CN104282671A - 发光二极管组件及制作方法 - Google Patents
发光二极管组件及制作方法 Download PDFInfo
- Publication number
- CN104282671A CN104282671A CN201310272503.XA CN201310272503A CN104282671A CN 104282671 A CN104282671 A CN 104282671A CN 201310272503 A CN201310272503 A CN 201310272503A CN 104282671 A CN104282671 A CN 104282671A
- Authority
- CN
- China
- Prior art keywords
- light
- emitting diode
- led component
- blue
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310272503.XA CN104282671B (zh) | 2013-07-01 | 2013-07-01 | 发光二极管组件及制作方法 |
CN201810834574.7A CN109065526A (zh) | 2013-07-01 | 2013-07-01 | 发光二极管组件及制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310272503.XA CN104282671B (zh) | 2013-07-01 | 2013-07-01 | 发光二极管组件及制作方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810834574.7A Division CN109065526A (zh) | 2013-07-01 | 2013-07-01 | 发光二极管组件及制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104282671A true CN104282671A (zh) | 2015-01-14 |
CN104282671B CN104282671B (zh) | 2018-08-21 |
Family
ID=52257419
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310272503.XA Active CN104282671B (zh) | 2013-07-01 | 2013-07-01 | 发光二极管组件及制作方法 |
CN201810834574.7A Pending CN109065526A (zh) | 2013-07-01 | 2013-07-01 | 发光二极管组件及制作方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810834574.7A Pending CN109065526A (zh) | 2013-07-01 | 2013-07-01 | 发光二极管组件及制作方法 |
Country Status (1)
Country | Link |
---|---|
CN (2) | CN104282671B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110021621A (zh) * | 2019-03-28 | 2019-07-16 | 苏州佳世达电通有限公司 | 显示器 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102116393B1 (ko) * | 2019-02-27 | 2020-05-28 | (주) 글로우원 | 양면 전극을 구비한 투명 led 디스플레이 |
CN110416396B (zh) * | 2019-08-20 | 2020-10-16 | 崇义县佰盛五金制品有限公司 | 一种节能环保型照明装置及其制造方法 |
Citations (6)
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---|---|---|---|---|
CN101968181A (zh) * | 2010-09-08 | 2011-02-09 | 葛世潮 | 一种高效率led灯泡 |
US20110084299A1 (en) * | 2009-10-13 | 2011-04-14 | Hiroshi Kotani | Led light source and manufacturing method for the same |
TW201117436A (en) * | 2009-11-04 | 2011-05-16 | Everlight Electronics Co Ltd | Light-emitting diode package and manufacturing method thereof |
TW201208128A (en) * | 2010-08-02 | 2012-02-16 | Advanced Optoelectronic Tech | Package structure of LED |
TW201230268A (en) * | 2010-10-26 | 2012-07-16 | Toshiba Lighting & Technology Corp | Luminous module and lighting apparatus |
CN103069593A (zh) * | 2010-10-22 | 2013-04-24 | 松下电器产业株式会社 | 安装用基板、发光装置及灯 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20050034936A (ko) * | 2003-10-10 | 2005-04-15 | 삼성전기주식회사 | 형광체를 이용한 파장변환형 발광 다이오드 패키지 및제조방법 |
KR101619832B1 (ko) * | 2009-11-30 | 2016-05-13 | 삼성전자주식회사 | 발광다이오드 패키지, 이를 구비한 발광다이오드 패키지 모듈과 그 제조 방법, 및 이를 구비한 헤드 램프 모듈과 그 제어 방법 |
US9732930B2 (en) * | 2010-07-20 | 2017-08-15 | Panasonic Intellectual Property Management Co., Ltd. | Light bulb shaped lamp |
CN202281057U (zh) * | 2011-05-11 | 2012-06-20 | 浙江锐迪生光电有限公司 | 一种LED芯片4π出光的高效率LED发光管 |
EP2672175A3 (en) * | 2010-11-04 | 2017-07-19 | Panasonic Intellectual Property Management Co., Ltd. | Light bulb shaped lamp and lighting apparatus |
CN102032493A (zh) * | 2011-01-28 | 2011-04-27 | 东莞市美能电子有限公司 | 一种led灯泡 |
CN102518968A (zh) * | 2011-12-20 | 2012-06-27 | 东莞市奥一特实业有限公司 | 球泡灯制备方法及实施该方法制得的球泡灯 |
CN102496674A (zh) * | 2011-12-23 | 2012-06-13 | 惠州市华阳多媒体电子有限公司 | 一种新型达成白光的led封装结构及封装方法 |
CN102748628A (zh) * | 2012-07-04 | 2012-10-24 | 曾浩华 | 一种led照明灯具 |
CN103013282B (zh) * | 2012-12-14 | 2015-02-25 | 江门市江海区亿宏光电有限公司 | 一种抗光衰led固晶绝缘胶 |
CN102983257A (zh) * | 2012-12-24 | 2013-03-20 | 上海顿格电子贸易有限公司 | Led灯丝接插座 |
-
2013
- 2013-07-01 CN CN201310272503.XA patent/CN104282671B/zh active Active
- 2013-07-01 CN CN201810834574.7A patent/CN109065526A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110084299A1 (en) * | 2009-10-13 | 2011-04-14 | Hiroshi Kotani | Led light source and manufacturing method for the same |
TW201117436A (en) * | 2009-11-04 | 2011-05-16 | Everlight Electronics Co Ltd | Light-emitting diode package and manufacturing method thereof |
TW201208128A (en) * | 2010-08-02 | 2012-02-16 | Advanced Optoelectronic Tech | Package structure of LED |
CN101968181A (zh) * | 2010-09-08 | 2011-02-09 | 葛世潮 | 一种高效率led灯泡 |
CN103069593A (zh) * | 2010-10-22 | 2013-04-24 | 松下电器产业株式会社 | 安装用基板、发光装置及灯 |
TW201230268A (en) * | 2010-10-26 | 2012-07-16 | Toshiba Lighting & Technology Corp | Luminous module and lighting apparatus |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110021621A (zh) * | 2019-03-28 | 2019-07-16 | 苏州佳世达电通有限公司 | 显示器 |
Also Published As
Publication number | Publication date |
---|---|
CN104282671B (zh) | 2018-08-21 |
CN109065526A (zh) | 2018-12-21 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170515 Address after: Hsinchu City, Taiwan, China Applicant after: EPISTAR Corp. Address before: Hsinchu City, Taiwan, China Applicant before: EPISTAR Corp. Applicant before: INTERLIGHT OPTOTECH Corp. Effective date of registration: 20170515 Address after: Hsinchu City, Taiwan, China Applicant after: EPISTAR Corp. Applicant after: INTERLIGHT OPTOTECH Corp. Address before: Taichung City, Taiwan, China Applicant before: HUGA OPTOTECH INC. Applicant before: INTERLIGHT OPTOTECH Corp. |
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TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20180606 Address after: Hsinchu City, Taiwan, China Applicant after: EPISTAR Corp. Applicant after: KAISTAR LIGHTING (XIAMEN) Co.,Ltd. Address before: Hsinchu City, Taiwan, China Applicant before: EPISTAR Corp. |
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GR01 | Patent grant | ||
GR01 | Patent grant |