CN104377194A - LED lamp filament, LED bulb and lamp - Google Patents
LED lamp filament, LED bulb and lamp Download PDFInfo
- Publication number
- CN104377194A CN104377194A CN201410654294.XA CN201410654294A CN104377194A CN 104377194 A CN104377194 A CN 104377194A CN 201410654294 A CN201410654294 A CN 201410654294A CN 104377194 A CN104377194 A CN 104377194A
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- China
- Prior art keywords
- led
- terminal pad
- heat
- led silk
- housing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention relates to an LED lamp filament, an LED bulb and a lamp. The LED lamp filament comprises a shell, an LED base body and a power pin line. The shell is of a transparent sealed structure, the LED base body is arranged in the shell, one end of the power pin line is located in the shell and electrically connected with the LED base body, and the other end of the power pin line is located outside the shell. The shell is full of the mixture of the liquid heat-conducting medium and fluorescent materials, and the LED base body is wrapped by the fluorescent materials, and even light emitting is achieved. The heat-conducting medium is liquid and cannot age or fracture or fall, the heat-conducting medium close to the heating part of the LED base body is heated, the temperature is increased, the heat of the heat-conducting medium close to the shell is brought away by the gas outside the shell, the temperature is reduced, heat can be quickly exchanged through the liquid heat-conducting medium, and efficient heat conduction is achieved.
Description
Technical field
The present invention relates to the technical field of light fixture, particularly relate to a kind of LED silk, LEDbulb lamp and light fixture.
Background technology
Current LED light effect is mainly limited by the photoelectric conversion efficiency of LED, LED light loss, the factors such as LED heat radiation is bad.The photoelectric conversion efficiency of LED and LED light loss depend primarily on the material that LED manufacturing process and LED select, and along with the development of technology, the photoelectric conversion efficiency of LED progressively improves, and LED light loss reduces gradually.And LED is dispelled the heat bad problem, hamper the raising of LED light effect, be the significant bottleneck of LED illumination lamp industry always.
There is the bulb lamp tool of LED silk, because its profile is close with conventional incandescent with lighting angle, receives market and welcome.Generally there is the bulb lamp tool of LED silk, the LED matrix of its LED silk is coated with fluoresent coating, and fluoresent coating covers on LED matrix, due to fluoresent coating poor thermal conductivity by adding curable silica gel, under long-time high temperature can aging, rupture, come off, cause LED silk to lose efficacy.Owing to being subject to the restriction of LED silk heat radiation, the bulb lamp tool generally with LED silk cannot be in the power of more than 10W for a long time, limits the application of the bulb lamp with LED silk.
Summary of the invention
Based on this, be necessary to provide a kind of LED silk of good heat dissipation effect, LEDbulb lamp and light fixture.
A kind of LED silk, comprising:
Housing is transparent hermetically-sealed construction;
LED matrix, is arranged in described housing; And
Power pins line, one end of described power pins line is positioned at described housing, and is electrically connected with described LED matrix, and the other end of described power pins line is positioned at outside described housing;
Wherein, liquid heat-conducting medium and the mixture of fluorescent material is full of in described housing.
Wherein in an embodiment, described heat-conducting medium is transparent conduction oil or transparent heat conductive silica gel oil.
Wherein in an embodiment, described conduction oil is more than conductive coefficient 0.1w/ (mk) and the heat resisting temperature synthesis type conduction oil or the mineral type conduction oil that are greater than 200 DEG C.
Wherein in an embodiment, the conductive coefficient of described heat conductive silica gel oil is more than 0.1w/ (mk), and heat resisting temperature is greater than 200 DEG C.
Wherein in an embodiment, described housing is the tubular structure of two ends sealing, and the quantity of described power pins line is two, and two described power pins lines are passed by the two ends of described housing respectively.
Wherein in an embodiment, described LED matrix comprises substrate and multiple setting LED luminescence unit on the substrate, and described substrate is strip, the order arrangement on the substrate of described LED luminescence unit.
A kind of LEDbulb lamp, comprises bulb lamp body and described LED silk;
Described bulb lamp body comprises:
Ball steeps, and inside has the cavity holding described LED silk; Described ball bubble is hermetically-sealed construction, and described chamber is filled with heat-conducting gas;
Lamp holder, is arranged on described ball bubble;
Driving power, is arranged on the inside of described lamp holder; And
Filament support, is positioned at described cavity, and described filament support is electrically connected with described driving power by wire; Described LED silk is arranged on described filament support, and described LED silk is electrically connected with described driving power by described filament support.
Wherein in an embodiment, described filament support comprises the first terminal pad, the second terminal pad and support bar, and the two ends of described support bar connect described first terminal pad and described second terminal pad respectively;
Described first terminal pad and described second terminal pad are electrically connected with described driving power respectively by wire;
Described LED silk is arranged between described first terminal pad and described second terminal pad, and the two described power pins lines be electrically connected with same described LED matrix are electrically connected with described first terminal pad and described second terminal pad respectively.
Wherein in an embodiment, described first terminal pad and described second terminal pad are parallel to each other, and described support bar is perpendicular to described first terminal pad and described second terminal pad;
The quantity of described LED silk is multiple, and multiple described LED silk is strip, and the extended line of multiple described LED silk is all not parallel with the extended line of described support bar.
A kind of light fixture, comprises light fitting body and described LED silk; Described LED silk is arranged on described light fitting body.
Above-mentioned LED silk, LEDbulb lamp and light fixture, be full of liquid heat-conducting medium and the mixture of fluorescent material, make fluorescent material be wrapped in around LED matrix in the housing of LED silk, realize uniform luminous.Heat-conducting medium is liquid, can not aging, rupture, come off, heat-conducting medium near LED matrix heating position is heated, temperature raises, heat-conducting medium heat near housing is taken away by the gas of outside, temperature reduces, and liquid heat-conducting medium can heat-shift fast, thus realizes efficient heat conduction.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of an embodiment LED silk;
Fig. 2 is the schematic diagram of an embodiment LEDbulb lamp.
Embodiment
For the ease of understanding the present invention, below with reference to relevant drawings, LED silk, LEDbulb lamp and light fixture are described more fully.The first-selected embodiment of LED silk, LEDbulb lamp and light fixture is given in accompanying drawing.But LED silk, LEDbulb lamp and light fixture can realize in many different forms, are not limited to embodiment described herein.On the contrary, provide the object of these embodiments be make the disclosure of LED silk, LEDbulb lamp and light fixture more comprehensively thorough.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present invention understand usually.The object of the term used in the specification of LED silk, LEDbulb lamp and light fixture herein just in order to describe specific embodiment, is not intended to be restriction the present invention.
As shown in Figure 1, the LED silk 100 of an execution mode comprises housing 120, LED matrix 140 and power pins line 160.Housing 120 is transparent hermetically-sealed construction, and the material of housing 120 can be transparent glass, also can be good stability and the high plastics of transparency, can certainly be transparent and can not with housing 120 inside and outside other materials of material generation chemical reaction.LED matrix 140 is arranged in housing 120, and one end of power pins line 160 is positioned at housing 120, and is electrically connected with LED matrix 140, and the other end of power pins line 160 is positioned at outside housing 120.A general LED matrix 140 connects two power pins lines 160, thus connects external power source, form loop.
Be full of liquid heat-conducting medium and the mixture 110 of fluorescent material in the housing 120 of LED silk 100, make fluorescent material be wrapped in LED matrix 140 around, realize uniform luminous.Heat-conducting medium is liquid, can not aging, rupture, come off, heat-conducting medium near LED matrix 140 heating position is heated, temperature raises, heat-conducting medium heat near housing 120 is taken away by the gas of housing 120 outside, temperature reduces, and liquid heat-conducting medium can heat-shift fast, thus realizes efficient heat conduction.
Wherein in an embodiment, heat-conducting medium can be transparent conduction oil or transparent heat conductive silica gel oil.Conduction oil is more than conductive coefficient 0.1w/ (mk) and the heat resisting temperature synthesis type conduction oil or the mineral type conduction oil that are greater than 200 DEG C.The conductive coefficient of heat conductive silica gel oil is more than 0.1w/ (mk), and heat resisting temperature is greater than 200 DEG C.More, conductive coefficient 0.14w/ (mk) the above effect of heat-conducting medium more.
Conduction oil can be biphenyl and Biphenyl Ether eutectic mixture type conduction oil, and the conduction oil of this type is that biphenyl and Biphenyl Ether eutectic mixture are made up of the biphenyl of 26.5% and the Biphenyl Ether of 73.5%.Be characterized in Heat stability is good, chemical reaction can not be produced with housing, LED matrix etc.Its boiling temperature within the scope of 256 ~ 258 DEG C, higher than the temperature of conduction oil under general service condition.
Conduction oil also can select the N320 conduction oil of promise Haars Co., Ltd, its main component is naphthenic base oils, there is reliable thermal stability, maximum temperature 300 DEG C, viscosity coefficient (40 DEG C) 30cSt, thermal transmission coefficient (200 DEG C) 0.122W/m.k, the coefficient of expansion (200 DEG C) 0.00097/ DEG C.
Conduction oil can also select the F-60 conduction oil of promise Haars Co., Ltd, its main component is alkylaromatic hydrocarbon, its the far super plain mineral oil of performance and alkyl benzene conduction oil, maximum temperature 315 DEG C, viscosity coefficient (40 DEG C) 5cSt, thermal transmission coefficient (200 DEG C) 0.105W/m.k, the coefficient of expansion (200 DEG C) 0.000968/ DEG C.
Heat conductive silica gel oil can select the KF-965 dimethyl organic silicone oil of company of SHIN-ETSU HANTOTAI, and its Applicable temperature is-30 DEG C to+250 DEG C, is applicable to closed environment.
Wherein in an embodiment, the tubular structure of housing 120 sealing in two ends, the quantity of power pins line 160 is two, and two power pins lines 160 are passed by the two ends of housing 120 respectively.Two power pins lines 160 are respectively used to connect outside power supply.LED matrix 140 comprises substrate 142 and multiple LED luminescence unit 144 be arranged on substrate 142, and substrate 142 is strip, and LED luminescence unit 144 is order arrangement on substrate 142, and blocking of substrate 142 pairs of light of strip is little, and therefore luminous efficiency is high.
As shown in Figure 2, the LEDbulb lamp 10 of an execution mode comprises the LED silk 100 shown in bulb lamp body and Fig. 1.Bulb lamp body comprises ball bubble 220, lamp holder 240, driving power 260 and filament support 280, and ball steeps 220 inside and has the cavity holding LED silk 100.Ball bubble 220 is hermetically-sealed construction, and chamber is filled with heat-conducting gas, and heat-conducting gas can be helium, neon and mist thereof etc.The material of ball bubble 220 can be transparent glass, also can be good stability and the high plastics of transparency, can certainly be transparent and can not steep other materials of the material generation chemical reaction inside and outside 220 with ball.Lamp holder 240 is arranged on ball bubble 220, and driving power 260 is arranged on the inside of lamp holder 240.
Filament support 280 is positioned at cavity, and filament support 280 is electrically connected with driving power 260 by wire.LED silk 100 is arranged on filament support 280, and LED silk 100 is electrically connected with driving power 260 by filament support 280.Be full of liquid heat-conducting medium and the mixture 110 of fluorescent material in the housing 120 of LED silk 100, make fluorescent material be wrapped in LED matrix 140 around, realize uniform luminous.Heat-conducting medium is liquid, can not aging, rupture, come off, heat-conducting medium near LED matrix 140 heating position is heated, temperature raises, heat-conducting medium heat near housing 120 is taken away by the gas of housing 120 outside, temperature reduces, and liquid heat-conducting medium can heat-shift fast, thus realizes efficient heat conduction.
Wherein in an embodiment, filament support 280 can comprise the first terminal pad 282, second terminal pad 284 and support bar 286, and the two ends of support bar 286 connect the first terminal pad 282 and the second terminal pad 284 respectively.Second terminal pad 284 can with ball steep 220 or lamp holder 240 be fixedly connected with.First terminal pad 282 and the second terminal pad 284 are electrically connected with driving power 260 respectively by wire.LED silk 100 is arranged between the first terminal pad 282 and the second terminal pad 284, and the two power pins lines 160 be electrically connected with same LED matrix 140 are electrically connected with the first terminal pad 282 and the second terminal pad 284 respectively.Filament support 280 structure is simple, and easily process, production cost is low, and structure is firmly firm, and the general filament that rocks is not easy to depart from the first terminal pad 282 or the second terminal pad 284.
Further, the first terminal pad 282 and the second terminal pad 284 are parallel to each other, and support bar 286 is perpendicular to the first terminal pad 282 and the second terminal pad 284.The quantity of LED silk 100 is multiple, and multiple LED silk 100 is strip, and the extended line of multiple LED silk 100 is all not parallel with the extended line of support bar 286.Strip LED silk 100 is more weak in two ends luminous power, if multiple LED silk 100 be arranged in parallel with support bar 286, then the position light intensity of the first terminal pad 282 is more weak, and LEDbulb lamp 10 is weak at the position light that the first terminal pad 282 is just right, causes LEDbulb lamp 10 overall brightness even not.By not parallel design, multiple LED silk 100 mutually supplements and strengthens the weak position of light, makes LEDbulb lamp 10 overall brightness even, improves illumination effect.
The light fixture of one execution mode, comprise the LED silk 100 shown in light fitting body and Fig. 1, LED silk 100 is arranged on light fitting body.LED silk 100 can be positioned at the inside of light fitting body, also can be positioned at the outside of light fitting body.Be full of liquid heat-conducting medium and the mixture 110 of fluorescent material in the housing 120 of LED silk 100, make fluorescent material be wrapped in LED matrix 140 around, realize uniform luminous.Heat-conducting medium is liquid, can not aging, rupture, come off, heat-conducting medium near LED matrix 140 heating position is heated, temperature raises, heat-conducting medium heat near housing 120 is taken away by the gas of housing 120 outside, temperature reduces, and liquid heat-conducting medium can heat-shift fast, thus realizes efficient heat conduction.
Above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a LED silk, is characterized in that, comprising:
Housing is transparent hermetically-sealed construction;
LED matrix, is arranged in described housing; And
Power pins line, one end of described power pins line is positioned at described housing, and is electrically connected with described LED matrix, and the other end of described power pins line is positioned at outside described housing;
Wherein, liquid heat-conducting medium and the mixture of fluorescent material is full of in described housing.
2. LED silk according to claim 1, is characterized in that, described heat-conducting medium is transparent conduction oil or transparent heat conductive silica gel oil.
3. LED silk according to claim 2, is characterized in that, described conduction oil is more than conductive coefficient 0.1w/ (mk) and the heat resisting temperature synthesis type conduction oil or the mineral type conduction oil that are greater than 200 DEG C.
4. LED silk according to claim 2, is characterized in that, the conductive coefficient of described heat conductive silica gel oil is more than 0.1w/ (mk), and heat resisting temperature is greater than 200 DEG C.
5. LED silk according to claim 1, is characterized in that, described housing is the tubular structure of two ends sealing, and the quantity of described power pins line is two, and two described power pins lines are passed by the two ends of described housing respectively.
6. LED silk according to claim 5, is characterized in that, described LED matrix comprises substrate and multiple setting LED luminescence unit on the substrate, and described substrate is strip, the order arrangement on the substrate of described LED luminescence unit.
7. a LEDbulb lamp, is characterized in that, comprises bulb lamp body and the LED silk described in any one of claim 1 to 6;
Described bulb lamp body comprises:
Ball steeps, and inside has the cavity holding described LED silk; Described ball bubble is hermetically-sealed construction, and described chamber is filled with heat-conducting gas;
Lamp holder, is arranged on described ball bubble;
Driving power, is arranged on the inside of described lamp holder; And
Filament support, is positioned at described cavity, and described filament support is electrically connected with described driving power by wire; Described LED silk is arranged on described filament support, and described LED silk is electrically connected with described driving power by described filament support.
8. LEDbulb lamp according to claim 7, is characterized in that, described filament support comprises the first terminal pad, the second terminal pad and support bar, and the two ends of described support bar connect described first terminal pad and described second terminal pad respectively;
Described first terminal pad and described second terminal pad are electrically connected with described driving power respectively by wire;
Described LED silk is arranged between described first terminal pad and described second terminal pad, and the two described power pins lines be electrically connected with same described LED matrix are electrically connected with described first terminal pad and described second terminal pad respectively.
9. LEDbulb lamp according to claim 8, is characterized in that, described first terminal pad and described second terminal pad are parallel to each other, and described support bar is perpendicular to described first terminal pad and described second terminal pad;
The quantity of described LED silk is multiple, and multiple described LED silk is strip, and the extended line of multiple described LED silk is all not parallel with the extended line of described support bar.
10. a light fixture, is characterized in that, comprises light fitting body and the LED silk described in any one of claim 1 to 6; Described LED silk is arranged on described light fitting body.
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CN201410654294.XA CN104377194A (en) | 2014-11-17 | 2014-11-17 | LED lamp filament, LED bulb and lamp |
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CN201410654294.XA CN104377194A (en) | 2014-11-17 | 2014-11-17 | LED lamp filament, LED bulb and lamp |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105889777A (en) * | 2016-06-03 | 2016-08-24 | 浙江九阳光电有限公司 | LED G9 lamp with high luminous efficiency |
WO2016162616A1 (en) | 2015-04-08 | 2016-10-13 | Led-Ner | Lighting device with led filaments |
CN107448917A (en) * | 2017-01-19 | 2017-12-08 | 广州奥翼电子科技股份有限公司 | A kind of light fixture |
JP6286698B1 (en) * | 2016-11-25 | 2018-03-07 | 株式会社ビートソニック | Filament type LED bulb |
JP2018037395A (en) * | 2016-08-30 | 2018-03-08 | 株式会社ビートソニック | Filament type LED bulb |
CN107795865A (en) * | 2016-08-30 | 2018-03-13 | 比特硕尼克株式会社 | Filament LED bulb |
WO2018149963A1 (en) * | 2017-02-20 | 2018-08-23 | Osram Opto Semiconductors Gmbh | Radiation emitting filament with heat conducting element |
CN109140279A (en) * | 2018-08-24 | 2019-01-04 | 重庆秉为科技有限公司 | A kind of LED light with flexible filament |
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WO2016162616A1 (en) | 2015-04-08 | 2016-10-13 | Led-Ner | Lighting device with led filaments |
US10544910B2 (en) | 2015-04-08 | 2020-01-28 | Led-Ner | Lighting device with LED filaments |
CN105889777A (en) * | 2016-06-03 | 2016-08-24 | 浙江九阳光电有限公司 | LED G9 lamp with high luminous efficiency |
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JP6286698B1 (en) * | 2016-11-25 | 2018-03-07 | 株式会社ビートソニック | Filament type LED bulb |
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CN107448917A (en) * | 2017-01-19 | 2017-12-08 | 广州奥翼电子科技股份有限公司 | A kind of light fixture |
WO2018149963A1 (en) * | 2017-02-20 | 2018-08-23 | Osram Opto Semiconductors Gmbh | Radiation emitting filament with heat conducting element |
CN109140279A (en) * | 2018-08-24 | 2019-01-04 | 重庆秉为科技有限公司 | A kind of LED light with flexible filament |
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Application publication date: 20150225 |