CN104377528B - Conducting slip ring assembly assembly method - Google Patents
Conducting slip ring assembly assembly method Download PDFInfo
- Publication number
- CN104377528B CN104377528B CN201410602145.9A CN201410602145A CN104377528B CN 104377528 B CN104377528 B CN 104377528B CN 201410602145 A CN201410602145 A CN 201410602145A CN 104377528 B CN104377528 B CN 104377528B
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- Prior art keywords
- slip ring
- assembly
- pilot pin
- conducting slip
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000009413 insulation Methods 0.000 claims abstract description 35
- 239000004593 Epoxy Substances 0.000 claims abstract description 17
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 17
- 239000000853 adhesive Substances 0.000 claims abstract description 9
- 230000001070 adhesive Effects 0.000 claims abstract description 9
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 4
- 238000005755 formation reaction Methods 0.000 claims abstract description 4
- 238000003754 machining Methods 0.000 claims abstract description 4
- 239000000565 sealant Substances 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims description 28
- 238000003466 welding Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 229920002379 silicone rubber Polymers 0.000 claims description 7
- 239000004945 silicone rubber Substances 0.000 claims description 7
- 238000000605 extraction Methods 0.000 claims description 6
- 230000000875 corresponding Effects 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 4
- 239000004972 Polyurethane varnish Substances 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920001971 elastomer Polymers 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 4
- 238000004140 cleaning Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000005266 casting Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 210000003491 Skin Anatomy 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 235000010585 Ammi visnaga Nutrition 0.000 description 1
- 240000005093 Ammi visnaga Species 0.000 description 1
- 210000001624 Hip Anatomy 0.000 description 1
- 229950000845 Politef Drugs 0.000 description 1
- 238000001467 acupuncture Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000002493 climbing Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000000051 modifying Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
Abstract
A kind of conducting slip ring assembly assembly method, including: step 1, insulating epoxy bonded adhesives is spread upon pilot pin surface, afterwards to pilot pin machining, forms pilot pin assembly；Step 2, welds formation slip ring assembly by conducting slip ring sheet with drawing wire；Step 3, installs insulation spacer and the slip ring assembly of many group alternate intervals arrangements on pilot pin assembly；Step 4, press-fits big axle journal on pilot pin assembly, forms conducting slip ring and assembles blank；Step 5, assembles conducting slip ring blank and carries out priming by vacuum epoxy pouring sealant, form conducting slip ring assembly.The present invention by being irrigated two component insulating epoxy bonded adhesives to reach the insulation effect between axle and slip ring sheet to pilot pin, and size is little, compact conformation.
Description
Technical field
The present invention relates to inertial instrument assembly field, be related specifically to a kind of, compact conformation little for size
The assembly method of conducting slip ring assembly.
Background technology
Gyroaccelerometer outer shroud power transmitting device in inertia type instrument can realize the power of gyropendulum and outer shroud
Transmit with signal.Power transmitting device is made up of conducting slip ring assembly, brush assembly of electric and support three part.Its
In, the quality of conducting slip ring assembly assembling quality directly influences the quality of power transmitting device service behaviour.By
In the volume requirement of extraordinary instrument, conducting slip ring assembly has that size is little, compact conformation, service aisle are many
Feature.Therefore, the assembly method of the miniaturization conducting slip ring assembly of high-precision requirement how is assembled
Become crucial.
The most general conducting slip ring assembly assembly method seems simple, but existing defects.Owing to not making
Using insulating trip part, assembly precision ensures by a spline-simulating frock completely.And spline-simulating tool structure is multiple
Miscellaneous, machining accuracy is difficult to ensure, the assembly precision thus resulting in conducting slip ring is difficult to control to.It addition, by
Being metal material in frock, assembling link cannot carry out the insulation examination between ring plate in advance, can only pass through
Assembling, encapsulating, machine just can carry out Insulation monitoring after adding, as long as there being a ring plate part defective then
Entirety all can be defective, and therefore conforming product rate is low.
The assembly method of prior art is difficult to meet the reliability of instrument miniaturization conducting slip ring product, conjunction
Lattice rate and performance indications requirement.
Summary of the invention
The technical problem to be solved in the present invention is: provides the assembly method of a kind of conducting slip ring assembly, overcomes
In prior art the assembly precision for miniaturized products cannot effectively control, product reliability and qualification rate
The problem that cannot be effectively ensured.
The technical scheme is that
A kind of conducting slip ring assembly assembly method, including: step 1, insulating epoxy bonded adhesives is spread upon
Pilot pin surface, afterwards to pilot pin machining, forms pilot pin assembly；Step 2, conduction is sliding
Ring plate welds formation slip ring assembly with drawing wire；Step 3, installs many groups alternately on pilot pin assembly
Spaced insulation spacer and slip ring assembly；Step 4, press-fits big axle journal, shape on pilot pin assembly
Conducting slip ring is become to assemble blank；Step 5, assembles conducting slip ring blank and carries out priming by vacuum epoxy
Casting glue, forms conducting slip ring assembly.
Further, step 1 includes: step 11, and insulating epoxy adhesive glue is spread upon pilot pin
Surface；Step 12, dries or hot setting glue-line；Step 13, with megameter check glue application portions and
The insulation resistance of non-glue application portions；Step 14, turnery processing pilot pin, add and protect man-hour bearing to install
Face.
Further, step 2 includes: step 21, measures the length of enamel-covered wire, and to enamel-covered wire
Termination carries out depainting process, makes extraction wire；Step 22, welding conducting slip ring sheet and extraction wire,
Form slip ring assembly；Step 23, with hairbrush or alcohol washes solder joint.
Further, step 2 also includes: step 24, checks the slip ring assembly after bonding wire, takes out at random
Take the ring plate after multiple bonding wire, be hung in wire tail with 50g counterweight, continue 1 minute, reject and occur
The defective ring plate that broken string, solder joint loosen；Step 25, with each ring plate of digital versatile table look-up and institute
The conduction drawing wire of welding；Step 26, is applied to pad surface with two component polyurethane varnish.
Further, step 3 includes, step 31, measures the thickness of slip ring ring plate assembly and insulating trip
Degree size, carries out packet assembling by size tolerance requirements to slip ring ring plate and insulation spacer；Step 32,
Pilot pin assembly is loaded encapsulating frock；Step 33, is initially charged with a piece of complete insulation spacer, then
Slip ring ring plate is alternately installed with insulation spacer.
Further, step 33 includes: gap cut off by insulation spacer.
Further, step 3 includes: step 34, with circuit tester check each ring and corresponding lead it
Between conducting, check the insulation between each conducting slip ring, between each conducting slip ring and pilot pin with megameter.
Further, include that step 50 comprises in conducting slip ring assembly d size before step 5
It is coated with silicone rubber in face to protect；Include after step 5, step 51, after glue solidification, take off
Silicone rubber.
Further, include after step 5, step 52, conducting slip ring assembly is carried out turnery processing.
Further, include after step 5, step 53, with megameter check between each ring, each ring with
Insulate between pilot pin.
Present invention advantage compared with prior art is:
(1) present invention by pilot pin is irrigated two component insulating epoxy bonded adhesives with reach axle with
Insulation effect between slip ring sheet, and the product of versatility generally uses insulation sleeve and is physically separated, with
Reach insulation effect.Owing to size is little, compact conformation, this product uses new epoxy encapsulating method more may be used
OK.
(2) prior art can only be overall by racking processing fixture control accuracy.And the present invention takes many groups
Slip ring ring plate combines, by the strict often group slip ring ring plate thickness controlling assembling and insulation spacer thickness
Degree, it is ensured that 28 groups of slip ring assemblies assemble with insulation spacer after conducting slip ring blank assembly effective of formation
Working size required precision, higher than versatility product size required precision.
(3) present invention replaces versatility by welding on ring plate inner hole wall is drawn wire (enamel-covered wire)
The production method of the slip ring assembly of ring plate welding AF (politef) lead-out wire in product.
(4) present invention operates by conducting slip ring blank assembly carries out vacuum epoxy encapsulating, perfusion
KMT-206 glue, it is ensured that the encapsulating quality of conducting slip ring assembly.Have with the product encapsulating formula of versatility
Difference, glue-pouring method is tightened up.
Accompanying drawing explanation
Fig. 1 is the assembly structure figure of the small-sized conducting slip ring assembly that the present invention is directed to；
Fig. 2 is that the machine after the pilot pin assembly assembling of the conducting slip ring assembly that the present invention is directed to adds structure chart；
Fig. 3 is the welding schematic diagram of the slip ring ring plate assembly in the conducting slip ring assembly that the present invention is directed to；
Fig. 4 is the welding schematic diagram of the slip ring ring plate assembly in the conducting slip ring assembly that the present invention is directed to；
Fig. 5 is the encapsulating frock schematic diagram of the small-sized conducting slip ring assembly that the present invention is directed to；
Fig. 6 is that the encapsulating frock of the small-sized conducting slip ring assembly that the present invention is directed to carries out showing of encapsulating operation
It is intended to；
Fig. 7 is that the silicone rubber that is coated with of the small-sized conducting slip ring assembly that the present invention is directed to carries out showing of protection part
It is intended to.
Detailed description of the invention
The present invention comprises the following steps:
1, by pilot pin 1 after assembling is cleaned, shape after two special component insulating epoxy bonded adhesives 2 is irrigated
Become pilot pin assembly encapsulating part.After the most machined, form pilot pin assembly.
2, slip ring assembly will be formed after welded for conducting slip ring sheet 4 extraction wire 5.
3, on pilot pin assembly, a piece of insulation spacer 3 is first filled, then according to a piece of slip ring assembly, a piece of
Insulation spacer 3 forms mode order closed assembly slip ring assembly and insulation spacer 3, assembling 28 altogether of a group
Group, after being finally loaded on a piece of insulation spacer 3, presses fit into big axle journal 6, forms conducting slip ring and assembles hair
Blank.
4, conducting slip ring is assembled blank and carries out the little conducting rod epoxy pouring sealant 7 (type that priming by vacuum is special
Number KMT-206) after, form conducting slip ring assembly.
The present invention specifically comprises the following steps that
As it is shown in figure 1, the present invention includes pilot pin 1, two special component insulating epoxy bonded adhesives 2, absolutely
The epoxy that edge pad 3, conducting slip ring sheet 4, extraction wire 5, big axle journal 6 and little conducting slip ring are special
Casting glue 7 (model KMT-206).Encapsulating frock 8 is used when casting glue.
The present invention pilot pin assembly assembling after processing structure as in figure 2 it is shown, pilot pin assembly mainly by
Part pilot pin 1, two special component insulating epoxy bonded adhesives 2 form.
Shown in Figure 2, the pilot pin assembly assembling of the present invention and the step of processing structure include:
A) modulate two component epoxy bonded adhesives, the glue prepared is evenly coated in pilot pin and is opened by A face
Beginning to 17.15 millimeters of scopes of size of end extension, (this is that small-sized conducting rod assembles ring plate, insulating trip
Effective length: 0.6 × 28 (28 groups of slip ring chip module thickness)+0.3 (insulating trip thickness)+maximum work
Differ from 0.05) in three faces on, in should ensure that A face (more than Ф 2.4mm part) size during gluing
Should not have glue, glue-line should be tried one's best uniformly, and should be without obvious bubble, intact plastic structure；
B) pilot pin assembly is in room temperature (20 ± 5) DEG C, after 24 hours dry, or solidifies under 60 DEG C of high temperature
After 4-6 hour, should be greater than 1.5mm, less than 2.3mm with its excircle dimension of vernier caliper measurement；
C) check that glue application portions and non-glue application portions insulation resistance should be greater than 250M Ω with 250V megameter；
D) pilot pin assembly is carried out turnery processing, bearing installed surface B face (little axle during clamping, should be protected
Ф 3 ± 0.02 spot size in footpath, this position is a size of Ф after pilot pin assembly turnery processingSee Fig. 2, measure the pilot pin size after processing, use requirement should be met.
The slip ring ring plate welding schematic diagram of the present invention is as it is shown on figure 3, ring plate assembly is mainly by conducting slip ring sheet
4 and draw wire 42 (enamel-covered wire) composition.Shown in Figure 3, the welding step bag of ring plate assembly
Include:
A) roll off the production line: measure the length of enamel-covered wire, meet and use requirement, with the scalpel end to enamel-covered wire
Head carries out depainting process, and a length of 1-2mm of depainting, the depainting of enamel-covered wire is answered cleaning thoroughly and do not allows
Having cut, root should be smooth, impulse-free robustness and do not allow to damage core, and by the enamel-covered wire termination after depainting
Bending processes.
B) welding: require welding ring plate (wire welds) with ring plate according to using, forms slip ring assembly；
The welding quality requiring ring plate should meet space product manual welding process specifications.After ring plate welding,
Solder joint is wanted firmly, should be positioned at ring plate center after wire welding, and scolding tin does not allows to exceed ring plate end face.
C) clean: dip in gasoline, alcohol washes solder joint with hairbrush, check under 25 times of magnifieres after cleaning
Solder joint be not allow for the fifth wheels such as scaling powder.
D) check: randomly draw the ring plate after 5 bonding wires, be hung in wire tail with 50g counterweight, hold
Continuous 1min, does not allow occur that broken string, solder joint loosen；With each ring plate of digital versatile table look-up with welded
The conduction of enamel-covered wire.
E), after solder joint is cleaned out, it is applied to pad surface, wire with two component polyurethane varnish TS01-3
(enamel-covered wire) coating removal skin portion does not allows to stretch out ring plate end face, as it is shown on figure 3, the wire of remainder
Do not allow to damage coat of paint.
The encapsulating frock schematic diagram of the present invention small-sized conducting slip ring assembly is as it is shown in figure 5, small-sized conducting slip ring
The assembly relation schematic diagram of assembly and encapsulating frock is as shown in Figure 6.Before encapsulating, pilot pin assembly is loaded and fill
Glue frock, well-located after with technique nut, pilot pin is fixed in encapsulating frock.Afterwards in encapsulating work
The encapsulating frock being loaded into conducting slip ring assembly in journey carries out the pre-heat treatment, and the glue after processing fills in work
In dress.
The assembling concrete operation step of the present invention small-sized conducting slip ring assembly is as follows:
A) measure the gauge of slip ring ring plate assembly and insulating trip with spiral micrometer, want by dimensional tolerance
Ask and slip ring ring plate and insulating trip are carried out packet assembling, it is simple to slip ring ring plate and the combination closed assembly of insulating trip.
Ring plate after assembling adds insulating trip paired a size of 0.6, the best closer to " 0 " line.Therefore, actual raw
In product, ring plate dimensioned is 0.3 ± 0.01, and insulating trip is the most also 0.3 ± 0.01.With reality by mistake
Difference size packet is assembled.Ring plate and insulating trip are respectively divided into four packet sizes: ring plate: Insulating trip is equally by above four packet size packets.By ring plate during assemblingChi
Very little and insulating tripThe pairing assembling of size, the like, by ring plateSize with
Insulating tripThe pairing assembling of size, ring plateWith insulating tripRing plate
With insulating tripCombination.Thus, the ring plate processing relatively thin and thicker insulating trip, process
Relatively thin insulating trip combines with thicker ring plate, to ensure the accuracy of 0.6 size after assembling, it is ensured that 28
Assembling adds 17.1-17.15 accuracy of gauge after a piece of insulating trip after joining.Wherein ring plate controls 0.3
± 0.01 size is to consider two reasons.One is the reliability that brush filament contacts with circuit, and two for considering to assemble
Insulating properties between rear ring plate, therefore, controls within 0.3+0.01.
B) by pilot pin assembly load encapsulating frock, well-located after, with technique nut, pilot pin is fixed
In encapsulating frock.
C) it is initially charged with a piece of complete insulation spacer, then carries out slip ring ring plate and insulation spacer alternately peace
Dress.Noting, insulation spacer now cuts off about the gap of (60 ° ± 5 °), slip ring ring plate and insulation
Pad formed 1 group successively against closed assembly, 28 groups altogether, be again loaded into after closed assembly is complete 1 complete exhausted
Edge pad, compresses with large-diameter, reinforces, it is ensured that the size after closed assembly is complete meets use requirement.(absolutely
The big characteristic that gap is the present invention is cut on edge pad.After purpose allows for encapsulating operation, glue energy
Carry out climbing glue process easily by gap, meanwhile, this gap makes glue degasification more smooth and easy.Gap ensures
Enriching of encapsulating glue, perfusion effect, without starved after glue solidification, in machine adds, do not have glue
Strength problem, the problem such as collect together of ring plate.) requiring: the solder joint of slip ring ring plate assembly answers cross-distribution,
Slip ring wire (enamel-covered wire) passes from two outlet mounting holes of big axle journal, and slip ring wire should be along waist
It is uniformly distributed along the circumference in shape groove, wire (enamel-covered wire) line skin during cabling, can not be scratched.
D) overall length dimension after measurement slip ring ring plate assembly and insulation spacer stacked group fill should meet use and want
Ask, and check with circuit tester and turn between each ring and corresponding lead, with megameter check between each ring,
Between each ring and pilot pin, insulation should be greater than 250M Ω.
E) being coated with silicone rubber in the face that conducting slip ring assembly d size comprises to protect, silicone rubber should cover
Its surface, as shown in Figure 6.
F) join according to the requirement that operates with of the special epoxy pouring sealant KMT-206 of little conducting slip ring
Glue, carries out preheating to glue and evacuation processes, and the encapsulating frock being loaded into conducting slip ring assembly is carried out
The pre-heat treatment, the glue after processing fills in frock, after evacuation, solidifies.
G), after glue solidification, take off silicone rubber, and electric conduction rod component (conducting slip ring assembly) is carried out car
Cut processing, measure the conducting rod size after processing, use requirement should be met.
H) clean the fifth wheel on conducting rod with gasoline, such as the iron filings in ring plate, toothpick, acupuncture should be used
Pin is removed, and should avoid damage to ring plate surface during removal.
I) check with circuit tester and turn between each ring and corresponding enamel-covered wire, with between the megameter each ring of inspection,
Between each ring and pilot pin, insulation should be greater than 250M Ω.
Claims (2)
1. a conducting slip ring assembly assembly method, it is characterised in that including:
Step 1, spreads upon pilot pin (1) surface, afterwards to described little axle by insulating epoxy bonded adhesives
Neck (1) machining, forms pilot pin assembly；Specifically include following steps:
Step 11, spreads upon described pilot pin surface by described insulating epoxy adhesive glue；
Step 12, dries or hot setting glue-line；
Step 13, checks glue application portions and the insulation resistance of non-glue application portions with megameter；
Step 14, pilot pin described in turnery processing, add and protect bearing installed surface man-hour；
Step 2, welds formation slip ring assembly by conducting slip ring sheet (4) with drawing wire (5)；Specifically
Comprise the steps:
Step 21, measures the length of enamel-covered wire, and the termination of described enamel-covered wire is carried out depainting process,
Make extraction wire；
Step 22, welding conducting slip ring sheet (4) and extraction wire (5), form described slip ring assembly；
Step 23, with hairbrush or alcohol washes solder joint；
Step 24, checks the described slip ring assembly after bonding wire, randomly draws the ring plate after multiple bonding wire,
It is hung in wire tail with 50g counterweight, continues 1 minute, reject and loosening not the conforming to of broken string, solder joint occurs
Lattice ring sheet；
Step 25, by each ring plate of digital versatile table look-up and the conduction drawing wire welded；
Step 26, is applied to pad surface with two component polyurethane varnish；
Step 3, installs the insulation spacer (3) of many group alternate intervals arrangements on described pilot pin assembly
With described slip ring assembly；Specifically include following steps:
Step 31, measures the gauge of slip ring ring plate assembly and insulating trip, by size tolerance requirements pair
Described slip ring ring plate and described insulation spacer carry out packet assembling；
Step 32, loads encapsulating frock by described pilot pin assembly；
Step 33, is initially charged with a piece of complete insulation spacer, and gap cut off by insulation spacer；Then described
Slip ring ring plate is alternately installed with described insulation spacer；
Step 34, checks the conducting between each ring and corresponding lead with circuit tester, checks with megameter
Insulation between each conducting slip ring, between each conducting slip ring and described pilot pin；
Step 4, press-fits big axle journal (6) on described pilot pin assembly, forms conducting slip ring and assembles hair
Blank；
Step 5, makes conducting slip ring assembly, comprises the steps:
Step 51, is coated with silicon in big axle journal (6) face that axially d size is comprised in conducting slip ring assembly
Rubber is protected；
Step 52, carries out priming by vacuum epoxy pouring sealant by described conducting slip ring assembling blank, is formed
Conducting slip ring assembly；
Step 53, after glue solidification, takes off silicone rubber；
Step 54, carries out turnery processing to conducting slip ring assembly.
Conducting slip ring assembly assembly method the most according to claim 1, it is characterised in that step
54 also include step 55 below, check with megameter and insulate between each ring, between each ring and pilot pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410602145.9A CN104377528B (en) | 2014-10-31 | Conducting slip ring assembly assembly method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410602145.9A CN104377528B (en) | 2014-10-31 | Conducting slip ring assembly assembly method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104377528A CN104377528A (en) | 2015-02-25 |
| CN104377528B true CN104377528B (en) | 2017-01-04 |
Family
ID=
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6049967A (en) * | 1998-07-31 | 2000-04-18 | Litton Systems, Inc. | Method of assembling a slip ring with an integral bearing |
| US6089875A (en) * | 1998-05-18 | 2000-07-18 | Star Micronics Co., Ltd. | Slip ring assembly and the manufacturing method thereof |
| CN1614830A (en) * | 2004-12-07 | 2005-05-11 | 刘磊 | Laminated conductive rotary slip ring and producing process |
| CN101039008A (en) * | 2007-04-29 | 2007-09-19 | 北京航天控制仪器研究所 | Radial insulation laminated conductive retractor collar |
| CN101340047A (en) * | 2008-08-28 | 2009-01-07 | 九江精达检测技术有限公司 | Lamination-vacuum pressure pouring process of micro conductive retractor collar |
| CN102751643A (en) * | 2011-04-19 | 2012-10-24 | 泰科电子公司 | Process of fabricating a slip ring component, a slip ring component and molded interconnect device including a slip ring component |
| CN103050864A (en) * | 2012-12-18 | 2013-04-17 | 北京兴华机械厂 | Fixture of electric conduction rod component |
| CN203871622U (en) * | 2014-03-27 | 2014-10-08 | 北京航天控制仪器研究所 | Multi-ring-number miniaturized inertia platform slip ring conductive apparatus |
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6089875A (en) * | 1998-05-18 | 2000-07-18 | Star Micronics Co., Ltd. | Slip ring assembly and the manufacturing method thereof |
| US6049967A (en) * | 1998-07-31 | 2000-04-18 | Litton Systems, Inc. | Method of assembling a slip ring with an integral bearing |
| CN1614830A (en) * | 2004-12-07 | 2005-05-11 | 刘磊 | Laminated conductive rotary slip ring and producing process |
| CN101039008A (en) * | 2007-04-29 | 2007-09-19 | 北京航天控制仪器研究所 | Radial insulation laminated conductive retractor collar |
| CN101340047A (en) * | 2008-08-28 | 2009-01-07 | 九江精达检测技术有限公司 | Lamination-vacuum pressure pouring process of micro conductive retractor collar |
| CN102751643A (en) * | 2011-04-19 | 2012-10-24 | 泰科电子公司 | Process of fabricating a slip ring component, a slip ring component and molded interconnect device including a slip ring component |
| CN103050864A (en) * | 2012-12-18 | 2013-04-17 | 北京兴华机械厂 | Fixture of electric conduction rod component |
| CN203871622U (en) * | 2014-03-27 | 2014-10-08 | 北京航天控制仪器研究所 | Multi-ring-number miniaturized inertia platform slip ring conductive apparatus |
Non-Patent Citations (1)
| Title |
|---|
| 三轴惯导测试台精密导电滑环组件的研制;陈世文，汤友三，于海平;《中国惯性技术学报》;19910215;全文 * |
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