Background technology
Glue pouring machine is also known as AB glue glue pouring machine, specially fluid is controlled, and by liquid dropping, covering, embedding in the automatic machinery of product surface or interiors of products, make it reach the equipment of the effects such as sealing, fixing, waterproof, general use mostly be two component liquid.Glue pouring machine is mainly used in bonding, the perfusion of glue, oil and other liquid in Product Process, coating, sealing, filling, and automation glue pouring machine can realize the encapsulating of the irregular figures such as point, line, arc, circle.Vacuum glue pouring machine is the improvement carried out on the basis of common glue pouring machine, specifically in the pipeline pump housing, air is taken out light, and then prevents from bubbling, and main application industry has automobile making, capacitor shield coil encapsulating, motor coil encapsulating etc.
In capacitor packages technical field, when encapsulating is carried out to capacitor packages, because existing glue pouring machine is when encapsulating, there is bubble in glue, cause some position in a glue process not fill with gluing, affect the quality of product, the bad ratio defective product of glue pouring machine is improved; The core bag of capacitor packages is the bigger the better, but the time of encapsulating can be caused long simultaneously, so must be filling several times in prior art, if disposable perfusion, be easy to cause glue to spray, have a strong impact on product quality; The time of encapsulating is longer, and encapsulating efficiency is very low, has had a strong impact on production efficiency and product quality.
Summary of the invention
Provide hereinafter about brief overview of the present invention, to provide about the basic comprehension in some of the present invention.Should be appreciated that this general introduction is not summarize about exhaustive of the present invention.It is not that intention determines key of the present invention or pith, and nor is it intended to limit the scope of the present invention.Its object is only provide some concept in simplified form, in this, as the preorder in greater detail discussed after a while.
The object of this invention is to provide a kind of automatic glue filling method.
The invention provides a kind of automatic glue filling method, thin film capacitor is being carried out in the process of encapsulating, control thin film capacitor by vibrating device to vibrate, after encapsulating amount in the chamber of thin film capacitor reaches scheduled volume, stop vibration film capacitor, and continue to carry out encapsulating to thin film capacitor, fill glue in the chamber of thin film capacitor till.
Compared with prior art, the present invention has following beneficial effect:
1, glue-pouring method of the present invention can make glue have good mobility in thin film capacitor inside, glue is accelerated greatly in the flowing velocity of core bag, suitable vibration frequency and amplitude can make glue fully fill, and overcome the technical barrier that there is space in thin-film capacitor product;
2, glue-pouring method of the present invention can be only filling with 1-2 time, just can complete glue perfusion, solve the technical problem needing in traditional glue-pouring method repeatedly to pour into, substantially reduce the production time of product, can also ensure the quality of product while raising the efficiency;
3, glue-pouring method of the present invention can realize the seamless seal of thin film capacitor inside, interiors of products does not have space, there is not bubble and air, to avoid in traditional glue-pouring method residual air and moisture to the impact of capacitor packages, effectively can prevent the oxidation of core bag, the heat conductivility of capacitor packages is relatively good, and insulating properties are relatively good.
Detailed description of the invention
With reference to the accompanying drawings embodiments of the invention are described.The element described in an accompanying drawing of the present invention or a kind of embodiment and feature can combine with the element shown in one or more other accompanying drawing or embodiment and feature.It should be noted that for purposes of clarity, accompanying drawing and eliminate expression and the description of unrelated to the invention, parts known to persons of ordinary skill in the art and process in illustrating.
The invention provides a kind of automatic glue filling method, thin film capacitor is being carried out in the process of encapsulating, control thin film capacitor by vibrating device to vibrate, after encapsulating amount in the chamber of thin film capacitor reaches scheduled volume, stop vibration film capacitor, and continue to carry out encapsulating to thin film capacitor, fill glue in the chamber of thin film capacitor till.
Preferably, scheduled volume is between the 2/3-3/4 of the volume of thin film capacitor chamber.When glue pouring machine and vibrating device 13 work together, when in thin film capacitor chamber, the groundwater increment of glue reaches scheduled volume, vibrating device 13 quits work.Scheduled volume is between the 2/3-3/4 of the volume of thin film capacitor chamber, the setting value of scheduled volume is when vibrating device 13 works by the upper limit being filled into the encapsulating value in thin film capacitor chamber that glue is steadily smooth, ensures that not having glue in encapsulating process sputters.Scheduled volume is too low, then vibrating device 13 can not reach maximized use; Scheduled volume is too high, can cause the splashing of glue, affect encapsulating quality when vibrating device 13 works.
Preferably, the amplitude of vibrating device 13 is 0.3mm ± 0.1mm.If the amplitude of vibrating device 13 is too small, then do not reach the effect accelerating glue flowing; If the amplitude of vibrating device 13 is excessive, then can cause the splashing of glue at vibration processes, the too small or excessive quality that all can affect encapsulating of amplitude.
Preferably, thin film capacitor is arranged in pallet, pallet is arranged on horizontal table, horizontal table comprises in horizontally disposed first workbench and the second workbench up and down, leave gap between first workbench and the second workbench, in gap, be provided with the vibrating device coordinated with the first workbench and the second workbench respectively.
Preferably, vibrating device 13 can be vibrating air cylinder, and the amplitude of vibrating air cylinder is 0.3mm ± 0.1mm, vibration frequency is 50 ~ 500Hz, meets vibration requirement.
The structural representation of the horizontal table of automatic glue filling machine as shown in Figure 1, automatic glue filling machine, comprise automatic glue filling platform, automatic glue filling platform comprises horizontal table and 10 and is positioned at pallet 20 above horizontal table 10, horizontal table 10 comprises in horizontally disposed first workbench 11 and the second workbench 12 up and down, leave gap between described first workbench 11 and described second workbench 12, in gap, be provided with the vibrating device 13 coordinated with described first workbench 11 and the second workbench 12 respectively.。
Automatic glue filling platform also comprises horizontal shifting platform 40, and horizontal table 10 is arranged on horizontal shifting platform 40.By the movement of horizontal shifting platform 40, drive the movement of horizontal table 10.In encapsulating process, by the movement of horizontal table 10, keep the relative position inconvenience of thin film capacitor and the horizontal table 10 be placed on it, thus the problem that the drippage accuracy of the glue avoiding horizontal table 10 encapsulating mode that is fixing, Tu Jiaokou movement to bring is inaccurate, avoid the generation of bad encapsulating part.
The structural representation of the pallet of automatic glue filling machine as shown in Figure 2, the bottom of pallet 20 is provided with draw-in groove 31, first workbench 11 is provided with locating slot 31, draw-in groove 31 matches with locating slot 30, be used for positioning pallet 20,20 positions of restriction pallet, prevent pallet 20 in encapsulating process from producing skew, thus avoid impacting the encapsulating quality of thin film capacitor.
The structural representation of the automatic glue filling platform of automatic glue filling machine as shown in Figure 3, between the gap of vibrating device 13 between the first workbench 11 and the second workbench 12, form horizontal table 10, pallet 20 is positioned at above horizontal table 10.The below of horizontal table 10 arranges horizontal shifting platform 40, drives horizontal table 10 and pallet 20 together to move by horizontal shifting platform 40.Automatic glue filling platform comprises horizontal table 10, pallet 20, horizontal shifting platform 40, carries out encapsulating to the thin film capacitor on pallet 20.
In the process to thin film capacitor encapsulating, glue is stored by batch can, thering is provided of glue is carried out by charging pump part, A, B two is carried out feed after component glue proportioning, then by A, B two component glue deliver to vacuum chamber part, A, B two component glue by the mixing rod in vacuum chamber, by mixing rod to A, B two component glue fully mix, then deliver to Tu Jiaokou, encapsulating is carried out to the coil of thin film capacitor.Carry out in the process of encapsulating, by on thin film capacitor placement tray, pallet 20 is delivered on the first workbench 11, open vibrating device, control thin film capacitor by vibrating device 13 and vibrate, after the encapsulating amount in the chamber of thin film capacitor reaches scheduled volume, stop vibration film capacitor, and continue to carry out encapsulating to thin film capacitor, fill glue in the chamber of thin film capacitor till, scheduled volume is between the 2/3-3/4 of the volume of thin film capacitor chamber.Vibrate while encapsulating, the mobility of glue can be accelerated, make to there is not space in glue; Stop vibration continuing encapsulating, be spilling, the splashing of avoiding vibrating the glue caused, prevent from affecting encapsulating effect.
In sum, glue-pouring method of the present invention can make glue have good mobility in thin film capacitor inside, glue is accelerated greatly in the flowing velocity of core bag, suitable vibration frequency and amplitude can make glue fully fill, and overcome the technical barrier that there is space in thin-film capacitor product; Glue-pouring method of the present invention can be only filling with 1-2 time, just can complete glue perfusion, solve the technical problem needing in traditional glue-pouring method repeatedly to pour into, substantially reduce the production time of product, can also ensure the quality of product while raising the efficiency; Glue-pouring method of the present invention can realize the seamless seal of thin film capacitor inside, interiors of products does not have space, there is not bubble and air, to avoid in traditional glue-pouring method residual air and moisture to the impact of capacitor packages, effectively can prevent the oxidation of core bag, the heat conductivility of capacitor packages is relatively good, and insulating properties are relatively good.
Last it is noted that above embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to previous embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.