CN104392905B - Method and apparatus for peeling film for semiconductor - Google Patents
Method and apparatus for peeling film for semiconductor Download PDFInfo
- Publication number
- CN104392905B CN104392905B CN201410696758.3A CN201410696758A CN104392905B CN 104392905 B CN104392905 B CN 104392905B CN 201410696758 A CN201410696758 A CN 201410696758A CN 104392905 B CN104392905 B CN 104392905B
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- film
- substrate
- taping
- peeling
- notch
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A method for simultaneously peeling a film for a vertical double-side roll type semiconductor includes: an upright placement step S10 in which the upright loading device 10 erects the substrate in a state of being horizontal to the ground, and places one of line segments connecting the apexes of the substrate in parallel with the direction of gravity; a taping unit attaching step S20 of attaching the taping unit transfer means 20 to the four corner portions of the film F attached to the two surfaces of the substrate by bringing the two taping units T1 and T2, to which the adhesive tape is attached, into close proximity to the two surfaces of the substrate while facing each other; a preliminary peeling step S30 in which the taping unit transfer means 20 simultaneously moves the taping units T1 and T2 in opposite directions, and the film is peeled from the upper four corners of the substrate by the taping units; in the final peeling step S40, the gripper elevating means 40 raises the gripper 41 that grips the upper four corner portion of the substrate, and the thin film is peeled from the substrate.
Description
Technical Field
The invention aims to provide a film peeling device and a peeling method for a semiconductor by using a pair of braid units.
Background
In a manufacturing process of a Printed Circuit Board (PCB) or a substrate for manufacturing a semiconductor, contaminants stained on the surface of the substrate are removed, and a protective film is attached to the upper and lower surfaces of the substrate to protect the surface of the substrate for a product for which the presence or absence of an abnormality is confirmed. Therefore, in order to insert various components such as semiconductors, capacitors, resistors, and the like into such a substrate, it is necessary to remove the protective film attached to the surface of the substrate.
As a conventional technique, there is korean registered patent No. 10-1119571, and the conventional technique is to peel a film in a state where a substrate is horizontally laid down, and has problems that the structure of the apparatus is increased, and steps required for peeling and the amount of transfer of components are large.
Disclosure of Invention
(technical problem to be solved)
The invention provides a thin film peeling device and a peeling method for a semiconductor using a pair of taping units, which can reduce the substrate transfer step and the transfer amount of the peeling device, make the device compact and compact, have excellent operability and can completely peel.
The invention aims to provide a film peeling device and a peeling method for a semiconductor by using a pair of braiding units, which can accurately and completely peel a protective film of a substrate, can process the substrate with the size of 30-80 cm, increases the operation efficiency per unit time and has excellent durability.
(means for solving the problems)
A method for simultaneously peeling a film for a vertical double-side roll type semiconductor includes: an upright placement step S10 in which the upright loading device 10 erects the substrate in a state of being horizontal to the ground, and places one of line segments connecting the apexes of the substrate in parallel with the direction of gravity;
a taping unit attaching step S20 of attaching the taping unit transfer means 20 to the four corner portions of the film F attached to the two surfaces of the substrate by bringing the two taping units T1 and T2, to which the adhesive tape is attached, into close proximity to the two surfaces of the substrate while facing each other;
a preliminary peeling step S30 in which the taping unit transfer means 20 simultaneously moves the taping units T1 and T2 in opposite directions, and the film is peeled from the upper four corners of the substrate by the taping units;
in the final peeling step S40, the gripper elevating means elevates the gripper that grips the upper four corner portion of the substrate, and the thin film is peeled off from the substrate.
(Effect of the invention)
According to the present invention, there are provided a thin film peeling apparatus for a semiconductor and a peeling method using a pair of taping units, which can reduce the number of steps for transferring a substrate and the amount of transfer of the peeling apparatus, and which can reduce the size and size of the apparatus.
Further, according to the present invention, there are provided a film peeling apparatus and a peeling method for a semiconductor using a pair of taping units, which can accurately and completely peel off a protective film of a substrate, can process a substrate having a size of 30 to 80cm, can increase the work efficiency per unit time, and can be excellent in durability.
Drawings
FIG. 1 is a flow chart of a method for peeling a film for a semiconductor using a pair of taping units according to the present invention.
FIG. 2 is a conceptual explanatory view of a method for peeling a film for a semiconductor using a pair of taping units according to the present invention.
FIG. 3 is a conceptual view of a film peeling apparatus for a semiconductor using a pair of taping units according to the present invention.
Fig. 4 is a conceptual view of the upright loading apparatus of the present invention.
FIGS. 5a, 5b and 5c are conceptual views of the notch forming unit of the present invention.
Fig. 6 is a conceptual view of the bonding unit and the bonding unit transfer means according to the present invention.
< description of symbols >
10 vertical loading device
20 means for transferring the braid unit
50 notch forming unit
51 linear motion type napper
53 rotary knurling device
55 non-contact laser
60 thin film recovery roller
T1, T2 taping unit
F is film
Detailed Description
The following describes in detail a method and an apparatus for peeling a semiconductor film using a pair of taping units according to an embodiment of the present invention with reference to the drawings. Fig. 1 is a flowchart of a method for peeling a film for a semiconductor using a pair of taping units according to the present invention, fig. 2 is a conceptual explanatory view of the method for peeling a film for a semiconductor using a pair of taping units according to the present invention, fig. 3 is a conceptual view of an apparatus for peeling a film for a semiconductor using a pair of taping units according to the present invention, fig. 4 is a conceptual view of an upright loading apparatus according to the present invention, fig. 5a, 5b, and 5c are conceptual views of a notch forming unit according to the present invention, and fig. 6 is a conceptual view of a bonding unit and a means for transferring the bonding unit according to the present invention.
As shown in fig. 1 to 6, in the standing step S10, the vertical loading device 10 stands the substrate in a state horizontal to the floor, and places one of line segments connecting the apexes of the substrate in parallel to the direction of gravity. In the taping unit adhering step S20, the taping unit transferring means 20 causes the two taping units T1 and T2 with the adhesive tape attached thereto to approach both surfaces of the substrate while facing each other, and adhere to the four corner portions of the film F adhered to both surfaces of the substrate.
In the preliminary peeling step S30 by the taping unit, the taping unit transfer means 20 simultaneously moves the taping units T1 and T2 in opposite directions, and the film is peeled from the upper four corners of the substrate. At this time, for the backward movement and the downward movement of the braid unit T1, T2 may use a 2-degree-of-freedom movement mechanism as shown in the embodiment of fig. 6, or may use a cam mechanism that moves along a specific curve. The related known technology of the 2-degree-of-freedom linear motion mechanism or the curve type cam mechanism is not described in detail here.
In the main peeling step S40, the gripper elevating means 40 elevates the gripper that grips the upper four corner portion of the substrate, and the thin film is peeled off from the substrate. As shown in fig. 1 or fig. 2, the clamping operation by the clamper is preferably performed after the preliminary peeling step 30, but may be performed before the preliminary peeling step when there is a blank region where the thin film is not deposited on the edge of the substrate. However, it is preferable that the raising of the clamper is performed after the preliminary peeling step 30.
As shown in fig. 1 to 6, in the method for simultaneously peeling off a film for a vertical double-side roller semiconductor according to an embodiment of the present invention, before the step of vertically placing S10 or between the step of vertically placing S10 and the step of taping unit attaching S20, a notch forming step S50 may be further included, in which the notch forming unit 50 forms notches for assisting the peeling off of the film at four corner portions of the film attached to both sides of the substrate S.
At this time, as shown in fig. 5a, 5b, and 5c, the notch forming unit 50 may include one notch forming device selected from the group consisting of a linear motion type napper 51 having a sharp tip end which makes a linear motion to form a notch in the film, a rotary type knurling device 53 which forms an unevenness on an outer circumferential surface and forms a notch in the film by contact rotation, and a non-contact type laser 55 which irradiates a laser to a notch forming region to form a notch.
As shown in fig. 1 to 6, the method for peeling a film for a semiconductor using a pair of taping units according to the present invention may further include: a step S60 in which the taping units T1, T2 attach the peeled film F to the film recovering roll 60; a step S70 of winding and collecting the peeled film F by rotating the film collection roller 60 by the film collection roller rotating means 70.
As shown in fig. 1 to 6, the film peeling apparatus for a semiconductor using a pair of taping units according to the present invention includes: an upright loading device 10 that rotates the substrate in a state horizontal to the ground so that one of the four corner corners is positioned on the upper side and stands upright in parallel to the direction of gravity; taping units T1, T2, which are a pair, placing upright loading units 10 therebetween and spaced apart in parallel; and a braid unit transfer means 20 for moving the braid units T1, T2 toward both sides of the substrate while facing each other, attaching the braid units to the four corner portions of the film F adhered to both sides of the substrate, and for transferring the braid units T1, T2 away from the substrate to peel the film from the upper four corner portions of the substrate in preparation for peeling. In addition, the method comprises the following steps: a clamper which is positioned at the upper part of the vertical loading device 10 and clamps the corner part of the uppermost four corners of the substrate; and a clamper lifting means coupled to the clamper for lifting the clamper to peel the film from the substrate.
As shown in fig. 1 to 6, the film peeling apparatus for semiconductor using a pair of taping units according to the present invention preferably further includes a notch forming unit 50 for forming notches for assisting film peeling at the four corner portions of the films attached to both sides of the substrate before the taping units T1, T2 are attached to the four corner portions of the film F attached to both sides of the substrate by the taping unit transfer means 20.
As shown in fig. 5a, 5b, and 5c, the notch forming unit 50 may be one selected from the group consisting of a linear motion type napper 51 having a sharp tip end which performs a linear motion to form a notch in the film, a rotary knurling device 53 which forms an uneven surface on an outer peripheral surface and forms a notch in the film by contact rotation, and a non-contact laser 55 which irradiates a notch forming region with a laser to form a notch.
As shown in fig. 4, the vertical type simultaneous thin film peeling apparatus for a double-roll semiconductor according to the present invention includes: a one-side support roller frame 11 disposed so that the support rollers r form a plane in parallel; a second-side support roller frame 12 disposed so that the support rollers r form a plane in parallel, and spaced apart from and disposed in parallel with the first-side support roller frame 11; and a frame rotating means 15 for integrally rotating the one side support roller frame 11 and the other side support roller frame 12.
While the present invention has been described with respect to the preferred embodiments, it is not intended that the scope of the present invention be limited to such embodiments, but rather that the scope of the present invention be defined by the following claims, including various modifications and alterations insofar as they come within the equivalent scope of the present invention.
It should be noted that reference numerals described in the following claims are merely provided to assist understanding of the present invention, and do not affect the explanation of the scope of the claims, and the scope of the claims should not be narrowed by the reference numerals described.
Claims (6)
1. A method for peeling a thin film for a semiconductor, comprising:
a vertical placement step (S10) in which the vertical loading device (10) vertically stands the substrate (S) in a state horizontal to the ground, and places one of line segments connecting the vertices of the substrate (S) in parallel to the direction of gravity;
a taping unit attaching step (S20) in which a taping unit transfer means (20) causes two taping units (T1, T2) with adhesive tapes attached thereto to face each other and approach both surfaces of the substrate (S) and attach to four corner portions of the film (F) attached to both surfaces of the substrate (S);
a preliminary peeling step (S30) in which the taping unit transfer means (20) simultaneously moves the taping units (T1, T2) in opposite directions, and the film (F) is peeled from the upper four corners of the substrate (S) by the taping unit;
a formal peeling step (S40) in which the gripper lifting means (40) lifts the gripper that grips the upper four corner portion of the substrate (S) to peel the thin film (F) from the substrate (S);
before the standing step (S10),
or between the upright placing step (S10) and the braid unit attaching step (S20), a notch forming step (S50) is included,
a notch forming unit (50) forms notches for assisting the peeling of the film (F) at four corner portions of the film (F) attached to both sides of the substrate (S).
2. The method of peeling a film for a semiconductor according to claim 1,
the notch forming unit (50) is included in
A linear-motion napper (51) having a sharp front end which moves linearly to form a notch in the film (F),
A rotary knurling device (53) which forms concave-convex on the outer peripheral surface and forms a notch on the film (F) by means of contact rotation,
A notch forming device is selected from the group consisting of a non-contact laser (55) for forming a notch by irradiating a notch forming area with a laser beam.
3. The method of peeling a film for a semiconductor according to claim 1, further comprising:
a step (S60) in which the taping unit (T1, T2) attaches the peeled film (F) to a film (F) recovery roller (60);
and a step (S70) in which a film (F) recovery roller rotating means (70) rotates the film (F) recovery roller (60) and winds and recovers the peeled film (F).
4. A thin film simultaneous peeling apparatus for a semiconductor, comprising:
a vertical loading device (10) which rotates the substrate (S) in a state of being horizontal to the ground so that one of the four corner corners is positioned on the upper side and vertically stands in parallel to the direction of gravity;
a pair of taping units (T1, T2) placing the upright loading devices (10) therebetween and spaced apart from each other in parallel;
a taping unit transfer means (20) for bringing the taping units (T1, T2) toward both sides of the substrate (S) while facing each other, adhering to four corner corners of the film (F) attached to both sides of the substrate (S), and for transferring the taping units (T1, T2) away from the substrate (S) at the time of preliminary peeling to peel the film (F) from the upper four corner corners of the substrate (S);
a clamper which is positioned at the upper part of the vertical loading device (10) and clamps the uppermost four corner part of the substrate (S);
a gripper lifting means which is coupled to the gripper and lifts the gripper to peel the film (F) from the substrate (S);
further comprising a notch forming unit (50) for forming notches before the taping units (T1, T2) are attached to the four corner portions of the film (F) attached to both sides of the substrate (S) by means of the taping unit transfer means (20),
notches for assisting the peeling of the film (F) are formed at the four corner portions of the film (F) attached to both surfaces of the substrate (S).
5. The simultaneous thin film peeling apparatus for semiconductors as recited in claim 4,
the notch forming unit (50) is included in
A linear-motion napper (51) having a sharp front end which moves linearly to form a notch in the film (F),
A rotary knurling device (53) which forms concave-convex on the outer peripheral surface and forms a notch on the film (F) by means of contact rotation,
A notch forming device is selected from the group consisting of a non-contact laser (55) for forming a notch by irradiating a notch forming area with a laser beam.
6. The simultaneous thin film peeling apparatus for semiconductors as recited in claim 4,
the upright loading device (10) comprises:
a one-side support roller frame (11) which is arranged so that the support rollers (r) form a plane in parallel;
a second support roller frame (12) which is disposed so that the support rollers (r) form a plane in parallel and is spaced apart from and disposed in parallel with the first support roller frame (11);
and a frame rotating means (15) for integrally rotating the one side support roller frame (11) and the other side support roller frame (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410696758.3A CN104392905B (en) | 2014-11-26 | 2014-11-26 | Method and apparatus for peeling film for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410696758.3A CN104392905B (en) | 2014-11-26 | 2014-11-26 | Method and apparatus for peeling film for semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104392905A CN104392905A (en) | 2015-03-04 |
| CN104392905B true CN104392905B (en) | 2020-08-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410696758.3A Expired - Fee Related CN104392905B (en) | 2014-11-26 | 2014-11-26 | Method and apparatus for peeling film for semiconductor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117209823B (en) * | 2023-10-12 | 2024-03-22 | 太湖聚智新材料科技有限公司 | Preparation method of polyimide film |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001287868A (en) * | 2000-04-06 | 2001-10-16 | Toshiba Corp | Sheet peeling device and plate member feeding system using it |
| CN1584548A (en) * | 2004-06-01 | 2005-02-23 | 中国科学院上海光学精密机械研究所 | Device for measuring film adhesion by peeling method |
| US20050161157A1 (en) * | 2004-01-27 | 2005-07-28 | Shinko Electric Industries Co., Ltd. | Substrate treating apparatus and method |
| CN1980847A (en) * | 2004-07-02 | 2007-06-13 | 夏普股份有限公司 | Method and device for peeling off film |
| CN101041282A (en) * | 2006-03-20 | 2007-09-26 | 株式会社阿迪泰克工程 | Film peeling device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3465209B2 (en) * | 1995-10-16 | 2003-11-10 | 日本電気エンジニアリング株式会社 | Peeling method of thin sheet protection sheet |
| JP2000051363A (en) * | 1998-08-12 | 2000-02-22 | Hitachi Cable Ltd | Manufacture for local winding removed ptfe covered tube with locally removed metal fabric and catheter tube |
| JP3163386U (en) * | 2010-07-30 | 2010-10-14 | 株式会社ケイピイエス | Film peeling device |
| JP5612957B2 (en) * | 2010-08-05 | 2014-10-22 | 矢崎総業株式会社 | Wire stripping blade structure |
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2014
- 2014-11-26 CN CN201410696758.3A patent/CN104392905B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001287868A (en) * | 2000-04-06 | 2001-10-16 | Toshiba Corp | Sheet peeling device and plate member feeding system using it |
| US20050161157A1 (en) * | 2004-01-27 | 2005-07-28 | Shinko Electric Industries Co., Ltd. | Substrate treating apparatus and method |
| CN1584548A (en) * | 2004-06-01 | 2005-02-23 | 中国科学院上海光学精密机械研究所 | Device for measuring film adhesion by peeling method |
| CN1980847A (en) * | 2004-07-02 | 2007-06-13 | 夏普股份有限公司 | Method and device for peeling off film |
| CN101041282A (en) * | 2006-03-20 | 2007-09-26 | 株式会社阿迪泰克工程 | Film peeling device |
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| CN104392905A (en) | 2015-03-04 |
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