CN104264134A - Formula of acid-based colloidal palladium activation solution - Google Patents

Formula of acid-based colloidal palladium activation solution Download PDF

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Publication number
CN104264134A
CN104264134A CN201410480905.3A CN201410480905A CN104264134A CN 104264134 A CN104264134 A CN 104264134A CN 201410480905 A CN201410480905 A CN 201410480905A CN 104264134 A CN104264134 A CN 104264134A
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CN
China
Prior art keywords
formula
acid
activation solution
solution
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410480905.3A
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Chinese (zh)
Inventor
杨彦涛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Changhui Machinery & Electronics Technology Co Ltd
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Wuxi Changhui Machinery & Electronics Technology Co Ltd
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Filing date
Publication date
Application filed by Wuxi Changhui Machinery & Electronics Technology Co Ltd filed Critical Wuxi Changhui Machinery & Electronics Technology Co Ltd
Priority to CN201410480905.3A priority Critical patent/CN104264134A/en
Publication of CN104264134A publication Critical patent/CN104264134A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/30Activating or accelerating or sensitising with palladium or other noble metal

Abstract

The invention discloses a formula of an acid-based colloidal palladium activation solution. The formula of the acid-based colloidal palladium activation solution comprises the following components in weight mixture ratios: a solution A containing 1g/L of palladium oxide, 165ml/L of oxalic acid, 2.68g/L of ferrous chloride and 200mL/L of deionized water; a solution B containing 75g/L of ferrous chloride, 8.5g/L of sodium ferrate and 110mL/L of oxalic acid. The invention provides the formula of the acid-based colloidal palladium activation solution, which has the advantages of strong activation performance and environmental friendliness.

Description

A kind of formula of acidic group colloidal pd activation solution
Technical field
The present invention relates to the formula of the activation solution in a kind of chemical-copper-plating process.
Background technology
In chemical-copper-plating process, activation solution forms the colloidal solid containing palladium metal in the solution, physisorption is utilized when activation treatment, palladium active center is formed at matrix surface, therefore, precious metal in activation solution can not and metallic copper between produce and replace metal level, the catalysis particle of the just unimolecular layer produced on matrix surface after activation, provides good condition of surface to the bonding force improving coating.The colloidal pd activation solution that existing acidic group colloidal pd activation solution is is dispersion medium with high salt concentration aqueous acid, owing to containing the higher hydrochloric acid of concentration in activation solution, the activity of hydrochloric acid is very strong, the acid that a kind of penetrating power is very strong, skill corrodes around multi-ply wood aperture with in the zone of oxidation of internal layer terminal pad Copper Foil, produce " pink circle ", containing thicker colloidal stannate compounds in acidic group colloidal pd activation solution, both the activation performance improving colloidal palladium had been unfavorable for, impair again electroless copper plating layer and matrix Copper Foil bonding force, and hydrochloric acid consumption is large in acidic group colloidal pd activation solution, acid mist is large, poor working environment, be unfavorable for operator ' s health and harm environment.
Summary of the invention
Goal of the invention: the invention solves the problems referred to above, provides the formula of the acidic group colloidal pd activation solution of the strong and environmental protection of a kind of activation performance.
Technical scheme: a kind of formula of acidic group colloidal pd activation solution, comprises following composition by weight ratio, first liquid: palladous oxide 1g/L, oxalic acid 165mL/L, iron protochloride 2.68g/L, deionized water 200mL/L;
Second liquid: iron protochloride 75g/L, Na2Fe04 8.5g/L, oxalic acid 110 mL/L.
Concrete, the concentration of oxalic acid is 34%.
Concrete, the proportioning of first liquid and second liquid is 1:1.
Beneficial effect: compared with prior art, its advantage is that the wustite compound produced does not affect the activation performance of colloidal palladium in the present invention, and with the environmental protection more of careless acid instead of HCl, the health can not damaging operator does not pollute the environment yet.
Embodiment
Below in conjunction with embodiment, illustrate the present invention further.
Embodiment 1
A formula for acidic group colloidal pd activation solution, comprises first liquid and second liquid.
Following composition by weight ratio, first liquid: palladous oxide 1g/L, concentration is the oxalic acid 165mL/L of 34%, iron protochloride 2.68g/L, deionized water 200mL/L;
Prepared by first liquid: by palladous oxide heating for dissolving in oxalic acid, constant temperature 55 DEG C is deposited, then is dissolved in by iron protochloride in oxalic acid and deionized water, and constant temperature 55 DEG C is deposited, and is slowly added in the solution containing palladous oxide by above solution of ferrous chloride.
Second liquid: iron protochloride 75g/L, Na2Fe04 8.5g/L, concentration is oxalic acid 110 mL/L of 34%;
Prepared by second liquid: the deionized water adding 600mL in a reservoir, and be sequentially added into iron protochloride, Na2Fe04, concentration is the oxalic acid of 34%, stir and heat help dissolving, constant temperature 55 DEG C is deposited.
First liquid is joined the proportions of second liquid by 1:1.
The invention provides the formula of the acidic group colloidal pd activation solution of the strong and environmental protection of a kind of activation performance.

Claims (3)

1. a formula for acidic group colloidal pd activation solution, is characterized in that: comprise following composition by weight ratio, first liquid: palladous oxide 1g/L, oxalic acid 165mL/L, iron protochloride 2.68g/L, deionized water 200mL/L;
Second liquid: iron protochloride 75g/L, Na2Fe04 8.5g/L, oxalic acid 110 mL/L.
2. the formula of a kind of acidic group colloidal pd activation solution according to claim 1, is characterized in that: the concentration of oxalic acid is 34%.
3. the formula of a kind of acidic group colloidal pd activation solution according to claim 1, is characterized in that: the proportioning of first liquid and second liquid is 1:1.
CN201410480905.3A 2014-09-19 2014-09-19 Formula of acid-based colloidal palladium activation solution Pending CN104264134A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410480905.3A CN104264134A (en) 2014-09-19 2014-09-19 Formula of acid-based colloidal palladium activation solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410480905.3A CN104264134A (en) 2014-09-19 2014-09-19 Formula of acid-based colloidal palladium activation solution

Publications (1)

Publication Number Publication Date
CN104264134A true CN104264134A (en) 2015-01-07

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410480905.3A Pending CN104264134A (en) 2014-09-19 2014-09-19 Formula of acid-based colloidal palladium activation solution

Country Status (1)

Country Link
CN (1) CN104264134A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59170253A (en) * 1983-03-16 1984-09-26 Hitachi Ltd Palladium activating solution
CN101054663A (en) * 2007-05-29 2007-10-17 南京工业大学 Activating process for nonmetal basal body chemical plating
CN103449538A (en) * 2013-07-02 2013-12-18 南京吉安特环保技术有限公司 Preparation method of nano palladium oxide hollow spheres
CN103469180A (en) * 2013-09-16 2013-12-25 苏州志向纺织科研股份有限公司 Method for preparing antistatic polyester through chemical nickel-plating process

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59170253A (en) * 1983-03-16 1984-09-26 Hitachi Ltd Palladium activating solution
CN101054663A (en) * 2007-05-29 2007-10-17 南京工业大学 Activating process for nonmetal basal body chemical plating
CN103449538A (en) * 2013-07-02 2013-12-18 南京吉安特环保技术有限公司 Preparation method of nano palladium oxide hollow spheres
CN103469180A (en) * 2013-09-16 2013-12-25 苏州志向纺织科研股份有限公司 Method for preparing antistatic polyester through chemical nickel-plating process

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Application publication date: 20150107