CN104387642B - 一种微流控芯片模具 - Google Patents
一种微流控芯片模具 Download PDFInfo
- Publication number
- CN104387642B CN104387642B CN201410496901.4A CN201410496901A CN104387642B CN 104387642 B CN104387642 B CN 104387642B CN 201410496901 A CN201410496901 A CN 201410496901A CN 104387642 B CN104387642 B CN 104387642B
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- China
- Prior art keywords
- parts
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- fluidic chip
- chip die
- powder
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- 239000000843 powder Substances 0.000 claims abstract description 12
- 229920000642 polymer Polymers 0.000 claims abstract description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000004411 aluminium Substances 0.000 claims abstract description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 9
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims abstract description 6
- 235000017491 Bambusa tulda Nutrition 0.000 claims abstract description 6
- 241001330002 Bambuseae Species 0.000 claims abstract description 6
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims abstract description 6
- 239000011425 bamboo Substances 0.000 claims abstract description 6
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 claims abstract description 6
- 239000003610 charcoal Substances 0.000 claims abstract description 6
- 239000000945 filler Substances 0.000 claims abstract description 6
- 239000002994 raw material Substances 0.000 claims abstract description 6
- 239000004014 plasticizer Substances 0.000 claims abstract description 5
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical group OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 10
- -1 2-ethyl hexyl Chemical group 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 150000002148 esters Chemical class 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000005062 Polybutadiene Substances 0.000 claims description 3
- 239000004793 Polystyrene Substances 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims description 3
- 229910052593 corundum Inorganic materials 0.000 claims description 3
- 239000010431 corundum Substances 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 229920002857 polybutadiene Polymers 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 239000012209 synthetic fiber Substances 0.000 claims description 2
- 229920002994 synthetic fiber Polymers 0.000 claims description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 1
- 239000005977 Ethylene Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000003672 processing method Methods 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0812—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0856—Iron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
- C08K2003/3045—Sulfates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410496901.4A CN104387642B (zh) | 2014-09-25 | 2014-09-25 | 一种微流控芯片模具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410496901.4A CN104387642B (zh) | 2014-09-25 | 2014-09-25 | 一种微流控芯片模具 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104387642A CN104387642A (zh) | 2015-03-04 |
CN104387642B true CN104387642B (zh) | 2016-12-28 |
Family
ID=52605609
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410496901.4A Active CN104387642B (zh) | 2014-09-25 | 2014-09-25 | 一种微流控芯片模具 |
Country Status (1)
Country | Link |
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CN (1) | CN104387642B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105150460A (zh) * | 2015-09-22 | 2015-12-16 | 芜湖奕辰模具科技有限公司 | 一种直通注塑模具 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1056393A (zh) * | 1990-05-08 | 1991-11-20 | 广州市华远电热电器厂 | 具有挠性及恒温特性的复合型导电高分子电发热体 |
EP1167457A2 (en) * | 2000-06-23 | 2002-01-02 | Shin-Etsu Chemical Co., Ltd. | Heat conductive silicone composition and semiconductor device |
CN101381592A (zh) * | 2008-10-16 | 2009-03-11 | 广东恒大新材料科技有限公司 | 一种具有电磁屏蔽功能的密封剂组合物 |
CN101805469A (zh) * | 2010-04-08 | 2010-08-18 | 中国铁道科学研究院金属及化学研究所 | 耐磨材料、制动用合成闸片及其制备方法 |
CN101835365A (zh) * | 2002-10-21 | 2010-09-15 | 莱尔德技术公司 | 导热的电磁干扰屏蔽 |
CN102604219A (zh) * | 2012-03-12 | 2012-07-25 | 东莞市兆科电子材料科技有限公司 | 高导热无机物热塑化组合物的制备方法及由该方法制造的散热部件 |
JP5126175B2 (ja) * | 2009-07-27 | 2013-01-23 | 住友ベークライト株式会社 | 金属含有ペーストおよび半導体装置 |
-
2014
- 2014-09-25 CN CN201410496901.4A patent/CN104387642B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1056393A (zh) * | 1990-05-08 | 1991-11-20 | 广州市华远电热电器厂 | 具有挠性及恒温特性的复合型导电高分子电发热体 |
EP1167457A2 (en) * | 2000-06-23 | 2002-01-02 | Shin-Etsu Chemical Co., Ltd. | Heat conductive silicone composition and semiconductor device |
CN101835365A (zh) * | 2002-10-21 | 2010-09-15 | 莱尔德技术公司 | 导热的电磁干扰屏蔽 |
CN101381592A (zh) * | 2008-10-16 | 2009-03-11 | 广东恒大新材料科技有限公司 | 一种具有电磁屏蔽功能的密封剂组合物 |
JP5126175B2 (ja) * | 2009-07-27 | 2013-01-23 | 住友ベークライト株式会社 | 金属含有ペーストおよび半導体装置 |
CN101805469A (zh) * | 2010-04-08 | 2010-08-18 | 中国铁道科学研究院金属及化学研究所 | 耐磨材料、制动用合成闸片及其制备方法 |
CN102604219A (zh) * | 2012-03-12 | 2012-07-25 | 东莞市兆科电子材料科技有限公司 | 高导热无机物热塑化组合物的制备方法及由该方法制造的散热部件 |
Also Published As
Publication number | Publication date |
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CN104387642A (zh) | 2015-03-04 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
CB03 | Change of inventor or designer information |
Inventor after: Li Zhun Inventor before: The inventor has waived the right to be mentioned |
|
COR | Change of bibliographic data | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20160919 Address after: 266199 No. 217, middle Chongqing Road, Licang District, Shandong, Qingdao, 103 Applicant after: Li Zhun Address before: 215335 129 North Road, Kunshan Development Zone, Suzhou, Jiangsu Applicant before: KUNSHAN BOJIAN PRECISION MOULD CO., LTD. |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191011 Address after: 314500, building 288, 2 Avenue, Indus street, Tongxiang, Zhejiang, Jiaxing Patentee after: Zhejiang harvest Network Technology Co., Ltd. Address before: 266199 No. 217, middle Chongqing Road, Licang District, Shandong, Qingdao, 103 Patentee before: Li Zhun |
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TR01 | Transfer of patent right |
Effective date of registration: 20191101 Address after: 314500 No. xd701-6, No. 1, Gongnong Road, Nanmen, Chongfu Town, Tongxiang City, Jiaxing City, Zhejiang Province Patentee after: Jiaxing Cauline Electronic Commerce Co., Ltd. Address before: 314500, building 288, 2 Avenue, Indus street, Tongxiang, Zhejiang, Jiaxing Patentee before: Zhejiang harvest Network Technology Co., Ltd. |
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Effective date of registration: 20201111 Address after: 710000 no.0001 Xidian stone maker space, 10th floor, Haigui building, No.18, Gaoxin 1st Road, hi tech Zone, Xi'an City, Shaanxi Province Patentee after: Xi'an Yian Renxin Biotechnology Co., Ltd Address before: 314500 No. xd701-6, No. 1, Gongnong Road, Nanmen, Chongfu Town, Tongxiang City, Jiaxing City, Zhejiang Province Patentee before: JIAXING LONGLIE ELECTRONIC COMMERCE Co.,Ltd. |
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