CN104313534B - A kind of preparation method of OLED mask assembly - Google Patents
A kind of preparation method of OLED mask assembly Download PDFInfo
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- CN104313534B CN104313534B CN201410501850.XA CN201410501850A CN104313534B CN 104313534 B CN104313534 B CN 104313534B CN 201410501850 A CN201410501850 A CN 201410501850A CN 104313534 B CN104313534 B CN 104313534B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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Abstract
The invention discloses a kind of preparation methods of OLED mask assembly, comprising: the mask substrate S1, assembling mask substrate step: is installed on outline border by laser welding process；S2, production mask open step: the laser beam at an acute angle with plane where mask substrate that hair is penetrated is cut by laser and is run on the mask substrate for be installed on outline border according to preset running track and forms mask open on mask substrate; to form mask assembly, mask open is less than the area S2 surrounded away from the edge of the laser head side close to the area S1 that the edge of the laser head side surrounds.The preparation method of the OLED mask assembly provided through the invention, under the premise of meeting environmental-friendly, the requirement of mask plate high quality opening can preferably be met, be cut by laser technique production mask open will not generation environment pollution, while when effectively reducing vapor deposition the mask open of mask plate masking effect.
Description
Technical field
The invention belongs to plane display industry, it is related to OLED display screen industry more particularly to a kind of OLED mask assembly
Preparation method.
Background technique
Organic light emitting display (Organic Light-Emitting Diode, abbreviation OLED) is follow-on display skill
Art is compared, is had with liquid crystal display used at present (Liquid Crystal Display, abbreviation LCD) display technology
The advantages that angle of visibility is big, beautiful in colour, low in energy consumption can gradually substitute the LCD technology of current mainstream.
In the manufacturing process of OLED display panel, wherein the deposition of organic layer will use mask plate, and Fig. 1 is shown
The schematic diagram of organic material is deposited using mask plate 10.It, can be solid by related process before vapor deposition since mask plate 10 is than relatively thin
It is scheduled on outline border 11, Fig. 2 show the floor map that mask plate is fixed on outline border 11.When vapor deposition, mask plate 10 is by outer
Frame 11 is fixed in supporting table 12, and the organic material in evaporation source 13 passes through evaporation and diffusion to 10 lower section of mask plate, mask plate 10
On certain position is provided with opening 100, organic material is deposited on corresponding position in deposition substrate 14 by opening 100
Place forms deposited organic layer.
In technical requirements, the deposition quality of deposited organic layer has very big influence to later product quality, therefore is steaming
It is very high to the edge definition and uniformity requirement of deposition region in deposition substrate 14 during plated deposition.In order to realize
Machine material is deposited well in deposition substrate 14, it is necessary to reduce influence of the mask plate opening frontside edge to deposited organic layer, i.e.,
Reducing shadowing effect as shown in Figure 3 (since mask plate opening frontside edge blocks influence to what organic material 30 deposited, causes
31 edge thickness of deposited organic layer is uneven), to reduce shadowing effect of the mask plate opening to organic material, the opening of mask plate
100 sections are often designed to " spill " structure shown in Fig. 4, are somebody's turn to do " spill " structure and are made generally by chemical etching process,
However the mask plate manufacturing technology of etch process can bring pollution to environment.
Based on this, industry wishes that environmental-friendly technique is used to make mask plate, under the premise of environmentally friendly
Production can satisfy the mask plate of OLED organic layer deposition, and technique production mask plate is cut by laser with environmental-friendly
Advantage, but conventional laser equipment cutting thin material formed mask plate 10 opening pattern as shown in figure 3, so pattern opening band
The defect come is as described above, its requirement for not being able to satisfy OLED display panel organic layer high quality deposition.
Korean Patent 10-2011-0088212 discloses a kind of technical solution being open using laser-cut polymer masks plate, tool
Body θ 1 as shown in figure 5, laser beam and mask substrate that laser head 51 emits form an angle, can by the laser that laser head projects
To form " taper type " hatch frame as shown in Figure 5 on mask plate, such hatch frame can be to avoid during vapor deposition
Shadowing effect shown in Fig. 3.But when actually preparing mask plate using this method, due to making the plate thickness of mask plate
It is not the reasons such as absolute consistent and laser characteristic, the opening of mask plate can have the following deficiencies: mask plate close to laser
The edge of opening linearity for the big opening that first 51 one side is formed is relatively good, and the small opening formed away from the one side of laser head 51
Edge of opening linearity it is poor.And during vapor deposition, mask plate needs tight away from the small opening face that laser head 51 is formed
Vapor deposition substrate 14, the i.e. contour structures of the small opening face decision deposited organic layer of mask plate are pasted, in this way, open edge straight line
Deposited organic layer edge quality can indirectly be influenced by spending bad small opening face.
It, can be compared under the premise of meeting environmental-friendly so industry needs to explore new mode and makes mask plate
The good requirement for meeting mask plate high quality opening.
Summary of the invention
In view of this, in order to solve the problems existing in the prior art, the present invention provides a kind of preparation methods of mask assembly.
According to described in the prior art, OLED evaporation mask plate production at present is used square in this patent background technique
There are two types of methods: first, the opening that cross section is " spill " structure is made by etching work, however the mask plate of etch process makes
Technology can bring pollution to environment；Second, be cut by laser technique production mask plate have the advantages that it is environmental-friendly but traditional
The opening that laser equipment cutting thin material is formed can bring shadowing effect, and the production method of mask assembly provided by the invention is full
Under the premise of foot is environmental-friendly, the requirement of mask plate high quality mask open can satisfy.
The present invention provides a kind of preparation method of OLED mask assembly, comprising:
S1, assembling mask substrate step: the mask substrate is installed on by outline border by laser welding process；
S2, production mask open step: be cut by laser that hair penetrates with plane where mask substrate is at an acute angle swashs
Light beam runs according to preset running track on the mask substrate for be installed on the outline border and in the mask substrate
Mask open is formed on mask ontology, to form mask assembly, the mask open is close to the laser cutting head side
The area S1 that edge surrounds is less than the area S2 surrounded away from the edge of the laser cutting head side.
The preparation method of OLED mask assembly of the invention is described below in detail.
Further, further include stretching step before the assembling mask substrate step, lead in the stretching step
Crossing the outside of mask substrate described in the gripper mechanism grips of mesh stretching body and carrying out taut draw to the mask substrate makes the mask
Substrate surface is smooth and has certain tension.
It further, further include by laser ablation mode or mechanically cutting side after the production mask open step
Formula removes the step of outside.
It is preferred that removing the outside by laser ablation mode, the step of laser ablation mode removes the outside packet
It includes external force and cancels outside step described in step, laser ablation, step is cancelled for the mesh stretching body to described by the external force
The falling part of outside is all cancelled, and reduces or eliminates the clamping device to the pulling force of the outside, is swashed by described
Light cuts off the outside step and removes the outside of the gripper mechanism grips.
Another preferred embodiment, the step of removing the outside by the laser ablation mode include laser half-carve step
Suddenly, outside removes step, forms half-carve area along the outside and the mask ontology adjoiner by the laser half-carve step,
Step is removed by the outside to remove half-carve area described in the outer edge.
It further, further include by laser half before the assembling mask substrate step, after the stretching step
Carving technology is the step of the adjoiner of the outside and the mask ontology forms half-carve area, in the assembling mask substrate step
It later, further include by the outer edge institute before the production mask open step or after the production mask open step
State the step of half-carve area removes.
Further, the Laser emission route of laser cutting head described in the laser cutting parameter and the mask
Acute angle formed by the plate face of substrate is 15 ° ~ 75 °.
Preferably, the Laser emission route of laser cutting head described in the laser cutting parameter and the mask base
Acute angle formed by the plate face of plate is 30 ° ~ 60 °.
Preferably, the Laser emission route of laser cutting head described in the laser cutting parameter and the mask base
Acute angle formed by the plate face of plate is 30 ° or 45 ° or 60 °.
Further, the mask plate is an integral molding structure or discrete mask unit splicing forms.
The additional aspect of the present invention and advantage will be set forth in part in the description, and will partially become from the following description
Obviously, or practice through the invention is recognized.
Detailed description of the invention
Above-mentioned and/or additional aspect of the invention and advantage will become from the following description of the accompanying drawings of embodiments
Obviously and it is readily appreciated that, in which:
Fig. 1 show the schematic diagram using mask assembly vapor deposition organic material；
Fig. 2 show the local vapor deposition schematic diagram of mask plate opening when being deposited using traditional masks component；
Fig. 3 show the mask plate opening schematic diagram using etch process production in the prior art；
Fig. 4 show a kind of using laser cutting parameter production mask plate opening schematic diagram；
Fig. 5 show mask substrate schematic perspective view in the present invention；
Fig. 6 show the present invention before assembling mask substrate step by the taut signal for drawing mask substrate of stretching component
Figure；
Fig. 7 show the schematic cross-section that mask substrate is assembled into outline border by laser welding process by the present invention；
Fig. 8 show the schematic cross-section that the present invention completes assembling mask substrate step；
Fig. 9 show the planar structure schematic diagram after completing assembling mask substrate step shown in Fig. 8；
Figure 10 show the schematic diagram (perspective view) that technique production mask open is cut by laser in the present invention；
Figure 11 show the schematic diagram (sectional view) that technique production mask open is cut by laser in the present invention；
Figure 12 show the floor map of present invention production mask open (from the unilateral observation for deviating from laser cutting head)；
Figure 13 show the schematic cross-section that the present invention makes half-carve area by laser half-carve；
Figure 14 show the schematic cross-section that the present invention completes laser half-carve production half-carve area；
Figure 15 show 140 enlarged schematic partial view in Figure 14；
Figure 16 show the floor map that the present invention completes laser half-carve production half-carve area；
Figure 17 show the present invention and completes the planar structure schematic diagram that outside removes mask assembly after step；
The partial enlargement structure that Figure 18 show the mask plate vapor deposition OLED organic material made by the method for the invention is shown
It is intended to；
Figure 19 show a kind of embodiment schematic diagram of the clamping device 621 of mesh stretching body.
In Fig. 1,10 be mask plate, and 100 be mask open, and 11 be outline border, and 12 be supporting table, and 13 be evaporation source, and 14 be heavy
Product substrate；
In Fig. 2,20 be organic material, and 21 be deposited organic layer；
In Fig. 4,41 be laser head, and θ 1 is the angle of the laser beam that laser head 41 emits and mask substrate；
In Fig. 5,50 be mask substrate, and 101 be the mask ontology of mask substrate, and 102 be the outside of mask substrate；
In Fig. 6,61 be base station, and 62 be mesh stretching body, and 621 be clamping device, and 622 be the installation for installing clamping device 621
Seat, 623 be the attachment rail being mounted in mounting base 622；
In Fig. 7,70 be the laser head of solder mask plate；
In Fig. 8,80 be solder joint；
In Figure 10,1000 be laser cutting head；
In Figure 11, the 1001 small openings formed for mask plate close to laser head side, 1002 deviate from laser head for mask plate
The big opening that side is formed, θ 2 are the angle of plane where the laser beam and mask substrate that laser cutting head 80 emits；
In Figure 12, S1 is the area that the open edge of the small opening of mask plate surrounds, and S2 is the opening edge of mask plate big opening
The area that edge surrounds；
In Figure 13,130 be the laser head for laser half-carve；
In Figure 14,140 be observation part to be amplified；
In Figure 15,150 be half-carve area；
In Figure 19,6211 be the collet of clamping device 621, and 6212 be the bottom plate of clamping device 621, and 6213 be clamping device
621 collet approach rail, 6214 be the motor of clamping device 621, and 6215 be the bottom plate sliding block of clamping device 621, and 6216 be clamping
The tension sensor of mechanism 621,6217 be the position-limit mechanism of clamping device 621.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, and for explaining only the invention, and is not construed as limiting the claims.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " fixation ",
" connection " shall be understood in a broad sense, for example, " connection " may be a fixed connection, is integrally connected, may be a detachable connection；
" fixation " can be integrally formed fixation, be also possible to fix by bindiny mechanism.For those of ordinary skill in the art
For, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.
Inventive concept of the invention is as follows: as described in technical background, used in OLED evaporation mask plate production at present
There are two types of methods: first, cross section is made as the opening of " spill " structure by etching work, however the mask plate system of etch process
Pollution can be brought to environment by making technology；Second, be cut by laser technique production mask plate have the advantages that it is environmental-friendly, but biography
The opening that system laser equipment cutting thin material is formed can bring shadowing effect.In consideration of it, OLED mask assembly provided by the invention
Mask assembly made by preparation method can overcome problem above, can preferably meet in OLED display screen vapor deposition process
Requirement to mask open high quality.
The preparation method of OLED mask assembly of the invention described below with reference to accompanying drawings.
The invention discloses a kind of preparation methods of OLED mask assembly, as shown in Fig. 5 ~ Figure 17 comprising:
S1, assembling mask substrate step: as shown in Fig. 5 ~ Fig. 9, mask substrate 50 is installed on by laser welding process
Outline border 11；
S2, production mask open step: as shown in Figure 10 ~ 12, first 1000 emit and mask substrates are cut by laser
The laser beam of 50 place planes θ 2 at an acute angle is run on the mask substrate 50 for be installed on outline border 11 according to preset running track
And mask open 100 is formed on the mask ontology 101 of mask substrate 50, to form mask assembly, mask open 100 is close
The area S1 that the edge of 1000 side of laser cutting head surrounds is less than the face surrounded away from the edge of 1000 side of laser cutting head
Product S2.
Fig. 5 show mask substrate three-dimensional structure diagram in the present invention, and mask substrate 50 includes the mask ontology of mask substrate
101 and mask substrate 102 two parts of outside, mask ontology 101 is usually an integral molding structure with outside.Pass through mask open
Making step forms mask open 100 on mask ontology 101, and by the clamping of clamping device 621 outside 102 rather than clamping is covered
Mould body 101 can so prevent mask ontology 101 from deforming while facilitate stretching.
In embodiments of the present invention, as shown in fig. 6, further including stretching step before assembling mask substrate step, taut
The outside 102 of mask substrate 50 is clamped by the clamping device 621 of mesh stretching body in net step and is stretched tight to mask substrate 50
Drawing makes 50 surfacing of mask substrate and has certain tension.
The signal that 10 plate of mask base is installed on outline border 11 by laser welding process by the present invention is shown shown in Fig. 7 ~ Fig. 9
Figure, Fig. 7 show the schematic cross-section that mask substrate is assembled into outline border by laser welding process, and Fig. 8, which is shown, completes group
The schematic cross-section of mask substrate step is filled, the planar structure that Fig. 9 show after completing assembling mask substrate step shown in Fig. 8 is shown
It is intended to, after completing stretching step, makes 50 surface of mask substrate under the clamping of 6211 pairs of outsides 102 of collet of clamping device 621
It is smooth and there is certain tension, the edge of mask ontology 101 and outline border 11 aligned by aligning, is emitted by laser head 70
Laser beam mask ontology 101 edge and 11 overlapping region of outline border carry out welding form solder joint 80, thus by mask ontology
101 are assembled on outline border 11.
Mask open step is made, with reference to shown in Figure 10 ~ Figure 12, Figure 10 show the present invention and technique system is cut by laser
Make the schematic diagram (perspective view) of mask open, Figure 11 show the signal that technique production mask open is cut by laser in the present invention
Scheme (sectional view), the floor map that Figure 12 show present invention production mask open (is seen from the side away from laser cutting head
Examine), θ 2 is that (angle theta 2 refers to sharp for the angle of laser beam and 50 place plane of mask substrate that laser cutting head 1000 emits
Acute angle formed by light beam and 50 place plane of mask substrate), S1 is the area that the open edge of the small opening 1001 of mask plate surrounds,
The area that S2 surrounds for the open edge of mask plate big opening 1002, and S2 > S1, to reduce mask open side during vapor deposition
The shadowing effect of wall, i.e. mask open 100 have certain taper, can effectively reduce 100 side wall of mask open to organic material
Material blocks, to improve evaporating quality, as shown in figure 18, it is organic that OLED is deposited in the mask plate to make by the method for the invention
The partial enlargement structural representation of material.
According to some embodiments of the present invention, further include after making mask open step by laser ablation mode or
Mechanically cutting mode removes the step of outside 102.It is preferred that outside 102 is removed by laser ablation mode, by laser ablation side
The edge of 102 mask ontologies 101 of formula removal outside will not tilt.
According to embodiments of the present invention, outside is removed by laser ablation mode after the production mask open step
102, the step of laser ablation mode removes outside 102 include external force cancel step, 102 steps outside laser ablation, by outer
Power cancels step and cancels mesh stretching body to the falling part of outside 102 or all, makes the drawing of 621 pairs of outsides 102 of clamping device
Power reduces or eliminates, and (is not shown the removal of outside 102 that clamping device 621 clamps in figure by 102 steps outside laser ablation
Out).
Step is cancelled by external force to cancel by the falling part of 621 pairs of outsides 102 of clamping device or all, can be effectively prevent
Cause to tear mask ontology 101 because the pulling force of 621 pairs of outsides of clamping device is excessive in 102 steps outside the laser ablation.It is cutting
Except the pulling force of 621 pairs of outsides of clamping device in the step of outside is smaller or only serves clamping action without the pulling force to outside 102
Effect.When outside 102 is wider, outside can be sagging because of self gravity, can be convenient by the clamping of 621 pairs of outsides of clamping device
It is cut by laser the operation of step；, will not be sagging because of the generation of its own gravity when outside 102 is narrow, in no clamping device
It can be good at outside 102 in the case where 621 clampings through laser ablation, then the clamping device in step outside the laser ablation
621 can discharge outside 102.
According to another preferred embodiment of the invention, as shown in Figure 13 ~ Figure 17, pass through after making mask open step
The step of laser ablation mode removes outside 102, and laser ablation mode removes outside 102 includes that laser half-carve step, outside are torn
Except step, half-carve area 150 is formed along outside 102 and 101 adjoiner of mask ontology by laser half-carve step, is removed by outside
Step removes outside 102 along half-carve area 150.Figure 13 show the present invention and makes half-carve area 150 by laser half-carve step
Schematic cross-section, the laser beam that laser head 130 emits are run using outside 102 and 101 adjoiner of mask ontology as running track, from
And half-carve area is formed, the schematic cross-section that laser half-carve makes half-carve area is completed for the present invention as shown in figure 14, Figure 15 is shown
140 enlarged schematic partial view in Figure 14, the depth of 150 laser half-carve of half-carve area is less than the thickness of mask substrate 50, shown in Figure 16
The floor map that laser half-carve step makes half-carve area is completed for the present invention.After completing laser half-carve step, clamping device
621 release outsides 102, then outside 102 is removed, be easy to remove outside 102 by half-carve area 150 along half-carve area 150,
The planar structure schematic diagram that outside removes mask assembly after step is completed as shown in figure 17 for the present invention.
It according to another embodiment of the present invention, further include passing through before assembling mask substrate step, after stretching step
Laser half-carve technique is the step of the adjoiner of outside 102 and mask ontology 101 forms half-carve area.Mask after completion stretching step
Substrate 50 has certain tension, forms half-carve area along outside 102 and 101 adjoiner of mask ontology by laser half-carve technique,
The depth that half-carve area half is carved is less than the thickness of mask substrate 50.After assembling mask substrate step, production mask open step
Further include the steps that removing outside 102 along half-carve area before or after making mask open step.By outside 102 along half
It carves and further includes the steps that the release of clamping device 621 outside 102 before area removes, removed outside 102 with facilitating.
According to some embodiments of the present invention, as shown in figure 11, in laser cutting parameter laser cutting head 1000 laser
Emitting acute angle theta 2 formed by the plate face of route and mask substrate is 15 ° ~ 75 °.
Preferably, in laser cutting parameter the plate face of the Laser emission route of laser cutting head 1000 and mask substrate institute at
Acute angle theta 2 be 30 ° ~ 60 °.
According to an embodiment of the invention, the Laser emission route of laser cutting head 1000 and mask base in laser cutting parameter
Acute angle theta 2 formed by the plate face of plate is 30 ° or 45 ° or 60 °.
According to some embodiments of the present invention, mask plate is an integral molding structure or discrete mask unit splicing forms.
According to some embodiments of the present invention, in production mask open step, it can be a laser cutting head 1000
Cutting production mask open, is also possible to two laser cutting heads 1000 while cutting production mask open, two laser cuttings
First 1000 working efficiency can improve.
It is above-mentioned to assemble mask substrate step, step outside laser ablation, in laser half-carve step in laser welding process
Laser head can be a laser head job, is also possible to two laser heads 130 and works at the same time to improve working efficiency.
Aforementioned mask plate 10 includes the opening 100 on mask ontology 101 and mask ontology.
Stretching component platform as shown in FIG. 6, the base station 61 including installing stretching component, mesh stretching body 62, clamping device
621, the mounting base of clamping device 621, the attachment rail 623 being mounted in mounting base 622 are installed.
Figure 19 show a kind of embodiment schematic diagram of the clamping device 621 of stretching component, and clamping device 621 includes collet
6211, bottom plate 6212, collet approach rail 6213, motor 6214, bottom plate sliding block 6215, collet approach rail 6213 are fixed at bottom plate
On 6212, the setting that 6211 lower end of collet is slided by the sliding block (not identifying in figure) to match with collet approach rail 6213 is in collet
On approach rail 6213, clamping device 621 is entirely through the bottom plate sliding block 6215 and stretching component 62 that 6212 lower part of bottom plate is arranged in
Attachment rail 623 matches in mounting base 622.Collet 6211 can be round-trip on collet approach rail 6213 under the drive of motor 6214
The movement to mask plate or mask substrate stretching is realized in movement；In addition, collet 6211 self by cylinder drive realize clamp with
Loosening up, the movement realizing the clamping of 6211 pairs of outsides 102 of collet or loosening.In some embodiments of the invention, bottom plate
Several tapped through holes are provided on 6212, matching is provided with several screw rods being of convenient length, can by rotary screw
To realize that screw rod is held out against with 622 upper surface of mounting base, to realize that each clamping device 621 is fixed on attachment rail 623
A certain determining position (not shown).
Provided by the present invention for the preparation method of OLED mask assembly, covering for technique production mask plate is cut by laser
Mould opening 100 will not generation environment pollution；Simultaneously because what laser cutting head 1000 emitted swashs in mask open making step
Light beam and 50 place plane of mask substrate are (angle theta 2 shown in Figure 11) at an acute angle, so that mask open 100 has certain cone
Degree, i.e., as shown in Figure 11, Figure 12, close to the face that the open edge of the small opening 1001 of 1000 side of laser cutting head formation surrounds
Product S2 is less than the area S1 that surrounds of open edge of the big opening 1002 formed away from 1000 side of laser cutting head, so can be with
The shadowing effect of mask plate when effectively reducing vapor deposition, OLED is deposited in the mask plate to make by the method for the invention as shown in figure 18
The partial enlargement structural representation of organic material, largely improves evaporating quality.
Although having carried out detailed retouch to a specific embodiment of the invention referring to multiple illustrative examples of the invention
It states, it must be understood that those skilled in the art can be designed that various other improvement and embodiment, these improve and implement
Example will be fallen within spirit and scope.Specifically, in aforementioned disclosure, attached drawing and the scope of the claims
Within, reasonable variations and modifications can be made in terms of the arrangement that components and/or sub-combination are laid out, without departing from
Spirit of the invention.In addition to components and/or the variations and modifications of layout aspect, range is by appended claims and its is equal
Object limits.
Claims (10)
1. a kind of preparation method of OLED mask assembly characterized by comprising
S1, assembling mask substrate step: the mask substrate is installed on by outline border by laser welding process；
S2, production mask open step: the laser beam at an acute angle with plane where mask substrate that hair is penetrated is cut by laser
According to the operation of preset running track and in the mask of the mask substrate on the mask substrate for be installed on the outline border
Mask open is formed on ontology, so that mask assembly is formed, edge of the mask open close to the laser cutting head side
The area S1 surrounded is less than the area S2 surrounded away from the edge of the laser cutting head side.
2. the preparation method of OLED mask assembly according to claim 1, which is characterized in that in the assembling mask substrate
Further include stretching step before step, passes through mask substrate described in the gripper mechanism grips of mesh stretching body in the stretching step
Outside and taut draw is carried out to the mask substrate make the mask substrate surfacing and there is certain tension.
3. the preparation method of OLED mask assembly according to claim 2, which is characterized in that in the production mask open
Further include the steps that removing the outside by laser ablation mode or mechanically cutting mode after step.
4. the preparation method of OLED mask assembly according to claim 3, which is characterized in that the laser ablation mode is gone
The step of side includes that external force cancels outside step described in step, laser ablation except as noted, and cancelling step by the external force will
The mesh stretching body cancels the falling part or whole of the outside, reduces the clamping device to the pulling force of the outside
Or eliminate, the outside of the gripper mechanism grips is removed by outside step described in the laser ablation.
5. the preparation method of OLED mask assembly according to claim 3, which is characterized in that the laser ablation mode is gone
The step of side includes that laser half-carve step, outside remove step except as noted, by the laser half-carve step along the outside
Half-carve area is formed with the mask ontology adjoiner, step is removed by the outside and tears half-carve area described in the outer edge
It removes.
6. the preparation method of OLED mask assembly according to claim 2, which is characterized in that in the assembling mask substrate
It further include the adjoining by laser half-carve technique in the outside and the mask ontology before step, after the stretching step
Place forms the step of half-carve area.
7. the preparation method of OLED mask assembly according to claim 6, which is characterized in that in the assembling mask substrate
After step, before the production mask open step or after the production mask open step further include by the outside
The step of being removed along the half-carve area.
8. the preparation method of OLED mask assembly according to claim 1, which is characterized in that in the laser cutting parameter
Acute angle formed by the Laser emission route of the laser cutting head and the plate face of the mask substrate is 30 ° ~ 60 °.
9. the preparation method of OLED mask assembly according to claim 1, which is characterized in that in the laser cutting parameter
Acute angle formed by the Laser emission route of the laser cutting head and the plate face of the mask substrate be 30 ° or 45 ° or
60°。
10. the preparation method of OLED mask assembly according to claim 1, which is characterized in that the mask plate is integrated
Molding structure or discrete mask unit splicing composition.
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| CN105349947B (en) * | 2015-10-27 | 2018-01-12 | 深圳浚漪科技有限公司 | High-precision metal mask plate processing method |
| CN109136838A (en) * | 2018-11-21 | 2019-01-04 | 京东方科技集团股份有限公司 | A kind of production method of mask plate, mask plate and evaporated device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100615536B1 (en) * | 2004-11-19 | 2006-08-25 | 알투스주식회사 | Manufacturing method and device of stretching mask for heating |
| KR101097331B1 (en) * | 2010-01-28 | 2011-12-23 | 삼성모바일디스플레이주식회사 | Manufacturing method of mask for depositing thin film on substrate |
| CN104060220A (en) * | 2013-03-19 | 2014-09-24 | 昆山允升吉光电科技有限公司 | Mask plate for manufacturing organic light-emitting display |
| CN203448870U (en) * | 2013-08-15 | 2014-02-26 | 昆山思拓机器有限公司 | Laser cutting device |
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