substrate and second substrate laminating, by the pressure dress of the laser package device described in any one of claim 1～8
Put pressure to be adjacent to first substrate and second substrate, and be sintered with laser.
11. method for packing as claimed in claim 10 are it is characterised in that also include：Sealed plastic box is coated on second substrate
When, the cutting edge position of second substrate applies and is covered with fixing sealed plastic box；
Before first substrate and second substrate being adjacent to by pressure wheel pressure, and being sintered with laser, burnt by laser
The fixing sealed plastic box of knot, first substrate and second substrate are fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410574990.XA CN104393197B (en) | 2014-10-23 | 2014-10-23 | Pressing device for laser packaging device, laser packaging device and packaging and pressing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410574990.XA CN104393197B (en) | 2014-10-23 | 2014-10-23 | Pressing device for laser packaging device, laser packaging device and packaging and pressing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104393197A CN104393197A (en) | 2015-03-04 |
| CN104393197B true CN104393197B (en) | 2017-02-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410574990.XA Active CN104393197B (en) | 2014-10-23 | 2014-10-23 | Pressing device for laser packaging device, laser packaging device and packaging and pressing method |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105679970B (en) * | 2016-04-11 | 2017-08-08 | 京东方科技集团股份有限公司 | Colloid agglomerating plant and method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101342334B1 (en) * | 2007-10-05 | 2013-12-16 | 코닝 인코포레이티드 | Method and apparatus for sealing a glass package |
| CN201555678U (en) * | 2009-11-13 | 2010-08-18 | 清华大学 | Three-wheel V-belt tension measuring apparatus |
| KR101030000B1 (en) * | 2009-12-10 | 2011-04-20 | 삼성모바일디스플레이주식회사 | Frit sealing system and method of manufacturing organic light emitting display apparatus using the same |
| KR101298970B1 (en) * | 2013-03-12 | 2013-08-22 | 주식회사 파티클로지 | Low melting temperature glass frit composition for laser sealing, low melting temperature glass frit using the same and sealing method of amoled using the low melting temperature glass frit |
| CN103367658B (en) * | 2013-07-17 | 2016-08-31 | 深圳市华星光电技术有限公司 | A kind of glass package structure and method for packing |
| CN103715371A (en) * | 2013-12-16 | 2014-04-09 | 京东方科技集团股份有限公司 | Packaging method and display device |
| CN103928638B (en) * | 2014-04-04 | 2016-08-17 | 京东方科技集团股份有限公司 | The method for packing of a kind of glass substrate, frit and electronic device |
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