CN104384070A - Automatic glue filling method - Google Patents
Automatic glue filling method Download PDFInfo
- Publication number
- CN104384070A CN104384070A CN201410745804.4A CN201410745804A CN104384070A CN 104384070 A CN104384070 A CN 104384070A CN 201410745804 A CN201410745804 A CN 201410745804A CN 104384070 A CN104384070 A CN 104384070A
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- CN
- China
- Prior art keywords
- film capacitor
- glue
- thin film
- workbench
- encapsulating
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention provides an automatic glue filling method. In the process of filling a film capacitor with glue, the film capacitor is controlled to vibrate by a vibration device; when the glue filling amount in a chamber of the film capacitor reaches the preset amount, the film capacitor stops vibration, and the glue is continuously poured into the film capacitor until the chamber of the film capacitor is filled with a glue solution. According to the automatic glue filling method, by the arrangement of the vibration device, the glue is filled while the vibration is carried out, so that the fluidity of the glue solution is improved greatly, no bubble exists in the glue solution, and the product quality is improved; the filling times are reduced, and the filling efficiency is improved greatly.
Description
Technical field
The present invention relates to capacitor packages technical field, particularly a kind of with vacuum glue pouring machine with the use of automatic glue filling method.
Background technology
Glue pouring machine is also known as AB glue glue pouring machine, specially fluid is controlled, and by liquid dropping, covering, embedding in the automatic machinery of product surface or interiors of products, make it reach the equipment of the effects such as sealing, fixing, waterproof, general use mostly be two component liquid.Glue pouring machine is mainly used in bonding, the perfusion of glue, oil and other liquid in Product Process, coating, sealing, filling, and automation glue pouring machine can realize the encapsulating of the irregular figures such as point, line, arc, circle.Vacuum glue pouring machine is the improvement carried out on the basis of common glue pouring machine, specifically in the pipeline pump housing, air is taken out light, and then prevents from bubbling, and main application industry has automobile making, capacitor shield coil encapsulating, motor coil encapsulating etc.
In capacitor packages technical field, when encapsulating is carried out to capacitor packages, because existing glue pouring machine is when encapsulating, there is bubble in glue, cause some position in a glue process not fill with gluing, affect the quality of product, the bad ratio defective product of glue pouring machine is improved; The core bag of capacitor packages is the bigger the better, but the time of encapsulating can be caused long simultaneously, so must be filling several times in prior art, if disposable perfusion, be easy to cause glue to spray, have a strong impact on product quality; The time of encapsulating is longer, and encapsulating efficiency is very low, has had a strong impact on production efficiency and product quality.
Summary of the invention
Provide hereinafter about brief overview of the present invention, to provide about the basic comprehension in some of the present invention.Should be appreciated that this general introduction is not summarize about exhaustive of the present invention.It is not that intention determines key of the present invention or pith, and nor is it intended to limit the scope of the present invention.Its object is only provide some concept in simplified form, in this, as the preorder in greater detail discussed after a while.
The object of this invention is to provide a kind of automatic glue filling method.
The invention provides a kind of automatic glue filling method, thin film capacitor is being carried out in the process of encapsulating, control thin film capacitor by vibrating device to vibrate, after encapsulating amount in the chamber of thin film capacitor reaches scheduled volume, stop vibration film capacitor, and continue to carry out encapsulating to thin film capacitor, fill glue in the chamber of thin film capacitor till.
Compared with prior art, the present invention has following beneficial effect:
1, glue-pouring method of the present invention can make glue have good mobility in thin film capacitor inside, glue is accelerated greatly in the flowing velocity of core bag, suitable vibration frequency and amplitude can make glue fully fill, and overcome the technical barrier that there is space in thin-film capacitor product;
2, glue-pouring method of the present invention can be only filling with 1-2 time, just can complete glue perfusion, solve the technical problem needing in traditional glue-pouring method repeatedly to pour into, substantially reduce the production time of product, can also ensure the quality of product while raising the efficiency;
3, glue-pouring method of the present invention can realize the seamless seal of thin film capacitor inside, interiors of products does not have space, there is not bubble and air, to avoid in traditional glue-pouring method residual air and moisture to the impact of capacitor packages, effectively can prevent the oxidation of core bag, the heat conductivility of capacitor packages is relatively good, and insulating properties are relatively good.
Accompanying drawing explanation
Below with reference to the accompanying drawings illustrate embodiments of the invention, above and other objects, features and advantages of the present invention can be understood more easily.Parts in accompanying drawing are just in order to illustrate principle of the present invention.In the accompanying drawings, same or similar technical characteristic or parts will adopt same or similar Reference numeral to represent.
The structural representation of the horizontal table of the automatic glue filling machine that Fig. 1 provides for the embodiment of the present invention;
The structural representation of the pallet of the automatic glue filling machine that Fig. 2 provides for the embodiment of the present invention;
The structural representation of the automatic glue filling platform of the automatic glue filling machine that Fig. 3 provides for the embodiment of the present invention.
Description of reference numerals:
10-horizontal table 11-first workbench 12-second workbench
13-vibrating device 20-pallet 30-locating slot
31-draw-in groove 40-horizontal shifting platform
Detailed description of the invention
With reference to the accompanying drawings embodiments of the invention are described.The element described in an accompanying drawing of the present invention or a kind of embodiment and feature can combine with the element shown in one or more other accompanying drawing or embodiment and feature.It should be noted that for purposes of clarity, accompanying drawing and eliminate expression and the description of unrelated to the invention, parts known to persons of ordinary skill in the art and process in illustrating.
The invention provides a kind of automatic glue filling method, thin film capacitor is being carried out in the process of encapsulating, control thin film capacitor by vibrating device to vibrate, after encapsulating amount in the chamber of thin film capacitor reaches scheduled volume, stop vibration film capacitor, and continue to carry out encapsulating to thin film capacitor, fill glue in the chamber of thin film capacitor till.
Preferably, scheduled volume is between the 2/3-3/4 of the volume of thin film capacitor chamber.When glue pouring machine and vibrating device 13 work together, when in thin film capacitor chamber, the groundwater increment of glue reaches scheduled volume, vibrating device 13 quits work.Scheduled volume is between the 2/3-3/4 of the volume of thin film capacitor chamber, the setting value of scheduled volume is when vibrating device 13 works by the upper limit being filled into the encapsulating value in thin film capacitor chamber that glue is steadily smooth, ensures that not having glue in encapsulating process sputters.Scheduled volume is too low, then vibrating device 13 can not reach maximized use; Scheduled volume is too high, can cause the splashing of glue, affect encapsulating quality when vibrating device 13 works.
Preferably, the amplitude of vibrating device 13 is 0.3mm ± 0.1mm.If the amplitude of vibrating device 13 is too small, then do not reach the effect accelerating glue flowing; If the amplitude of vibrating device 13 is excessive, then can cause the splashing of glue at vibration processes, the too small or excessive quality that all can affect encapsulating of amplitude.
Preferably, thin film capacitor is arranged in pallet, pallet is arranged on horizontal table, horizontal table comprises in horizontally disposed first workbench and the second workbench up and down, leave gap between first workbench and the second workbench, in gap, be provided with the vibrating device coordinated with the first workbench and the second workbench respectively.
Preferably, vibrating device 13 can be vibrating air cylinder, and the amplitude of vibrating air cylinder is 0.3mm ± 0.1mm, vibration frequency is 50 ~ 500Hz, meets vibration requirement.
The structural representation of the horizontal table of automatic glue filling machine as shown in Figure 1, automatic glue filling machine, comprise automatic glue filling platform, automatic glue filling platform comprises horizontal table and 10 and is positioned at pallet 20 above horizontal table 10, horizontal table 10 comprises in horizontally disposed first workbench 11 and the second workbench 12 up and down, leave gap between described first workbench 11 and described second workbench 12, in gap, be provided with the vibrating device 13 coordinated with described first workbench 11 and the second workbench 12 respectively.。
Automatic glue filling platform also comprises horizontal shifting platform 40, and horizontal table 10 is arranged on horizontal shifting platform 40.By the movement of horizontal shifting platform 40, drive the movement of horizontal table 10.In encapsulating process, by the movement of horizontal table 10, keep the relative position inconvenience of thin film capacitor and the horizontal table 10 be placed on it, thus the problem that the drippage accuracy of the glue avoiding horizontal table 10 encapsulating mode that is fixing, Tu Jiaokou movement to bring is inaccurate, avoid the generation of bad encapsulating part.
The structural representation of the pallet of automatic glue filling machine as shown in Figure 2, the bottom of pallet 20 is provided with draw-in groove 31, first workbench 11 is provided with locating slot 31, draw-in groove 31 matches with locating slot 30, be used for positioning pallet 20,20 positions of restriction pallet, prevent pallet 20 in encapsulating process from producing skew, thus avoid impacting the encapsulating quality of thin film capacitor.
The structural representation of the automatic glue filling platform of automatic glue filling machine as shown in Figure 3, between the gap of vibrating device 13 between the first workbench 11 and the second workbench 12, form horizontal table 10, pallet 20 is positioned at above horizontal table 10.The below of horizontal table 10 arranges horizontal shifting platform 40, drives horizontal table 10 and pallet 20 together to move by horizontal shifting platform 40.Automatic glue filling platform comprises horizontal table 10, pallet 20, horizontal shifting platform 40, carries out encapsulating to the thin film capacitor on pallet 20.
In the process to thin film capacitor encapsulating, glue is stored by batch can, thering is provided of glue is carried out by charging pump part, A, B two is carried out feed after component glue proportioning, then by A, B two component glue deliver to vacuum chamber part, A, B two component glue by the mixing rod in vacuum chamber, by mixing rod to A, B two component glue fully mix, then deliver to Tu Jiaokou, encapsulating is carried out to the coil of thin film capacitor.Carry out in the process of encapsulating, by on thin film capacitor placement tray, pallet 20 is delivered on the first workbench 11, open vibrating device, control thin film capacitor by vibrating device 13 and vibrate, after the encapsulating amount in the chamber of thin film capacitor reaches scheduled volume, stop vibration film capacitor, and continue to carry out encapsulating to thin film capacitor, fill glue in the chamber of thin film capacitor till, scheduled volume is between the 2/3-3/4 of the volume of thin film capacitor chamber.Vibrate while encapsulating, the mobility of glue can be accelerated, make to there is not space in glue; Stop vibration continuing encapsulating, be spilling, the splashing of avoiding vibrating the glue caused, prevent from affecting encapsulating effect.
In sum, glue-pouring method of the present invention can make glue have good mobility in thin film capacitor inside, glue is accelerated greatly in the flowing velocity of core bag, suitable vibration frequency and amplitude can make glue fully fill, and overcome the technical barrier that there is space in thin-film capacitor product; Glue-pouring method of the present invention can be only filling with 1-2 time, just can complete glue perfusion, solve the technical problem needing in traditional glue-pouring method repeatedly to pour into, substantially reduce the production time of product, can also ensure the quality of product while raising the efficiency; Glue-pouring method of the present invention can realize the seamless seal of thin film capacitor inside, interiors of products does not have space, there is not bubble and air, to avoid in traditional glue-pouring method residual air and moisture to the impact of capacitor packages, effectively can prevent the oxidation of core bag, the heat conductivility of capacitor packages is relatively good, and insulating properties are relatively good.
Last it is noted that above embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to previous embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (6)
1. an automatic glue filling method, it is characterized in that, thin film capacitor is being carried out in the process of encapsulating, control described thin film capacitor by vibrating device to vibrate, after encapsulating amount in the chamber of described thin film capacitor reaches scheduled volume, stop the described thin film capacitor of vibration, and continue to carry out encapsulating to described thin film capacitor, fill glue in the chamber of described thin film capacitor till.
2. automatic glue filling method according to claim 1, is characterized in that, described scheduled volume is between the 2/3-3/4 of the volume of described thin film capacitor chamber.
3. automatic glue filling method according to claim 1, is characterized in that, the vibration frequency of described vibrating device is 50Hz ~ 500Hz.
4. automatic glue filling method according to claim 1, is characterized in that, the amplitude of described vibrating device is 0.3mm ± 0.1mm.
5. the automatic glue filling method according to Claims 1-4 any one, it is characterized in that, described thin film capacitor is arranged in pallet, described pallet is arranged on horizontal table, described horizontal table comprises in horizontally disposed first workbench and the second workbench up and down, leave gap between described first workbench and described second workbench, in described gap, be provided with the described vibrating device coordinated with described first workbench and the second workbench respectively.
6. the automatic glue filling method according to Claims 1-4 any one, is characterized in that, described vibrating device is vibrating air cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410745804.4A CN104384070A (en) | 2014-12-08 | 2014-12-08 | Automatic glue filling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410745804.4A CN104384070A (en) | 2014-12-08 | 2014-12-08 | Automatic glue filling method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104384070A true CN104384070A (en) | 2015-03-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410745804.4A Pending CN104384070A (en) | 2014-12-08 | 2014-12-08 | Automatic glue filling method |
Country Status (1)
| Country | Link |
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| CN (1) | CN104384070A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108565134A (en) * | 2018-04-05 | 2018-09-21 | 广东职业技术学院 | A kind of flat machine of capacitance embedding shake |
| CN108787321A (en) * | 2018-06-04 | 2018-11-13 | 苏州聿知新机械科技有限公司 | A kind of the segmented adhesive injection device and its working method of automatic governing glue |
| CN108806883A (en) * | 2018-06-04 | 2018-11-13 | 苏州聿知新机械科技有限公司 | A kind of the layering process for filling colloid and its adhesive injection device of automotive wire bundle connector |
| CN108832442A (en) * | 2018-06-04 | 2018-11-16 | 苏州聿知新机械科技有限公司 | A kind of oscillatory type automatic glue filling device and its working method |
| CN108816643A (en) * | 2018-06-04 | 2018-11-16 | 苏州聿知新机械科技有限公司 | A kind of the segmented automatic glue-pouring equipment and its working method of automotive wire bundle |
| CN108988100A (en) * | 2018-06-04 | 2018-12-11 | 苏州聿知新机械科技有限公司 | A kind of segmentation adhesive injection device and its working method |
| CN113053672A (en) * | 2021-03-23 | 2021-06-29 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | Fixing and sealing method of combined non-solid tantalum capacitor for spacecraft |
| CN115394573A (en) * | 2022-08-25 | 2022-11-25 | 成都宏明电子股份有限公司 | Perfusion method and perfusion tool for high-power high-energy-storage-density capacitor |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61271053A (en) * | 1985-05-27 | 1986-12-01 | Canon Inc | Film forming device |
| US4633804A (en) * | 1984-03-06 | 1987-01-06 | Fujitsu Limited | Spinner and method for processing a substrate |
| JP2006198508A (en) * | 2005-01-20 | 2006-08-03 | Seiko Epson Corp | Liquid droplet ejection apparatus, work excitation method in liquid droplet ejection apparatus, production method for electro-optical apparatus, electro-optical apparatus and electronic equipment |
| CN202105599U (en) * | 2011-05-30 | 2012-01-11 | 常州市美纤膜技术有限公司 | Ultrafiltration membrane vibration glue pouring device |
| CN202570547U (en) * | 2012-04-09 | 2012-12-05 | 湖州倍格曼新材料有限公司 | Automatic adhesive injection platform |
-
2014
- 2014-12-08 CN CN201410745804.4A patent/CN104384070A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4633804A (en) * | 1984-03-06 | 1987-01-06 | Fujitsu Limited | Spinner and method for processing a substrate |
| JPS61271053A (en) * | 1985-05-27 | 1986-12-01 | Canon Inc | Film forming device |
| JP2006198508A (en) * | 2005-01-20 | 2006-08-03 | Seiko Epson Corp | Liquid droplet ejection apparatus, work excitation method in liquid droplet ejection apparatus, production method for electro-optical apparatus, electro-optical apparatus and electronic equipment |
| CN202105599U (en) * | 2011-05-30 | 2012-01-11 | 常州市美纤膜技术有限公司 | Ultrafiltration membrane vibration glue pouring device |
| CN202570547U (en) * | 2012-04-09 | 2012-12-05 | 湖州倍格曼新材料有限公司 | Automatic adhesive injection platform |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108565134A (en) * | 2018-04-05 | 2018-09-21 | 广东职业技术学院 | A kind of flat machine of capacitance embedding shake |
| CN108787321A (en) * | 2018-06-04 | 2018-11-13 | 苏州聿知新机械科技有限公司 | A kind of the segmented adhesive injection device and its working method of automatic governing glue |
| CN108806883A (en) * | 2018-06-04 | 2018-11-13 | 苏州聿知新机械科技有限公司 | A kind of the layering process for filling colloid and its adhesive injection device of automotive wire bundle connector |
| CN108832442A (en) * | 2018-06-04 | 2018-11-16 | 苏州聿知新机械科技有限公司 | A kind of oscillatory type automatic glue filling device and its working method |
| CN108816643A (en) * | 2018-06-04 | 2018-11-16 | 苏州聿知新机械科技有限公司 | A kind of the segmented automatic glue-pouring equipment and its working method of automotive wire bundle |
| CN108988100A (en) * | 2018-06-04 | 2018-12-11 | 苏州聿知新机械科技有限公司 | A kind of segmentation adhesive injection device and its working method |
| CN113053672A (en) * | 2021-03-23 | 2021-06-29 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | Fixing and sealing method of combined non-solid tantalum capacitor for spacecraft |
| CN115394573A (en) * | 2022-08-25 | 2022-11-25 | 成都宏明电子股份有限公司 | Perfusion method and perfusion tool for high-power high-energy-storage-density capacitor |
| CN115394573B (en) * | 2022-08-25 | 2023-09-15 | 成都宏明电子股份有限公司 | Filling method and filling tool for high-power high-energy-storage-density capacitor |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: NANTONG JIANGHAI CAPACITOR CO., LTD. Effective date: 20150528 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20150528 Address after: Tongzhou District Pingchao town in Jiangsu province 226361 Nantong Tongyang Road No. 79 Applicant after: Nantong Xinjianghai Power Electronics Co.,Ltd. Applicant after: Nantong Jianghai Capacitor Co., Ltd. Address before: Tongzhou District Pingchao town in Jiangsu province 226361 Nantong Tongyang Road No. 79 Applicant before: Nantong Xinjianghai Power Electronics Co.,Ltd. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150304 |