CN104249466A - Production technology of Teflon film - Google Patents
Production technology of Teflon film Download PDFInfo
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- CN104249466A CN104249466A CN201310271078.2A CN201310271078A CN104249466A CN 104249466 A CN104249466 A CN 104249466A CN 201310271078 A CN201310271078 A CN 201310271078A CN 104249466 A CN104249466 A CN 104249466A
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Abstract
The invention discloses a production technology of a Teflon film. The production technology comprises a material temperature-keeping process, a compacting process, a sintering process and a turning process. The material temperature-keeping process and the compacting process utilize dust-free purified workshops as production workshops. A vacuum automatic feeding technology is used in all feeding processes. The Teflon film obtained by the production technology has uniform density, is prepared by special processes, has a low treatment cost and has thickness tolerance within +/-2% improved by five times than that of the traditional technology.
Description
Technical field
The present invention relates to a kind of production technology of membrane material, particularly relate to the production technology that a kind of polytetrafluoroethylene (PTFE) is thin.
Background technology
Polytetrafluoroethylene (PTFE) is generally called " King ", is a kind of Prof. Du Yucang macromolecular material employing fluorine and replace all hydrogen atoms in polyethylene.Polytetrafluoroethylene (PTFE) has very stable electrical property (as dielectric constant, dielectric loss etc.), high accuracy polytetrafluoroethylene film is clamped into very equably in the production technology of high frequency printed circuit board and goes, the stability of this circuit board electrical property and the peel strength of Copper Foil and medium and the fineness on surface can be improved.Working condition and the technique of conventional polytetrafluoroethylene film are: as long as in clean workshop, with stainless steel spoon, polytetrafluoroethylene (PTFE) powder is joined in the compacting tool set of certain specification, and this time mould in polytetrafluoroethylene (PTFE) powder to unite accumulation, irregular spacing is had between uniting and uniting, that is the polytetrafluoroethylene (PTFE) powder very irregular in mould, powder mobility is very poor, superficial density is very uneven, suppress with hydraulic press and be difficult to the air in mould to discharge, so the density of whole blank is also uneven, the density of the film that later turning goes out is uneven equally, so suppress high-frequency circuit board by normal film, directly affect product electrical property.In addition, China's polytetrafluoroethylene film product standard is on the low side, standard No. is QB/T3627-1999, wherein thickness deviation be product thickness ± 10%, and general high frequency printed circuit board adopts 6 ~ 10 polytetrafluoroethylene films, the printed circuit board (PCB) cumulative errors of suppressing with the film of this dozen of tolerances are large, directly affect electrical property.Last because of slug press in the workshop that routine is clean, the micro mist dirt in air can not be solved, such as PM2.5 etc., as these dust are mixed in blank along with reinforced, after high temperature sintering, the dust carbonization be mixed into, through the thin film printed wiring board using them that turning goes out, affect electrical property.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, a kind of production technology of polytetrafluoroethylene film is provided, to solve the problems of the technologies described above.
For achieving the above object, the present invention is achieved through the following technical solutions:
A production technology for polytetrafluoroethylene film, is characterized in that, described technique comprises the following steps:
(1) material constant temperature: by polyflon in cleaning shop, under 23 ~ 27 DEG C of temperature conditions, constant temperature is placed 24 ~ 48 hours;
(2) suppress: in cleaning shop, under 23 ~ 27 DEG C of temperature conditions, adopt vacuum auto feed technology to feed in raw material, suppress main base;
(3) the main base suppressed is left standstill 48 hours;
(4) sinter: the main base left standstill is put into automatic baking oven and sinters, sintering temperature is from normal temperature, persistently overheating to 380 DEG C, and sintering time is 150 hours;
(5) cut: adopt international state-of-the-art cutting apparatus to cut, thickness of cutting allowance control is to ± 2%.
Compared with prior art, the present invention has following significant progressive and useful effect:
1, owing to adopting special process after film thermal sizing, reduce film temperature rapidly, cool time is short, effective, and technique is special, and processing cost is low;
2, in use or storing process, film dimensions can not be shunk, and volume face is smooth, and therefore the horizontal and vertical size of film is kept.
3, suppressing workshop is 100,000 grades of dust-free purification workshops, compacting charging process adopts import vacuum automatic charging equipment, polytetrafluoroethylene (PTFE) powder is made to become powder, be scattering into very equably in mould, make the polytetrafluorethylepowder powder superficial density in whole mould even, the green density extruded is even, and thickness deviation controls within 2%, and thickness deviation improves five times than traditional handicraft.
Detailed description of the invention
In order to further illustrate technical scheme of the present invention, below in conjunction with embodiment, the preferred embodiment of the invention is described, but should be appreciated that these describe just in order to further illustrate the features and advantages of the present invention, instead of limiting to the claimed invention.
Embodiment 1
(1) material constant temperature: by polyflon in cleaning shop, under 23 DEG C of temperature conditions, constant temperature places 24 hours;
(2) suppress: in cleaning shop, under 23 DEG C of temperature conditions, adopt vacuum auto feed technology to feed in raw material, suppress main base;
(3) the main base suppressed is left standstill 48 hours;
(4) sinter: the main base left standstill is put into automatic baking oven and sinters, sintering temperature is from normal temperature, persistently overheating to 380 DEG C, and sintering time is 150 hours;
(5) cut: adopt international state-of-the-art cutting apparatus to cut, thickness of cutting allowance control is to ± 2%.
Adopt the polytetrafluoroethylene film that the method is produced, even density, technique are special, processing cost is low; Thickness deviation controls within ± 2%, and thickness deviation improves five times than traditional handicraft.
Embodiment 2
(1) material constant temperature: by polyflon in cleaning shop, under 27 DEG C of temperature conditions, constant temperature places 48 hours;
(2) suppress: in cleaning shop, under 27 DEG C of temperature conditions, adopt vacuum auto feed technology to feed in raw material, suppress main base;
(3) the main base suppressed is left standstill 48 hours;
(4) sinter: the main base left standstill is put into automatic baking oven and sinters, sintering temperature is from normal temperature, persistently overheating to 380 DEG C, and sintering time is 150 hours;
(5) cut: adopt international state-of-the-art cutting apparatus to cut, thickness of cutting allowance control is to ± 2%.
Adopt the polytetrafluoroethylene film that the method is produced, even density, technique are special, processing cost is low; Thickness deviation controls within 2%, and thickness deviation improves five times than traditional handicraft.
Embodiment 3
(1) material constant temperature: by polyflon in cleaning shop, under 25 DEG C of temperature conditions, constant temperature places 36 hours;
(2) suppress: in cleaning shop, under 25 DEG C of temperature conditions, adopt vacuum auto feed technology to feed in raw material, suppress main base;
(3) the main base suppressed is left standstill 36 hours;
(4) sinter: the main base left standstill is put into automatic baking oven and sinters, sintering temperature is from normal temperature, persistently overheating to 380 DEG C, and sintering time is 150 hours;
(5) cut: adopt international state-of-the-art cutting apparatus to cut, thickness of cutting allowance control is to ± 2%.
Adopt the polytetrafluoroethylene film that the method is produced, even density, technique are special, processing cost is low; Thickness deviation controls within ± 2%, and thickness deviation improves five times than traditional handicraft.
Claims (1)
1. a production technology for polytetrafluoroethylene film, is characterized in that: described technique comprises the following steps:
(1) material constant temperature: by polyflon in cleaning shop, under 23 ~ 27 DEG C of temperature conditions, constant temperature is placed 24 ~ 48 hours;
(2) suppress: in cleaning shop, under 23 ~ 27 DEG C of temperature conditions, adopt vacuum auto feed technology to feed in raw material, suppress main base;
(3) the main base suppressed is left standstill 48 hours;
(4) sinter: the main base left standstill is put into automatic baking oven and sinters, sintering temperature is from normal temperature, persistently overheating to 380 DEG C, and sintering time is 150 hours;
(5) cut: adopt international state-of-the-art cutting apparatus to cut, thickness of cutting allowance control is to ± 2%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310271078.2A CN104249466A (en) | 2013-06-28 | 2013-06-28 | Production technology of Teflon film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310271078.2A CN104249466A (en) | 2013-06-28 | 2013-06-28 | Production technology of Teflon film |
Publications (1)
| Publication Number | Publication Date |
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| CN104249466A true CN104249466A (en) | 2014-12-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310271078.2A Pending CN104249466A (en) | 2013-06-28 | 2013-06-28 | Production technology of Teflon film |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106042411A (en) * | 2016-06-18 | 2016-10-26 | 泰州市亚星塑业有限公司 | Production technology of teflon film |
| CN106217912A (en) * | 2016-09-26 | 2016-12-14 | 佛山慧氟高分子材料有限公司 | A kind of production technology of LCD liquid crystal display screen module binding Teflon thin film |
| CN108284554A (en) * | 2017-01-09 | 2018-07-17 | 中昊晨光化工研究院有限公司 | A kind of preparation method of high-strength polytetrafluoroethyl-ne hydraulic pressure product |
| CN112091245A (en) * | 2019-06-18 | 2020-12-18 | 浙江德清科赛塑料制品有限公司 | Preheating treatment process for turning PTFE (Polytetrafluoroethylene) lathe blank |
| CN115519810A (en) * | 2022-09-27 | 2022-12-27 | 佛山慧氟高分子材料有限公司 | Production process of PTFE waterproof breathable film |
-
2013
- 2013-06-28 CN CN201310271078.2A patent/CN104249466A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106042411A (en) * | 2016-06-18 | 2016-10-26 | 泰州市亚星塑业有限公司 | Production technology of teflon film |
| CN106217912A (en) * | 2016-09-26 | 2016-12-14 | 佛山慧氟高分子材料有限公司 | A kind of production technology of LCD liquid crystal display screen module binding Teflon thin film |
| CN108284554A (en) * | 2017-01-09 | 2018-07-17 | 中昊晨光化工研究院有限公司 | A kind of preparation method of high-strength polytetrafluoroethyl-ne hydraulic pressure product |
| CN112091245A (en) * | 2019-06-18 | 2020-12-18 | 浙江德清科赛塑料制品有限公司 | Preheating treatment process for turning PTFE (Polytetrafluoroethylene) lathe blank |
| CN115519810A (en) * | 2022-09-27 | 2022-12-27 | 佛山慧氟高分子材料有限公司 | Production process of PTFE waterproof breathable film |
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Application publication date: 20141231 |