CN104312469A - Anisotropic conductive adhesive tape - Google Patents
Anisotropic conductive adhesive tape Download PDFInfo
- Publication number
- CN104312469A CN104312469A CN201410565877.5A CN201410565877A CN104312469A CN 104312469 A CN104312469 A CN 104312469A CN 201410565877 A CN201410565877 A CN 201410565877A CN 104312469 A CN104312469 A CN 104312469A
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- China
- Prior art keywords
- cladding
- electrically conductive
- conductive particles
- microcapsule
- anisotropy conductiving
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Abstract
The invention relates to an anisotropic conductive adhesive tape which comprises an insulating adhesive layer, a conductive microcapsule which is arranged in the insulating adhesive layer in mono-molecule arrangement mode and a base film covering the back of the insulating adhesive layer, wherein the conductive microcapsule comprises conductive particles and a wrapping body which wraps the conductive microcapsule. The wrapping body is flat, wherein the thickness is less than the width. The conductive microcapsule passes through the wrapping body in the thickness direction. According to the flat wrapping body, the conductive microcapsules which is stressed in the insulating adhesive layer are directionally arranged, and the exposed part of the conductive microcapsules vertically pass through the insulating adhesive layer, so that the anisotropism of the adhesive tape is ensured.
Description
[technical field]
The invention belongs to microelectronic packaging technology field, particularly relate to a kind of can prevent intercommunication between electrically conductive particles and cause conductive path dislocation anisotropy conductiving glue band.
[background technology]
Anisotropy conductiving glue band is little, that resistance the is high in the other direction electrical element of a kind of resistance in particular directions.Its principle is to make dispersing conductive fine particles in insulation glue-line and unit molecule arrangement, the electrical conductor of contact insulation glue-line both sides can only by the longitudinal On current of electrically conductive particles, and owing to being insulated by insulation glue-line between electrically conductive particles, thus cannot horizontal On current, reach anisotropic effect characteristic.
But due to electrically conductive particles more small, be scattered in insulation glue-line in phase mutual edge distance be difficult to control, if multiple electrically conductive particles position too close to and pile up, then may local produce horizontal conducting, affect product performance.
Therefore, be necessary that providing a kind of new anisotropy conductiving glue to bring solves the problem.
[summary of the invention]
Main purpose of the present invention is to provide a kind of and can prevents intercommunication between electrically conductive particles and cause the anisotropy conductiving glue band of conductive path dislocation.
The present invention is achieved through the following technical solutions above-mentioned purpose: a kind of anisotropy conductiving glue band, it comprises insulation glue-line, unit molecule and is arranged in conduction microcapsule in described insulation glue-line, is covered in the basement membrane at the described insulation glue-line back side, described conduction microcapsule comprise electrically conductive particles and are coated on the cladding outside described electrically conductive particles, described cladding is the flats that thickness is less than width, the thickness direction of the through described cladding of described electrically conductive particles.
Concrete, the thickness of described cladding is less than the half of its width.
Concrete, the two ends that described electrically conductive particles exposes described cladding have projection, and described projection is above the surface of described cladding.
Concrete, the material of described electrically conductive particles comprises at least one in silver, copper, gold, al and ni.
Concrete, described insulation paste layer material is organosilane crosslinked polyethylene.
Concrete, the material of described cladding is urethane.
Concrete, described polymkeric substance front is coated with protective membrane.
Compared with prior art, the beneficial effect of a kind of anisotropy conductiving glue band of the present invention is:
1, flat cladding can make conduction microcapsule align in insulation glue-line pressurized, and makes the extending part of electrically conductive particles longitudinally through insulation glue-line, ensures the anisotropy of adhesive tape.
2, electrically conductive particles exposed portion protrudes from outside cladding, its contact when binding electrical conductor being made more stable, preventing electrically conductive particles be subject to the stop of cladding and do not reach electrical conductor so that open circuit.
3, the glue-line that insulate is nonpolarity macromolecular material and cladding is polar material, and adjacent cladding can be attracted each other, and makes conduction microcapsule densely arranged more regularly, makes the effective conducting area in unit surface higher, and resistance is less.
4, protective membrane can avoid insulation glue-line front polluted and lose viscosity.
[accompanying drawing explanation]
Fig. 1 is the structural representation of anisotropy conductiving glue band of the present invention.
Fig. 2 is the structural representation of conduction microcapsule.
Fig. 3 is the structural representation after anisotropy conductiving glue band of the present invention binding electrical conductor.
Numeral in figure:
1, insulate glue-line, and 2, conduction microcapsule, 21, electrically conductive particles, 211, protruding, 22, cladding, 3, basement membrane, 4, protective membrane, the 6, first electrical conductor, the 7, second electrical conductor.
[embodiment]
Below in conjunction with specific embodiment, the present invention is described in further detail.
With reference to Fig. 1, Fig. 3; the present invention is a kind of anisotropy conductiving glue band; it comprises insulation glue-line 1, unit molecule and is arranged in conduction microcapsule 2 in insulation glue-line 1, is covered in the basement membrane 3 at insulation glue-line 1 back side and is covered in the protective membrane 4 in insulation glue-line 1 front; conduction microcapsule 2 are made up of electrically conductive particles 21 and the cladding 22 be coated on outside electrically conductive particles 21; cladding 22 is the flats of width 1/3 in thickness, the thickness direction of the through cladding 22 of electrically conductive particles 21.When the cladding 22 of flats can make conduction microcapsule 2 be scattered in insulation glue-line 1, general planar is arranged in insulation glue-line 1, makes electrically conductive particles 21 expose the normal direction of part along insulation glue-line 1 of cladding 22.Basement membrane 3 and protective membrane 4 can, from the two sides air-isolation of insulation glue-line 1, prevent insulation glue-line 1 from losing viscosity because of contaminated.When removing basement membrane 3 and protective membrane 4, make conductive tape and the first electrical conductor 6, when second electrical conductor 7 is bound, be subject to mechanical effect, contact the first electrical conductor 6, the conduction microcapsule 2 of the second electrical conductor 7 can be clamped and its width can become along sticking veneer direction, the electrically conductive particles 21 of through like this cladding 22 will the longitudinal passage of the first electrical conductor 6 to the second electrical conductor 7 corresponding to conducting, and due to cladding 22 must be had between adjacent conductive particulate 21 to isolate, so electric current can not move in the surface direction of insulation glue-line 1, i.e. lateral isolation, therefore conducting direction is limited, ensure the anisotropy of adhesive tape.
As shown in Figure 2 and Figure 3, the material of electrically conductive particles 21 is a kind of in silver, copper, gold, al and ni or comprises two ends that above several alloy conductive particulate 21 exposes cladding 22 and have protruding 211, described protruding 211 above the surface of cladding 22.If without protruding 211, although conductive tape and the first electrical conductor 6, second electrical conductor 7 conduct electricity the in the right direction of microcapsule 2 when binding, but may conduct electricity microcapsule 2 and the first electrical conductor 6 or the second electrical conductor 7 direct contact surface is positioned at cladding 22 surface but not electrically conductive particles 21 is surperficial, open circuit will occur like this and not have the effect of conducting; Have protruding 211, conductive tape and the first electrical conductor 6, second electrical conductor 7 can ensure to conduct electricity microcapsule 2 and the first electrical conductor 6 or the second electrical conductor 7 direct contact surface and be positioned at electrically conductive particles 21 surface when binding, and metal variable shape, reliable contact can be formed with the first electrical conductor 6 or the second electrical conductor 7 when there being internal stress.
As Fig. 1, insulation glue-line 1 material is organosilane crosslinked polyethylene, and the material of cladding 22 is urethane.Insulation glue-line 1 forms non-polar macromolecular scaffold, cladding 22 is polar material, therefore when cladding 22 is scattered in insulation glue-line 1, adjacent cladding 22 attracts each other and close, make close to each other between conduction microcapsule 2 and guarantor unit's adhesive tape area have enough conducting mediums on the one hand, make cladding 22 be connected and more easily form roughly coplanar unimolecular layer on the other hand, ensure anisotropic effect.
Above-described is only some embodiments of the present invention.For the person of ordinary skill of the art, without departing from the concept of the premise of the invention, can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (7)
1. an anisotropy conductiving glue band, it comprises insulation glue-line, unit molecule and is arranged in conduction microcapsule in described insulation glue-line, is covered in the basement membrane at the described insulation glue-line back side, it is characterized in that: described conduction microcapsule comprise electrically conductive particles and are coated on the cladding outside described electrically conductive particles, described cladding is the flats that thickness is less than width, the thickness direction of the through described cladding of described electrically conductive particles.
2. anisotropy conductiving glue band according to claim 1, is characterized in that: the thickness of described cladding is less than the half of its width.
3. anisotropy conductiving glue band according to claim 1, it is characterized in that: the two ends that described electrically conductive particles exposes described cladding have projection, described projection is above the surface of described cladding.
4. anisotropy conductiving glue band according to claim 1, is characterized in that: the material of described electrically conductive particles comprises at least one in silver, copper, gold, al and ni.
5. anisotropy conductiving glue band according to claim 1, is characterized in that: described insulation paste layer material is organosilane crosslinked polyethylene.
6. anisotropy conductiving glue band according to claim 5, is characterized in that: the material of described cladding is urethane.
7. anisotropy conductiving glue band according to claim 1, is characterized in that: described polymkeric substance front is coated with protective membrane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410565877.5A CN104312469A (en) | 2014-10-22 | 2014-10-22 | Anisotropic conductive adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410565877.5A CN104312469A (en) | 2014-10-22 | 2014-10-22 | Anisotropic conductive adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104312469A true CN104312469A (en) | 2015-01-28 |
Family
ID=52367792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410565877.5A Pending CN104312469A (en) | 2014-10-22 | 2014-10-22 | Anisotropic conductive adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104312469A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104910855A (en) * | 2015-05-25 | 2015-09-16 | 叶志伟 | Conductive adhesive used for flip chip LED packaging |
| WO2020103364A1 (en) * | 2018-11-21 | 2020-05-28 | 武汉华星光电半导体显示技术有限公司 | ANISOTROPIC CONDUCTIVE TAPE AND METHOD FOR MANUFACTURING SAME<u /> |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003268344A (en) * | 2002-03-20 | 2003-09-25 | Shin Etsu Polymer Co Ltd | Anisotropically electroconductive adhesive and heat- seal connector |
| JP2008153201A (en) * | 2006-11-16 | 2008-07-03 | Korea Inst Of Science & Technology | Microcapsule-conductive particle complex, manufacturing method thereof and anisotropic conductive adhesive film using the same |
| CN103013370A (en) * | 2012-12-14 | 2013-04-03 | 京东方科技集团股份有限公司 | Anisotropic conductive adhesive film and electronic device |
| CN103903683A (en) * | 2012-12-28 | 2014-07-02 | 鸿富锦精密工业（深圳）有限公司 | Anisotropic conductive film and preparation method thereof |
| CN204325212U (en) * | 2014-10-22 | 2015-05-13 | 苏州百诚精密科技有限公司 | Anisotropy conductiving glue band |
-
2014
- 2014-10-22 CN CN201410565877.5A patent/CN104312469A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003268344A (en) * | 2002-03-20 | 2003-09-25 | Shin Etsu Polymer Co Ltd | Anisotropically electroconductive adhesive and heat- seal connector |
| JP2008153201A (en) * | 2006-11-16 | 2008-07-03 | Korea Inst Of Science & Technology | Microcapsule-conductive particle complex, manufacturing method thereof and anisotropic conductive adhesive film using the same |
| CN103013370A (en) * | 2012-12-14 | 2013-04-03 | 京东方科技集团股份有限公司 | Anisotropic conductive adhesive film and electronic device |
| CN103903683A (en) * | 2012-12-28 | 2014-07-02 | 鸿富锦精密工业（深圳）有限公司 | Anisotropic conductive film and preparation method thereof |
| CN204325212U (en) * | 2014-10-22 | 2015-05-13 | 苏州百诚精密科技有限公司 | Anisotropy conductiving glue band |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104910855A (en) * | 2015-05-25 | 2015-09-16 | 叶志伟 | Conductive adhesive used for flip chip LED packaging |
| WO2020103364A1 (en) * | 2018-11-21 | 2020-05-28 | 武汉华星光电半导体显示技术有限公司 | ANISOTROPIC CONDUCTIVE TAPE AND METHOD FOR MANUFACTURING SAME<u /> |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150128 |