CN104319206B - Suspended sheet-metal electronic component and batch manufacturing method thereof - Google Patents
Suspended sheet-metal electronic component and batch manufacturing method thereof Download PDFInfo
- Publication number
- CN104319206B CN104319206B CN201410555072.2A CN201410555072A CN104319206B CN 104319206 B CN104319206 B CN 104319206B CN 201410555072 A CN201410555072 A CN 201410555072A CN 104319206 B CN104319206 B CN 104319206B
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- Prior art keywords
- supporting body
- lower cover
- electronic component
- metallic conductor
- cover plate
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/0411—Miniature fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/024—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being hermetically sealed
- H01C1/026—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being hermetically sealed with gaseous or vacuum spacing between the resistive element and the housing or casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Fuses (AREA)
Abstract
The invention discloses a suspended sheet-metal electronic component and a batch manufacturing method thereof which simply the whole structure and the manufacturing technique. The suspended sheet-metal electronic component comprises an upper cover plate, a lower cover plate, outer electrodes, a metal conductor and an insulator carrier. The two outer electrodes cover the end surfaces at two ends of the upper cover plate and the lower cover plate respectively. The insulation carrier is arranged between the upper cover plate and the lower cover plate and form a cavity together with the upper cover plate and the lower cover plate, and the thickness of the cavity is larger than that of the metal conductor. The metal conductor transversely penetrates into the cavity. Two inner electrodes are arranged at two ends of the metal conductor, and penetrate through two ends of the insulation carrier to be electrically connected with the two outer electrodes. The batch manufacturing method of the suspended sheet-metal electronic component can form the cavity surrounding the metal conductor without forming a cavity in a ceramic tube or being provided with grooves on the upper cover plate and the lower cover plate, greatly reduces the manufacturing difficulty, simplifies the whole manufacturing technique, and is especially suitable to manufacture micro electronic components in batches quickly.
Description
Technical field
The invention belongs to technical field of electronic components, and in particular to a kind of electronic component of sheet metal for hanging type structure
And the batch fabrication method of the element.
Background technology
Electronic component --- such as fuse, resistor etc., often using tinsel, metal forming or metal sheet being formed
Body with electrical resistance property, and played a part of to protect and completely cut off in metallic perimeter with wrapped with insulation.Insulant
Parcel mode typically abuts directly on metal material and the hanging two types of metal material.
It is close to the packaging type processing technology of metal material, in the field of business widely used, such as notification number is CN102013368's
Chinese patent provides a kind of fuse, including glass-ceramic substrate and the fusible metal being embedded in glass-ceramic substrate are led
Need to increase thermal insulation layer to reduce the radiating of metallic conductor under body, but this structure, can be only achieved higher more stable fusing
Energy.
And the wrapped with insulation mode of metal material suspended type typically by insulation crust coated metal conductor and makes metal
Conductor is vacantly in intracavity.This structure has many benefits, by taking fuse as an example, due to the poor thermal conductivity of air, so that melt
Metal is easier rapid accumulation heat and fuses, and is obtained in that good stable fusing performance, and the space energy around melt
Buffering explosion energy, improves the interrupting performance of fuse.Such as notification number discloses one for the Chinese patent of CN203192732U
Common metal material suspended type fuse is planted, the patent provides the insulation tube of an open at both ends, and metal bath is fixed on
In insulation tube, earthenware and two ends copper that two ends assembling copper cap needs manufactured size precision very high as electrode, this kind of technique
Cap, in addition it is also necessary to which especially arranging a load bearing component prevents its bending from pressing close to earthenware for fixing metal bath two ends, so work
Skill is complex, relatively costly.In prior art, minification also is difficult to using the electronic component of the hanging mode of metal material,
And it is difficult the rapid batch manufacturing.
The content of the invention
To solve the above problems, the invention discloses a kind of hanging type sheet metal electronic component and its batch fabrication method,
Overall structure is simplified, manufacturing process has been simplified, has been adapted to make microminiature electronic component.
In order to achieve the above object, the present invention provides following technical scheme：
A kind of hanging type sheet metal electronic component, including upper cover plate, lower cover, external electrode, metallic conductor, insulation carrying
Body, the dispatch from foreign news agency extremely two, is respectively coated by two end surfaces of lower cover, the insulation supporting body be arranged on upper cover plate and
Between lower cover, and upper and lower cover plates constitute cavity, insulation carries body thickness and is more than metallic conductor thickness, and the metallic conductor traverses
In the cavity, metallic conductor two ends have two interior electrodes, and the interior electrode is through insulation supporting body two ends respectively with two
External electrode forms electrical connection.
Further, the interior electrode is integrally formed with metallic conductor.Ensure that conductor and interior electrode bond strength and
Good uniform electrical conductance, improves the stability in use of electronic component.
Further, the upper cover plate and/or lower cover are provided with groove, and the insulation supporting body is located at recess edge
On.Groove can further increase the gap between upper and lower cover plates,
Further, the interior electrode width is identical with electronic component width, and broad interior electrode forms face with external electrode
Connection, it is ensured that the bond strength and good electrical conductance of interior electrode and external electrode.
Further, the insulation supporting body is made using glass or polymer colloid material.
Present invention also offers the batch fabrication method of hanging type sheet metal electronic component, comprises the steps：
Make metallic conductor：Array pattern is formed on sheet metal, the array pattern includes multiple shape identical gold
Category unit, the metal unit include metallic conductor and the interior electrode positioned at metal unit two ends；
Form insulation supporting body：Height is formed in the surrounding of each metal unit to carry more than the insulation of metallic conductor thickness
Body；
Merge upper and lower cover plates：Be formed with insulation supporting body the upper and lower both sides of metal unit array merge respectively lower cover with
Upper cover plate, makes cover plate with insulation supporting body heating bonding, solidification；
Form external electrode：The metallic conductor for getting togather upper and lower cover plates is cut into into strip, wall scroll electronic element array is formed, and
Upper and lower cover plates two ends form external electrode；
Segmentation molding：Stripe like electrical elements array to forming external electrode is split, and forms Single Electron element.
Further, realized by following means the step of the formation insulation supporting body：Metal array figure is put into
In mould, macromolecular material colloid is flowed into into the position molding in default hole.
Further, realized by following means the step of the formation insulation supporting body：Fill out metal array figure is two-sided
Upper fluid sealant, forms insulation supporting body after solidification.
Present invention also offers the batch fabrication method of another kind of hanging type sheet metal electronic component, comprises the steps：
Make metallic conductor：Array pattern is formed on sheet metal, the array pattern includes multiple shape identical gold
Category unit, the metal unit include metallic conductor and the interior electrode positioned at metal unit two ends；
Form insulation supporting body：Respectively on upper and lower cover plate each electronic component position edge printed glass or high score
Sub- material is so as to forming insulation supporting body；
Merge upper and lower cover plates：The metallic conductor array for processing is clipped in print insulation supporting body upper and lower cover plates it
Between so as to heating bonding, fixation；
Form external electrode：The metallic conductor for getting togather upper and lower cover plates is cut into into strip, wall scroll electronic element array is formed, and
Upper and lower cover plates two ends form external electrode；
Segmentation molding：Stripe like electrical elements array to forming external electrode is split, and forms Single Electron element.
Further, groove is previously provided with upper cover plate and/or lower cover, formed when insulating supporting body in pre-groove
Edge printed glass or macromolecular material form insulation supporting body.
Compared with prior art, the invention has the advantages that and beneficial effect：
The present invention without the need in earthenware formed cavity, also without in upper and lower cover plates arrange groove just can be in metal
Cavity is formed around conductor, manufacture difficulty is greatly reduced, is particularly suited for making the small electronic component of volume；Insulation is carried
The formation of body is available to be not required to coat adhesive in addition between mould or mode of printing, with upper and lower insulation cover plate, only need to heat just
Can reach and combine closely, this invention simplifies overall manufacturing process, reduces production cost, be suitable for quick large batch of making electricity
Subcomponent.
Description of the drawings
Fig. 1 is sheet metal schematic diagram before molding；
Fig. 2 is conductor part and interior electrode portion point shaping schematic view；
Fig. 3 is that effect diagram after insulation supporting body is formed on the metallic conductor in embodiment one；
Fig. 4 be embodiment one in upper and lower cover plates close after effect diagram；
Fig. 5 is to be cut into the effect diagram after strip in embodiment one；
Fig. 6 is effect diagram after formation external electrode in embodiment one；
Fig. 7 is single electronic component schematic diagram after segmentation molding in embodiment one；
Longitudinal sectional views of the Fig. 8 for Fig. 7；
Fig. 9 is effect diagram after formation insulation supporting body on up/down cover plate in embodiment two；
Figure 10 is default reeded up/down cover plate schematic diagram；
Figure 11 is that effect diagram after insulation supporting body is formed on default reeded up/down cover plate；
Figure 12 is using electronic component longitudinal sectional view made by the up/down cover plate shown in Figure 11.
Reference numerals list：
Lower cover 1, metallic conductor 3, insulate supporting body 4, and upper cover plate 5, external electrode 6, interior electrode 7,8-X virtually divide in direction
Secant, 9-Y directions virtual dividing line, 10- grooves.
Specific embodiment
The technical scheme that the present invention is provided is described in detail below with reference to specific embodiment, it should be understood that following concrete
Embodiment is only illustrative of the invention and is not intended to limit the scope of the invention.
Such as Fig. 7, shown in Fig. 8, Figure 12, hanging type sheet metal electronic component includes upper cover plate 5,1, two external electrodes of lower cover
6th, metallic conductor 3, insulation supporting body 4, wherein external electrode 6 are respectively coated by two end surfaces of lower cover and cover plate are played solid
Be set for use, insulation supporting body 4 be arranged between upper cover plate 5 and lower cover 1, insulate supporting body as electronic component side wall and
Upper and lower cover plates constitutes cavity 2, and 4 thickness of insulation supporting body is more than 3 thickness of metallic conductor, and metallic conductor 3 is traversed in aforementioned cavity 2
Portion, 3 two ends of metallic conductor are provided with two interior electrodes 7, the interior electrode 7 through insulation supporting body two ends respectively with two external electrodes 6
Form electrical connection.Interior electrode 7 is preferably formed in one with metallic conductor 3, it is ensured that conductor and the bond strength of interior electrode and good
Good uniform electrical conductance.Interior electrode 7 is preferably with whole electronic component with wide（As shown in Figure 4）, so ensure that conductor is in
In the middle of cavity 2, conductor intensity is good, and highly stable electrical connection can be formed between interior electrode 7 and external electrode 6, it is to avoid go out
In existing traditional thread fuse-link, between fuse and external electrode, only point contacts the problem that easy loose contact causes open circuit to take place frequently.It is above-mentioned
Structure without the need in earthenware formed cavity 2, also without in upper and lower cover plates arrange groove just can be around metallic conductor
A cavity 2 is formed, manufacture difficulty is greatly reduced, and be can ensure that centre of the conductor in cavity 2, be more suitable for making volume
Small electronic component.Insulation supporting body is preferably adopted and is not required between glass or polymer colloid material, with upper and lower insulation cover plate
Coating adhesive, need to only heat and just be capable of achieving to combine closely in addition, Simplified flowsheet.
Embodiment one：
The batch fabrication method of above-mentioned hanging type sheet metal electronic component is present embodiments provided, is comprised the steps：
Make metallic conductor：Fig. 1 is one piece of sheet metal material, and its composition can be single metal or alloy material,
Array pattern as shown in Figure 2 is formed on the sheet metal, figure generation type preferably adopts punching press or engraving method.We pass through
X-direction virtual dividing line 8（The line vertical with metallic conductor）And Y-direction virtual dividing line 9（The line parallel with metallic conductor）Can
The array pattern is divided into into the metal unit figure of multiple I-shapeds, each I-shaped metal unit figure includes
Integrally formed metallic conductor 3 and interior electrode 7.I-shaped is only a kind of preferred exemplary for being suitable to process of metallic conductor,
The shape of conductor can process different graphic as needed.
Insulation supporting body is formed on metallic conductor：As shown in figure 3, in each I-shaped metal unit（Include interior
The metallic conductor 3 of electrode and conductor part）Surrounding formed height more than metallic conductor thickness insulation supporting body 4, metal is led
Body is preferably placed in the middle of insulation supporting body, so in use if there is will not be curved because of metallic conductor during emergency situations
Bent or other reasonses make other insulation positions of the contact in the middle part of metallic conductor in addition to interior electrode.The formation of insulation supporting body is excellent
Choosing is using following method:
Method 1：Using formed in mould mode, metal array figure as shown in Figure 2 is put in mould, by macromolecule
Material colloids flow into the position molding in default hole；
Method 2 is：Fluid sealant is filled out metal array figure as shown in Figure 2 is two-sided, above-mentioned insulation is formed after solidification and is held
Carrier.
Merge upper and lower cover plates：As shown in figure 4, being closed in the upper and lower both sides of metal unit array for being formed with insulation supporting body respectively
And lower cover 1 and upper cover plate 5, ceramic cover plate and insulation supporting body heating bonding, solidification are made, forms empty around metallic conductor
Chamber.Lower cover 1 preferably adopts solid smooth ceramic wafer with upper cover plate 5, and composition is the ceramics material such as conventional aluminium oxide, zirconium oxide
Material, without the need for adhesive during merging.Cover plate adopts ceramic material, compared to materials such as the macromolecules for being more than metal using thermal coefficient of expansion
The electronic component of material substrate, it is to avoid metallic conductor is differed greatly and causes electronics with macromolecular material coefficient of thermal expansion when temperature is raised
The risk that leement duration direction metallic conductor is pulled off.
Form external electrode：As shown in figure 5, the metal unit array for getting togather ceramic cover plate is cut along Y-direction virtual dividing line 9
Into strips, wall scroll electronic element array is formed, and forms external electrode 6 as shown in Figure 6.It is preferred that using in the coating of ceramic cover plate two ends
Silver paste forms external electrode 6.Abundant c-type external electrode fixes upper and lower ceramic cover plate, effectively improves the consolidation of electronic component
Degree, can then improve the capability of antidetonance when this electronic component is used as fuse.
Segmentation molding：To the stripe like electrical elements array that forms external electrode, virtual dividing line 8 is split in X direction,
Single Electron element is formed, electronic component as shown in Figure 7 is completed.
Little, miniature fuse can be gone out with batch making by above-mentioned steps, metallic conductor 3 is fusible portion, metal is led
Body is integrally formed, can form good electrical connection with external electrode 6 with interior electrode 7.Existed by the supporting body 4 that insulate inside fuse
Gap is separated out between upper and lower cover plates, is linked to be certain cavity so as to be formed around the fuse-link, it is ensured that fuse-link not with upper and lower covers
Plate is contacted, it can be ensured that the fusing time of fuse is rapid, uniform, while cavity has the function of pressure release, can disperse disjunction
Impulsive force in experiment, improves the capability of antidetonance.
Embodiment two：
Another kind of batch fabrication method of hanging type sheet metal electronic component is present embodiments provided, is comprised the steps：
Make metallic conductor：It is embodied as means identical with embodiment one；
Insulation supporting body is formed on the cover board：Ceramic cover plate is adopted in this example still, as shown in figure 9, adopting thick film screen printing
Mode, respectively on upper and lower ceramic cover plate the position edge printed glass or macromolecular material of each electronic component so as to shape
Into insulation supporting body.
As improvement, can select groove is provided with upper cover plate or lower cover, shape also can be designed with upper and lower cover plates
Shape identical groove, by taking upper cover plate as an example, as shown in Figure 10, is previously provided with groove 10, in pre-groove on upper ceramic cover plate 5
10 edges form insulation supporting body 4 with the mode printed glass or macromolecular material of thick film screen printing again, so as to reach intensification groove
Effect（As shown in figure 11）, can so increase the gap between upper and lower cover plates, so as to further lift fusing performance.Up and down
The electronic component section that pre-groove is respectively provided with ceramic cover plate 5 is as shown in figure 12.
Merge upper and lower ceramic cover plate：3 array of metallic conductor for processing is clipped in the pottery up and down for printing insulation supporting body
Between porcelain cover plate so as to heating bonding, fixation, wherein upper and lower cover plates, upper and lower cover plates recess edge toward each other, together with insulation
Body merges to form cavity, and metallic conductor is vacantly in the cavities.
The process for forming external electrode is identical with embodiment one.
The process of segmentation molding is identical with embodiment one.
Processing step in embodiment one, two not only may be utilized in fabricating hanging type fuse, it can also be used to manufacture hanging type
Sheet metal resistor device, when making resistor, upper and lower cover plates preferably uses the more preferable insulant of thermal diffusivity, such as resin etc., passes through
In life-time service, hanging metallic conductor is not close to following circuit board to the resistor that the inventive method is produced, and has reached and has dissipated
The effect of heat, it is possible to increase the rated power of resistor.
Technological means disclosed in the present invention program are not limited only to the technological means disclosed in above-mentioned embodiment, also include
The technical scheme being made up of above technical characteristic combination in any.It should be pointed out that for those skilled in the art
For, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (10)
1. a kind of batch fabrication method of hanging type sheet metal electronic component, it is characterised in that comprise the steps：
Make metallic conductor：Array pattern is formed on sheet metal, the array pattern includes multiple shape identical metal lists
Unit, the metal unit include metallic conductor（3）With the interior electrode positioned at metallic conductor two ends（7）；
Form insulation supporting body：Height is formed in the surrounding of each metal unit and is more than metallic conductor（3）The insulation of thickness is carried
Body（4）；
Merge upper and lower cover plates：It is being formed with insulation supporting body（4）The upper and lower both sides of metal unit array merge lower cover respectively（1）
With upper cover plate（5）, cover plate is made with insulation supporting body（4）Heating bonding, solidification；
Form external electrode：Upper and lower cover plates will be got togather（1,5）Metal unit array along the wire cutting vertical with metallic conductor, formed
Wall scroll electronic element array, and in upper and lower cover plates（1,5）Two ends form external electrode（6）；
Segmentation molding：To forming external electrode（6）Stripe like electrical elements array split along the line parallel with metallic conductor, formed
Single Electron element.
2. the batch fabrication method of hanging type sheet metal electronic component according to claim 1, it is characterised in that the shape
The step of into insulation supporting body, is realized by following means：Metal array figure is put in mould, by macromolecular material colloid
Flow into the position molding in default hole.
3. the batch fabrication method of hanging type sheet metal electronic component according to claim 1, it is characterised in that the shape
The step of into insulation supporting body, is realized by following means：Fluid sealant is filled out metal array figure is two-sided, after solidification, forms exhausted
Edge supporting body.
4. the batch fabrication method of another kind of hanging type sheet metal electronic component, comprises the steps：
Make metallic conductor：Array pattern is formed on sheet metal, the array pattern includes multiple shape identical metal lists
Unit, the metal unit include metallic conductor（3）With the interior electrode positioned at metallic conductor two ends（7）；
Form insulation supporting body：Respectively in upper and lower cover plate（1,5）The position edge printed glass or high score of upper each electronic component
Sub- material is so as to forming insulation supporting body（4）；
Merge upper and lower cover plates：The metallic conductor array for processing is clipped in the upper and lower cover plates for printing insulation supporting body（1,5）It
Between so as to heating bonding, fixation；
Form external electrode：The metal unit array of upper and lower cover plates will be got togather along the wire cutting vertical with metallic conductor, wall scroll is formed
Electronic element array, and in upper and lower cover plates（1,5）Two ends form external electrode（6）；
Segmentation molding：To forming external electrode（6）Stripe like electrical elements array split along the line parallel with metallic conductor, formed
Single Electron element.
5. the batch fabrication method of hanging type sheet metal electronic component according to claim 4, it is characterised in that：In Shang Gai
Plate（5）And/or lower cover（1）On be previously provided with groove（10）, formed when insulating supporting body in pre-groove（10）Print at edge
Glass or macromolecular material form insulation supporting body（4）.
6. a kind of hanging type sheet metal electronic component, it is characterised in that：Including upper cover plate（5）, lower cover（1）, external electrode（6）、
Metallic conductor（3）, insulation supporting body（4）, the external electrode（6）For two, be respectively coated by lower cover（1,5）Two head ends
Face, the insulation supporting body（4）Upper cover plate is formed at using mould molding or thick film screen printing or filler curing mode（5）And lower cover
Plate（1）Between, and upper and lower cover plates（1,5）Constitute cavity（2）, insulate supporting body（4）Thickness is more than metallic conductor（3）Thickness, institute
State metallic conductor（3）Traverse in the cavity（2）In, the insulation supporting body of metallic conductor both sides（4）Side wall seamless gap, metal are led
Body（3）Two ends have two interior electrodes（7）, the interior electrode（7）Through insulation supporting body（4）Two ends respectively with two external electrodes
（6）Form electrical connection.
7. hanging type sheet metal electronic component according to claim 6, it is characterised in that：The interior electrode（7）With metal
Conductor（3）It is integrally formed.
8. the hanging type sheet metal electronic component according to claim 6 or 7, it is characterised in that：The upper cover plate（5）With/
Or lower cover（1）It is provided with groove（10）, it is described insulation supporting body be located at groove（10）On edge.
9. the hanging type sheet metal electronic component according to claim 6 or 7, it is characterised in that：The interior electrode（7）Width
It is identical with electronic component width.
10. the hanging type sheet metal electronic component according to claim 6 or 7, it is characterised in that：The insulation supporting body
（4）Made using glass or polymer colloid material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410555072.2A CN104319206B (en) | 2014-10-20 | 2014-10-20 | Suspended sheet-metal electronic component and batch manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410555072.2A CN104319206B (en) | 2014-10-20 | 2014-10-20 | Suspended sheet-metal electronic component and batch manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104319206A CN104319206A (en) | 2015-01-28 |
| CN104319206B true CN104319206B (en) | 2017-04-12 |
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| CN201410555072.2A Active CN104319206B (en) | 2014-10-20 | 2014-10-20 | Suspended sheet-metal electronic component and batch manufacturing method thereof |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107610988B (en) | 2017-10-30 | 2021-01-01 | Aem科技(苏州)股份有限公司 | Miniature super surface-mounted fuse and manufacturing method thereof |
| JP6854302B2 (en) * | 2018-01-10 | 2021-04-07 | ディーフォン エレクテック カンパニー リミテッドＤｅｆｏｎｄ Ｅｌｅｃｔｅｃｈ Ｃｏ．， Ｌｔｄ | Electrical switch module for use with variable speed controllers in electrical devices |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5198792A (en) * | 1992-06-12 | 1993-03-30 | Cooper Industries, Inc. | Electrical fuses and method of manufacture |
| US8081057B2 (en) * | 2009-05-14 | 2011-12-20 | Hung-Chih Chiu | Current protection device and the method for forming the same |
| CN102194615A (en) * | 2010-03-02 | 2011-09-21 | 功得电子工业股份有限公司 | Embedded type circuit lamination protection element and manufacturing method thereof |
| EP2408277B1 (en) * | 2010-07-16 | 2016-02-17 | Schurter AG | Fuse element |
| CN102436884A (en) * | 2011-09-15 | 2012-05-02 | 南京萨特科技发展有限公司 | Preparation method of alloy plate precision current sensing resistor |
| CN102568968B (en) * | 2011-12-20 | 2015-02-25 | Aem科技(苏州)股份有限公司 | Manufacturing method for suspended fuse type surface mount fuse instrument |
| CN102623272A (en) * | 2012-04-25 | 2012-08-01 | 东莞市贝特电子科技股份有限公司 | Chip fuse |
| KR101320720B1 (en) * | 2012-11-09 | 2013-10-21 | 스마트전자 주식회사 | Fuse and manufacturing method thereof |
| CN204144203U (en) * | 2014-10-20 | 2015-02-04 | 南京萨特科技发展有限公司 | Hanging type sheet metal electronic component |
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2014
- 2014-10-20 CN CN201410555072.2A patent/CN104319206B/en active Active
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| CN104319206A (en) | 2015-01-28 |
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Effective date of registration: 20180408 Address after: Qixia District of Nanjing City, Jiangsu province 210049 horses Street Youth Road No. 6 Patentee after: Nanjing lont Electronics Co.,Ltd. Address before: Qixia District of Nanjing City, Jiangsu province science and Technology Park 210049 horses Green Road No. 6 Patentee before: NANJING SART SCIENCE & TECHNOLOGY DEVELOPMENT Co.,Ltd. |
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