CN104347545A - Structure with large-power semiconductor module and cooling devcie, cooling system and method for manufacturing structure - Google Patents
Structure with large-power semiconductor module and cooling devcie, cooling system and method for manufacturing structure Download PDFInfo
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- CN104347545A CN104347545A CN201410258530.6A CN201410258530A CN104347545A CN 104347545 A CN104347545 A CN 104347545A CN 201410258530 A CN201410258530 A CN 201410258530A CN 104347545 A CN104347545 A CN 104347545A
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- 238000001816 cooling Methods 0.000 title claims abstract description 94
- 239000004065 semiconductor Substances 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000012530 fluid Substances 0.000 claims abstract description 35
- 230000007704 transition Effects 0.000 claims abstract description 6
- 230000008878 coupling Effects 0.000 claims description 9
- 238000010168 coupling process Methods 0.000 claims description 9
- 238000005859 coupling reaction Methods 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 239000007788 liquid Substances 0.000 abstract 1
- 239000012809 cooling fluid Substances 0.000 description 10
- 239000002826 coolant Substances 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The arrangement has a liquid cooling device including a main body with a main surface, two side surfaces and two longitudinal surfaces. A power semiconductor module is thermally and conductively connected to the main body, where cooling channels extend from one side surface to the other side surface. The main body includes a fluid port on one longitudinal surface, where the fluid port transitions at an angle between 30 and 75 degrees to one side surface and emerges into a connection spacefor the cooling channels. Independent claims are also included for the following: a cooling system a method for manufacturing a cooling arrangement.
Description
Technical field
The present invention relates to a kind of there is high-power semiconductor module and cooling device structure, be a kind ofly provided with the cooling system of this structure and a kind of method for the manufacture of this structure.
Background technology
By prior art, such as, by the known a kind of cooling device for high-power semiconductor module of DE 197 47 321 A1, wherein this cooling device is made up of the cooling body that heat conduction is good, and this cooling body has multiple cooling duct being used for receiving fluidised form coolant.In each cooling duct, be torsionally provided with helical, its external diameter is equally large with the in-profile of cooling duct.The access aperture of cooling device and tap are offsettingly arranged on side, therefore there is not the pipe preferably with more small flow resistance.
Flow can not match with each pipe at this, or could can only mate with huge cost.In addition, the cooling duct of each outside is preferred with regard to flow.
Summary of the invention
On the basis of the above-mentioned fact, the object of the invention is, propose a kind ofly have the structure of high-power semiconductor module and cooling device and a kind of especially preferred method being used for manufacturing this structure, wherein the flow of multiple cooling duct can carry out regulating and to compensate or balanced simultaneously or alternatively in its ratio.
This object by the present invention by have claim 1 feature structure and by being achieved by method according to claim 14.Preferred embodiment is described in each dependent claims.
Have in the structure of high-power semiconductor module and cooling device by of the present invention, cooling device is configured to the fluid cooling device with square main body and first side element, this main body has the first and second interareas arranged in parallel, side and vertical face, and wherein high-power semiconductor module to be arranged on the first interarea and to be connected with main body with heat conduction.Multiple cooling duct extends through main body from the first side towards the second side, on the first side wherein abutting in main body and the groove had towards this first side, cooling duct is led in this groove and this groove constitutes connection space for these cooling ducts first side elements into intimate.Main body has first fluid interface on its first longitudinal side, wherein first fluid interface transitions is in the first interface channel, and this interface channel is discharged on the first side with the first angle between 30 ° and 75 ° and on the first entrance, is communicated to first connection space at this place.
In principle as equivalent solution, connection space also can be arranged in main body partly or fully, and its mode arranges groove similarly in side member.
Described high-power semiconductor module refers at least one high-power semiconductor module certainly, and wherein multiple power semiconductor component can be arranged in main body.
Preferably, first interface channel has the first width and the first cross section when first fluid interface transitions, and have the second width and the second cross section on the first entrance of the first connection space, wherein the second cross section has the area of 75% to 125% of the first cross section.At this, first, second or two cross sections are all configured to circle.First and second cross sections are at this and always refer to surface perpendicular to flow direction below.Width is defined as the width of these cross sections equally.
Equally, first fluid interface and the first affiliated side can have spacing, and this spacing is between 0.5 to 5 times of the first width.
First interface channel preferably have straight, perpendicular to the first passage portion section of the first side and straight second channel portion section, this second channel portion section is led to the first connection space with the first angle from the first side, wherein these two channel part sections have transitional region, and these two channel part sections couple together by this transitional region.
Also advantageously, cooling duct has the 3rd width and mutual equidistant spacing, and this spacing is 0.2 to 3 times of the 3rd width.At this, the width of cooling duct refers to the interarea that is parallel to main body and the width of flow direction perpendicular to the cooling fluid of coolant.At this, the first entrance has spacing at this and adjacent cooling duct, and this spacing is 0.5 to 5 times of the mutual spacing in cooling duct.
The groove of first side element has the 3rd cross section of U-shaped in a preferred manner.3rd cross section can have spacing constant in length and (this side is subordinated to the first entrance) continues or the reduction of non-continuous ground from the side.The area of the 3rd cross section is at this and hereafter certainly only referring to the relevant range between the first entrance and last cooling duct.Reduce constantly and herein means, the diameter in the relevant range between the first entrance to last cooling duct is not increase, but reduces.The minimizing of non-continuous ground should refer at this, and diameter becomes greatly in short scope, to form minor air cell near the first entrance.
Especially advantageously, main body is symmetrical towards its mid-plane and therefore also has second fluid interface, wherein second fluid interface transitions is in the second interface channel, and this interface channel is discharged on the second side with the second angle between 30 ° and 75 ° and on the second entrance, is communicated to second connection space at this place of second side element equally.Mid-plane herein means symmetrical plane, and it is parallel to side and carries out extending and split interarea and vertical face from centre.At this especially advantageously, the first and second fluid interfaces are arranged side by side in a longitudinal direction of the main body.
Have two said structures by cooling system of the present invention, it only has a fluid interface respectively.These two structures be parallel to each other by its second side and specular arrange, and to be connected to each other by extra jockey.
For this reason especially advantageously, this jockey is coupling device, and it makes the cooling duct of the affiliated mutual alignment of two structures be interconnected respectively.
This especially preferred feature being used for manufacturing the method for the structure with high-power semiconductor module and cooling device is especially following main method step, and wherein this cooling device is configured to fluid cooling device:
A) extrude manufacture main body by aluminum or aluminum alloy, wherein form cooling duct at this;
B) form the first and second channel part sections, mode vertically introduces first passage portion section from the first vertical face of main body, and wherein second channel portion section is introduced with the first angle between 30 ° and 75 ° by the first side; First and second channel part sections are preferably introduced by cutting process respectively at this;
C) side member and high-power semiconductor module are set.
Should be understood that each structural scheme of the present invention can realize individually or in the combination itself do not repelled arbitrarily, to realize improving.Whether the feature more than mentioned and set forth especially is mentioned irrelevant with them in the framework of the method and content, and can not only apply in the combination mentioned, and can also apply in other combination or individually, and can not depart from scope of the present invention.
Accompanying drawing explanation
Other elaboration of the present invention, favourable details and feature are all from the following description of the embodiment shown in the Fig. 1 to 7 by structure of the present invention or from part description wherein.
Fig. 1 overlooks at interarea the first structural scheme that there is shown by structure of the present invention, and this structure has high-power semiconductor module and cooling device;
Fig. 2 shows the second structural scheme by structure of the present invention in a top view;
Fig. 3 shows by the first cooling system of the present invention in a top view;
Fig. 4 shows by the second cooling system of the present invention in a top view;
Fig. 5 shows the side member by structure of the present invention in cross-section;
Fig. 6 in the first side depending on there is shown by the first structure of the present invention;
Fig. 7 in the first vertical face depending on there is shown by the first structure of the present invention.
Embodiment
Fig. 1 is at the profile overlooking the first structural scheme that there is shown by structure of the present invention of interarea, and this structure has high-power semiconductor module and cooling device.Main body 30 is shown at this, it has the first and second interareas 300,301 (see Fig. 6) arranged in parallel, the first and second vertical faces 304,305, side 302,303 and first and second, and have four cooling ducts, these cooling ducts extend to the second side 303 from the first side 302.Because main body 30 is made by aluminium or by the alloy mainly containing aluminium in extrusion, construct these cooling ducts 32 with this.
Also see Fig. 6, the first interarea 300 arranges multiple high-power semiconductor module 2, merely illustrates one of them for clarity.The high-power semiconductor module that these high-power semiconductor modules 2 are preferably made with conventionally form, they typically have the highest cooling requirement partly in the scope of the power semiconductor component 20 schematically shown equally.Show through simulation, the cooling duct in the middle of in the cooling device by described prior art just in time has the cooling fluid flow less than each external refrigeration passage usually, and therefore has less cooling power.On the other hand, the power semiconductor component be arranged on above cooling during rolling passage needs the highest cooling power mostly, because compared with the power semiconductor component 20 be arranged on above external refrigeration passage, the heat dissipation of side can only realize with less degree.
Cooling device 3 also has first side element 40 (in this case make view clear and illustrate separatedly), it closely (exemplarily by being threaded and unshowned potted component of schematically showing) be arranged on the first side 302 of main body 30.First side element 40 abuts on the side of the first side 302 at it has the first groove 42.Therefore this groove forms connection space 420, and all cooling ducts are all led in this connection space.This groove 42 has the 3rd cross section of U-shaped at this, and their area is all constant at this in whole correlation length.
By the present invention, main body 30 has first fluid interface 34 on its first longitudinal side 304.This first fluid interface 34 can as directedly equally be configured to be threaded, and is used for inputting or discharge the device of cooling fluid and can be arranged on this is threaded.
This first fluid interface 34 is transitioned in the first interface channel 36, and this interface channel has straight first passage portion section 360, and this channel part section first longitudinal side 304 that is equally preferably perpendicular to as shown extends in main body 30.First interface channel 36 also has straight second channel portion section 370, and it leads in the first connection space 420 from the first side 302 the first entrance 30 with the first angle.These two channel part sections 360,370 have common transitional region 364 in the volume of main body 30.First passage portion section 360 is vertically incorporated in main body 30 by cutting way (such as boring or milling mode) at this from the first vertical face 304.Second channel portion section 370 is incorporated in main body 30 with the first angle [alpha] from the first vertical face 302 by cutting way equally at this.
First interface channel 36 has the first width 362 from the transition part of first fluid interface 34 and is being configured to the first circular cross section in its further trend.Equally, the second interface channel 37 has the second width 372 and is configured to the second circular cross section equally on the first entrance 38 of the first connection chamber 420 in its other trend.In this structural scheme, the second cross section has the area of 90% of the first cross section, therefore improves the flowing velocity of cooling fluid.
Fig. 2 with Fig. 1 similar depending on there is shown the second structural scheme by structure of the present invention, wherein in order to make, view is clear does not illustrate high-power semiconductor module, and illustrate only cooling device.Second structural scheme be mainly by the difference of the structural scheme of Fig. 1, main body 30 construct towards its mid-plane 9 be symmetrical.Therefore, main body 30 has second fluid interface 54.At this, the first and second fluid interfaces 34,56 on the longitudinal direction of main body 30 abreast but arrange separatedly.
Second fluid interface 54 is transitioned in the second interface channel 56, this interface channel is discharged so that the second angle (identical with the first angle) is upper in the second side 303 (see Fig. 1) of main body 30, and leads on the second entrance in second connection space 620 at this place of second side element 60.
Composition graphs 1,2, each groove 42,62 specular ground of the first and second side member 40,60 has the 3rd cross section of identical U-shaped.3rd cross section has the area continuing reduction from each side in correlation length.This side is subordinated to respective entrance 38.
In addition, Fig. 2 also show cooling fluid via the inflow effect by interface channel of the present invention.Cooling fluid is discharged from interface channel with an angle (preferably with the angle of 50 ° to 60 °), this generates eddy current, and this eddy current is responsible for realizing uniform flow in the cooling channel.Principal character of the present invention is that cooling fluid is discharged from entrance with the angle of regulation.This fine adjustment is realized by the relative position of this entrance and cooling duct.See Fig. 6, simulation shows, the minimum flow of flow-rate ratio of through-flow best cooling duct is high at most 5 times in the prior art.As in the structural scheme of advising herein, these differences in the scope of 30% to 40%, and do not have other to be used for regulating or guiding the measure of fluid.
Fig. 3 shows in a top view by the first cooling system 10 of the present invention.This cooling system 10 is made up of two structures 3 by Fig. 1, wherein these two structures 3 be parallel to each other by its second side 303 (with reference to Fig. 1) and specular arrange, and to be connected to each other by extra jockey.This extra jockey is made up of coupling device 70 at this, and this coupling device makes the cooling duct 32 of the affiliated mutual alignment of these two structures 3 or main body 30 be interconnected respectively.Therefore, create the cooling duct linked together to a certain extent, they linearly extend through two structures 3 and coupling device 70.
Side member 40,60 forms the termination place of cooling system respectively.In this cooling system 10, first fluid interface 34 exemplarily plays inlet port, and cooling fluid to be arrived in the first connection space 420 by the first entrance 38 via the first interface channel 36 by this fluid interface.This cooling fluid is arrived in the second connection space 620 by these cooling ducts, and is arrived in the second interface channel 56 from this by the second entrance 58.So, the outlet that this affiliated second fluid interface 54 is used as cooling fluid is used.
In addition, this coupling device 70 forms extra jockey, is used for realizing the mechanical connection of two structures 3.In addition, this coupling device 70 or each main body 30 to be attached thereto provide sealing device, are used for realizing liquid-tight connection.
High-power semiconductor module 2 is arranged in these two structures.One in these high-power semiconductor modules 2 is schematically show only at this.
Fig. 4 shows in a top view by the second cooling system of the present invention.This cooling system also has two structures, and they mutually by its second side 303 (with reference to Fig. 1) arrange and be connected to each other by extra jockey in specular ground.This jockey has auxiliary body 80 and two coupling devices 70, and this auxiliary body and main body 30 construct similarly.This auxiliary body is identical with main body, but does not certainly have fluid interface and interface channel.By the main body 30 of structure 3 and auxiliary body 80 and other structure 3 are formed a line, form a line with main body 30 again, create the cooling duct linked together to a certain extent, they linearly extend through cooling system 10.
High-power semiconductor module 2 is arranged on this main body 30 and auxiliary body 80.One in these high-power semiconductor modules 2 is schematically show only at this.
Fig. 5 is illustrating the side member by structure of the present invention from the cross section viewed from the vertical face of affiliated main body.Can see at this groove opened wide towards the side 302 belonging to main body, this groove forms connection space 420 (with reference to Fig. 1) in the structure towards main body 30.This groove is configured to U-shaped, and has the 3rd cross section.
Fig. 6 in the first side of main body depending on there is shown by the first structure of the present invention, it has main body 30 and the high-power semiconductor module 2 of cooling device.High-power semiconductor module is shown schematically as at this has housing 22, large power semiconductor component 20, electric insulation and the matrix 26 of heat conduction and interface arrangement 24.
Fig. 6 also show cooling duct 32, and compared with circular structure, they have that expand surface, starlike structure at this.Always make great efforts in principle cooling duct is formed like this, namely effectively make heat be transformed into coolant from cooling body material as far as possible.The mode of texturing of the structural scheme (especially conventional structural scheme) of cooling duct is not theme of the present invention.
Cooling duct 32 has the 3rd unified width 320 and mutual equidistant spacing 322 respectively, and this spacing is about 0.5 times of the 3rd width at this.
First entrance 38 is in this and adjacent cooling duct 32 tool spacing 34, and this spacing is 2 times of the mutual spacing 322 in cooling duct.
Fig. 7 in the first vertical face 304 of main body depending on there is shown by the first structure 1 of the present invention.Also schematically show high-power semiconductor module, first fluid interface 34 and be connected to first interface channel 36 (see Fig. 1) with the first width 362 above it.Fluid interface 34 and the spacing 340 of the first affiliated side 302 are 2.5 times of the first width 362 of the first interface channel at this.
Claims (15)
1. one kind has the structure (1) of high-power semiconductor module (2) and cooling device (3), wherein, this cooling device (3) is configured to have square main body (30) and the fluid cooling device of first side element (40), this main body has the first interarea arranged in parallel and the second interarea (300, 301), first side and the second side (302, 303) and the first vertical face and the second vertical face (304, 305), wherein, this high-power semiconductor module (2) is arranged on this first interarea (300) and goes up and be connected with this main body (30) heat conduction, wherein, multiple cooling duct (32) extends through this main body (30) from this first side (302) towards this second side (303), the first side (302) that this first side element (40) closely abuts in this main body (30) is gone up and the groove (42) had towards this first side (302), this cooling duct (32) is communicated in this groove and this groove is configured for the connection space of this cooling duct (32), wherein, this main body (30) has first fluid interface (34) on this first vertical face (304), wherein, this first fluid interface (34) is transitioned into the first interface channel (36), this first interface channel is discharged so that the first angle (α) between 30 ° to 75 ° is upper in this first side (302) and is communicated to the first connection space (420) at the first entrance (38).
2. structure according to claim 1, wherein, described first interface channel (36) has the first width (362) and the first cross section at the transition part of described first fluid interface (34), and on first entrance (38) of described first connection space (420), there is the second width (372) and the second cross section, wherein, described second cross section has the area of 75% to 125% of the first cross section.
3. structure according to claim 2, wherein, described first, second or two cross sections are all configured to circle.
4. structure according to claim 2, wherein, described first fluid interface (34) and described first side (302) have spacing (340), and this spacing is between 0.5 to 5 times of described first width (362).
5. the structure according to any one of the claims, wherein, described first interface channel (36) have straight, perpendicular to first passage portion section (360) of the first side (304) and straight second channel portion section (370), this second channel portion section is communicated to described first connection space (420) with the first angle (α) from this first side (302), further, this first and second channel parts section (360,370) has transitional region (364).
6. structure according to any one of claim 1 to 4, wherein, described cooling duct (32) have the 3rd width (320) and mutual equidistant spacing (322), and this spacing is 0.2 to 3 times of the 3rd width.
7. structure according to claim 6, wherein, described first entrance (38) and adjacent cooling duct (32) have spacing (324), and this spacing is 0.5 to 5 times of the mutual spacing (322) in cooling duct.
8. structure according to any one of claim 1 to 4, wherein, the groove (42) of described first side element (40) has the 3rd cross section of U-shaped.
9. structure according to claim 8, wherein, described 3rd cross section there is area constant in length and from be subordinated to the first entrance side continue or non-continuous reduce.
10. structure according to any one of claim 1 to 4, wherein, described main body (30) constructs symmetrically about its mid-plane (9) and has second fluid interface (54), wherein, this second fluid interface (54) is transitioned in the second interface channel (56), and this second interface channel is discharged with the second angle between 30 ° and 75 ° and is communicated to the second connection space of second side element (60) at the second entrance on the second side (303).
11. structures according to claim 10, wherein, described first and second fluid interfaces (34,56) are arranged abreast on the longitudinal direction of described main body (30).
12. 1 kinds of cooling systems (10), it has two structures according to any one of claim 1 to 9, wherein, these two structures be parallel to each other by respective the second side (303) and specular arrange, and to be connected to each other by extra jockey.
13. cooling systems according to claim 12, wherein, described jockey is coupling device (70), and this coupling device makes the cooling duct (32) of the affiliated mutual alignment of described two structures be interconnected respectively.
14. 1 kinds are used for manufacture and have the method for the structure of high-power semiconductor module (2) and cooling device (3), wherein this cooling device (3) is configured to fluid cooling device, and the feature of the method is especially following main method step:
A) extrude manufacture main body by aluminum or aluminum alloy, wherein, form cooling duct (32) at this;
B) the first and second channel part sections (360,370) are formed, mode vertically introduces first passage portion section (360) from the first vertical face (304) of main body (30), and wherein, described second channel portion section (370) is introduced with the first angle (α) between 30 ° and 75 ° by the first side (302);
Side member (40) and high-power semiconductor module (2) c) are set.
15. by method according to claim 14, and wherein, described first and second channel part sections (360,370) are introduced by cutting process respectively.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102013108086.3 | 2013-07-29 | ||
| DE201310108086 DE102013108086B3 (en) | 2013-07-29 | 2013-07-29 | Cooling arrangement for use in cooling system for power semiconductor module, has main body including fluid port that transitions at specific angle to one side surface of main body, and emerges into connection space for cooling channels |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104347545A true CN104347545A (en) | 2015-02-11 |
| CN104347545B CN104347545B (en) | 2018-11-02 |
Family
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420310018.7U Expired - Fee Related CN204088295U (en) | 2013-07-29 | 2014-06-11 | There is structure and the cooling system of high-power semiconductor module and cooling device |
| CN201410258530.6A Active CN104347545B (en) | 2013-07-29 | 2014-06-11 | Structure, cooling system with high-power semiconductor module and cooling device and the method for manufacturing the structure |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420310018.7U Expired - Fee Related CN204088295U (en) | 2013-07-29 | 2014-06-11 | There is structure and the cooling system of high-power semiconductor module and cooling device |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN204088295U (en) |
| DE (1) | DE102013108086B3 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793700A (en) * | 2016-12-29 | 2017-05-31 | 广东美的暖通设备有限公司 | Heat sink assembly, electric-controlled box and refrigeration system for electric-controlled box |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3937130A1 (en) * | 1989-11-08 | 1990-05-31 | Asea Brown Boveri | Box-type cooler - for power semiconductor modules insulated by layer of specified plastic material |
| DE19646195A1 (en) * | 1996-11-08 | 1998-05-14 | Austerlitz Electronic Gmbh | Modular, extruded, liquid-cooling body with adjustable characteristic |
| EP1089604A1 (en) * | 1999-08-30 | 2001-04-04 | Electric Boat Corporation | Heat transfer cold plate arrangement |
| DE10203238A1 (en) * | 2002-01-28 | 2003-06-05 | Siemens Ag | Cooling component has U-profiles with connection arrangements, cooling profile apertures forming flow chambers with U-profiles, which are irreversibly joined to cooling profile |
| DE102011008355A1 (en) * | 2011-01-12 | 2012-07-12 | Volkswagen Ag | Device for guiding cooling fluid i.e. cooling water, in power electrical or electronic element refrigerating arrangement of e.g. electrical vehicle, has throughable cooling channel via which fluid flows from inlet opening to outlet opening |
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2013
- 2013-07-29 DE DE201310108086 patent/DE102013108086B3/en active Active
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2014
- 2014-06-11 CN CN201420310018.7U patent/CN204088295U/en not_active Expired - Fee Related
- 2014-06-11 CN CN201410258530.6A patent/CN104347545B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3937130A1 (en) * | 1989-11-08 | 1990-05-31 | Asea Brown Boveri | Box-type cooler - for power semiconductor modules insulated by layer of specified plastic material |
| DE19646195A1 (en) * | 1996-11-08 | 1998-05-14 | Austerlitz Electronic Gmbh | Modular, extruded, liquid-cooling body with adjustable characteristic |
| EP1089604A1 (en) * | 1999-08-30 | 2001-04-04 | Electric Boat Corporation | Heat transfer cold plate arrangement |
| DE10203238A1 (en) * | 2002-01-28 | 2003-06-05 | Siemens Ag | Cooling component has U-profiles with connection arrangements, cooling profile apertures forming flow chambers with U-profiles, which are irreversibly joined to cooling profile |
| DE102011008355A1 (en) * | 2011-01-12 | 2012-07-12 | Volkswagen Ag | Device for guiding cooling fluid i.e. cooling water, in power electrical or electronic element refrigerating arrangement of e.g. electrical vehicle, has throughable cooling channel via which fluid flows from inlet opening to outlet opening |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793700A (en) * | 2016-12-29 | 2017-05-31 | 广东美的暖通设备有限公司 | Heat sink assembly, electric-controlled box and refrigeration system for electric-controlled box |
Also Published As
| Publication number | Publication date |
|---|---|
| CN204088295U (en) | 2015-01-07 |
| CN104347545B (en) | 2018-11-02 |
| DE102013108086B3 (en) | 2014-08-21 |
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