CN104325598A - Injection moulding device, liquid crystal module, backlight module and manufacturing method thereof - Google Patents

Injection moulding device, liquid crystal module, backlight module and manufacturing method thereof Download PDF

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Publication number
CN104325598A
CN104325598A CN201410437045.5A CN201410437045A CN104325598A CN 104325598 A CN104325598 A CN 104325598A CN 201410437045 A CN201410437045 A CN 201410437045A CN 104325598 A CN104325598 A CN 104325598A
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CN
China
Prior art keywords
injection moulding
light guide
guide plate
glue frame
die unit
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CN201410437045.5A
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Chinese (zh)
Inventor
王影
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Shenzhen Techaser Technologies Co Ltd
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Shenzhen Techaser Technologies Co Ltd
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Priority to CN201410437045.5A priority Critical patent/CN104325598A/en
Publication of CN104325598A publication Critical patent/CN104325598A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/33Moulds having transversely, e.g. radially, movable mould parts
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133608Direct backlight including particular frames or supporting means

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Planar Illumination Modules (AREA)

Abstract

The invention provides an injection moulding device, a liquid crystal module, a backlight module and a manufacturing method thereof. The manufacturing method of the backlight module comprises the following steps: controlling the moving module in a first mould unit to form a first injection moulding space; placing a finished flexible circuit board into the first injection moulding space; injecting one of the injection moulding materials of light guide plate or rubber frame into the flow guide channel of a second mould unit, guiding the injection moulding material to flow into the first injection moulding space of the first mould unit through the flow guide channel; after the injection moulding material is injected into and moulded in the first injection moulding space, controlling the moving module of the first mould unit so as to form a second injection moulding space; injecting the other injection moulding material into the flow guide channel, moulding the injection moulding material in the second injection moulding space so as to obtain an integral part composed of a rubber frame, a light guide plate, and the finished flexible circuit board, and finally assembly an optical film group and the integral part together. The production efficiency and product quality of the backlight module are both improved.

Description

A kind of injection moulding apparatus, liquid crystal module, backlight module and preparation method thereof
Technical field
The present invention relates to backlight module field, particularly relate to a kind of injection moulding apparatus, liquid crystal module, backlight module and preparation method thereof.
Background technology
Along with the sharply development of network and radio communication technology, portable information product such as small-medium size product, particularly intelligent terminal etc. obtains significant progress.People, while constantly pursuing high-resolution, high-contrast, narrow frame and ultra-thin display unit, also wish to reduce its production cost.The building block of backlight module comprises: chase, reflector plate, glue frame, light guide plate, finished product flexible PCB (FPCA) and optical diaphragm group.In the prior art, the glue frame of described backlight module, reflector plate and light guide plate be injection moulding respectively, make shaping after, carry out man-made assembly more together fixing, therefore there is following problem: the laminating of FPCA and glue frame is by manually fitting, often can there is laminating lack of standardization, or both will exist gap, the brightness of backlight module will be caused to be affected; There is assembly clearance between light guide plate and glue frame, between assembly clearance, have unnecessary light source, viewing area can be caused to have bright line risk, and for some product, the light between glue frame and light guide plate gap also through glue frame, may affect display effect; Along with the development of the narrow frame of product, the glue strip electrode after shaping is yielding, the assembling difficulty between glue frame and light guide plate; Light guide plate and glue frame easily depart from after assembling, and affect the total quality of backlight module; The assembling process of glue frame, light guide plate and FPCA is process the most difficult and loaded down with trivial details in the assembling of current backlight module, therefore affects overall package efficiency, and then reduces production efficiency.
Summary of the invention
The invention provides a kind of injection moulding apparatus, liquid crystal module, backlight module and preparation method thereof, solve backlight module production efficiency in prior art low, the problem that product substandard products are more.
In order to solve the problem, the present invention by the following technical solutions:
A preparation method for backlight module, comprising:
The mobile module controlled in the first die unit forms the first injection moulding space; Finished product flexible PCB is put into this first injection moulding space;
Wherein a kind of injected plastics material in the injected plastics material of light guide plate or glue frame is injected the drainage trough of the second die unit, described injected plastics material flows in the first injection moulding space of the first die unit by drainage trough;
After the described first injection moulding space of described injected plastics material injection is shaping, the mobile module controlling described first die unit forms the second injection moulding space;
Another kind of injected plastics material is injected described drainage trough, described injected plastics material flows in the second injection moulding space of the first die unit by drainage trough, after the described second injection moulding space of described injected plastics material injection is shaping, obtain glue frame, light guide plate and the one-body molded parts of finished product flexible PCB;
Described glue frame, light guide plate and the one-body molded parts of finished product flexible PCB and optical diaphragm group are assembled.
Further, the concrete steps forming glue frame, light guide plate and the one-body molded parts of finished product flexible PCB comprise: the mobile module controlling the first die unit forms light guide plate injection moulding space; The injected plastics material of light guide plate is injected the drainage trough of the second die unit; After the injected plastics material of described light guide plate is shaping, the mobile module controlling described first die unit forms glue frame injection moulding space; The injected plastics material of glue frame is injected described drainage trough;
Or the mobile module controlling the first die unit forms glue frame injection moulding space; The injected plastics material of glue frame is injected the drainage trough of the second die unit; After the injected plastics material of described glue frame is shaping, the mobile module controlling described first die unit forms light guide plate injection moulding space; The injected plastics material of light guide plate is injected described drainage trough.
Further, described mobile module specifically comprises: dipper crowding gear, locking mechanism or movable block mechanism.
Further, also described backlight module comprises chase; Also comprise after described glue frame, light guide plate and the one-body molded parts of finished product flexible PCB and optical diaphragm group are assembled: be in chase described in the parts after glue frame, light guide plate and the one-body molded parts of finished product flexible PCB and optical diaphragm group being assembled are placed on.
A kind of backlight module, comprise blooming piece, glue frame, light guide plate and finished product flexible PCB, described glue frame, light guide plate and finished product flexible PCB for: according to the step of glue frame, light guide plate and the one-body molded parts of finished product flexible PCB as described in making in the method as described in any one of claim 1-4, the one-body molded parts of making; Described blooming piece and glue frame, light guide plate and the one-body molded assembling parts of finished product flexible PCB shaping.
Further, also comprise chase, described blooming piece and glue frame, light guide plate and the one-body molded parts of finished product flexible PCB are placed in described chase.
A kind of liquid crystal module, comprise liquid crystal panel, comprise backlight module as claimed in claim 5, described liquid crystal panel is arranged on described backlight module.
A kind of injection moulding apparatus, for making the glue frame of backlight module, light guide plate and the one-body molded parts of finished product flexible PCB, described injection moulding apparatus comprises the first die unit and the second die unit;
Described first die unit comprises mobile module, and described mobile module is for the formation of light guide plate injection moulding space or glue frame injection moulding space, and described injection moulding space is for carrying out the injection moulding of corresponding injected plastics material after placing finished product flexible PCB again;
Described second die unit comprises drainage trough, and described drainage trough is used for the injected plastics material of the light guide plate injected wherein or glue frame to flow into the injection moulding space that described first die unit is placed with the correspondence of finished product flexible PCB.
Further, described mobile module specifically comprises: dipper crowding gear, locking mechanism or movable block mechanism.
Further, described dipper crowding gear specifically comprises the first pressing unit and the second pressing unit; Described first pressing unit forms light guide plate injection moulding space by carrying out descending motion on the axis direction of described first die unit or carries out ascending motion closedown light guide plate injection moulding space; Described second pressing unit forms glue frame injection moulding space by carrying out descending motion on the axis direction of described first die unit or carries out ascending motion closedown glue frame injection moulding space.
Further, described first die unit comprises two identical mobile modules; Described drainage trough is for flowing into the injection moulding space of the correspondence formed by two described mobile modules being placed with finished product flexible PCB simultaneously by the injected plastics material of the described light guide plate injected wherein or glue frame.
The invention provides a kind of injection moulding apparatus, liquid crystal module, backlight module and preparation method thereof, the first injection moulding space is formed by the mobile module controlled in the first die unit, after finished product flexible PCB being put into this first injection moulding space, wherein a kind of injected plastics material in the injected plastics material of light guide plate or glue frame is injected the drainage trough of the second die unit, and by the time its shaping after, the mobile module controlling the first die unit again forms the second injection moulding space, finally more another kind of injected plastics material being injected described drainage trough forms glue frame, light guide plate and the one-body molded parts of finished product flexible PCB, again these parts and optical diaphragm group are carried out assembled formation, obtain backlight module.The FPCA of the backlight module obtained in this programme is not needed to consume manpower and is pasted by double faced adhesive tape, and assembly clearance between light guide plate and glue frame, can not be there is, also there will not be causes viewing area to have bright line risk because assembly clearance has unnecessary light source simultaneously in the prior art, and may also display effect be affected, in addition, also the problem causing the assembling difficulty between glue frame and light guide plate due to the narrow frame of product is there will not be in this programme, that direct injection moulding is formed now, combined by the mode of machine process, do not need artificial participation, thus there is not the problem of assembling difficulty, and then improve production efficiency, and the quality of product have also been obtained larger lifting.
Accompanying drawing explanation
The preparation method flow chart of the one-body molded parts of glue frame, light guide plate and FPCA that Fig. 1 provides for one embodiment of the invention;
The preparation method flow chart of the one-body molded parts of glue frame, light guide plate and FPCA that Fig. 2 provides for another embodiment of the present invention;
The structure chart of the injection moulding apparatus that Fig. 3 provides for one embodiment of the invention;
The schematic diagram of die opening state during mould-injection frame, light guide plate and FPCA that Fig. 4 provides for one embodiment of the invention one-body molded parts;
The schematic diagram of the state of mold-closing injection light guide plate during mould-injection frame, light guide plate and FPCA that Fig. 5 provides for one embodiment of the invention one-body molded parts;
The schematic diagram of the state of mold-closing injection glue frame during mould-injection frame, light guide plate and FPCA that Fig. 6 provides for one embodiment of the invention one-body molded parts;
The schematic diagram of die opening state after injection moulding during mould-injection frame, light guide plate and FPCA that Fig. 7 provides for one embodiment of the invention one-body molded parts;
The schematic diagram of the state of the one-body molded parts of glue frame, light guide plate and FPCA is ejected after injection moulding during mould-injection frame, light guide plate and the FPCA one-body molded parts that Fig. 8 provides for one embodiment of the invention.
Detailed description of the invention
By reference to the accompanying drawings the present invention is described in further detail below by detailed description of the invention.
One embodiment of the invention provides a kind of preparation method of backlight module, comprising: the mobile module controlled in the first die unit forms the first injection moulding space; Finished product flexible PCB is put into this first injection moulding space; Wherein a kind of injected plastics material in the injected plastics material of light guide plate or glue frame is injected the drainage trough of the second die unit, described injected plastics material flows in the first injection moulding space of the first die unit by drainage trough; After the described first injection moulding space of described injected plastics material injection is shaping, the mobile module controlling described first die unit forms the second injection moulding space; Another kind of injected plastics material is injected described drainage trough, described injected plastics material flows in the second injection moulding space of the first die unit by drainage trough, after the described second injection moulding space of described injected plastics material injection is shaping, obtain glue frame, light guide plate and the one-body molded parts of finished product flexible PCB; Optical diaphragm group and described glue frame, light guide plate and the one-body molded parts of finished product flexible PCB are assembled.The primary object of this backlight module is, its glue frame, light guide plate and FPCA are integrated, carries out the consumption that man-made assembly saves manpower again, and improve assembling quality after in hinge structure glue frame, light guide plate, FPCA is shaping respectively.In addition, also can make to use the display effect of terminal of this backlight module to be highly improved.Particularly, the preparation method of described glue frame, light guide plate and the one-body molded parts of FPCA as shown in Figure 1, is the preparation method flow chart of the one-body molded parts of glue frame, light guide plate and FPCA that one embodiment of the invention provides, refers to Fig. 1, after described method starts:
S101: the mobile module controlled in the first die unit forms light guide plate injection moulding space, and finished product flexible PCB put into this glue frame injection moulding space.Described mobile module specifically comprises: dipper crowding gear, locking mechanism or movable block mechanism.First, the first die unit and the second die unit are formed die opening state, then carries out the control of above-mentioned steps.As, when described mobile module is dipper crowding gear, controls this dipper crowding gear and carry out carrying out moving on the axis direction of the first die unit forming light guide plate injection moulding space; When described mobile module is locking mechanism, controls this locking mechanism and carry out lock-bit in the injection moulding space of light guide plate and fix, form light guide plate injection moulding region, then carry out corresponding injection operation; When described mobile module is movable block mechanism, directly movable block corresponding for light guide plate injection moulding region is carried out taking-up and just can form light guide plate injection moulding region.
S102: the drainage trough injected plastics material of light guide plate being injected the second die unit, described injected plastics material is flowed in the light guide plate injection moulding space of the first die unit by drainage trough.First, before the injected plastics material of light guide plate being injected the drainage trough of the second die unit, need the first die unit and the second die unit to carry out matched moulds, then the injected plastics material of light guide plate is injected the drainage trough of the second die unit.The injected plastics material of described light guide plate generally adopts has high reflectivity and the new material of not extinction, such as poly-methyl methacrylate vinegar base photodiffusion material etc.
S103: after the injected plastics material of light guide plate is shaping, the mobile module controlling the first die unit forms glue frame injection moulding space.The specific practice that the injected plastics material of described light guide plate is shaping comprises: after mould is carried out die sinking, and drying namely can be shaping; For the formation in glue frame injection moulding space, same, also can form described glue frame injection moulding space by controlling dipper crowding gear described above, locking mechanism or movable block mechanism.
S104: the injected plastics material of glue frame is injected drainage trough, and described injected plastics material is flowed in the glue frame injection moulding space of the first die unit by drainage trough.After first die unit being carried out matched moulds, then the injected plastics material of glue frame is injected the drainage trough of the second die unit.The injected plastics material of described glue frame is generally the mixed material etc. of poly-carbonic acid vinegar and glass fibre.
S105: after the injected plastics material of glue frame is shaping, the glue frame, light guide plate and the one-body molded parts of FPCA that injection moulding are formed eject reset.Same, after needing first two die units to be carried out die sinking, after waiting for its shaping end, then carry out ejecting reset processing.So just obtain the one-body molded parts of glue frame, light guide plate and FPCA.
After obtaining the one-body molded parts of glue frame, light guide plate and FPCA, the more one-body molded parts of this glue frame, light guide plate and FPCA and other optical diaphragm group are assembled, obtain backlight module.
Described backlight module also comprises chase; Also comprise after described glue frame, light guide plate and the one-body molded parts of finished product flexible PCB and optical diaphragm group are assembled: the parts after glue frame, light guide plate and the one-body molded parts of finished product flexible PCB and optical diaphragm group being assembled are placed in described chase.
Described optical diaphragm group comprises anti-dazzling screen, upper bright enhancement film, lower bright enhancement film, diffusion barrier and reflector plate; Described optical diaphragm group and described glue frame, light guide plate and the one-body molded parts of finished product flexible PCB being placed in chase specifically comprises: reflector plate, described glue frame, light guide plate and the one-body molded parts of finished product flexible PCB, lower bright enhancement film, upper bright enhancement film and anti-dazzling screen are placed on successively in described chase.Use such method to make backlight module, not only increase production efficiency, also improve its technological level simultaneously, its quality is improved.
In addition, described optical diaphragm group comprises: anti-dazzling screen, upper bright enhancement film, lower bright enhancement film, diffusion barrier and reflectance coating; Now, by described reflectance coating direct spraying behind the back side of described glue frame, light guide plate and the one-body molded parts of FPCA, then can assemble with miscellaneous part; Or after in the frame that described reflectance coating can be sprayed at described glue iron integrated frame, then assemble with miscellaneous part, form backlight module.
The preparation method of described glue frame, light guide plate and the one-body molded parts of FPCA also comprises as shown in Figure 2, is the preparation method flow chart of the one-body molded parts of glue frame, light guide plate and FPCA that another embodiment of the present invention provides, refers to Fig. 2, after described method starts:
S201: the mobile module controlled in the first die unit forms glue frame injection moulding space, and finished product flexible PCB put into this glue frame injection moulding space.Described mobile module specifically comprises: dipper crowding gear, locking mechanism or movable block mechanism.First, the first die unit and the second die unit are formed die opening state, then carries out the control of above-mentioned steps.As, when described mobile module is dipper crowding gear, controls this dipper crowding gear and carry out carrying out moving on the axis direction of the first die unit forming glue frame injection moulding space; When described mobile module is locking mechanism, controls this locking mechanism and carry out lock-bit in the injection moulding space of light guide plate and fix, form glue frame injection moulding region, then carry out corresponding injection operation; When described mobile module is movable block mechanism, directly movable block corresponding for glue frame injection moulding region is carried out taking-up and just can form glue frame injection moulding region.
S202: the drainage trough injected plastics material of glue frame being injected the second die unit, described injected plastics material is flowed in the glue frame injection moulding space of the first die unit by drainage trough.First, before the injected plastics material of light guide plate being injected the drainage trough of the second die unit, need the first die unit and the second die unit to carry out matched moulds, then the injected plastics material of glue frame is injected the drainage trough of the second die unit.The injected plastics material of described glue frame is generally the mixed material etc. of poly-carbonic acid vinegar and glass fibre.
S203: after the injected plastics material of glue frame is shaping, the mobile module controlling the first die unit forms light guide plate injection moulding space.The specific practice that the injected plastics material of described glue frame is shaping comprises: mould is carried out die sinking, and drying namely can be shaping; For the formation in light guide plate injection moulding space, same, also can form described glue frame injection moulding space by controlling dipper crowding gear described above, locking mechanism or movable block mechanism.
S204: the injected plastics material of light guide plate is injected drainage trough, and described injected plastics material is flowed in the light guide plate injection moulding space of the first die unit by drainage trough.After first die unit being carried out matched moulds, then the injected plastics material of light guide plate is injected the drainage trough of the second die unit.The injected plastics material of described light guide plate generally adopts has high reflectivity and the new material of not extinction, such as poly-methyl methacrylate vinegar base photodiffusion material etc.
S205: after the injected plastics material of light guide plate is shaping, the glue frame, light guide plate and the one-body molded parts of FPCA that injection moulding are formed eject reset.Same, after needing first two die units to be carried out die sinking, after waiting for its shaping end, then carry out ejecting reset processing.So just obtain the one-body molded parts of glue frame, light guide plate and FPCA.
Then, the more one-body molded parts of this glue frame, light guide plate and FPCA and other optical diaphragm group are assembled, obtain backlight module.
The preparation method of the backlight module that the present embodiment provides, its main feature is, by FPCA by twice injection moulding, twice shaping after, form glue frame, light guide plate and the one-body molded parts of FPCA, then assemble with miscellaneous part, form backlight module, improve the production efficiency of this backlight module, also improve its end product quality simultaneously.
As shown in Figure 3, for the structure chart of the injection moulding apparatus that one embodiment of the invention provides, refer to Fig. 3, described injection moulding apparatus 30 is for making the glue frame of backlight module, light guide plate and the one-body molded parts of finished product flexible PCB, and described injection moulding apparatus 30 comprises: the first die unit 31 and the second die unit 32; Described first die unit 31 comprises mobile module 311, and described mobile module 311 is for the formation of light guide plate injection moulding space or glue frame injection moulding space, and described injection moulding space is for carrying out the injection moulding of corresponding injected plastics material after placing finished product flexible PCB again; Described second die unit 32 comprises drainage trough 321, and described drainage trough 321 is for flowing into the injected plastics material of the light guide plate injected wherein or glue frame the injection moulding space that described first die unit 31 is placed with the correspondence of finished product flexible PCB.In certain embodiments, described mobile module 311 specifically comprises: dipper crowding gear, locking mechanism or movable block mechanism.As, when described mobile module 311 is dipper crowding gear, controls this dipper crowding gear and carry out carrying out moving on the axis direction of the first die unit forming light guide plate injection moulding space; When described mobile module 311 is locking mechanism, controls this locking mechanism and carry out lock-bit in the injection moulding space of light guide plate and fix, form light guide plate injection moulding region, then carry out corresponding injection operation; When described mobile module 311 is movable block mechanism, directly movable block corresponding for light guide plate injection moulding region is carried out taking-up and just can form light guide plate injection moulding region.
In certain embodiments, described dipper crowding gear specifically comprises the first pressing unit and the second pressing unit; Described first pressing unit forms light guide plate injection moulding space by carrying out descending motion on the axis direction of described first die unit 31 or carries out ascending motion closedown light guide plate injection moulding space; Described second pressing unit forms glue frame injection moulding space by carrying out descending motion on the axis direction of described first die unit 31 or carries out ascending motion closedown glue frame injection moulding space.Preferably, the process using this injection moulding apparatus 30 to make described glue frame, light guide plate and the one-body molded parts of FPCA particularly comprises: the mobile module 311 controlled in the first die unit 31 forms light guide plate injection moulding space; Finished product flexible PCB is put into this light guide plate injection moulding space; The injected plastics material of light guide plate is injected the drainage trough 321 of the second die unit 32, described injected plastics material flows in the light guide plate injection moulding space of the first die unit 31 by drainage trough; Described injected plastics material inject described light guide plate injection moulding space shaping after, the mobile module 311 controlling described first die unit 31 forms the second injection moulding space; The injected plastics material of glue frame is injected described drainage trough 321, described injected plastics material enters in the second injection moulding space of the first die unit 31 by drainage concentrated flow 321, after the injected plastics material of glue frame is shaping, the glue frame, light guide plate and the one-body molded parts of FPCA that injection moulding are formed eject reset, obtain glue frame, light guide plate and the one-body molded parts of finished product flexible PCB.So just one-body molded to glue frame, light guide plate and FPCA parts are completed, the one-body molded parts of this glue frame, light guide plate and FPCA are than the mode not only convenient operation could fitted with the miscellaneous part in backlight module after needing manpower to be pasted by FPCA in prior art, save manpower, and its technique combined is more perfect, improves the quality of backlight module.
In further embodiments, described first die unit 31 comprises two identical mobile modules 311; Described drainage trough 321 is for flowing into the injection moulding space of the correspondence formed by two described mobile modules 311 being placed with finished product flexible PCB simultaneously by the injected plastics material of the described light guide plate injected wherein or glue frame.The design of two mobile modules, makes this injection moulding apparatus 30 can simultaneously injection moulding two pieces glue frame, light guide plate and the one-body molded parts of FPCA, further increases its production efficiency.
Such as, when described mobile module is dipper crowding gear, as Figure 4-8, for the detailed process schematic diagram utilizing this injection moulding apparatus mould-injection frame, light guide plate and the one-body molded parts of FPCA that one embodiment of the invention provides, refer to Fig. 4, now, the first die unit 31 in described injection moulding apparatus 30 and the second die unit 32 are in die opening state, and described dipper crowding gear comprises the first pressing unit 312 and the second pressing unit 313; In the first die unit, the first pressing unit 312 forms light guide plate injection moulding space, FPCA41 is put into light guide plate injection moulding space, and is fixed on the position of its correspondence by described FPCA41, and mobile second pressing unit 313 closes the injection moulding region of glue frame; Refer to Fig. 5, now, the individual die unit of described injection moulding apparatus 30 is in matched moulds state, and the injected plastics material by light guide plate injects the drainage trough 321 of the second die unit 32, and described injected plastics material flows in the light guide plate injection moulding space of the first die unit 31 by drainage trough 321; Refer to Fig. 6, now, the individual die unit of described injection moulding apparatus 30 is in matched moulds state, and described glue frame injection moulding region is opened, and carries out the injection moulding of the injected plastics material of glue frame; Refer to Fig. 7, now the individual die unit of described injection moulding apparatus 30 is in die opening state, and after injection moulding, die sinking is carried out drying, cooling etc.; Refer to Fig. 8, one-body molded to glue frame, light guide plate and FPCA parts 40 carry out ejecting reset by described injection moulding apparatus 30, and like this, whole glue frame, light guide plate and the one-body molded parts of FPCA have just completed.
Present embodiments provide a kind of injection moulding apparatus for making the one-body molded parts of glue frame, light guide plate and FPCA in backlight module, the use of this device, the quality of the backlight module of glue frame, light guide plate and the one-body molded parts of FPCA using the making of this device to be formed is improved, also improves production efficiency simultaneously.
Present invention also offers a kind of backlight module, comprise blooming piece, glue frame, light guide plate and finished product flexible PCB, described glue frame, light guide plate and finished product flexible PCB are: according to the step making described glue frame, light guide plate and the one-body molded parts of finished product flexible PCB in method as described above, the one-body molded parts of making; Described blooming piece and glue frame, light guide plate and the one-body molded assembling parts of finished product flexible PCB shaping.In certain embodiments, described backlight module also comprises chase, and described blooming piece and glue frame, light guide plate and the one-body molded parts of finished product flexible PCB are placed in described chase.In further embodiments, described optical diaphragm group comprises anti-dazzling screen, upper bright enhancement film, lower bright enhancement film, diffusion barrier and reflector plate; Preferably, described blooming piece and glue frame, light guide plate and the one-body molded parts of finished product flexible PCB are placed in chase and specifically comprise: reflector plate, described glue frame, light guide plate and the one-body molded parts of finished product flexible PCB, lower bright enhancement film, upper bright enhancement film and anti-dazzling screen are placed on successively in described chase.
In certain embodiments, described optical diaphragm group comprises: anti-dazzling screen, upper bright enhancement film, lower bright enhancement film, diffusion barrier and reflectance coating; Now, by described reflectance coating direct spraying behind the back side of described glue frame, light guide plate and the one-body molded parts of FPCA, then can assemble with miscellaneous part, form backlight module.
Present invention also offers a kind of liquid crystal module, comprise liquid crystal panel, it is characterized in that, comprise backlight module described above, described liquid crystal panel is arranged on described backlight module.
The invention provides a kind of injection moulding apparatus, liquid crystal module, backlight module and preparation method thereof, by twice injection moulding and twice shaping, after defining glue frame, light guide plate and the one-body molded parts of finished product flexible PCB, again these one-body molded parts and optical diaphragm group are assembled, form backlight module.The FPCA of the backlight module obtained in this programme is not needed to consume manpower and is pasted by double faced adhesive tape, and assembly clearance between light guide plate and glue frame, can not be there is, also there will not be causes viewing area to have bright line risk because assembly clearance has unnecessary light source simultaneously in the prior art, improve the display effect of the terminal using this backlight module, in addition, due to the glue frame in this programme, light guide plate and FPCA are formed by direct injection moulding, utilize the mode of machine process to combine, do not need artificial participation, thus there is not the problem of assembling difficulty, can also enhance productivity simultaneously like this, the quality of product have also been obtained larger lifting.
Above content is in conjunction with concrete embodiment further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, some simple deduction or replace can also be made, all should be considered as belonging to protection scope of the present invention.

Claims (10)

1. a preparation method for backlight module, is characterized in that, comprising:
The mobile module controlled in the first die unit forms the first injection moulding space; Finished product flexible PCB is put into described first injection moulding space;
Wherein a kind of injected plastics material in the injected plastics material of light guide plate or glue frame is injected the drainage trough of the second die unit, described injected plastics material flows in the first injection moulding space of the first die unit by drainage trough;
After the described first injection moulding space of described injected plastics material injection is shaping, the mobile module controlling described first die unit forms the second injection moulding space;
Another kind of injected plastics material is injected described drainage trough, described injected plastics material flows in the second injection moulding space of the first die unit by drainage trough, after the described second injection moulding space of described injected plastics material injection is shaping, obtain glue frame, light guide plate and the one-body molded parts of finished product flexible PCB;
Described glue frame, light guide plate and the one-body molded parts of finished product flexible PCB and optical diaphragm group are assembled.
2. the preparation method of backlight module according to claim 1, is characterized in that, the concrete steps forming glue frame, light guide plate and the one-body molded parts of finished product flexible PCB comprise: the mobile module controlling the first die unit forms light guide plate injection moulding space; The injected plastics material of light guide plate is injected the drainage trough of the second die unit; After the injected plastics material of described light guide plate is shaping, the mobile module controlling described first die unit forms glue frame injection moulding space; The injected plastics material of glue frame is injected described drainage trough;
Or the mobile module controlling the first die unit forms glue frame injection moulding space; The injected plastics material of glue frame is injected the drainage trough of the second die unit; After the injected plastics material of described glue frame is shaping, the mobile module controlling described first die unit forms light guide plate injection moulding space; The injected plastics material of light guide plate is injected described drainage trough.
3. the preparation method of backlight module according to claim 1 and 2, is characterized in that, described mobile module specifically comprises: dipper crowding gear, locking mechanism or movable block mechanism.
4. the preparation method of backlight module according to claim 1 and 2, is characterized in that, described backlight module also comprises chase; Also comprise after described glue frame, light guide plate and the one-body molded parts of finished product flexible PCB and optical diaphragm group are assembled: the parts after glue frame, light guide plate and the one-body molded parts of finished product flexible PCB and optical diaphragm group being assembled are placed in described chase.
5. a backlight module, comprise blooming piece, glue frame, light guide plate and finished product flexible PCB, it is characterized in that, described glue frame, light guide plate and finished product flexible PCB for: according to the step of glue frame, light guide plate and the one-body molded parts of finished product flexible PCB as described in making in the method as described in any one of claim 1-4, the one-body molded parts of making; Described blooming piece and glue frame, light guide plate and the one-body molded assembling parts of finished product flexible PCB shaping.
6. backlight module according to claim 5, is characterized in that, also comprises chase, and described blooming piece and glue frame, light guide plate and the one-body molded parts of finished product flexible PCB are placed in described chase.
7. a liquid crystal module, comprises liquid crystal panel, it is characterized in that, comprises backlight module as claimed in claim 5, and described liquid crystal panel is arranged on described backlight module.
8. an injection moulding apparatus, for making the glue frame of backlight module, light guide plate and the one-body molded parts of finished product flexible PCB, it is characterized in that, described injection moulding apparatus comprises the first die unit and the second die unit;
Described first die unit comprises mobile module, and described mobile module is for the formation of light guide plate injection moulding space or glue frame injection moulding space, and described injection moulding space is for carrying out the injection moulding of corresponding injected plastics material after placing finished product flexible PCB again;
Described second die unit comprises drainage trough, and described drainage trough is used for the injected plastics material of the light guide plate injected wherein or glue frame to flow into the injection moulding space that described first die unit is placed with the correspondence of finished product flexible PCB.
9. injection moulding apparatus according to claim 8, is characterized in that, described mobile module specifically comprises: dipper crowding gear, locking mechanism or movable block mechanism.
10. injection moulding apparatus according to claim 9, is characterized in that, described dipper crowding gear specifically comprises the first pressing unit and the second pressing unit; Described first pressing unit forms light guide plate injection moulding space by carrying out descending motion on the axis direction of described first die unit or carries out ascending motion closedown light guide plate injection moulding space; Described second pressing unit forms glue frame injection moulding space by carrying out descending motion on the axis direction of described first die unit or carries out ascending motion closedown glue frame injection moulding space.
CN201410437045.5A 2014-08-29 2014-08-29 Injection moulding device, liquid crystal module, backlight module and manufacturing method thereof Pending CN104325598A (en)

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004095516A (en) * 2002-09-04 2004-03-25 Seiko Epson Corp Photoconductive unit, backlight unit, electro-optical device, electronic device, and manufacturing method for the photoconductive unit
US20060268581A1 (en) * 2005-05-24 2006-11-30 Hon Hai Precision Industry Co., Ltd. Method and apparatus for light guide unit and backlight module using the same
CN2852193Y (en) * 2005-12-06 2006-12-27 群康科技(深圳)有限公司 Backlight module assembly and liquid crystal display device employing the same
CN201867554U (en) * 2010-09-17 2011-06-15 联建(中国)科技有限公司 Structure of LCD device
CN103047584A (en) * 2012-12-07 2013-04-17 京东方科技集团股份有限公司 Backlight module, production method thereof and display device
CN202915166U (en) * 2012-09-10 2013-05-01 上海天马微电子有限公司 Backlight module and liquid crystal display device
CN202992921U (en) * 2012-12-24 2013-06-12 上海天马微电子有限公司 Backlight module and liquid crystal display device
CN203409966U (en) * 2013-08-12 2014-01-29 深圳市立德通讯器材有限公司 Mould for injection molding integration backlight

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004095516A (en) * 2002-09-04 2004-03-25 Seiko Epson Corp Photoconductive unit, backlight unit, electro-optical device, electronic device, and manufacturing method for the photoconductive unit
US20060268581A1 (en) * 2005-05-24 2006-11-30 Hon Hai Precision Industry Co., Ltd. Method and apparatus for light guide unit and backlight module using the same
CN2852193Y (en) * 2005-12-06 2006-12-27 群康科技(深圳)有限公司 Backlight module assembly and liquid crystal display device employing the same
CN201867554U (en) * 2010-09-17 2011-06-15 联建(中国)科技有限公司 Structure of LCD device
CN202915166U (en) * 2012-09-10 2013-05-01 上海天马微电子有限公司 Backlight module and liquid crystal display device
CN103047584A (en) * 2012-12-07 2013-04-17 京东方科技集团股份有限公司 Backlight module, production method thereof and display device
CN202992921U (en) * 2012-12-24 2013-06-12 上海天马微电子有限公司 Backlight module and liquid crystal display device
CN203409966U (en) * 2013-08-12 2014-01-29 深圳市立德通讯器材有限公司 Mould for injection molding integration backlight

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
徐佩弦: "《塑料注射成型与模具设计指南》", 31 January 2014 *
贾润礼等: "《新型注塑模设计》", 31 July 2006 *

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Application publication date: 20150204