CN104339099B - 一种含铜及其合金的中温钎料 - Google Patents
一种含铜及其合金的中温钎料 Download PDFInfo
- Publication number
- CN104339099B CN104339099B CN201410501536.1A CN201410501536A CN104339099B CN 104339099 B CN104339099 B CN 104339099B CN 201410501536 A CN201410501536 A CN 201410501536A CN 104339099 B CN104339099 B CN 104339099B
- Authority
- CN
- China
- Prior art keywords
- solder
- copper
- alloy
- 20min
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 65
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 25
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 25
- 239000010949 copper Substances 0.000 title claims abstract description 25
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 11
- 239000000956 alloy Substances 0.000 title claims abstract description 11
- 229910052709 silver Inorganic materials 0.000 claims abstract description 20
- 239000004332 silver Substances 0.000 claims abstract description 20
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 10
- 239000011574 phosphorus Substances 0.000 claims abstract description 10
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 10
- 239000010703 silicon Substances 0.000 claims abstract description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 7
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000002844 melting Methods 0.000 claims abstract description 4
- 230000008018 melting Effects 0.000 claims abstract description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 6
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910000636 Ce alloy Inorganic materials 0.000 claims description 3
- 241000196324 Embryophyta Species 0.000 claims description 3
- 235000007164 Oryza sativa Nutrition 0.000 claims description 3
- 229910001096 P alloy Inorganic materials 0.000 claims description 3
- 240000003936 Plumbago auriculata Species 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- SKEYZPJKRDZMJG-UHFFFAOYSA-N cerium copper Chemical compound [Cu].[Ce] SKEYZPJKRDZMJG-UHFFFAOYSA-N 0.000 claims description 3
- 239000003610 charcoal Substances 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 239000010903 husk Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 235000009566 rice Nutrition 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 240000007594 Oryza sativa Species 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 7
- 238000005057 refrigeration Methods 0.000 abstract description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 17
- 238000005476 soldering Methods 0.000 description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 238000005219 brazing Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910000635 Spelter Inorganic materials 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 241000209094 Oryza Species 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910001338 liquidmetal Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000004455 differential thermal analysis Methods 0.000 description 1
- 230000005662 electromechanics Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410501536.1A CN104339099B (zh) | 2014-09-27 | 2014-09-27 | 一种含铜及其合金的中温钎料 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410501536.1A CN104339099B (zh) | 2014-09-27 | 2014-09-27 | 一种含铜及其合金的中温钎料 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104339099A CN104339099A (zh) | 2015-02-11 |
CN104339099B true CN104339099B (zh) | 2016-06-01 |
Family
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Family Applications (1)
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---|---|---|---|
CN201410501536.1A Active CN104339099B (zh) | 2014-09-27 | 2014-09-27 | 一种含铜及其合金的中温钎料 |
Country Status (1)
Country | Link |
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CN (1) | CN104339099B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106181123A (zh) * | 2016-08-19 | 2016-12-07 | 佛山晓世科技服务有限公司 | 一种低银中温钎焊料 |
CN108381058A (zh) * | 2018-02-27 | 2018-08-10 | 江苏远方动力科技有限公司 | 一种含Ga低银铜基高性能钎料及其制备方法 |
CN108465974A (zh) * | 2018-02-27 | 2018-08-31 | 江苏远方动力科技有限公司 | 一种低银铜基高性能钎料及其制备方法 |
CN108381060A (zh) * | 2018-05-16 | 2018-08-10 | 中原工学院 | 铜磷基钎料及其应用 |
CN113843546A (zh) * | 2021-09-23 | 2021-12-28 | 金华市金钟焊接材料有限公司 | 一种CuPSnAgNi-Re超银钎料、制备方法及应用 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63313695A (ja) * | 1987-06-12 | 1988-12-21 | Tanaka Kikinzoku Kogyo Kk | 銀ろう合金 |
EP0465861A1 (de) * | 1990-07-04 | 1992-01-15 | Degussa Aktiengesellschaft | Lotlegierung |
CN101786208A (zh) * | 2010-03-25 | 2010-07-28 | 杭州华光焊料有限公司 | 一种新型活性铜磷钎料 |
CN102626837A (zh) * | 2012-05-09 | 2012-08-08 | 哈尔滨工业大学 | 中温铜基钎料及其制备方法 |
CN103358048A (zh) * | 2013-07-25 | 2013-10-23 | 杭州华光焊接新材料股份有限公司 | 一种银铜磷系真空钎料 |
-
2014
- 2014-09-27 CN CN201410501536.1A patent/CN104339099B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63313695A (ja) * | 1987-06-12 | 1988-12-21 | Tanaka Kikinzoku Kogyo Kk | 銀ろう合金 |
EP0465861A1 (de) * | 1990-07-04 | 1992-01-15 | Degussa Aktiengesellschaft | Lotlegierung |
CN101786208A (zh) * | 2010-03-25 | 2010-07-28 | 杭州华光焊料有限公司 | 一种新型活性铜磷钎料 |
CN102626837A (zh) * | 2012-05-09 | 2012-08-08 | 哈尔滨工业大学 | 中温铜基钎料及其制备方法 |
CN103358048A (zh) * | 2013-07-25 | 2013-10-23 | 杭州华光焊接新材料股份有限公司 | 一种银铜磷系真空钎料 |
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Publication number | Publication date |
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CN104339099A (zh) | 2015-02-11 |
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Effective date of registration: 20200629 Address after: 430000 705, 706a, building 1, Huigu spacetime, No.206, laowuhuang highway, Donghu New Technology Development Zone, Wuhan City, Hubei Province Patentee after: Wuhan Tuozhijia Information Technology Co.,Ltd. Address before: Hemudu Site in Yuyao City, Zhejiang Province town Luojiang village 315000 Jiang Ningbo home Patentee before: NINGBO YINMA WELDING TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20201103 Address after: Jiangdong Road, Shuichang Road, Gulou District, Nanjing City, Jiangsu Province, 210000 Patentee after: Li Wenkang Address before: 430000 705, 706a, building 1, Huigu spacetime, No.206, laowuhuang highway, Donghu New Technology Development Zone, Wuhan City, Hubei Province Patentee before: Wuhan Tuozhijia Information Technology Co.,Ltd. |