CN104342058B - A kind of preparation method of photocuring anisotropic conductive film - Google Patents
A kind of preparation method of photocuring anisotropic conductive film Download PDFInfo
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Abstract
A kind of photocuring anisotropic conductive film, it includes a plastic film substrate, an anisotropic conductive adhesive layer；This anisotropic conductive adhesive layer is coated on a kind of light-cured type anisotropic conductive on this plastic film substrate and is formed by hot air drying；This light-cured type anisotropic conductive is made up of according to the component of mass percent following: simple function group photocuring activated monomer 5-11%；Polyfunctional group photocuring activated monomer 6-12%；Light-cured resin 10-15%；Light trigger 5-8%；Film-forming resin 30-49%；Elastomer 10-20%；Nanometer insulating particle 8-16%；Electrically conductive particles 3-12%；Levelling agent 1.0-3.0%；Coupling agent 2-5%；Polymerization inhibitor 0.02-0.05%.Anisotropic conductive film prepared by the present invention is particularly well-suited to the bonding between transparent conductive substrate (such as photoconductive film and electro-conductive glass) and flexible circuit board.
Description
Technical field
The present invention relates to UV solidification anisotropic conductive (ACA), anisotropic conductive film (Anisotropic Conductive
Film, ACF) and preparation method thereof, belong to microelectronics Packaging field.
Background technology
Generally, anisotropic conductive film (Anisotropic Conductive Film:ACF) has unilateal conduction concurrently and glues
Connect fixing function, be currently used for COG (chip on glass, chip glass), TCP (Tape Carrier Package, band
Carry encapsulation)/COF (Chip On Film, chip on film), FPC (Flexible printed circuit, flexible PCB) etc.
Hot pressing bonding machines is used when microcircuit connects.But, recent electronic product is (as mobile phone, panel computer, Wearable electronics produce
Product ...) constantly to miniaturization, thin type and scratch shape direction and develop, more and more use blooming or ultra-thin glass is micro-
The LCD liquid crystal display screen of circuit substrate and touch screen.
Due to blooming and ultra-thin glass and anisotropic conductive film hot press under too high temperature and pressure, can cause
The problem that the pyrolytic damage of circuit and thermal expansion and thermal-shrinkage differential etc. cause.Such as, the ACF module of hot setting is high at high temperature
In wet reliability testing, the problem that As time goes on switching performance reduces.Under the bonding pressure that ultra-thin glass is bigger
It is easily broken.Therefore lower ACF solidification temperature (less than e.g.130 DEG C) and less solidifying pressure become the development of ACF bonding
Direction.
Ultraviolet light shows at the applied research of polymer curing reaction, carries out ACF according to ultraviolet light and solidifies bonding, permissible
Reduce the temperature of polymer curing reaction.And the Chinese patent CN101601171A of Sony Chemical provides double-deck ACF, its
In formed by containing light and heat-curing resin containing electroconductive particle layer, its photocuring is used for ACF film forming procedure rather than electronics
Element and microcircuit substrate bonding cohesive process.Chinese patent CN1926675A provides a kind of employing photocuring and carries out ACF nation
Fixed formula and technique, utilize 200mJ/cm2(320-390nm) photocuring location, 170 DEG C/80MPa/10sec hot binding,
The highest this pressure temperature is not suitable for blooming or low temperature requirements that ultra-thin glass is microcircuit substrate, the Japan of BRIDGESTONE
Patent JP H10-338860A proposes a kind of by heat cure or the ACF of photocuring, and its formula is mainly by Polyvinyl acetal tree
Fat is formed.Japan Patent JP H10-338844A proposes another kind of by heat cure or the ACF of photocuring, its formula mainly by
(methyl) acrylic resin is formed.United States Patent (USP) US 20050136246A1 and Chinese patent CN1639294 proposes another kind
By heat cure and the ACF of photocuring, its formula is mainly by acetal resin/modified polyacetal resin/melmac institute
Composition, this ACF can be in 130 DEG C/3MPa/20sec heat cure or 30sec photocuring.Chinese patent CN101724361 propose with
Heat cure promotes the mode of photocuring and it is necessary to carrying out photocuring, if only carrying out single light or heat cure, curing reaction is the completeest
Entirely, curing degree is on the low side.The Chinese patent CN1367219A of Tsing-Hua University mentions containing epoxy resin acrylic acid photocuring ACF,
But do not indicate enforceable concrete composition and condition.Korean Patent KR20110078247, Korean Patent KR20110076050,
Four patents such as Japan Patent JP H6-11683, Chinese patent CN203760001U all propose the UV of Specialty Design and solidify ACF
Bonding equipment.
Summary of the invention
The technical problem to be solved in the present invention is: (FPC on film, flexible PCB bonding exists for FOF to provide one
On film), the photocuring ACF of the transparent circuit board such as FOG (FPC on Glass, flexible PCB bonding is on glass) and preparation thereof
Method, improves the anisotropic conductive film adhesion strength for PET blooming, utilizes photocuring to substitute existing heat cure bonding work
Skill, it is to avoid blooming and ultra-thin glass during bonding, can cause circuit with anisotropic conductive film under too high temperature and pressure
The problem that pyrolytic damage and thermal expansion and thermal-shrinkage differential etc. cause.
In order to solve above-mentioned technical problem, the present invention proposes techniques below scheme: a kind of photocuring anisotropic conductive film, its
Including a plastic film substrate, an anisotropic conductive adhesive layer；
This anisotropic conductive adhesive layer is that a kind of light-cured type anisotropic conductive is coated on this plastic film substrate also
Formed by hot air drying；
This light-cured type anisotropic conductive is made up of according to the component of mass percent following:
Described simple function group photocuring activated monomer is made up of the mixture of following a kind of material or many kinds of substance: methyl
2-(Acryloyloxy)ethanol, methacrylate hydroxypropyl acrylate, (methyl) isobornyl acrylate, ethoxyethoxyethyl acrylic acid
Ester, lauric acid (methyl) acrylate, 2-phenoxyethyl acrylate；
Described polyfunctional group photocuring activated monomer is made up of the mixture of following a kind of material or many kinds of substance: 2-bis-
Methyl propyl ester diacrylate, Tricyclodecane Dimethanol diacrylate, ethoxylated bisphenol A diacrylate, (ethoxyquin-) 2-
Methyl isophthalic acid, 3 propylene glycol diacrylates, two (three) propylene glycol diacrylates, three (2-ethoxy) isocyanuric acid three acrylic acid
Ester, ethoxyquin (the third oxidation) trimethylolpropane trimethacrylate, glycerol propoxylate triacrylate, two-trimethylolpropane
Tetraacrylate, (ethoxyquin) tetramethylol methane tetraacrylate, double pentaerythritol C5 methacrylate, Bis(pentaerythritol) six acrylic acid
Ester；
Described light-cured resin is made up of the mixture of following a kind of material or many kinds of substance: unsaturated polyester (UP), epoxy
Acrylic resin, polyurethane acrylic resin, polyester acrylate resin, polyoxyalkylene acrylate resin, acrylate functional poly-
Acrylic resin, the vistanex containing unsaturated double-bond, various epoxy resin, epoxy-functional polyorganosiloxane resin, have
The resin of vinyl ether functional base；
Described light trigger belongs to radical photoinitiator or cation light initiator, and described light trigger is by following one
The mixture planting material or many kinds of substance forms: benzoin ether derivant, benzil derivatives, Dialkoxy acetophenones, α-
Hydroxyalkyl phenones, α-amine alkyl phenones, acylphosphine oxide, aryl peroxy esters compound, benzoyl formiate, benzophenone/
Tertiary amine, thioxanthone/tertiary amine, anthraquinone/tertiary amine；
Described film-forming resin is made up of the mixture of following a kind of material or many kinds of substance: saturated polyol polyester, benzene
Epoxy resins；
Described elastomer is made up of the mixture of following a kind of material or many kinds of substance: epoxy terminated nitrile rubber, poly-
Propylhomoserin ester rubber, nbr carboxyl terminal, carboxylated nbr, end hydroxy butadiene, thiorubber., acrylic rubber.
Limiting further of technique scheme is: described nanometer insulating particle is by following a kind of material or multiple thing
The mixture composition of matter: nano-ceramic powder, Nano-meter SiO_22, nano-TiO2, nano-calcium carbonate.
Limiting further of technique scheme is: described electrically conductive particles is mixed by following a kind of material or many kinds of substance
Compound forms: copper, nickel, gold, silver, stannum, zinc, palladium, ferrum, tungsten, the metal conductive particles of molybdenum；Polymer microsphere surface be coated with copper,
Nickel, gold, silver, stannum, zinc, the composite conducting particles of palladium.
Limiting further of technique scheme is: described levelling agent is by following a kind of material or two kinds of materials
Mixture forms: polydimethylsiloxane, polyester modified siloxane, polyether modified siloxane, aralkyl modified siloxanes, propylene
Acid esters levelling agent.
Limiting further of technique scheme is: above-mentioned coupling agent is mixed by following a kind of material or many kinds of substance
Compound forms: β-(3.4-epoxy cyclohexyl) ethyl trimethoxy silane, γ-glycidoxypropyl trimethoxy silane, γ-
(methacryloxypropyl) propyl trimethoxy silicane.
Limiting further of technique scheme is: above-mentioned polymerization inhibitor is by following a kind of material or many kinds of substance
Mixture form: hydroquinone, 1,4-benzoquinone, methylnaphthohydroquinone, MEHQ, 2-tert-butyl hydroquinone, to tert-butyl o
Benzodiazepines, 2,5-di-tert-butyl hydroquinone, phenothiazine, tert-butylhydroquinone, 1,4-naphthoquinone.
Limiting further of technique scheme is: this photocuring anisotropic conductive film needs to use a photocuring binding
Device, this photocuring bonding device includes a control unit, a Light Curing Unit, a heat-pressure unit；
This control unit includes a master controller and the memorizer being connected with this master controller, a loader, one shows
Show device, a power supply；
This Light Curing Unit include a UV generator, a UV line source, a quartz glass base, a transparent conductive substrate,
One anisotropic conductive film, a flexible circuit board, a UV protective cover；
This UV generator is connected with this master controller, UV line source respectively；
This quartz glass floor installation is above this UV line source；
This transparent conductive substrate is placed on this quartz glass base；
Some conducting terminals are installed on this transparent conductive substrate；
This anisotropic conductive film is placed on this transparent conductive substrate；
This flexible circuit board is placed on this this anisotropic conductive film；
Some flexible circuit board terminals are installed in this flexible circuit board；
By this anisotropic conductive film, this flexible circuit board and this transparent conductive substrate realize electrically conducting；
This UV protective cover covers on this UV line source, quartz glass base, transparent conductive substrate, anisotropic conductive film, flexibility
The outside of wiring board；
This heat-pressure unit includes a drive part, a hot press parts, a thermal head；
This drive part is connected with this master controller, this hot press parts respectively；
This thermal head is arranged on the lower section of this hot press parts；
This thermal head is arranged on the top of this flexible circuit board.
Limiting further of technique scheme is: UV line source is the UV line source of wavelength 200-400nm；Described
The longest 20-320mm of light-emitting window, wide 2-10mm, the longest 50-100mm, wide 5mm of UV line source；Described UV linear light
The overall dimensions in source is long 100-320mm, wide 30-80mm, high 50-100mm, the longest 50-120mm, wide 30-50mm, high
50-60mm。
In order to solve above-mentioned technical problem, the present invention also proposes techniques below scheme: a kind of photocuring anisotropic conductive film
Preparation method, comprise the following steps:
Step one: weigh simple function group photocuring activated monomer 5-11%, polyfunctional group photocuring according to mass percent
Activated monomer 6-12%, light-cured resin 10-15%, light trigger 5-8%, film-forming resin 30-49%, elastomer 10-
20%, nanometer insulating particle 8-16%, electrically conductive particles 3-12%, levelling agent 1-3%, coupling agent 2-5%, polymerization inhibitor
0.02-0.05%；
Step 2: by light-cured resin, film-forming resin, elastomer, be made up of according to 1:1 mass ratio toluene and ethyl acetate
Solvent put into dispersing mixer add heat fusing, melt temperature is less than 150 DEG C, forms mixture；
Step 3: the mixture obtained by step 2 is cooled to less than 60 DEG C, then by the simple function group photocuring of liquid
Activated monomer and polyfunctional group photocuring activated monomer add in said mixture；
Step 4: nanometer insulating particle is added in said mixture；
Step 5: electrically conductive particles is added in said mixture；
Step 6: light trigger, levelling agent, coupling agent, polymerization inhibitor are added in said mixture, prepares above-mentioned photocuring
Type anisotropic conductive；
Step 7: above-mentioned light-cured type anisotropic conductive is coated on above-mentioned plastic film substrate with coating machine；
Step 8: by the semi-finished product of step 7 gained, by air drier, drying and forming-film, the film of formation is i.e. above-mentioned
Anisotropic conductive adhesive layer, can be prepared by the present invention photocuring anisotropic conductive film without protecting film.
Limiting further of technique scheme is: this preparation method also includes step 9: covered by layer protecting film
On this anisotropic conductive adhesive layer, can be prepared by the present invention photocuring anisotropic conductive film with protecting film.The present invention has
Following beneficial effect:
1, the present invention provides a kind of photocuring ACF for transparent circuit board such as FOF, FOG, and this light-cured type ACF uses
PEPA is as film-forming resin, in order to improve the anisotropic conductive film adhesion strength for PET blooming,
2, photocuring is utilized to substitute existing heat cure bonding process, it is to avoid blooming and ultra-thin glass conduct electricity with anisotropy
Film under too high temperature and pressure during bonding, can cause the pyrolytic damage of circuit and thermal expansion and thermal-shrinkage differential etc. to cause
Problem.
3, on the basis of existing hot press, a UV line source and control circuit are increased, it is achieved photocuring bonding work
Skill.
4, ACF prepared by the present invention is particularly well-suited to transparent conductive substrate (such as photoconductive film and electro-conductive glass) with flexible
Bonding between wiring board.
Accompanying drawing explanation
Fig. 1 is the photocuring bonding process schematic diagram of light-cured type anisotropic conductive film of the present invention.
Fig. 2 is profile and the light-emitting window scale diagrams of the UV line source of photocuring bonding device of the present invention.
Fig. 3 is the technical process control schematic diagram of photocuring bonding device of the present invention.
Detailed description of the invention
1, photocuring anisotropic conductive film:
The present invention proposes a kind of photocuring anisotropic conductive film, and it includes a plastic film substrate, an anisotropic conductive
Layer and one covers the protecting film on this anisotropic conductive adhesive layer.
Described plastic film substrate is PET (polyethylene terephthalate, polyethylene terephthalate)
Material.
This anisotropic conductive adhesive layer is that a kind of light-cured type anisotropic conductive is coated on this plastic film substrate also
Formed by hot air drying.
This light-cured type anisotropic conductive is made up of according to the component of mass percent following:
Described simple function group photocuring activated monomer is made up of the mixture of following a kind of material or many kinds of substance: methyl
2-(Acryloyloxy)ethanol, methacrylate hydroxypropyl acrylate, (methyl) isobornyl acrylate, ethoxyethoxyethyl acrylic acid
Ester, lauric acid (methyl) acrylate, 2-phenoxyethyl acrylate.
Described polyfunctional group photocuring activated monomer is made up of the mixture of following a kind of material or many kinds of substance: 2-bis-
Methyl propyl ester diacrylate, Tricyclodecane Dimethanol diacrylate, ethoxylated bisphenol A diacrylate, (ethoxyquin-) 2-
Methyl isophthalic acid, 3 propylene glycol diacrylates, two (three) propylene glycol diacrylates, three (2-ethoxy) isocyanuric acid three acrylic acid
Ester, ethoxyquin (the third oxidation) trimethylolpropane trimethacrylate, glycerol propoxylate triacrylate, two-trimethylolpropane
Tetraacrylate, (ethoxyquin) tetramethylol methane tetraacrylate, double pentaerythritol C5 methacrylate, Bis(pentaerythritol) six acrylic acid
Ester.
Described light-cured resin is made up of the mixture of following a kind of material or many kinds of substance: unsaturated polyester (UP), epoxy
Acrylic resin, polyurethane acrylic resin, polyester acrylate resin, polyoxyalkylene acrylate resin, acrylate functional poly-
Acrylic resin, the vistanex containing unsaturated double-bond, various epoxy resin, epoxy-functional polyorganosiloxane resin, have
The resin of vinyl ether functional base.
Described light trigger belongs to radical photoinitiator or cation light initiator, and described light trigger is by following one
The mixture planting material or many kinds of substance forms: benzoin ether derivant, benzil derivatives, Dialkoxy acetophenones, α-
Hydroxyalkyl phenones, α-amine alkyl phenones, acylphosphine oxide, aryl peroxy esters compound, benzoyl formiate, benzophenone/
Tertiary amine, thioxanthone/tertiary amine, anthraquinone/tertiary amine.
Described film-forming resin is made up of the mixture of following a kind of material or many kinds of substance: saturated polyol polyester, benzene
Epoxy resins.
Described elastomer is made up of the mixture of following a kind of material or many kinds of substance: epoxy terminated nitrile rubber, poly-
Propylhomoserin ester rubber, nbr carboxyl terminal, carboxylated nbr, end hydroxy butadiene, thiorubber., acrylic rubber.
Described nanometer insulating particle is made up of the mixture of following a kind of material or many kinds of substance: nano-ceramic powder, receive
Rice SiO2, nano-TiO2, nano-calcium carbonate.
Described electrically conductive particles is made up of the mixture of following a kind of material or many kinds of substance: copper, nickel, gold, silver, stannum, zinc,
Palladium, ferrum, tungsten, the metal conductive particles of molybdenum；The composite conducting of copper, nickel, gold, silver, stannum, zinc, palladium it is coated with at polymer microsphere surface
Particle.
Described levelling agent is made up of the mixture of following a kind of material or two kinds of materials: polydimethylsiloxane, poly-
Fat modified siloxane, polyether modified siloxane, aralkyl modified siloxanes, acrylate levelling agent.
Above-mentioned coupling agent is made up of the mixture of following a kind of material or many kinds of substance: β-(3.4-epoxy cyclohexyl) second
Base trimethoxy silane, γ-glycidoxypropyl trimethoxy silane, γ-(methacryloxypropyl) propyl trimethoxy silicon
Alkane.
Above-mentioned polymerization inhibitor is made up of the mixture of following a kind of material or many kinds of substance: hydroquinone, 1,4-benzoquinone, first
Base hydroquinone, MEHQ, 2-tert-butyl hydroquinone, p-tert-Butylcatechol, 2,5-di-tert-butyl hydroquinone, fen
Thiazine, tert-butylhydroquinone, 1,4-naphthoquinone.
2, the preparation method of photocuring anisotropic conductive film:
The preparation method of above-mentioned photocuring anisotropic conductive film, comprises the steps:
Step one: weigh simple function group photocuring activated monomer 5-11%, polyfunctional group photocuring according to mass percent
Activated monomer 6-12%, light-cured resin 10-15%, light trigger 5-8%, film-forming resin 30-49%, elastomer 10-
20%, nanometer insulating particle 8-16%, electrically conductive particles 3-12%, levelling agent 1-3%, coupling agent 2-5%, polymerization inhibitor
0.02-0.05%；
Step 2: by light-cured resin, film-forming resin, elastomer, be made up of according to 1:1 mass ratio toluene and ethyl acetate
Solvent put into dispersing mixer add heat fusing, melt temperature is less than 150 DEG C, forms mixture；
Step 3: the mixture obtained by step 2 is cooled to less than 60 DEG C, then by the simple function group photocuring of liquid
Activated monomer and polyfunctional group photocuring activated monomer add in said mixture；
Step 4: nanometer insulating particle is added in said mixture；
Step 5: electrically conductive particles is added in said mixture；
Step 6: light trigger, levelling agent, coupling agent, polymerization inhibitor are added in said mixture, prepares above-mentioned photocuring
Type anisotropic conductive；
Step 7: above-mentioned light-cured type anisotropic conductive is coated on above-mentioned plastic film substrate with coating machine；
Step 8: by the semi-finished product of step 7 gained, by air drier, drying and forming-film, the film of formation is i.e. above-mentioned
Anisotropic conductive adhesive layer, can be prepared by the present invention photocuring anisotropic conductive film without protecting film.
Following step 9 is optionally, if to prepare the photocuring anisotropic conductive film with protecting film, then
After step 8, proceed step 9: covered on this anisotropic conductive adhesive layer by layer protecting film, can be prepared by containing protection
The photocuring anisotropic conductive film of film.
The light-cured type ACF prepared by the present invention seen from table-1 and table-2 is more suitable for than existing thermohardening type ACF
The bonding under cryogenic conditions between bright electrically-conductive backing plate (such as photoconductive film and electro-conductive glass) and flexible circuit board, and have
Preferably adhesive strength.
The recipe ratio of the heat cure ACF comparative example 1-2 of table-1 photocuring of the present invention ACF embodiment 1-4 and prior art is relatively
(note: in table, the proportioning of each component is mass ratio)
Table-2 photocuring ACF embodiment 1-4 and the Performance comparision of heat cure ACF comparative example 1-2
3, the photocuring bonding device of anisotropic conductive film:
Above-mentioned photocuring anisotropic conductive film, needs to use a kind of photocuring bonding device as shown in Figure 1 to Figure 3, should
Photocuring bonding device includes control unit 30, Light Curing Unit 29, heat-pressure unit 21.
This control unit 30 includes a master controller 23 and memorizer 24, input being connected with this master controller 23
Device 25, one display 26, power supply 27.
This Light Curing Unit 29 includes that UV generator 28, UV line source 10, quartz glass base 11, is transparent leads
Electric substrate 12, one anisotropic conductive film 18, flexible circuit board 16, UV protective cover 22.
This UV generator 28 is connected with this master controller 23, UV line source 10 respectively.
This quartz glass base 11 is arranged on above this UV line source 10.
This transparent conductive substrate 12 is placed on this quartz glass base 11.
Some conducting terminals 13 are installed on this transparent conductive substrate 12.
This anisotropic conductive film 18 is placed on this transparent conductive substrate 12.Containing conductive particle in this anisotropic conductive film 18
Son 14.
This flexible circuit board 16 is placed on this this anisotropic conductive film 18.
Some flexible circuit board terminals 15 are installed in this flexible circuit board 16.
By this anisotropic conductive film 18, this flexible circuit board 16 and this transparent conductive substrate 12 realize electrically conducting.
This UV protective cover 22 covers on this UV line source 10, quartz glass base 11, transparent conductive substrate 12, anisotropy conduction
Film 18, the outside of flexible circuit board 16.
This heat-pressure unit 21 includes drive part 20, hot press parts 19, thermal head 17.
This drive part 20 is connected with this master controller 23, this hot press parts 19 respectively.
This thermal head 17 is arranged on the lower section of this hot press parts 19.
This thermal head 17 is arranged on the top of this flexible circuit board 16.
This anisotropic conductive film 18 is placed between quartz glass base 11 and thermal head 17.This quartz glass base 11 He
This anisotropic conductive film 18 is pressed and heats by thermal head 17.Wherein, quartz glass base 11 allows UV light permeability.UV
The UV light permeability quartz glass base 11 that line source 10 sends, carries out UV light and irradiates solidification this anisotropic conductive film 18.
Above-mentioned UV line source is the UV line source of wavelength 200-400nm.
The longest 20-320mm of light-emitting window, wide 2-10mm, the longest 50-100mm, wide 5mm of UV line source.
The overall dimensions of the light-emitting window size of UV line source is long 100-320mm, wide 30-80mm, high 50-100mm, preferably
For for long 50-120mm, wide 30-50mm, high 50-60mm.
Above-mentioned photocuring bonding device, as long as increase a UV line source and control thereof on the basis of existing hot press
Circuit.Existing heat cure bonding machines, because needing during bonding to make CCD or infrared light para-position, base is constituted by quartz glass,
As long as therefore install the UV line source of a small volume in the lower section of quartz glass base, photocuring bonding work just can be realized
Skill.
Above-mentioned UV line source control circuit is one UV line source of increase on the basis of existing Control of Hot Press Control circuit
Control circuit, UV line source control circuit is incorporated to former Control of Hot Press Control circuit, jointly realizes the control of bonding process.
Wherein Light Curing Unit 29 is to have the UV line source 10 of Fig. 2 profile, is arranged on the quartzy glass of original hot press
In the lower section accommodation space of glass base 11；
UV generator 28 is installed in below the operating board of original hot press in the accommodation space of rack；
Fiber-optic transfer is used between described UV line source and UV generator.
This photocuring bonding device can be by hot-press solidifying and photocuring isolated operation, it is also possible to runs simultaneously, makes former heat
Press has photo-thermal dual curable bonding function.
After this photocuring bonding device also utilizes the control unit control thermal head unit of former hot press to start pressing, warp
Activate UV solidified cell when spending the required time, control radiant intensity and irradiation time that UV solidified cell produces simultaneously.
This photocuring bonding device utilizes the pressure head of the memorizer memory response presser unit in former Control of Hot Press Control unit
By the precompressed required time of anisotropic conductive film.Memorizer can be additionally used in radiant intensity and the irradiation of memory response UV solidified cell
Time.
This photocuring bonding device utilizes the various parameters of the display display photocuring bonding of former Control of Hot Press Control unit
And running status.
This photocuring bonding device utilize former Control of Hot Press Control unit loader input various parameters.
4, the key operation step using this photocuring bonding device to carry out bonding process process is as follows:
Step 1: transparent conductive substrate 12 to be pressed is placed on the quartz glass base 11 of above-mentioned photocuring bonding device；
Step 2: start CCD (or infrared light) alignment device, carries out flexible circuit board 16 and has attached anisotropy conduction
The para-position of the transparent conductive substrate 12 of film 18；
Step 3: the platform that para-position is good is moved the top to UV line source 10, the lower section of thermal head 17, master controller 23
After startup thermal head unit 21 starts pressing, and after the set time, master controller 23 activates UV solidified cell 29, complete
Become photocuring bonding process.
Claims (2)
1. the preparation method of a photocuring anisotropic conductive film, it is characterised in that:
Above-mentioned photocuring anisotropic conductive film includes a plastic film substrate, an anisotropic conductive adhesive layer；
This anisotropic conductive adhesive layer is that a kind of light-cured type anisotropic conductive is coated on this plastic film substrate and is passed through
Hot air drying is formed；
This light-cured type anisotropic conductive is made up of according to the component of mass percent following:
Simple function group photocuring activated monomer 5-11%；
Polyfunctional group photocuring activated monomer 6-12%；
Light-cured resin 10-15%；
Light trigger 5-8%；
Film-forming resin 30-49%；
Elastomer 10-20%；
Nanometer insulating particle 8-16%；
Electrically conductive particles 3-12%；
Levelling agent 1.0-3.0%；
Coupling agent 2-5%；
Polymerization inhibitor 0.02-0.05%；
Described simple function group photocuring activated monomer is made up of the mixture of following a kind of material or many kinds of substance: metering system
Acid hydroxyl ethyl ester, methacrylate hydroxypropyl acrylate, (methyl) isobornyl acrylate, ethoxyethoxyethyl acrylate, the moon
Cinnamic acid (methyl) acrylate, 2-phenoxyethyl acrylate;
Described polyfunctional group photocuring activated monomer is made up of the mixture of following a kind of material or many kinds of substance: 2-diformazan
Base propyl ester diacrylate, Tricyclodecane Dimethanol diacrylate, ethoxylated bisphenol A diacrylate, (ethoxyquin-) 2-first
Base-1,3 propylene glycol diacrylate, propylene glycol diacrylate, tripropylene glycol diacrylate, three (2-ethoxy) isocyanide
Uric acid triacrylate, ethoxyquin (third oxidation) trimethylolpropane trimethacrylate, glycerol propoxylate triacrylate, two-
Trimethylolpropane tetra-acrylate, (ethoxyquin) tetramethylol methane tetraacrylate, double pentaerythritol C5 methacrylate, double season penta
Tetrol six acrylate；
Described light-cured resin is made up of the mixture of following a kind of material or many kinds of substance: unsaturated polyester (UP), propylene oxide
Acid resin, polyurethane acrylic resin, polyester acrylate resin, polyoxyalkylene acrylate resin, the polypropylene of acrylate functional
Acid resin, vistanex, epoxy resin, epoxy-functional polyorganosiloxane resin containing unsaturated double-bond, there is vinyl ethers
The resin of functional group；
Described light trigger belongs to radical photoinitiator or cation light initiator, and described light trigger is by following a kind of thing
The mixture composition of matter or many kinds of substance: benzoin ether derivant, benzil derivatives, Dialkoxy acetophenones, α-hydroxyl alkane
Base benzophenone, α-amine alkyl phenones, acylphosphine oxide, aryl peroxy esters compound, benzoyl formiate, benzophenone/uncle
Amine, thioxanthone/tertiary amine, anthraquinone/tertiary amine；
Described film-forming resin is made up of the mixture of following a kind of material or many kinds of substance: saturated polyol polyester, phenoxy
Fat；
Described elastomer is made up of the mixture of following a kind of material or many kinds of substance: epoxy terminated nitrile rubber, poly-propylhomoserin
Ester rubber, nbr carboxyl terminal, carboxylated nbr, end hydroxy butadiene, thiorubber., acrylic rubber；
The preparation method of above-mentioned photocuring anisotropic conductive film comprises the following steps:
Step one: weigh simple function group photocuring activated monomer 5-11%, polyfunctional group photocuring activity according to mass percent
Monomer 6-12%, light-cured resin 10-15%, light trigger 5-8%, film-forming resin 30-49%, elastomer 10-20%, nanometer
Insulating particle 8-16%, electrically conductive particles 3-12%, levelling agent 1-3%, coupling agent 2-5%, polymerization inhibitor 0.02-0.05%；
Step 2: by light-cured resin, film-forming resin, elastomer, by toluene and ethyl acetate according to 1:1 mass ratio form molten
Agent is put into and is added heat fusing in dispersing mixer, and melt temperature is less than 150 DEG C, forms mixture；
Step 3: the mixture obtained by step 2 is cooled to less than 60 DEG C, then by the simple function group photocuring activity of liquid
Monomer and polyfunctional group photocuring activated monomer add in said mixture；
Step 4: nanometer insulating particle is added in said mixture；
Step 5: electrically conductive particles is added in said mixture；
Step 6: light trigger, levelling agent, coupling agent, polymerization inhibitor are added in said mixture, prepares above-mentioned light-cured type different
Side's property conducting resinl；
Step 7: above-mentioned light-cured type anisotropic conductive is coated on above-mentioned plastic film substrate with coating machine；
Step 8: by the semi-finished product of step 7 gained, by air drier, drying and forming-film, the film of formation is i.e. above-mentioned different side
Property conductive adhesive layer, can be prepared by the photocuring anisotropic conductive film without protecting film.
The preparation method of photocuring anisotropic conductive film the most according to claim 1, it is characterised in that this preparation method is also
Including step 9: layer protecting film is covered on this anisotropic conductive adhesive layer, can be prepared by the photocuring with protecting film different
Side's property conducting film.
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| CN106226927A (en) * | 2016-08-29 | 2016-12-14 | 贵州晟昌科技有限公司 | A kind of production technology of liquid crystal module |
| CN107097487B (en) * | 2017-03-24 | 2019-02-26 | 江苏科德宝建筑节能科技有限公司 | A kind of fire-resistant waterproof ventilation film |
| CN107346070B (en) * | 2017-07-11 | 2021-01-19 | 京东方科技集团股份有限公司 | Display substrate |
| CN107987768B (en) * | 2017-12-20 | 2020-06-02 | 广州市嵩达新材料科技有限公司 | Ultraviolet-cured self-repairing coating adhesive and preparation method and application thereof |
| CN109628049A (en) * | 2018-11-09 | 2019-04-16 | 深圳市华星光电技术有限公司 | A kind of anisotropy conductiving glue sticks agent and its conductive film |
| CN110358484A (en) * | 2019-07-23 | 2019-10-22 | 深圳市华星光电技术有限公司 | Conducting resinl and preparation method thereof |
| CN110938402A (en) * | 2019-12-18 | 2020-03-31 | 湖南省和祥润新材料有限公司 | Flame-retardant light-cured adhesive and preparation method thereof |
| CN112898776B (en) * | 2021-01-22 | 2022-12-02 | 镇江中垒新材料科技有限公司 | Anisotropic conductive sheet and preparation method thereof |
| CN113046004A (en) * | 2021-03-23 | 2021-06-29 | 业成科技（成都）有限公司 | Anisotropic conductive adhesive and bonding method |
| CN114774063B (en) * | 2022-04-15 | 2023-06-09 | 烟台万华聚氨酯合成材料有限公司 | Packaging adhesive for OLED flexible display screen and preparation method thereof |
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