CN104332540B - A kind of method for preparing high luminescence energy p-type ZnO film - Google Patents

A kind of method for preparing high luminescence energy p-type ZnO film Download PDF

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CN104332540B
CN104332540B CN201410618510.5A CN201410618510A CN104332540B CN 104332540 B CN104332540 B CN 104332540B CN 201410618510 A CN201410618510 A CN 201410618510A CN 104332540 B CN104332540 B CN 104332540B
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type zno
zno film
sputtering
film
pure
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CN104332540A (en
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叶志镇
陈珊珊
潘新花
黄靖云
何海平
吕斌
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Zhejiang University ZJU
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/14Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes

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  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Luminescent Compositions (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Abstract

The method of high luminescence energy p-type ZnO film disclosed by the invention, step includes:Using molecular beam epitaxial device, by pure O2By the oxygen plasma of rf active formation as O sources, with simple metal Zn sources as reaction source, with the pure NaF powder of solid as p-type doped source, in Grown p-type ZnO film;The p-type ZnO film of acquisition is placed in ion-sputtering system, regulation sputtering current to 10~15 mA, in film surface sputtering sedimentation Pt or Au metallic particles, sputtering time is 20~100 s.The inventive method is simply controllable, while p-type ZnO film band-edge emission is strengthened, restrained effectively defect luminescence, drastically increases the luminescent properties of p-type ZnO, for the zno-based photoelectric device for preparing high luminescence energy is laid a good foundation.

Description

A kind of method for preparing high luminescence energy p-type ZnO film
Technical field
The present invention relates to a kind of growing method of p-type ZnO film, especially the preparation side of high luminescence energy p-type ZnO film Method.
Background technology
ZnO material is up to 60 meV as broad stopband direct band-gap semicondictor material, exciton bind energy, in ultraviolet light photo neck There is huge application prospect in domain, and the excellent N-shaped of processability and p-type ZnO film are to realize its wide variety of key.Mesh Before, the N-shaped ZnO film with excellent properties can be obtained.But due to doping asymmetry, it is difficult to obtain the p-type of excellent performance ZnO, this seriously constrains the development of zno-based photoelectric device.
Have reported the p-type electric-conducting that ZnO film is realized using different doped sources in the world at present, but the film for being obtained lacks Fall into more, band edge is luminous weaker, defect luminescence substantially, simultaneously because hole mobility is low, causes the Homojeneous p-n Junction of final preparation Electron-hole recombinations occur mainly in the relatively poor p areas of quality, this greatly limits the luminescent properties of device.In recent years, Increasing ZnMgO electronic barrier layers turns into the main path for overcoming this problem at present.However, ZnMgO/ZnO heterostructure band knots Structure is I type structures, and ZnMgO provide not only electron transition potential barrier, Carrier recombination is limited in into active area;Meanwhile, also provide Hole transition potential barrier, prevents transmission of the partial holes to active area, and this similarly limits the luminescent properties of device.In addition On the one hand, electronic barrier layer can not fundamentally solve the problems, such as that p-type layer luminescent properties are poor.Therefore, development is needed badly a kind of new Approach solve this problem.
The content of the invention
Can strengthen luminous and suppression defect luminescence the high luminescence energy p-type ZnO of band edge it is an object of the invention to provide a kind of The preparation method of film.
The method for preparing high luminescence energy p-type ZnO film of the invention, comprises the following steps:
1)Cleaned substrate is put into molecular beam epitaxial device, underlayer temperature is heated to 400~600 DEG C, will Pure O2By the oxygen plasma of rf active formation as O sources, growth regulation chamber pressure is 2 × 10-6~8 × 10-6Torr, With simple metal Zn sources as reaction source, regulation Zn source temperatures are 260~350 DEG C, with the pure NaF powder of solid as p-type doped source, are adjusted 400~620 DEG C of section Na source temperatures, in Grown p-type ZnO film;
2)The p-type ZnO film of acquisition is placed in ion-sputtering system, sputtering current is adjusted to 10~15 mA, thin Film surface sputtering sedimentation Pt or Au metallic particles, sputtering time is 20~100 s.
In the present invention, described pure O2Purity be 99.9999 more than %, the purity of simple metal Zn for 99.9998 % with On, the purity of pure NaF powder is 99.995 more than %.
In the present invention, described substrate can be ZnO bodies monocrystalline or a surface sapphires or c surface sapphires or m surface sapphires.
The present invention sputters the sputtering time and sputtering current of Pt or Au metallic particles by adjusting, thus it is possible to vary p-type ZnO is thin The luminescent properties of film.
The beneficial effects of the present invention are:
The present invention is using in metallic particles such as p-type ZnO film surface sputtering sedimentation Pt, Au, on the one hand, metallic particles with The interface of film produces metallic surface plasma excimer, and the resonance coupling lighted using surface plasmons and band edge is made With the band-edge emission of enhancing p-type ZnO film;On the other hand, due to the Fermi levels such as Pt, Au and the defect level of ZnO Match somebody with somebody, the electronics in defect level can easily be transferred to metallic particles, so as to restrained effectively the defect luminescence of p-type ZnO. The inventive method is simply controllable, while p-type ZnO film band-edge emission is strengthened, restrained effectively defect luminescence, greatly The luminescent properties of p-type ZnO are improve, for the zno-based photoelectric device for preparing high luminescence energy is laid a good foundation.
Brief description of the drawings
Fig. 1 is the Photoluminescence before and after p-type ZnO film sputtering Pt metallic particles.
Specific embodiment
Embodiment 1
1)Molecular beam epitaxial device is put into after m surface sapphire substrates are carried out into cleaning treatment, underlayer temperature is heated to 600 DEG C, growth regulation chamber pressure is 2 × 10-6Torr, with by the pure O of rf active2(The % of purity 99.9999)It is O sources, activation O2Radio-frequency power be 350 W;Metal Zn(The % of purity 99.9998)Source is reaction source, and regulation Zn source heating-up temperatures are to 280 DEG C; Solid NaF powder(The % of purity 99.995)It is Na sources, 600 DEG C of regulation Na sources heating-up temperature, growth Na mixes on m surface sapphires Miscellaneous p-type ZnO film, growth time is 5 h, and film is thick to be about 300 nm.
2)By step 1)The p-type ZnO film of preparation is placed in ion-sputtering system, sputtering current is adjusted to 12mA, thin Film surface sputtering sedimentation Pt metallic particles, sputtering time is 60 s.
Step 1)Obtained Na doped p type ZnO thin films have excellent room temperature electric property, and resistivity is 510.5 Ω Cm, hole concentration is up to 2.4 × 1016 cm-3, hall mobility is 0.5 cm2/V·s。
Fig. 1 is shown through step 2)The Photoluminescence of before processing rear film, as seen from the figure, does not sputter Pt particles Before, film band edge peak is weaker, and defect peak is obvious, thin-film light emitting poor-performing;After sputtering 60 s Pt metallic particles, film Band edge peak is remarkably reinforced, and does not observe defect peak, nearly 10 times or so of band edge luminescence enhancement, shows to sputter the rear film of Pt particles With good optical property.
Embodiment 2
1)Molecular beam epitaxial device is put into after m surface sapphire substrates are carried out into cleaning treatment, underlayer temperature is heated to 600 DEG C, growth regulation chamber pressure is 3 × 10-6Torr, with by the pure O of rf active2(Purity 99.9999%)It is O sources, activates O2 Radio-frequency power be 350 W;Metal Zn(The % of purity 99.9998)Source is reaction source, 280 DEG C of regulation Zn sources heating-up temperature;Solid NaF powder(The % of purity 99.995)It is Na sources, 610 DEG C of regulation Na sources heating-up temperature, growth Na mixes in m surface sapphire substrates Miscellaneous p-type ZnO film, growth time is 5h, and film is thick to be about 300 nm.
2)By step 1)The p-type ZnO film of preparation is placed in ion-sputtering system, sputtering current is adjusted to 15 mA, thin Film surface sputtering sedimentation Au metallic particles, sputtering time is 80 s.
Step 1)Obtained Na doped p type ZnO thin films have excellent room temperature electric property, and resistivity is 523.9 Ω Cm, hole concentration is up to 2.4 × 1016 cm-3, hall mobility is 0.5 cm2/V·s。
Through step 2)The band edge peak for processing rear film is remarkably reinforced, and does not observe defect peak, band edge luminescence enhancement nearly 8 Times.
Embodiment 3
1)Molecular beam epitaxial device is put into after c surface sapphire substrates are carried out into cleaning treatment, underlayer temperature is heated to 500 DEG C, growth regulation chamber pressure is 6 × 10-6Torr, with by the pure O of rf active2(Purity 99.9999%)It is O sources, activates O2 Radio-frequency power be 350 W;Metal Zn(The % of purity 99.9998)Source is reaction source, 300 DEG C of regulation Zn sources heating-up temperature;Solid NaF powder(The % of purity 99.995)It is Na sources, 500 DEG C of regulation Na sources heating-up temperature grows Na doped p types on c surface sapphires ZnO film, growth time is 3 h, and film is thick to be about 250 nm.
2)By step 1)The p-type ZnO film of preparation is placed in ion-sputtering system, sputtering current is adjusted to 10 mA, thin Film surface sputtering sedimentation Pt metallic particles, sputtering time is 50 s.
Step 1)Obtained Na doped p type ZnO thin films have excellent room temperature electric property, and resistivity is 372.0 Ω Cm, hole concentration is up to 4.2 × 1016 cm-3, hall mobility is 0.4 cm2/V·s。
Through step 2)The band edge peak for processing rear film is remarkably reinforced, and does not observe defect peak, band edge luminescence enhancement nearly 15 Times.

Claims (3)

1. the method for preparing high luminescence energy p-type ZnO film, its step is as follows:
1)Cleaned substrate is put into molecular beam epitaxial device, underlayer temperature is heated to 400~600 DEG C, by pure O2 By the oxygen plasma of rf active formation as O sources, growth regulation chamber pressure is 2 × 10-6~8 × 10-6Torr, with pure Metal Zn sources are reaction source, and regulation Zn source temperatures are 260~350 DEG C, with the pure NaF powder of solid as p-type doped source, adjust Na 400~620 DEG C of source temperature, in Grown p-type ZnO film;
2)The p-type ZnO film of acquisition is placed in ion-sputtering system, sputtering current is adjusted to 10~15 mA, in film table Face sputtering sedimentation Pt or Au metallic particles, sputtering time is 20~100 s.
2. the method for preparing high luminescence energy p-type ZnO film according to claim 1, it is characterized in that described substrate is ZnO bodies monocrystalline or a surface sapphires or c surface sapphires or m surface sapphires.
3. the method for preparing high luminescence energy p-type ZnO film according to claim 1, it is characterized in that described pure O2's Purity is 99.9999 more than %, and the purity of metal Zn is 99.9998 more than %, and the purity of NaF is 99.995 more than %.
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CN106129191A (en) * 2016-06-29 2016-11-16 中山大学 High brightness ultraviolet LED based on Be supplementary doping technology and preparation method thereof
CN111128683B (en) * 2019-12-30 2022-07-05 中国科学院长春光学精密机械与物理研究所 Method for preparing P-type zinc oxide film by using molecular beam epitaxy technology

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101710605A (en) * 2009-11-26 2010-05-19 武汉大学 Ultraviolet light-emitting diode based on n-ZnO/n-GaN alloplasm nN node and preparation method thereof
CN102534767A (en) * 2011-12-29 2012-07-04 浙江大学 Na-mixing method for growing p-type ZnO single crystal film
CN103031597A (en) * 2012-12-25 2013-04-10 浙江大学 Na-Be codoped p-ZnO film growth method

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JP5502360B2 (en) * 2009-04-10 2014-05-28 スタンレー電気株式会社 Zinc oxide based semiconductor device and method for manufacturing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101710605A (en) * 2009-11-26 2010-05-19 武汉大学 Ultraviolet light-emitting diode based on n-ZnO/n-GaN alloplasm nN node and preparation method thereof
CN102534767A (en) * 2011-12-29 2012-07-04 浙江大学 Na-mixing method for growing p-type ZnO single crystal film
CN103031597A (en) * 2012-12-25 2013-04-10 浙江大学 Na-Be codoped p-ZnO film growth method

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