CN104349577A - 双面压接背板及其钻孔方法 - Google Patents
双面压接背板及其钻孔方法 Download PDFInfo
- Publication number
- CN104349577A CN104349577A CN201310335047.9A CN201310335047A CN104349577A CN 104349577 A CN104349577 A CN 104349577A CN 201310335047 A CN201310335047 A CN 201310335047A CN 104349577 A CN104349577 A CN 104349577A
- Authority
- CN
- China
- Prior art keywords
- depth
- backboard
- brill
- control
- deep drilling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Drilling And Boring (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310335047.9A CN104349577B (zh) | 2013-08-02 | 2013-08-02 | 双面压接背板及其钻孔方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310335047.9A CN104349577B (zh) | 2013-08-02 | 2013-08-02 | 双面压接背板及其钻孔方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104349577A true CN104349577A (zh) | 2015-02-11 |
CN104349577B CN104349577B (zh) | 2017-03-29 |
Family
ID=52504085
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310335047.9A Active CN104349577B (zh) | 2013-08-02 | 2013-08-02 | 双面压接背板及其钻孔方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104349577B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105208776A (zh) * | 2015-09-06 | 2015-12-30 | 浪潮电子信息产业股份有限公司 | 一种pcb双面压接的方法 |
CN105472892A (zh) * | 2015-12-30 | 2016-04-06 | 东莞生益电子有限公司 | 一种电路板的制作方法 |
CN105636357A (zh) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | 一种控制背钻孔孔位精准度的方法 |
CN108882525A (zh) * | 2018-08-24 | 2018-11-23 | 郑州云海信息技术有限公司 | 一种pcb板及pcb正反面连接器的压接方法 |
CN112672520A (zh) * | 2021-01-14 | 2021-04-16 | 珠海杰赛科技有限公司 | 一种线路板的压接孔的加工方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040108137A1 (en) * | 2002-12-10 | 2004-06-10 | Litton Systems, Inc. | Cross connect via for multilayer printed circuit boards |
US7337537B1 (en) * | 2003-09-22 | 2008-03-04 | Alcatel Lucent | Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board |
CN102883536A (zh) * | 2012-09-29 | 2013-01-16 | 杭州华三通信技术有限公司 | 一种pcb板通孔加工方法及通孔结构 |
-
2013
- 2013-08-02 CN CN201310335047.9A patent/CN104349577B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040108137A1 (en) * | 2002-12-10 | 2004-06-10 | Litton Systems, Inc. | Cross connect via for multilayer printed circuit boards |
US7337537B1 (en) * | 2003-09-22 | 2008-03-04 | Alcatel Lucent | Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board |
CN102883536A (zh) * | 2012-09-29 | 2013-01-16 | 杭州华三通信技术有限公司 | 一种pcb板通孔加工方法及通孔结构 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105208776A (zh) * | 2015-09-06 | 2015-12-30 | 浪潮电子信息产业股份有限公司 | 一种pcb双面压接的方法 |
CN105472892A (zh) * | 2015-12-30 | 2016-04-06 | 东莞生益电子有限公司 | 一种电路板的制作方法 |
CN105636357A (zh) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | 一种控制背钻孔孔位精准度的方法 |
CN108882525A (zh) * | 2018-08-24 | 2018-11-23 | 郑州云海信息技术有限公司 | 一种pcb板及pcb正反面连接器的压接方法 |
CN112672520A (zh) * | 2021-01-14 | 2021-04-16 | 珠海杰赛科技有限公司 | 一种线路板的压接孔的加工方法 |
Also Published As
Publication number | Publication date |
---|---|
CN104349577B (zh) | 2017-03-29 |
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C06 | Publication | ||
PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. Patentee after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. Patentee before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220915 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. Patentee after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. Patentee before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |
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TR01 | Transfer of patent right |