CN104335604A - Ultrasonic sensor and method for producing same - Google Patents
Ultrasonic sensor and method for producing same Download PDFInfo
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- CN104335604A CN104335604A CN201480001285.9A CN201480001285A CN104335604A CN 104335604 A CN104335604 A CN 104335604A CN 201480001285 A CN201480001285 A CN 201480001285A CN 104335604 A CN104335604 A CN 104335604A
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- recess
- construction element
- ultrasonic sensor
- wiring construction
- housing
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- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 238000003780 insertion Methods 0.000 claims abstract description 28
- 230000037431 insertion Effects 0.000 claims abstract description 28
- 238000010276 construction Methods 0.000 claims description 135
- 238000000034 method Methods 0.000 claims description 18
- 239000011230 binding agent Substances 0.000 claims description 9
- 206010000060 Abdominal distension Diseases 0.000 claims description 2
- 208000024330 bloating Diseases 0.000 claims description 2
- 230000002787 reinforcement Effects 0.000 description 15
- 238000009826 distribution Methods 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 12
- 230000000694 effects Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000005452 bending Methods 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 238000005219 brazing Methods 0.000 description 3
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 3
- 239000011358 absorbing material Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 102220488128 Olfactory receptor 2A12_R62A_mutation Human genes 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000009958 sewing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
- G01S15/88—Sonar systems specially adapted for specific applications
- G01S15/93—Sonar systems specially adapted for specific applications for anti-collision purposes
- G01S15/931—Sonar systems specially adapted for specific applications for anti-collision purposes of land vehicles
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
- G01S7/521—Constructional features
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K9/00—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers
- G10K9/12—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers electrically operated
- G10K9/122—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers electrically operated using piezoelectric driving means
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K9/00—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers
- G10K9/18—Details, e.g. bulbs, pumps, pistons, switches or casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
- G01S15/88—Sonar systems specially adapted for specific applications
- G01S15/93—Sonar systems specially adapted for specific applications for anti-collision purposes
- G01S15/931—Sonar systems specially adapted for specific applications for anti-collision purposes of land vehicles
- G01S2015/932—Sonar systems specially adapted for specific applications for anti-collision purposes of land vehicles for parking operations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
- G01S15/88—Sonar systems specially adapted for specific applications
- G01S15/93—Sonar systems specially adapted for specific applications for anti-collision purposes
- G01S15/931—Sonar systems specially adapted for specific applications for anti-collision purposes of land vehicles
- G01S2015/937—Sonar systems specially adapted for specific applications for anti-collision purposes of land vehicles sensor installation details
- G01S2015/938—Sonar systems specially adapted for specific applications for anti-collision purposes of land vehicles sensor installation details in the bumper area
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Acoustics & Sound (AREA)
- Multimedia (AREA)
- Computer Networks & Wireless Communication (AREA)
- General Physics & Mathematics (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
An ultrasonic sensor equipped with: a damper (40) provided with a first recess (43) and second recesses (44A, 44B); an internal wiring member (50) having one end connected to a piezoelectric element and the other end (52) positioned inside the first recess (43); and an external wiring member (60) having insertion parts (62A, 62B) which are positioned, respectively, inside the second recesses (44A, 44B). Consequently, it is possible to suppress the occurrence of a joining failure between the internal wiring member and the external wiring member.
Description
Technical field
The present invention relates to ultrasonic sensor and manufacture method thereof, especially relate to the inside Wiring construction element that to arrange in housing and power to piezoelectric element and on this inner Wiring construction element, be electrically connected ultrasonic sensor and the manufacture method thereof of outside wiring component.
Background technology
Ultrasonic sensor detects object by sending ultrasonic pulse signal off and on and receiving from the reflected wave of object.Common ultrasonic sensor possesses: piezoelectric element; Accommodate the housing of this piezoelectric element; Be connected with piezoelectric element and the Wiring construction element of drawing to the outside of housing.Wiring construction element comprises situation about being made up of 1 component and situation about being made up of the inside Wiring construction element be electrically connected to each other and this 2 components of outside wiring component.
Japanese Unexamined Patent Publication 2011-250327 publication (patent documentation 1) discloses a kind of ultrasonic sensor.This publication describes following content: use solder to be connected between the terminal of conductive member and the electrode of piezoelectric element, and utilize resin by the covering of the surrounding of this solder, easily can form the structure of brazed portion thus, and can prevent dispersing of solder grain.
Japanese Unexamined Patent Publication 2012-010312 publication (patent documentation 2) also discloses a kind of ultrasonic sensor.This ultrasonic sensor possesses the housing of collecting piezoelectric element.The sidewall portion of housing has thinner wall section in open side, has heavy section at bottom side.Elastic component is provided with between heavy section and terminal retaining member.This publication describes following content: according to this structure, can prevent vibration from sewing, and the reverberation characteristic caused is sewed in improvement vibration.
Japanese Unexamined Patent Publication 04-220900 publication (patent documentation 3) discloses a kind of drip proof type ultrasonic microphone.This publication describes following content: by using vibration-proof rubber, and the detection sensitivity of acoustic receiver signal rises, and can improve in-plant detection perform.
At first technical literature
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2011-250327 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2012-010312 publication
Patent documentation 3: Japanese Unexamined Patent Publication 04-220900 publication
Summary of the invention
The problem that invention will solve
Connect inner Wiring construction element being configured on the piezoelectric element in housing, and use solder etc. this inner Wiring construction element and outside wiring component to be engaged.In the ultrasonic sensor with such structure, easily produce between inner Wiring construction element with outside wiring component engage bad.
The object of the invention is to obtain a kind ofly have the ultrasonic sensor and manufacture method thereof that can suppress to produce between inner Wiring construction element with outside wiring component and engage bad structure.
For solving the scheme of problem
Possess based on ultrasonic sensor of the present invention: the housing having bottom tube-like, piezoelectric element, it is arranged on the inner bottom surface of above-mentioned housing, buffer, it is configured in above-mentioned housing, has interarea, and be provided with the first recess and the second recess at above-mentioned interarea in the opposition side in the face of above-mentioned piezoelectric element side, inner Wiring construction element, its one end is connected with above-mentioned piezoelectric element, and draw from the side at above-mentioned piezoelectric element place towards above-mentioned first recess side, the other end is configured in above-mentioned first recess, and outside wiring component, it has insertion section, above-mentioned insertion section is configured in above-mentioned second recess, this outside wiring component by the opening of above-mentioned housing, draw by the outside to above-mentioned housing, above-mentioned inner Wiring construction element and said external Wiring construction element are inserted in above-mentioned second recess in above-mentioned first recess and by the above-mentioned insertion section of said external Wiring construction element by being inserted into by the above-mentioned other end of above-mentioned inner Wiring construction element and being electrically connected to each other, above-mentioned first recess has from the side at the above-mentioned second recess place inner wall part opposed with the above-mentioned other end of the above-mentioned inner Wiring construction element be configured in above-mentioned first recess.
Preferably, when from above-mentioned first recess of normal direction top view of the bottom surface relative to above-mentioned housing and above-mentioned second recess, when using in above-mentioned second recess from the part being positioned at position farthest above-mentioned first recess is observed as reference position time, above-mentioned inner wall part is formed in the mode between said reference position and above-mentioned inner Wiring construction element.
Preferably, above-mentioned buffer also has with the leading-out portion arranged along the mode that arbitrary path is derived by above-mentioned inner Wiring construction element, preferably, above-mentioned leading-out portion possesses the guide portion arranged towards the inner side depression of above-mentioned buffer, and above-mentioned inner Wiring construction element has the part be configured in guide sections.
Preferably, above-mentioned leading-out portion also has: the bellying bloating setting from above-mentioned interarea towards the side at the opening place of above-mentioned housing; A pair protuberance that side from above-mentioned bellying towards above-mentioned first recess place is projecting, said external Wiring construction element has the part be configured between a pair above-mentioned protuberance.
Preferably, above-mentioned inner Wiring construction element has the extension being configured in above-mentioned first recess side from above-mentioned protuberance observation.
Preferably, above-mentioned interarea is provided with 2 above-mentioned second recesses, said external Wiring construction element has 2 the above-mentioned insertion sections configured respectively in 2 above-mentioned second recesses, and 2 above-mentioned second recesses are formed in the mode be communicated with above-mentioned first recess.
Preferably, the part be electrically connected with above-mentioned inner Wiring construction element in said external Wiring construction element and the part be electrically connected with said external Wiring construction element in above-mentioned inner Wiring construction element along the normal direction of the bottom surface relative to above-mentioned housing mutually towards equidirectional extension.
Preferably, above-mentioned ultrasonic sensor also possesses the binding agent above-mentioned inner Wiring construction element and above-mentioned buffer bondd.
Preferably, above-mentioned ultrasonic sensor also possesses the fixed component installed with above-mentioned buffer phase ground connection, and said external Wiring construction element is pressed against to above-mentioned inner Wiring construction element by above-mentioned fixed component.
Manufacture method based on ultrasonic sensor of the present invention is the manufacture method of above-mentioned ultrasonic sensor, and wherein, above-mentioned ultrasonic sensor possesses: the housing having bottom tube-like, piezoelectric element, it is arranged on the inner bottom surface of above-mentioned housing, buffer, it is configured in above-mentioned housing, has interarea, and be provided with the first recess and the second recess at above-mentioned interarea in the opposition side in the face of above-mentioned piezoelectric element side, inner Wiring construction element, its one end is connected with above-mentioned piezoelectric element, and draw from the side at above-mentioned piezoelectric element place towards above-mentioned first recess side, the other end is configured in above-mentioned first recess, and outside wiring component, it has insertion section, above-mentioned insertion section is configured in above-mentioned second recess, this outside wiring component by the opening of above-mentioned housing, draw by the outside to above-mentioned housing, above-mentioned first recess has from the side at the above-mentioned second recess place inner wall part opposed with the above-mentioned other end of the above-mentioned inner Wiring construction element be configured in above-mentioned first recess, the manufacture method of above-mentioned ultrasonic sensor has: by being inserted in above-mentioned first recess by the above-mentioned other end of above-mentioned inner Wiring construction element, and the operation of above-mentioned inner Wiring construction element is kept at above-mentioned first recess, by being inserted in above-mentioned second recess the above-mentioned insertion section of said external Wiring construction element, and keep the operation of said external Wiring construction element at above-mentioned second recess, by the operation that above-mentioned inner Wiring construction element and said external Wiring construction element are electrically connected to each other.
Invention effect
According to the present invention, can obtain a kind of there is the ultrasonic sensor and manufacture method thereof that can suppress to produce between inner Wiring construction element with outside wiring component and engage bad structure.
Accompanying drawing explanation
Fig. 1 is the cutaway view of the ultrasonic sensor representing execution mode.
Fig. 2 be along the II-II line in Fig. 1 to looking cutaway view.
Fig. 3 is the first stereogram of the ultrasonic sensor representing execution mode.
Fig. 4 is the second stereogram of the ultrasonic sensor representing execution mode.
Fig. 5 is the stereogram of the decomposing state of the ultrasonic sensor representing execution mode.
Fig. 6 is the stereogram of piezoelectric element and the inner Wiring construction element representing that the ultrasonic sensor of execution mode possesses.
Fig. 7 is the first stereogram representing the buffer that the ultrasonic sensor of execution mode possesses.
Fig. 8 is the second stereogram representing the buffer that the ultrasonic sensor of execution mode possesses.
Fig. 9 is the vertical view representing the buffer that the ultrasonic sensor of execution mode possesses.
Figure 10 is the stereogram near the interarea of the buffer that the ultrasonic sensor schematically showing execution mode possesses.
Figure 11 is the first stereogram of the first operation of the manufacture method of the ultrasonic sensor representing execution mode.
Figure 12 is the second stereogram of the first operation of the manufacture method of the ultrasonic sensor representing execution mode.
Figure 13 is the first stereogram of the second operation of the manufacture method of the ultrasonic sensor representing execution mode.
Figure 14 is the second stereogram of the second operation of the manufacture method of the ultrasonic sensor representing execution mode.
Figure 15 is the stereogram of the buffer that the ultrasonic sensor of the first variation representing execution mode possesses.
Figure 16 is the cutaway view of the ultrasonic sensor of the first variation representing execution mode.
Figure 17 is the cutaway view of the ultrasonic sensor of the second variation representing execution mode.
Figure 18 is the stereogram of the ultrasonic sensor of the 3rd variation representing execution mode.
Figure 19 is the vertical view of the buffer that the ultrasonic sensor of the 4th variation representing execution mode possesses.
Figure 20 is the vertical view of the buffer that the ultrasonic sensor of the 5th variation representing execution mode possesses.
Figure 21 is the stereogram of the buffer that the ultrasonic sensor of the 6th variation representing execution mode possesses.
Embodiment
Below, with reference to accompanying drawing, illustrate based on embodiments of the present invention and each variation.In the explanation of execution mode and each variation, when mentioning number and amount etc., except having special situation about recording, scope of the present invention may not be defined in this number and this amount etc.In the explanation of execution mode and each variation, for same parts and suitable parts, sometimes mark that same the repetitive description thereof will be omitted with reference to numbering.
[execution mode]
(ultrasonic sensor 100)
With reference to Fig. 1 ~ Figure 10, the ultrasonic sensor 100 of execution mode is described.Fig. 1 is the cutaway view representing ultrasonic sensor 100.Fig. 2 be along the II-II line in Fig. 1 to looking cutaway view.Fig. 3 and Fig. 4 is first and second stereogram representing ultrasonic sensor 100 respectively.Fig. 5 is the stereogram of the decomposing state representing ultrasonic sensor 100.
With reference to Fig. 1 ~ Fig. 5, ultrasonic sensor 100 possesses: housing 10, piezoelectric element 20 (Fig. 1, Fig. 2, Fig. 5), reinforcement 30, buffer 40, inner Wiring construction element 50, outside wiring component 60 and vibration-damped component 70 (Fig. 1, Fig. 2).In Fig. 3 ~ Fig. 5, in order to clearly show the internal structure etc. of housing 10, do not record vibration-damped component 70.In Fig. 5 and Fig. 7 etc., describe Z-direction, Z1 direction (Fig. 7), Y direction and X-direction.Z-direction represents the normal direction of the base surface (being equivalent to " bottom surface " of the present application) relative to housing 10, and the details about each position all will be described below.Z1 direction represent in Z-direction especially from the side, upper end 12 of housing 10 towards the direction of side, lower end 11.Y direction represents the extended direction of the first recess 43.X-direction represents the direction vertical with Z-direction and Y direction.About these directions, also identical in Fig. 9, Figure 10, Figure 15, Figure 18 described later ~ Figure 21.
(housing 10)
The sidewall of cylindrical shape that housing 10 possesses discoideus base plate and arranges along the periphery of base plate.Housing 10 has side, lower end 11 obturation and the shape having bottom tube-like of upper end 12 side opening.The surface of the inner side of base plate is inner bottom surface 13 (Fig. 1, Fig. 2, Fig. 5).Inner bottom surface 13 is provided with the base 14 (Fig. 5) for configuring reinforcement 30.Housing 10 is such as by having high resiliency and the aluminium of light weight is formed.Housing 10 is by such as to forge such aluminium or cut makes.
(piezoelectric element 20)
Fig. 6 is the stereogram representing piezoelectric element 20 and inner Wiring construction element 50.With reference to Fig. 5 and Fig. 6, piezoelectric element 20 is made up of such as lead zirconate titanate system pottery.Piezoelectric element 20 is configured on the inner bottom surface 13 (Fig. 5) of housing 10, and uses (not shown) such as binding agents and be fixed on inner bottom surface 13.Piezoelectric element 20 has flat shape, and is provided with drive electrode pair in two platen surface.Specifically, piezoelectric element 20 with the platen surface of housing 10 opposite side on be provided with the part of the first drive electrode 21 (Fig. 6) and the second drive electrode 22 (Fig. 6).First drive electrode 21 has the shape of rectangle.Second drive electrode 22 has the shape extending to the platen surface of its opposition side from the platen surface of housing 10 side of piezoelectric element 20.Gap 23 is provided with between the first drive electrode 21 and the second drive electrode 22.By to drive electrode to applying driving voltage, and piezoelectric element 20 carry out diametrically expansion vibrate.The base plate of piezoelectric element 20 and housing 10 can play function as bimorph oscillator.Bimorph oscillator vibrates and bending vibration in the normal direction of the platen surface of piezoelectric element 20 by the expansion of piezoelectric element 20.Vibrated by this bending, the inner bottom surface 13 of housing 10 forms the main vibration area of housing 10.
(reinforcement 30)
Reinforcement 30 has discoid shape and is provided with opening in central authorities.Reinforcement 30 plays function as so-called weight.Reinforcement 30 is made by such as punch forming to have high acoustic resistance.Reinforcement 30 is by such as forming as than the SUS of the density of housing 10 and the high material of rigidity and zinc.Reinforcement 30, by adjustment size (thickness etc.) and shape, also can be made up of the material (aluminium) identical with housing 10.
Reinforcement 30 and the base 14 of housing 10 are configured in (the arrow A R30 with reference in Fig. 5) on the base 14 of housing 10 in contact.By arranging reinforcement 30, the rigidity of peripheral part of the inner bottom surface 13 of housing 10 can be improved, the vibration of the base plate of housing 10 can be suppressed to the transmission of the sidewall of housing 10.Reinforcement 30 not necessarily structure, is therefore arranged as required.
(buffer 40)
Buffer 40 is configured in housing 10.Buffer 40 (also referred to as bolster) such as has elastomeric formed body.Buffer 40 is made up of such as silicon rubber or polyurethane resin.Protuberance 41 (with reference to Fig. 1, Fig. 2, Fig. 8) is provided with in the bottom of buffer 40.Buffer 40 is configured in (the arrow A R40 with reference in Fig. 5) in housing 10 in the mode that protuberance 41 engages with the opening of reinforcement 30.
As shown in Figures 1 and 2, in the present embodiment, protuberance 41 is opposed separated from each other with piezoelectric element 20.It should be noted that, protuberance 41 and piezoelectric element 20 also can contact with each other.Between protuberance 41 and piezoelectric element 20, can the sound-absorbing materials such as polyester felt be set.By using sound-absorbing material, can absorb from the sound wave of piezoelectric element 20 for spilling to the open side of housing 10.In the present embodiment, buffer 40 does not contact with the sidewall of housing 10.It should be noted that, buffer 40 also can have the shape with the sidewall contact of housing 10.
Fig. 7 and Fig. 8 is first and second stereogram representing buffer 40 respectively.Buffer 40, except having protuberance 41 (Fig. 8), also has interarea 42, first recess 43, a pair second recess 44A, 44B, bellying 45A, 45B, columnar part 45C and guide portion 46,47.In the figure 7, in order to clearly show first recess 43 and second recess 44A, 44B etc., a part of cutting of columnar part 45C is represented.It should be noted that, guide portion 46,47 is equivalent to " leading-out portion " of the present invention.
The interarea 42 of buffer 40 forms the part being formed as discoid platen surface in the position of buffer 40.Under the state that buffer 40 is configured in housing 10, interarea 42, under looking squarely observation from Y direction, is positioned at the opposition side with the side faced by piezoelectric element 20.The mode that bellying 45A, 45B and columnar part 45C bloat towards the side at the opening place of housing 10 (side, upper end 12) from interarea 42 with a part for interarea 42 is arranged.Bellying 45A, 45B and columnar part 45C are arranged respectively along a part for the periphery of buffer 40, and are separated from each other setting.
Bellying 45A, 45B have the shape of column.Guide portion 46 is arranged between bellying 45A and bellying 45B.Guide portion 46 has the shape caved in towards protuberance 41 side from the upper surface of bellying 45A, 45B.Bellying 45A, 45B and guide portion 46 are linearly arranged.Guide portion 47 is by arranging the local excision being formed as discoid part formed in the position of buffer 40.In other words, guide portion 47 is formed in the mode caved in towards the inner side of radial direction from the periphery of buffer 40.By guide portion 46 and guide portion 47, form the space (groove shape) with L shape for configuring inner Wiring construction element 50.
First recess 43 and second recess 44A, 44B are located at interarea 42.When centered by the position forming bellying 45A, 45B and guide portion 46 when top view buffer 40, the first recess 43 and second recess 44A, 44B are positioned at the opposition side of the side arranging guide portion 47.The mode that first recess 43 and second recess 44A, 44B cave in towards protuberance 41 side with a part for interarea 42 is formed.
First recess 43 is arranged along the end face 45S of bellying 45A, 45B, forms rectangular-shaped space (receiving space).First recess 43 extends along the direction (Y direction in Fig. 7) identical with the direction that bellying 45A, 45B and guide portion 46 arrange.When observing in the Z-axis direction, the first recess 43 extends along from the side, upper end 12 of housing 10 (Fig. 3 etc.) towards the direction (the Z1 direction in Fig. 7) of side, lower end 11.In the first recess 43, be configured with a part (other end 52) for inner Wiring construction element 50, details are described below.
Second recess 44A, 44B, by a part for the inner peripheral surface of the first recess 43 excision being formed respectively, the direction (Y direction in Fig. 7) that the first recess 43 extends arranges spaced apart from each other.When observing in the Z-axis direction, second recess 44A, 44B also extends along from the side, upper end 12 of housing 10 (Fig. 3 etc.) towards the direction (the Z1 direction in Fig. 7) of side, lower end 11.Second recess 44A, 44B forms the space (receiving space) of shape cylinder being axially divided into two halves.In the second recess 44A, be configured with the front end 62A (insertion section) of the pin terminal 61A of outside wiring component 60, details are described below.The front end 62B (insertion section) of the pin terminal 61B of outside wiring component 60 is configured with in the second recess 44B.
(inner Wiring construction element 50)
Inner Wiring construction element 50 (Fig. 5 reference) comprises one end 51 and the other end 52, has banded shape.Inner Wiring construction element 50 has the function supplied to piezoelectric element 20 from the driving voltage of outside wiring component 60 described later.As inner Wiring construction element 50, use such as flexible print substrate (Flexible Printed Circuits) etc.As shown in Figure 6, the platen surface of piezoelectric element 20 side of inner Wiring construction element 50 is formed with multiple Wiring pattern (first distribution 57 and the second distribution 58).
One end 51 of inner Wiring construction element 50 is electrically connected with piezoelectric element 20.Specifically, the first distribution 57 of inner Wiring construction element 50 is electrically connected with the first drive electrode 21 of piezoelectric element 20.Inner second distribution 58 of Wiring construction element 50 is electrically connected with the second drive electrode 22 of piezoelectric element 20.Midway part 53 between one end 51 and the other end 52 is drawn from the side at piezoelectric element 20 place towards interarea 42 (the first recess 43) side.Midway part 53 is to bend along the surface in guide portion 46,47 or bend and configured by the mode in guide portion 46,47.
The part of the other end 52 side of inner Wiring construction element 50 has T-shaped shape.The other end 52 of inner Wiring construction element 50 comprises extension 52A, 52B (Fig. 5).Extension 52A, 52B have the shape of extending on the direction (Y direction in Fig. 5) orthogonal with the direction that midway part 53 extends (X-direction in Fig. 5).First recess 43 that is inserted partially into of the other end 52 side of inner Wiring construction element 50 configures (the arrow A R50 with reference in Fig. 5, Fig. 7) interiorly.At this, the first recess 43 has from the side at second recess 44A, 44B place inner wall part 43C opposed with the other end 52 of the inside Wiring construction element 50 be configured in the first recess 43.The other end 52 of inner Wiring construction element 50 has the elastic force (recuperability) of the midway part 53 of inner Wiring construction element 50, therefore, when the other end 52 of inner Wiring construction element 50 is inserted in the first recess 43, front end 62A, 62B of pin terminal 61A, 61B are sandwiched by the other end 52 of inner Wiring construction element 50 and the internal perisporium of second recess 44A, 44B, and are engaged by the inner wall part 43C of the first recess 43.It should be noted that, the distance that the first recess 43 can be formed as the X-direction of the first recess 43 is longer than the thickness of inner Wiring construction element 50, makes after locking, between inner wall part 43C and the other end 52 of inner Wiring construction element 50, there is a little surplus.
Inner Wiring construction element 50 is configured in the mode of the other end 52 towards the identical direction (the Z1 direction in Fig. 7) of pin terminal 61A, the 61B with outside wiring component 60, and in this case distribution in pin terminal 61A, 61B.In other words, the part (selling terminal 61A, 61B) be electrically connected with inner Wiring construction element 50 in outside wiring component 60 and the part (other end 52) be electrically connected with outside wiring component 60 in inner Wiring construction element 50 along from the side, upper end 12 of housing 10 towards the direction (Z1 direction) of side, lower end 11 mutually towards equidirectional extension.
(outside wiring component 60)
Outside wiring component 60 (with reference to Fig. 5) comprises pin terminal 61A, 61B and maintaining part 65.Pin terminal 61A, 61B have the shape of column, are applied driving voltage by from outside.Maintaining part 65 has such as rectangular-shaped shape, is made up of resins such as nylon66 fiber.Pin terminal 61A, 61B is spaced apart to be kept by maintaining part 65 side by side.Interval between second recess 44A and the second recess 44B corresponds to the interval between pin terminal 61A and pin terminal 61B.The front end of pin terminal 61A, 61B plays function as insertion section 62A, 62B.
The insertion section 62A of pin terminal 61A is configured in (the arrow A R62A with reference in Fig. 7) in the second recess 44A.The insertion section 62B of pin terminal 61B is configured in (the arrow A R62B with reference in Fig. 7) in the second recess 44B.The part of maintaining part 65 side of outside wiring component 60 by the opening of housing 10, draw by the outside to housing 10.Under the state that the insertion section 62A of pin terminal 61A is configured in the second recess 44A and the insertion section 62B of pin terminal 61A is configured in the second recess 44B, pin terminal 61A, 61B extend along the normal direction relative to bottom surface (parallel with Z-direction) of housing 10.In this case, terminal 61A, 61B is sold opposed with the other end 52 of inner Wiring construction element 50.Specifically, 61A is opposed with the first distribution 57 (Fig. 6) of the other end 52 of inner Wiring construction element 50 for pin terminal, and 61B is opposed with the second distribution 58 (Fig. 6) of the other end 52 of inner Wiring construction element 50 for pin terminal.Solder 65A, 65B (Fig. 2 ~ Fig. 4) is respectively equipped with at the first recess 43 and second recess 44A, 44B, thus, pin terminal 61A is electrically connected with the first distribution 57 (Fig. 6) of the other end 52 of inner Wiring construction element 50, and pin terminal 61B is electrically connected with the second distribution 58 (Fig. 6) of the other end 52 of inner Wiring construction element 50.That is, the conducting of piezoelectric element 20 and outside wiring component 60 is guaranteed via inner Wiring construction element 50.
(vibration-damped component 70)
Vibration-damped component 70 (Fig. 1, Fig. 2) is filled into the inside of housing 10, front end 62A, 62B of buffer 40, pin terminal 61A, 61B and inner Wiring construction element 50 is sealed.The space of inner bottom surface 13 side of housing 10 is covered by reinforcement 30 and buffer 40.Vibration-damped component 70 is only filled in the space of the open side of housing 10.Vibration-damped component 70 also has the function making buffer 40 from housing 10 difficult drop-off.As the material of vibration-damped component 70, silicone resin and polyurethane resin etc. can be enumerated.The vibration of housing 10 is decayed by buffer 40 and vibration-damped component 70.The vibration of housing 10 hardly externally Wiring construction element 60 propagate.Effectively can reduce the vibration produced when externally substrate is installed by pin terminal 61A, 61B to sew.
As the material of buffer 40, preferably not easily propagate the material of vibration.As the material of vibration-damped component 70, preferably the vibration of housing 10 is suppressed to the material of (vibration damping).
Pin terminal 61A, 61B and piezoelectric element 20 carry out distribution by inner Wiring construction element 50.Because inner Wiring construction element 50 adopts FPC, therefore, even if external force repeated action is in pin terminal 61A, 61B, all can there is strain when each External Force Acting in inner Wiring construction element 50.Therefore, inner Wiring construction element 50 can be suppressed to adopt the situation that broken string occurs during lead-in wire.And inner Wiring construction element 50 has banded shape, and the contact area rate contacted with vibration-damped component 70 goes between greatly, therefore can not apply the load of local to vibration-damped component 70, the destruction of vibration-damped component 70 can also be suppressed.
The other end 52 of inner Wiring construction element 50 and front end 62A, 62B (insertion section) of pin terminal 61A, 61B are towards equidirectional, and they use solder 65A, 65B to connect.The midway part 53 of inner Wiring construction element 50 is drawn from the connecting portion be connected with pin terminal 61A, 61B along the radial direction of housing 10, thus with certain curvature bending or bending.If from the External Force Acting in the direction that housing 10 is extracted in pin terminal 61A, 61B, then the masterpiece in identical with this external force direction is used for the connecting portion of inner Wiring construction element 50 and pin terminal 61A, 61B.Bent by the midway part 53 of inner Wiring construction element 50, the curvature of inner Wiring construction element 50 changes.Now, act on inner Wiring construction element 50 to be eliminated (minimizing) by the spring of inner Wiring construction element 50 with the shear stress on the connecting portion of pin terminal 61A, 61B.Thus realize the non-incident structure of broken string at the connecting portion place of pin terminal 61A, 61B and inner Wiring construction element 50.
Fig. 9 is the vertical view representing buffer 40.Figure 10 is the stereogram of the vicinity of the interarea 42 schematically showing buffer 40.With reference to Fig. 9 and Figure 10, the first recess 43 of present embodiment comprises sidewall portion 43A, 43B, inner wall part 43C and bottom surface sections 43D (Figure 10).43A, 43B are spaced apart mutually opposing in sidewall portion.Sidewall portion 43A, 43B when observing from inner wall part 43C be positioned at Y direction two outside position.The space that first recess 43 surrounds as the end face 45S (with reference to Fig. 7, Fig. 9) by sidewall portion 43A, 43B, inner wall part 43C, bottom surface sections 43D and bellying 45A, 45B and being formed.
Under the state that the other end 52 (Figure 10) of inner Wiring construction element 50 is configured in the first recess 43, inner wall part 43C is opposed with the other end 52 of inner Wiring construction element 50 from the side at second recess 44A, 44B place.In Fig. 10, in order to for simplicity, the hatching of oblique line is used to show the position suitable with inner wall part 43C.As shown in Figure 9, when from normal direction top view first recess 43 of the bottom surface relative to housing 10 and second recess 44A, 44B, if will observe the part of the position be positioned at farthest as reference position PA, PB from the first recess 43 in second recess 44A, 44B, then inner wall part 43C is formed in the mode between reference position PA, PB and inner Wiring construction element 50.
(manufacture method)
With reference to Figure 11 and Figure 12, the manufacture method of ultrasonic sensor 100 is described.First, in housing 10, configure piezoelectric element 20 (with reference to Fig. 1 etc.) and reinforcement 30.Piezoelectric element 20 connects one end 51 (with reference to Fig. 1 etc.) of inner Wiring construction element 50, and inner Wiring construction element 50 is drawn towards the open side of housing 10.To be configured in housing 10 correspondingly with buffer 40, inner Wiring construction element 50 is to be configured in guide portion 47,46 by the mode of the guide portion 47,46 of buffer 40 successively.The other end 52 of inner Wiring construction element 50 bends and is inserted in the first recess 43 of buffer 40 as shown in the arrow DR1 in Figure 11,12.In this case, the other end 52 of inner Wiring construction element 50 is locked to the inner wall part 43C (Figure 10 etc.) of the first recess 43 by the effect of the elastic force (recuperability) of the midway part 53 of inner Wiring construction element 50.That is, the other end 52 of inner Wiring construction element 50 is kept with the state after being located by the first recess 43.
With reference to Figure 13 and Figure 14, then, prepare outside wiring component 60, front end 62A, 62B (insertion section) of pin terminal 61A, 61B are inserted in second recess 44A, 44B of buffer 40 respectively.In the present embodiment, the first recess 43 and second recess 44A, 44B are interconnected.Front end 62A, 62B of pin terminal 61A, 61B are pressed against the internal perisporium of second recess 44A, 44B by the effect of the elastic force (recuperability) of inner Wiring construction element 50.Front end 62A, 62B of pin terminal 61A, 61B are sandwiched by the other end 52 of inner Wiring construction element 50 and the internal perisporium of second recess 44A, 44B.Pin terminal 61A, 61B self uprights of outside wiring component 60 and being kept by location.In this case, solder 65A, 65B (Fig. 2 ~ Fig. 4) is respectively equipped with in the part that the other end 52 of pin terminal 61A, 61B and inner Wiring construction element 50 is opposed each other.Then, vibration-damped component 70 is set in housing 10.By the above, obtain the ultrasonic sensor 100 shown in Fig. 1 ~ Fig. 4.
When carrying out brazing operation, the other end 52 and pin terminal 61A, 61B of inner Wiring construction element 50 are located maintenance.Therefore, brazing operation can easily and have and realize with high reliability.Therefore, the structure of ultrasonic sensor 100 according to the present embodiment, can suppress to engage bad situation at inner Wiring construction element 50 with producing between outside wiring component 60 effectively.
The guide portion 46,47 (with reference to Fig. 7) being located at buffer 40 also can play a role effectively for the location in the Y direction of inner Wiring construction element 50.Guide portion 46,47 not necessarily structure, is therefore arranged as required.As the manufacture method of ultrasonic sensor 100, can first pin terminal 61A, 61B be installed in second recess 44A, 44B, then the other end 52 of inner Wiring construction element 50 be installed in the first recess 43.Above-mentioned install operation and can carry out simultaneously.
In said structure, front end 62A, 62B of pin terminal 61A, 61B of outside wiring component 60 have the function as the insertion section of inserting to second recess 44A, 44B.Insertion section can be formed at maintaining part 65 and as the part of maintaining part 65.In this case, insert in the insertion section of maintaining part 65 and under the state being locked to the second recess, sell terminal 61A, 61B and located.This structure also can obtain functions and effects similar to the above.
Also there is the situation using fixture to carry out distribution in inner Wiring construction element and outside wiring component.In this case, fixture use solder be connected with outside wiring component by inner Wiring construction element.Then, outside wiring component is removed from fixture, outside wiring component is configured in the position of the regulation in housing.When outside wiring component is removed from fixture, need to consider and avoid coming off of the connecting portion of inner Wiring construction element and outside wiring component.But, in the present application, owing to not using fixture when solder connects, therefore do not need the bad connection considering outside wiring component to worry when fixture is removed.When not using fixture as in the present embodiment, the length of mode to inner Wiring construction element not needing to make the position of inner Wiring construction element arrival fixture or inner Wiring construction element just in time arrive the position of fixture manages and regulates, therefore in this viewpoint, also can shorten the length of the entirety of inner Wiring construction element, and the minimizing of manufacturing expense can be realized.
[the first variation]
Figure 15 is the stereogram of the buffer 40A of the first variation representing execution mode.Buffer 40A also has a pair protuberance 48A, 48B.Protuberance 48A is arranged by making end face 45S outstanding partly from the end face 45S of bellying 45A towards the side at the first recess 43 place.Protuberance 48B is arranged by making end face 45S outstanding partly from the end face 45S of bellying 45B towards the side at the first recess 43 place.First recess 43 covers from the open side of housing 10 by protuberance 48A, 48B.That is, extension 52A, 52B is configured between protuberance 48A, 48B and the first recess 43 respectively.Be configured in the other end 52 of the inside Wiring construction element 50 in the first recess 43 when brazing operation, can be located more reliably in the Z-axis direction.Due to the existence of protuberance 48A, 48B, the situation that the other end 52 of the inside Wiring construction element 50 of ultrasonic sensor 100 comes off from the first recess 43 along Z-direction can be suppressed further.It should be noted that, guide portion 46,47 and protuberance 48A, 48B are equivalent to " leading-out portion " of the present invention.
Ultrasonic sensor 100A is as shown in figure 16 such, and pin terminal 61A, 61B can be configured in the inner side of a pair protuberance 48A, 48B.In this case, a pair protuberance 48A, 48B also can play a role for the location in the Y direction of outside wiring component 60 (pin terminal 61A, 61B).
[the second variation]
Figure 17 is the cutaway view of the ultrasonic sensor 100B of the second variation representing execution mode.Ultrasonic sensor 100B also possesses the binding agent 49 of the end face 45S inner Wiring construction element 50 being bonded in buffer 40.As binding agent 49, the binding agent of silicon system, instantaneous binding agent etc. can be used.Due to formation like this, therefore in the last stage arranging vibration-damped component 70, the inside Wiring construction element 50 of ultrasonic sensor 100 and coming off of outside wiring component 60 connection each other can be suppressed further.It should be noted that, inner Wiring construction element 50 can not only bond with the end face 45S of buffer 40 by binding agent 49, but also is bondd by the end face 45S of outside wiring component 60 with buffer 40.
[the 3rd variation]
Figure 18 is the cutaway view of the ultrasonic sensor 100C of the 3rd variation representing execution mode.Ultrasonic sensor 100C also possesses fixed component 90.Fixed component 90 has roughly C shape, and 2 ends are installed with the end face 45S phase ground connection of buffer 40.Fixed component 90 is arranged in mode pin terminal 61A, 61B of outside wiring component 60 being pressed against the other end 52 of inner Wiring construction element 50.Due to formation like this, therefore in the last stage arranging vibration-damped component 70, the inside Wiring construction element 50 of ultrasonic sensor 100 and coming off of outside wiring component 60 connection each other can be suppressed further.
[the 4th variation]
Figure 19 is the vertical view of the buffer 40D of the 4th variation representing execution mode.As shown in figure 19,2 second recesses 44A, 44B are to be formed with the disconnected mode of the first recess 43.In this case, the first recess 43, second recess 44A and the second recess 44B forms independently recess (hole portion) respectively.The other end 52 of pin terminal 61A, 61B and inner Wiring construction element 50 guarantees conducting by solder.By this structure, also the functions and effects same with above-mentioned execution mode can be obtained.
[the 5th variation]
Figure 20 is the vertical view of the buffer 40E of the 5th variation representing execution mode.As shown in figure 20, the interarea 42 of buffer 40 is provided with 1 the second recess 44K.When from the normal direction top view of the bottom surface relative to housing 10, the part of observing position farthest from the first recess 43 in the second recess 44K forms reference position PC.In fig. 20, although illustrate the structure that the second recess 44K is not communicated with the first recess 43, the second recess 44K also can be communicated with the first recess 43.The other end 52 of pin terminal 61A, 61B and inner Wiring construction element 50 guarantees conducting by solder.Also the functions and effects same with above-mentioned execution mode can be obtained by this structure.
[the 6th variation]
Figure 21 is the vertical view of the buffer 40F of the 6th variation representing execution mode.In above-mentioned ultrasonic sensor, buffer has guide portion 46,47 and protuberance 48A, 48B, but is not limited thereto.As shown in figure 21, buffer 40F has protuberance 48A, 48B, does not have guide portion 46,47.In this case, protuberance 48A, 48B is equivalent to " leading-out portion " of the present invention.Also the functions and effects same with above-mentioned execution mode can be obtained by this structure.
[other variation]
In above-mentioned ultrasonic sensor, piezoelectric element 20 is made up of lead zirconate titanate system pottery, but is not limited thereto.Such as, piezoelectric element 20 also can be made up of the piezoelectric etc. of the non-lead system piezoelectric ceramic such as potassium/sodium niobtae and alkaline niobic acid system pottery.In above-mentioned ultrasonic sensor, outside wiring component 60 has pin terminal 61A, 61B, but is not limited thereto.Such as, each pin terminal 61A, 61B also can be lead-in wire.
Above, describe based on embodiments of the present invention and each variation, but execution mode of disclosure and each variation are illustrate but not restricted contents on whole points.Technical scope of the present invention is open by claims, and comprises the whole changes in the meaning and scope that are equal to claims.
Industrial applicibility
The back sonar of such as motor vehicle, the angle sonar of motor vehicle can be used in based on ultrasonic sensor of the present invention and detect sidewall in tandem parking etc. between barrier and motor vehicle with or without the parking point sensor etc. in space.
Symbol description
10 housings, 11 lower ends, 12 upper ends, 13 inner bottom surfaces, 14 bases, 20 piezoelectric elements, 21 first drive electrodes, 22 second drive electrodes, 23 gaps, 30 reinforcements, 40, 40A, 40D, 40E buffer, 41 protuberances, 42 interareas, 43 first recesses, 43A, 43B sidewall portion, 43C inner wall part, 43D bottom surface sections, 44A, 44B, 44K second recess, 45A, 45B bellying, 45C columnar part, 45S end face, 46, 47 guide portion, 48A, 48B protuberance, 49 binding agents, 50 inner Wiring construction elements, 51 one end, 52 other ends, 52A, 52B extension, 53 midway parts, 57 first distributions, 58 second distributions, 60 outside wiring components, 61A, 61B sells terminal, 62A, 62B front end (insertion section), 65 maintaining parts, 65A, 65B solder, 70 vibration-damped components, 90 fixed components, 100, 100A, 100B, 100C ultrasonic sensor, AR30, AR40, AR50, AR62A, AR62B, DR1 arrow, PA, PB, PC reference position.
Claims (11)
1. a ultrasonic sensor, it possesses:
There is the housing of bottom tube-like;
Piezoelectric element, it is arranged on the inner bottom surface of described housing;
Buffer, it is configured in described housing, has interarea, and be provided with the first recess and the second recess at described interarea in the opposition side in the face of described piezoelectric element side;
Inner Wiring construction element, its one end is connected with described piezoelectric element, and draw from the side at described piezoelectric element place towards described first recess side, the other end is configured in described first recess; And
Outside wiring component, it has insertion section, and described insertion section is configured in described second recess, and this outside wiring component by the opening of described housing, draw by the outside to described housing,
Described inner Wiring construction element and described outside wiring component by the described other end of described inner Wiring construction element to be inserted in described first recess and the described insertion section of described outside wiring component to be inserted in described second recess and to be electrically connected to each other,
Described first recess has from the side at the described second recess place inner wall part opposed with the described other end of the described inner Wiring construction element be configured in described first recess.
2. ultrasonic sensor according to claim 1, wherein,
Described in the normal direction top view from the bottom surface relative to described housing when the first recess and described second recess, when using in described second recess from the part being positioned at position farthest described first recess is observed as reference position time, described inner wall part is formed in the mode between described reference position and described inner Wiring construction element.
3. ultrasonic sensor according to claim 1 and 2, wherein,
Described buffer also has with the leading-out portion arranged along the mode that arbitrary path is derived by described inner Wiring construction element.
4. ultrasonic sensor according to claim 3, wherein,
Described leading-out portion possesses the guide portion arranged towards the inner side depression of described buffer,
Described inner Wiring construction element has the part be configured in described guide portion.
5. the ultrasonic sensor according to claim 3 or 4, wherein,
Described leading-out portion also has: the bellying bloating setting from described interarea towards the side at the opening place of described housing; A pair protuberance that side from described bellying towards described first recess place is projecting,
Described outside wiring component has the part be configured in described in a pair between protuberance.
6. ultrasonic sensor according to claim 5, wherein,
Described inner Wiring construction element has the extension being configured in described first recess side from described protuberance observation.
7. the ultrasonic sensor according to any one of claim 1 ~ 6, wherein,
Described interarea is provided with 2 described second recesses,
Described outside wiring component has 2 the described insertion sections configured respectively in 2 described second recesses,
2 described second recesses are formed in the mode be communicated with described first recess.
8. the ultrasonic sensor according to any one of claim 1 ~ 7, wherein,
The part be electrically connected with described inner Wiring construction element in described outside wiring component and the part be electrically connected with described outside wiring component in described inner Wiring construction element along the normal direction of the bottom surface relative to described housing mutually towards equidirectional extension.
9. the ultrasonic sensor according to any one of claim 1 ~ 8, wherein,
Described ultrasonic sensor also possesses the binding agent described inner Wiring construction element and described buffer bondd.
10. the ultrasonic sensor according to any one of claim 1 ~ 9, wherein,
Described ultrasonic sensor also possesses the fixed component installed with described buffer phase ground connection,
Described outside wiring component is pressed against to described inner Wiring construction element by described fixed component.
The manufacture method of 11. 1 kinds of ultrasonic sensors, it is the manufacture method of the ultrasonic sensor according to any one of claim 1 ~ 10, wherein,
Described ultrasonic sensor possesses:
There is the housing of bottom tube-like;
Piezoelectric element, it is arranged on the inner bottom surface of described housing;
Buffer, it is configured in described housing, has interarea, and be provided with the first recess and the second recess at described interarea in the opposition side in the face of described piezoelectric element side;
Inner Wiring construction element, its one end is connected with described piezoelectric element, and draw from the side at described piezoelectric element place towards described first recess side, the other end is configured in described first recess; And
Outside wiring component, it has insertion section, and described insertion section is configured in described second recess, and this outside wiring component by the opening of described housing, draw by the outside to described housing,
Described first recess has from the side at the described second recess place inner wall part opposed with the described other end of the described inner Wiring construction element be configured in described first recess,
The manufacture method of described ultrasonic sensor has:
By being inserted in described first recess by the described other end of described inner Wiring construction element, and keep the operation of described inner Wiring construction element at described first recess;
By being inserted in described second recess the described insertion section of described outside wiring component, and keep the operation of described outside wiring component at described second recess;
By the operation that described inner Wiring construction element and described outside wiring component are electrically connected to each other.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-088460 | 2013-04-19 | ||
| JP2013088460 | 2013-04-19 | ||
| PCT/JP2014/050963 WO2014171158A1 (en) | 2013-04-19 | 2014-01-20 | Ultrasonic sensor and method for producing same |
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| CN104335604A true CN104335604A (en) | 2015-02-04 |
| CN104335604B CN104335604B (en) | 2017-10-10 |
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| CN201480001285.9A Active CN104335604B (en) | 2013-04-19 | 2014-01-20 | Ultrasonic sensor and its manufacture method |
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| JP (1) | JP5660257B1 (en) |
| CN (1) | CN104335604B (en) |
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| CN107211220A (en) * | 2015-02-16 | 2017-09-26 | 株式会社村田制作所 | Ultrasonic sensor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP7048474B2 (en) * | 2018-10-30 | 2022-04-05 | 京セラ株式会社 | Ultrasonic sensor |
| JP7318495B2 (en) * | 2019-11-15 | 2023-08-01 | Tdk株式会社 | Ultrasonic device and fluid detection device |
| JP7514755B2 (en) | 2020-12-16 | 2024-07-11 | Tdk株式会社 | Ultrasonic Transducers |
| JP2022137676A (en) * | 2021-03-09 | 2022-09-22 | Tdk株式会社 | ultrasonic transducer |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1233757A (en) * | 1998-04-24 | 1999-11-03 | 株式会社村田制作所 | Ultrasonic sensor |
| CN1882197A (en) * | 2005-06-09 | 2006-12-20 | 株式会社电装 | Ultrasonic sensor device and ultrasonic transducer |
| JP2007282058A (en) * | 2006-04-10 | 2007-10-25 | Nippon Ceramic Co Ltd | Ultrasonic sensor |
| WO2013051525A1 (en) * | 2011-10-05 | 2013-04-11 | 株式会社村田製作所 | Ultrasonic sensor |
-
2014
- 2014-01-20 CN CN201480001285.9A patent/CN104335604B/en active Active
- 2014-01-20 WO PCT/JP2014/050963 patent/WO2014171158A1/en active Application Filing
- 2014-01-20 JP JP2014529735A patent/JP5660257B1/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1233757A (en) * | 1998-04-24 | 1999-11-03 | 株式会社村田制作所 | Ultrasonic sensor |
| CN1882197A (en) * | 2005-06-09 | 2006-12-20 | 株式会社电装 | Ultrasonic sensor device and ultrasonic transducer |
| JP2007282058A (en) * | 2006-04-10 | 2007-10-25 | Nippon Ceramic Co Ltd | Ultrasonic sensor |
| WO2013051525A1 (en) * | 2011-10-05 | 2013-04-11 | 株式会社村田製作所 | Ultrasonic sensor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107211220A (en) * | 2015-02-16 | 2017-09-26 | 株式会社村田制作所 | Ultrasonic sensor |
| CN107211220B (en) * | 2015-02-16 | 2019-10-15 | 株式会社村田制作所 | Ultrasonic sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5660257B1 (en) | 2015-01-28 |
| WO2014171158A1 (en) | 2014-10-23 |
| CN104335604B (en) | 2017-10-10 |
| JPWO2014171158A1 (en) | 2017-02-16 |
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