CN104371564A - Conductive adhesive - Google Patents
Conductive adhesive Download PDFInfo
- Publication number
- CN104371564A CN104371564A CN201410593002.6A CN201410593002A CN104371564A CN 104371564 A CN104371564 A CN 104371564A CN 201410593002 A CN201410593002 A CN 201410593002A CN 104371564 A CN104371564 A CN 104371564A
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- China
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- parts
- conductive adhesive
- conductive
- conductive filler
- rongalite
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Abstract
The invention discloses a conductive adhesive prepared from the following raw materials in parts by weight: 9-15 parts of waterborne polyurethane latex, 3-10 parts of butyldiglycol, 3-10 parts of a coupling agent, 3-8 parts of organobentonite of 20-50 meshes, 2-6 parts of a water-based leveling agent, 2-5 parts of asphalt, 3-8 parts of rubber powder, 2-6 parts of terpene resin, 8-14 parts of maleic anhydride, 3-8 parts of a tert-butyl hydroperoxide rongalite mixture, 4-6 parts of alkyl phenyl polyoxyethylene ether, 3-6 parts of glycidyl methacrylate, 2-7 parts of sodium bicarbonate, 3-5 parts of silicone oil, 2-6 parts of nano calcium oxide and 10-20 parts of a conductive filler. The conductive adhesive disclosed by the invention has the beneficial effects of good conductivity, uniform distribution of the conductive filler, stable performance and good cohesiveness.
Description
Technical field
The present invention relates to a kind of conductive adhesive.
Background technology
Electro-conductive adhesive is a kind of tackiness agent solidifying or have certain conductivity after drying, usual preparation method is for filmogen with matrix resin and solidifying agent, conductive filler material is conductive additive, by the bonding effect of matrix resin, conducting particles is combined together to form conductive network passage, realizes being connected by the conduction of adhesives.Electro-conductive adhesive chief component is matrix resin, solidifying agent, conductive additive and auxiliary agent composition.Electro-conductive adhesive purposes is very extensive, can carry out metal chassis connection, bonding wire and base, bonding element and the plane hole through printed wiring, and the tuning and hole of bonding waveguide is repaired.But existing electro-conductive adhesive is difficult to be evenly dispersed in adhesive system, greatly reduce the cementability of tackiness agent.Service requirements can not be met.
Summary of the invention
For the deficiencies in the prior art, the technical problem to be solved in the present invention is, provides a kind of conductive adhesive, and have good conductive capability, conductive filler material is evenly distributed, stable performance, and cohesiveness is also better simultaneously.
For solving the deficiencies in the prior art, the technical scheme that the present invention takes is: a kind of conductive adhesive, is made up of the raw material of following parts by weight:
Aqueous polyurethane emulsion 9-15 part, butyl 3-10 part, coupling agent 3-10 part, 20-50 order organobentonite 3-8 part, water-based flow agent 2-6 part, pitch 2-5 part, rubber powder 3-8 part, terpine resin 2-6 part, maleic anhydride 8-14 part, tertbutyl peroxide rongalite mixture 3-8 part, alkylphenol polyoxyethylene 4-6 part, glycidyl methacrylate 3-6 part, sodium bicarbonate 2-7 part, silicone oil 3-5 part, nano calcium oxide 2-6 part, conductive filler material 10-20 part.
The invention has the beneficial effects as follows, conductive adhesive of the present invention, have good conductive capability, conductive filler material is evenly distributed, stable performance, and cohesiveness is also better simultaneously.
Embodiment
embodiment 1
A kind of conductive adhesive, be made up of the raw material of following parts by weight:
Aqueous polyurethane emulsion 9 parts, butyl 3 parts, coupling agent 3 parts, 20-50 order organobentonite 3 parts, water-based flow agent 2 parts, pitch 2 parts, rubber powder 3 parts, terpine resin 2 parts, maleic anhydride 8 parts, 3 parts, tertbutyl peroxide rongalite mixture, alkylphenol polyoxyethylene 4 parts, glycidyl methacrylate 3 parts, sodium bicarbonate 2 parts, silicone oil 3 parts, nano calcium oxide 2 parts, conductive filler material 10 parts.
embodiment 2
A kind of conductive adhesive, be made up of the raw material of following parts by weight:
Aqueous polyurethane emulsion 15 parts, butyl 10 parts, coupling agent 10 parts, 20-50 order organobentonite 8 parts, water-based flow agent 6 parts, pitch 5 parts, rubber powder 8 parts, terpine resin 6 parts, maleic anhydride 14 parts, 8 parts, tertbutyl peroxide rongalite mixture, alkylphenol polyoxyethylene 6 parts, glycidyl methacrylate 6 parts, sodium bicarbonate 7 parts, silicone oil 5 parts, nano calcium oxide 6 parts, conductive filler material 20 parts.
Claims (1)
1. a conductive adhesive, is characterized in that: be made up of the raw material of following parts by weight:
Aqueous polyurethane emulsion 9-15 part, butyl 3-10 part, coupling agent 3-10 part, 20-50 order organobentonite 3-8 part, water-based flow agent 2-6 part, pitch 2-5 part, rubber powder 3-8 part, terpine resin 2-6 part, maleic anhydride 8-14 part, tertbutyl peroxide rongalite mixture 3-8 part, alkylphenol polyoxyethylene 4-6 part, glycidyl methacrylate 3-6 part, sodium bicarbonate 2-7 part, silicone oil 3-5 part, nano calcium oxide 2-6 part, conductive filler material 10-20 part.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410593002.6A CN104371564A (en) | 2014-10-30 | 2014-10-30 | Conductive adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410593002.6A CN104371564A (en) | 2014-10-30 | 2014-10-30 | Conductive adhesive |
Publications (1)
Publication Number | Publication Date |
---|---|
CN104371564A true CN104371564A (en) | 2015-02-25 |
Family
ID=52550772
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410593002.6A Pending CN104371564A (en) | 2014-10-30 | 2014-10-30 | Conductive adhesive |
Country Status (1)
Country | Link |
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CN (1) | CN104371564A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106147632A (en) * | 2016-08-08 | 2016-11-23 | 强新正品(苏州)环保材料科技有限公司 | A kind of conductive adhesive |
CN106190010A (en) * | 2016-08-08 | 2016-12-07 | 强新正品(苏州)环保材料科技有限公司 | Conductive adhesive |
CN110016307A (en) * | 2019-05-05 | 2019-07-16 | 合肥凯大新型材料科技有限公司 | A kind of insulating cement that can be used as carries out the secondary conductive pressure sensitive adhesive used |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110042004A1 (en) * | 2009-08-19 | 2011-02-24 | Evonik Goldschmidt Gmbh | Curable material comprising silylated polymers containing urethane groups, and use thereof in sealants, adhesives, binders and/or surface modifiers |
CN103865464A (en) * | 2014-03-20 | 2014-06-18 | 长春市三化实业有限责任公司 | Water-based conductive adhesive and preparation method thereof |
-
2014
- 2014-10-30 CN CN201410593002.6A patent/CN104371564A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110042004A1 (en) * | 2009-08-19 | 2011-02-24 | Evonik Goldschmidt Gmbh | Curable material comprising silylated polymers containing urethane groups, and use thereof in sealants, adhesives, binders and/or surface modifiers |
CN103865464A (en) * | 2014-03-20 | 2014-06-18 | 长春市三化实业有限责任公司 | Water-based conductive adhesive and preparation method thereof |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106147632A (en) * | 2016-08-08 | 2016-11-23 | 强新正品(苏州)环保材料科技有限公司 | A kind of conductive adhesive |
CN106190010A (en) * | 2016-08-08 | 2016-12-07 | 强新正品(苏州)环保材料科技有限公司 | Conductive adhesive |
CN110016307A (en) * | 2019-05-05 | 2019-07-16 | 合肥凯大新型材料科技有限公司 | A kind of insulating cement that can be used as carries out the secondary conductive pressure sensitive adhesive used |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
EXSB | Decision made by sipo to initiate substantive examination | ||
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WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150225 |