CN104290020A - Soluble solid soft abrasive polishing device based on cooling fins - Google Patents
Soluble solid soft abrasive polishing device based on cooling fins Download PDFInfo
- Publication number
- CN104290020A CN104290020A CN201410460373.7A CN201410460373A CN104290020A CN 104290020 A CN104290020 A CN 104290020A CN 201410460373 A CN201410460373 A CN 201410460373A CN 104290020 A CN104290020 A CN 104290020A
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- China
- Prior art keywords
- polishing disk
- chilling plate
- semiconductor chilling
- temperature
- surface roughness
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/015—Temperature control
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a soluble solid soft abrasive polishing device based on cooling fins. A polishing device body is a polishing plate with micro abrasive particles on the surface layer, the back of the polishing plate is provided with the semiconductor cooling fins, the bottom of the polishing plate is provided with at least three temperature control belts formed by annularly arranging the semiconductor cooling fins, the upper side of the polishing plate is further provided with a cantilever guide rail provided with a laser surface roughness measuring device, the laser surface roughness measuring device is used for measuring surface roughness of the polishing plate so as to analyze the distribution situation of the micro abrasive particles, and accordingly surface flatness of the polishing plate is adjusted by controlling the temperature of each temperature control belt. Data measured by the laser surface roughness measuring device are accurate, it is guaranteed that an abrasive particle layer is flatter, and machining precision is high; temperature is controlled through the semiconductor cooling fins, so that the device is economical and convenient to control; the whole device is simple in structure and convenient to control due to the fact that solubility of the micro abrasive particles is changed by changing the temperature.
Description
Technical field
The present invention relates to grinding and polishing field, particularly relate to a kind of solubility set mild abrasives burnishing device of based semiconductor cooling piece.
Background technology
In modern polishing technology, the smooth of polishing disk plays vital effect, in polishing process, the whole of polishing disk circumferentially scribbles multilayer fine abrasive uniformly, have polishing fluid during polishing to be constantly sprayed on fine abrasive, the effect of polishing fluid dissolves fine abrasive to have allowed the inadequate abrasive material of the acutance of polishing dissolve, and exposes the self refresh that the good abrasive material of the new acutance of lower floor realizes abrasive material.But because polishing fluid is subject to the centrifugal action of generation when polishing disk rotates, all the time polishing fluid is had mobile to polishing disk periphery, so just cause the distributed pole of polishing fluid on whole polishing disk uneven, namely polishing disk is few and the polishing fluid at polishing disk periphery place is many near the polishing fluid of circle centre position, thus the speed causing the abrasive material of polishing disk periphery after grinding to upgrade is faster than the abrasive material near center of circle part, so just the abrasive material in whole polishing disk is caused not measure up, namely peripheral lower than center, have impact on the quality of polishing.
In order to address this problem, propose a kind of burnishing device of based semiconductor cooling piece.Because the solubility of fine abrasive grains is relevant with temperature, temperature its solubility higher is higher, therefore, adopt a kind of burnishing device of based semiconductor cooling piece that semiconductor chilling plate is affixed on the polishing disk back side, by controlling the size of zones of different semiconductor chilling plate electric current, change the temperature of zones of different semiconductor chilling plate, thus make the temperature on polishing disk surface different.The material conducts heat performance thick and not used due to polishing disk thickness is not strong, therefore, it is possible to ensure that semiconductor chilling plate does not have too large impact to all the other regional temperatures again while its corresponding region temperature of change.Change the temperature of semiconductor chilling plate according to specific requirement, ensure that the fine abrasive grains solubility of polishing disk face center part is higher, to ensure in polishing disk that fine abrasive grains can keep level, smooth by this method, ensure that machining accuracy is higher.
Summary of the invention
The technical problem to be solved in the present invention is to solve the deficiencies in the prior art, provides a kind of temperature by changing semiconductor chilling plate and controls the solubility of fine abrasive grains thus enable fine abrasive grains in polishing disk keep the solubility set mild abrasives burnishing device of level, the smooth based semiconductor cooling piece simultaneously making machining accuracy higher.
For achieving the above object, the technical solution adopted in the present invention is: a kind of solubility set mild abrasives burnishing device based on cooling piece, described burnishing device main body is the polishing disk that top layer scribbles fine abrasive grains, semiconductor chilling plate is equipped with at the described polishing disk back side, be provided with at least three bottom described polishing disk and enclose the temp. control belt be made up of semiconductor chilling plate annular array, the semiconductor chilling plate often enclosing described temp. control belt is unified to be controlled, and often encloses described temp. control belt and independently controls; The cantilevered rail that laser surface roughness measuring instrument is housed also is provided with above described polishing disk, described laser surface roughness measuring instrument for measuring polishing disk surface roughness thus analyzing described fine abrasive grains distribution situation, and then often encloses the temperature of described temp. control belt to adjust polishing disk surface smoothness by control.
Further, described fine abrasive grains uniform application in polishing disk surface, and can be dissolved in cooling fluid, and its solubility is subject to the impact of temperature, and its temperature more high-dissolvability is higher.
Further, described polishing disk thickness is moderate, and thermal conductivity is moderate, can ensure, when semiconductor chilling plate is affixed on its back side, can not have much impact again while affecting corresponding region temperature to neighboring area temperature.
Further, described semiconductor chilling plate is followed polishing disk and is rotated, and described semiconductor chilling plate connects the carbon brush be located at for powering to semiconductor chilling plate below polishing disk.
Further, described cantilevered rail is parallel to polishing disk surface, and laser surface roughness measuring instrument is parallel to polishing disk surface moving linearly along cantilevered rail.
Further, by wired in series together, the semiconductor chilling plate of described each and every one temp. control belt every connects into loop by carbon brush and wire to the semiconductor chilling plate of described each temp. control belt.
Compared with prior art, the present invention has the following advantages: the present invention is simple and compact for structure, and production cost is low; Utilize laser surface roughness measuring instrument to record to be that data are accurate, to ensure that abrasive grain layer is more smooth, thus ensure that machining accuracy is higher; Utilize semiconductor chilling plate control temperature, economical and practical, it is convenient to control; By changing the solubility of temperature change fine abrasive grains, thus make whole apparatus structure simple and be convenient to control.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Fig. 2 is the upward view of polishing disk of the present invention and semiconductor refrigerating chip architecture.
Fig. 3 is structural representation top view of the present invention.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearly understand, below in conjunction with detailed description of the invention also with reference to accompanying drawing, the present invention is described in more detail.Should be appreciated that, these describe just exemplary, and do not really want to limit the scope of the invention.In addition, in the following description, the description to known features and technology is eliminated, to avoid unnecessarily obscuring concept of the present invention.
Composition graphs 1, Fig. 2 and Fig. 3, a kind of solubility set mild abrasives burnishing device based on cooling piece, its agent structure is polishing disk 1, laser surface roughness measuring instrument 7 is had above polishing disk 1, in order to measure the flatness of the fine abrasive grains on polishing disk surface, at the back side of polishing disk 1, semiconductor chilling plate 13 is housed, the flat conditions of fine abrasive grains at polishing disk is known according to the data that measuring instrument records, thus the size of current of adjustment semiconductor chilling plate 13, affect the solubility of each region fine abrasive grains.
Whole device is divided into drive part, measure portion, temperature-controlled portion.Drive part is connected with polishing disk 1 by shaft coupling 5 primarily of rotary electric machine 6, drives polishing disk to rotate when rotary electric machine rotates, and support 4 is housed in the below of polishing disk and plays the effect supporting polishing disk 1.
Cantilevered rail 8 and laser surface roughness measuring instrument 7 are housed above polishing disk 1, between laser surface roughness measuring instrument 7 and cantilevered rail 8, have drive motors 10, move in cantilevered rail 8 in order to driving laser surfagauge 7.Cantilevered rail is contained on support 9.When polishing disk starts to rotate, by the mobile position of laser surface roughness measuring instrument 7 in cantilevered rail 8, the surface light roughness of the different border circular areas of polishing disk can be measured, i.e. the distribution situation of known fine abrasive grains.
At the back side of polishing disk 1, semiconductor chilling plate 13 is housed, semiconductor chilling plate 13 is evenly distributed in the back side of polishing disk 1 in the form of a ring, each semiconductor chilling plate 13 in same circle by wired in series together, then forms loop by visiting brush 11 with wire 3 UNICOM be positioned on outer wall 2.The semiconductor chilling plate 13 of each circle connects from different wires 3 by visiting brush 11, when needing the electric current of the semiconductor chilling plate 13 changing a certain circle, only needs the electric current of the wire 3 corresponding to changing.
The working procedure of whole device is as follows:
1, smear fine abrasive grains at polishing disk 1 surface uniform, start rotary electric machine 6, make polishing disk 1 normal rotation.
2, workpiece starts to carry out polishing on polishing disk, with this simultaneously, sprays cooling fluid, coolant distribution can be made uneven, thus cause the not flat bed of fine abrasive grains layer because polishing disk rotates generation centrifugal force.
3, start the roughness that laser surface roughness measuring instrument 7 mobile laser surface roughness measuring instrument 7 under the drive of drive motors 10 records the different annular region in polishing disk surface, calculate the flat conditions of the fine abrasive grains in corresponding annular region.
4, according to the result recorded, calculate the applicable temperature of corresponding region, thus make fine abrasive grains more smooth.
5, under the prerequisite considering the factor such as temperature loss, heat transfer, convert out according to required temperature the electric current that the semiconductor chilling plate 13 below corresponding region passes through, the size of the electric current that the control of semiconductor chilling plate 13 electric current is circulated by the wire 3 controlled on outer wall 2 realizes.Because each root wire connects the semiconductor chilling plate 13 of an annular region, therefore, the temperature that size of current that each root wire passes through can control an annular region is only needed to control.
6, control temperature is passed through, make polishing disk formation temperature field, and then affect the solubility of fine abrasive grains, on the whole, the desirable solubility distributed effect reached is: the solubility of central area is higher than fringe region, and solubility is successively decreased gradually from center to edge.
Should be understood that, above-mentioned detailed description of the invention of the present invention only for exemplary illustration or explain principle of the present invention, and is not construed as limiting the invention.Therefore, any amendment made when without departing from the spirit and scope of the present invention, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.In addition, claims of the present invention be intended to contain fall into claims scope and border or this scope and border equivalents in whole change and modification.
Claims (6)
1. the solubility set mild abrasives burnishing device based on cooling piece, it is characterized in that: described burnishing device main body is the polishing disk (1) that top layer scribbles fine abrasive grains, semiconductor chilling plate (13) is equipped with at described polishing disk (1) back side, described polishing disk (1) bottom is provided with at least three and encloses the temp. control belt be made up of semiconductor chilling plate (13) annular array, the semiconductor chilling plate (13) often enclosing described temp. control belt is unified to be controlled, and often encloses described temp. control belt and independently controls; Described polishing disk (1) top is also provided with the cantilevered rail (8) that laser surface roughness measuring instrument (7) are housed, described laser surface roughness measuring instrument (7) for measuring polishing disk (1) surface roughness thus analyzing described fine abrasive grains distribution situation, and then often encloses the temperature of described temp. control belt to adjust polishing disk (1) surface smoothness by control.
2. a kind of solubility set mild abrasives burnishing device based on cooling piece according to claim 1, it is characterized in that: described fine abrasive grains uniform application is in polishing disk (1) surface, and can be dissolved in cooling fluid, its solubility is subject to the impact of temperature, and its temperature more high-dissolvability is higher.
3. a kind of solubility set mild abrasives burnishing device based on cooling piece according to claim 1, it is characterized in that: described polishing disk (1) thickness is moderate, thermal conductivity is moderate, can ensure, when semiconductor chilling plate (13) is affixed on its back side, can not have much impact to neighboring area temperature again while affecting corresponding region temperature.
4. a kind of solubility set mild abrasives burnishing device based on cooling piece according to claim 1, it is characterized in that: described semiconductor chilling plate (13) is followed polishing disk (1) and rotated, described semiconductor chilling plate (13) connects the carbon brush (11) being located at polishing disk (1) below and being used for powering to semiconductor chilling plate (13).
5. a kind of solubility set mild abrasives burnishing device based on cooling piece according to claim 1, it is characterized in that: described cantilevered rail (8) is parallel to polishing disk (1) surface, and laser surface roughness measuring instrument (7) is parallel to polishing disk (1) surperficial moving linearly along cantilevered rail (8).
6. a kind of solubility set mild abrasives burnishing device based on cooling piece according to claim 1, it is characterized in that: the semiconductor chilling plate (13) of described each temp. control belt is cascaded by wire (3), the semiconductor chilling plate (13) of described each and every one temp. control belt every connects into loop by carbon brush (11) and wire (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410460373.7A CN104290020B (en) | 2014-09-11 | A kind of solubility set mild abrasives burnishing device based on cooling piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410460373.7A CN104290020B (en) | 2014-09-11 | A kind of solubility set mild abrasives burnishing device based on cooling piece |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104290020A true CN104290020A (en) | 2015-01-21 |
| CN104290020B CN104290020B (en) | 2017-01-04 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112355888A (en) * | 2020-11-27 | 2021-02-12 | 苏州恒嘉晶体材料有限公司 | Polishing disk and cooling system for lower disk surface of polishing disk |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07237096A (en) * | 1994-02-23 | 1995-09-12 | Fuji Electric Co Ltd | End face machining method for work having minute hole |
| CN102601719A (en) * | 2011-01-20 | 2012-07-25 | 株式会社荏原制作所 | Polishing method and polishing apparatus |
| CN102672594A (en) * | 2012-05-04 | 2012-09-19 | 上海华力微电子有限公司 | Device for precisely controlling temperature of CMP (Chemical Mechanical Polishing) grinding disc |
| CN202462201U (en) * | 2012-03-05 | 2012-10-03 | 中芯国际集成电路制造(上海)有限公司 | Grinding temperature control system and grinding device |
| CN102802871A (en) * | 2010-03-19 | 2012-11-28 | 霓达哈斯股份有限公司 | Polishing apparatus, polishing pad, and polishing information management system |
| CN204160306U (en) * | 2014-09-11 | 2015-02-18 | 衢州学院 | A kind of solubility set mild abrasives burnishing device based on cooling piece |
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07237096A (en) * | 1994-02-23 | 1995-09-12 | Fuji Electric Co Ltd | End face machining method for work having minute hole |
| CN102802871A (en) * | 2010-03-19 | 2012-11-28 | 霓达哈斯股份有限公司 | Polishing apparatus, polishing pad, and polishing information management system |
| CN102601719A (en) * | 2011-01-20 | 2012-07-25 | 株式会社荏原制作所 | Polishing method and polishing apparatus |
| CN202462201U (en) * | 2012-03-05 | 2012-10-03 | 中芯国际集成电路制造(上海)有限公司 | Grinding temperature control system and grinding device |
| CN102672594A (en) * | 2012-05-04 | 2012-09-19 | 上海华力微电子有限公司 | Device for precisely controlling temperature of CMP (Chemical Mechanical Polishing) grinding disc |
| CN204160306U (en) * | 2014-09-11 | 2015-02-18 | 衢州学院 | A kind of solubility set mild abrasives burnishing device based on cooling piece |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112355888A (en) * | 2020-11-27 | 2021-02-12 | 苏州恒嘉晶体材料有限公司 | Polishing disk and cooling system for lower disk surface of polishing disk |
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