CN104202955A - Device for improving EMC (Electro Magnetic Compatibility) of circuit - Google Patents
Device for improving EMC (Electro Magnetic Compatibility) of circuit Download PDFInfo
- Publication number
- CN104202955A CN104202955A CN201410404628.8A CN201410404628A CN104202955A CN 104202955 A CN104202955 A CN 104202955A CN 201410404628 A CN201410404628 A CN 201410404628A CN 104202955 A CN104202955 A CN 104202955A
- Authority
- CN
- China
- Prior art keywords
- metal layer
- conductive metal
- pcb board
- ground level
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
The invention provides a device for improving the EMC of a circuit. A controller of the circuit is arranged on a printed circuit board (PCB); a housing sleeves the PCB; a conductive metal layer is arranged outside or on the PCB; the conductive metal layer is electrically connected with a ground layer of the PCB. The additionally-arranged conductive metal layer is conductive and electrically connected with the ground layer of the PCB, so that the interference on the ground layer of the PCB flows in the conductive metal layer to prevent or reduce the electromagnetic interference on the PCB. If the conductive metal layer is not arranged, a common-mode signal on the ground layer of the PCB flows on the PCB all the time and ultimately forms a loop with the ground, the purpose of the complete elimination of the common-mode interference cannot be achieved. After the conductive metal layer is additionally arranged, an interference signal on the PCB is released, so that the EMC of the entire circuit is improved. According to the device for improving the EMC of the circuit, the parasitic capacitance is greatly reduced and the electromagnetic emission loop impedance is improved, so that the electromagnetic emission level of the circuit is reduced.
Description
Technical field
The present invention relates to electromagnetic compatibility technology field, particularly a kind of device that improves Electric Circuit Electromagnetic Compatibility.
Background technology
Along with scientific and technological progress, electronic equipment is more and more diversified, applies also more and more extensive.
The electromagnetic environment more complicated of some electronic equipment, therefore, requiring for the Electro Magnetic Compatibility (EMC, Electro Magnetic Compatibility) of electronic equipment middle controller can be more and more higher.
At present, the shell of controller mainly contains two kinds: one is plastic casing, and another kind is metal shell.
Plastic casing is due to low cost, apply more general, but plastic casing does not have the electromagnetic shielding ability of metal shell, therefore, the EMC performance of EMC performance when controller uses plastic casing when using metal shell has poor gap.
Therefore, those skilled in the art need to provide a kind of device that improves circuit EMC, even if the controller in circuit uses plastic casing also can have higher EMC performance.
In Fig. 3 of the prior art, by the track of noise pollution, to M point, noise pollution cannot enter follow-up sensitive circuit S.
It should be noted that, filter capacitor C1 in Fig. 3 is connected between pre-process circuit R and sensitive circuit S, and before filter capacitor C1 in Fig. 2 is connected to pre-process circuit R, when specific implementation, can be connected near the connector of tested electronic equipment, wherein connector refers to the plug-in unit of the wire harness line in circuit.
In addition, be a radiation source for each circuit, can outside emittance.Introduce the emittance that device provided by the invention can reduce circuit below.
The principle of paper electromagnetic emission: circuit board forms loop by parasitic capacitance and LISN, the earth, the size of current in loop represents the electromagnetic emission ability of controller, the electric current that flows through LISN is exactly loop current, just can characterize the electromagnetic emission ability of circuit by the electric current in measurement LISN.
Because parasitic capacitance is proportional to the length of parasitic part, in Fig. 3, plastic casing controller parasitic capacitance is the parasitic capacitance between wire harness and circuit board cabling and the earth, and in Fig. 2, and adding parasitic capacitance after metal copper layer is parasitic capacitance between conductive metal layer and the earth.Obviously, the parasitic capacitance C3 in Fig. 2 is less than the parasitic capacitance C2 in Fig. 3.Therefore, adopt parasitic capacitance of the present invention significantly to reduce, electromagnetic emission impedance loop increases, thereby reduces the electromagnetic emission level of controller.
Because parasitic capacitance is less, corresponding impedance is larger, and the electric current flowing through is less.
Because C3 is less than C2, therefore, the electric current in the launching circuit shown in Fig. 2 is less than the electric current in the launching circuit shown in Fig. 3.
For LISN, the size of emission level is that the electric current that flows through LISN by detection is passed judgment on, and therefore, the emission level shown in Fig. 2 is less than the emission level shown in Fig. 3.
To sum up, because the present invention has increased conductive metal layer, not only eliminated the common mode current in the ground level of pcb board, and made the emission level of whole circuit obtain effective reduction.All effective for the EMC that improves whole circuit like this.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of device that improves circuit EMC, even if can ensure that the controller in circuit uses plastic casing, also has higher EMC performance.
The embodiment of the present invention provides a kind of device that improves circuit EMC, and whole circuit is positioned on printing board PCB plate;
The outside sheathed housing of described pcb board;
One deck conductive metal layer is set outside described pcb board;
Or,
One deck conductive metal layer is set on described pcb board;
Described conductive metal layer is electrically connected with the ground level of described pcb board.
Preferably, one deck conductive metal layer is set on described pcb board, specifically comprises:
In the time that described pcb board is individual layer pcb board, described conductive metal layer is positioned at the outermost layer of described pcb board;
In the time that described pcb board is multi-layer PCB board, described conductive metal layer is between adjacent two-layer pcb board.
Preferably, described conductive metal layer is electrically connected with the ground level of described pcb board, is specially:
On described conductive metal layer with the ground level of described pcb board on correspondence position all punch, and hole between on the ground level of conductive metal layer and described pcb board is electrically connected.
Preferably, one deck conductive metal layer is set outside described pcb board, is specially:
Described conductive metal layer is arranged on the inner side of described housing;
Or,
The bottom surface of described housing is conductive metal layer.
Preferably, described conductive metal layer is conductive copper layer.
Preferably, described conductive metal layer is electrically connected with the ground level of described pcb board, is specially:
Between described conductive metal layer and the ground level of described pcb board, be electrically connected by resistance-capacitance network.
Preferably, described resistance-capacitance network comprises the first resistance and the 4th electric capacity;
One end of described the first resistance connects described conductive metal layer, and the other end of described the first resistance connects the ground level of described pcb board;
One end of described the 4th electric capacity connects described conductive metal layer, and the other end of described the 4th electric capacity connects the ground level of described pcb board.
Preferably, the housing of described controller is plastic casing.
Preferably, N hole is set on described conductive metal layer; N hole is set on the ground level of described pcb board; Described N is greater than 1 integer;
A described N hole is evenly arranged.
Preferably, also comprise filter capacitor;
Described filter capacitor is connected to the connector place of circuit.
Compared with prior art, the present invention has the following advantages:
In the present invention, increasing one deck conductive metal layer, because conductive metal layer conducts electricity, and is to be electrically connected with the ground level of pcb board.Can make like this interference on the ground level of pcb board flow into conductive metal layer, thereby avoid or reduce the electromagnetic interference on pcb board.Because if this conductive metal layer not, the common-mode signal on the ground level of pcb board refluxes on pcb board always, form loop, cannot reach the object of thorough elimination common mode disturbances.In the present embodiment, add after conductive metal layer, the interference signal on pcb board can have been discharged, thereby improved the EMC performance of whole circuit.In addition, the present invention has reduced the electromagnetic emission level of whole circuit, because the principle of electromagnetic emission is: circuit board forms loop by parasitic capacitance and LISN, the earth, and the size of current in loop represents the electromagnetic emission ability of controller.Parasitic capacitance is proportional to the device length that forms parasitic capacitance, and plastic casing controller parasitic capacitance is the parasitic capacitance between wire harness and circuit board cabling and the earth, and after interpolation metal copper layer, parasitic capacitance is parasitic capacitance between metal copper layer and the earth.Adopt parasitic capacitance of the present invention significantly to reduce, electromagnetic emission impedance loop increases, thereby reduces the electromagnetic emission level of controller.
Brief description of the drawings
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is device embodiment mono-schematic diagram of raising circuit EMC provided by the invention;
Fig. 2 is the signal path figure that device provided by the invention is corresponding;
Fig. 3 is the signal path figure in the circuit that plastic casing is corresponding;
Fig. 4 is device embodiment bis-schematic diagrames of raising circuit EMC provided by the invention;
Fig. 5 is device embodiment tri-schematic diagrames of raising circuit EMC provided by the invention;
Fig. 6 is device embodiment tetra-schematic diagrames of raising circuit EMC provided by the invention;
Fig. 7 is device embodiment five schematic diagrames of raising circuit EMC provided by the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.
Embodiment mono-:
Referring to Fig. 1, this figure is device embodiment mono-schematic diagram of raising circuit EMC provided by the invention.
The device of the raising circuit EMC that the present embodiment provides, the controller in this circuit is positioned on printing board PCB plate;
One deck conductive metal layer 200 is set outside described pcb board;
Or,
One deck conductive metal layer 200 is set on described pcb board;
Described conductive metal layer 200 is electrically connected with the ground level 100 of described pcb board.
It should be noted that, in Fig. 1, only illustrate to have drawn the ground level 100 of pcb board, do not draw whole pcb board.
It should be noted that, be only schematic diagram in Fig. 1, and conductive metal layer 200 can be positioned at outside pcb board, also can be positioned on pcb board.
Wherein, conductive metal layer 200 is positioned on pcb board and refers to, and can be positioned at the outermost layer of pcb board, also can be positioned at the inside of pcb board.
It should be noted that, conductive metal layer 200 conducts electricity, and is to be electrically connected with the ground level 100 of pcb board.Can make like this interference on the ground level 100 of pcb board flow into conductive metal layer 200, thereby avoid or reduce the electromagnetic interference on pcb board.Because if this conductive metal layer 200 not, the common-mode signal on the ground level 100 of pcb board refluxes on pcb board always, form loop, cannot reach the object of thorough elimination common mode disturbances.In the present embodiment, add after conductive metal layer 200, the interference signal on pcb board can have been discharged, thereby improved the EMC performance of whole circuit.In addition, the present invention has reduced the electromagnetic emission level of whole circuit, because the principle of electromagnetic emission is: circuit board forms loop by parasitic capacitance and LISN, the earth, and the size of current in loop represents the electromagnetic emission ability of controller.Parasitic capacitance is proportional to the device length that forms parasitic capacitance, and plastic casing controller parasitic capacitance is the parasitic capacitance between wire harness and circuit board cabling and the earth, and after interpolation metal copper layer, parasitic capacitance is parasitic capacitance between metal copper layer and the earth.Adopt parasitic capacitance of the present invention significantly to reduce, electromagnetic emission impedance loop increases, thereby reduces the electromagnetic emission level of controller.
In order to understand better the advantage of device provided by the invention, describe in detail below in conjunction with the path profile of interference signal.
Referring to Fig. 2, this figure is the signal path figure that device provided by the invention is corresponding.
Wherein, line impedance stabilization net work (LISN, Line Lmpedance Stabilization Network) is the auxiliary equipment of EMC test, and as shown in Figure 2, LISN is connected to the electric power incoming line place of tested electronic equipment.
It should be noted that, for simply, use resistance R and triangle S to represent the circuit in tested electronic equipment in the present embodiment, wherein R represents the pre-process circuit in tested electronic equipment, and S represents the sensitive circuit in tested electronic equipment.
Sensitive circuit S is more responsive to interference signal, therefore, under perfect condition, does not wish interference signal and enters sensitive circuit S.
In the present embodiment, just ended to N point by the track of noise pollution, cannot enter follow-up sensitive circuit S.
In the present embodiment, owing to having added conductive metal layer 200, therefore, the parasitic capacitance between whole tested electronic equipment and the earth is the parasitic capacitance between conductive metal layer 200 and the earth, i.e. C3.
Because electricity between the ground level 100 of pcb board and conductive metal layer 200 is electrically connected, therefore, the path of common mode current is as shown in the dotted line in Fig. 2.Can find out from the path of dotted line, the scheme that the present embodiment provides, owing to having added conductive metal layer 200, common mode current can not flow on the ground level of pcb board 100, but enter conductive metal layer by the ground level 100 of pcb board, and then conductive metal layer 200 enters the earth by common mode current through parasitic capacitance C3, can ensure does not like this have common mode current on the ground level 100 of pcb board, and then can not cause on pcb board and have common mode current flows, can make like this EMC performance of the controller on pcb board be improved.
For the advantage of more outstanding Fig. 2, analyze below in conjunction with Fig. 3, Fig. 3 is controller of the prior art outside corresponding signal path figure while being plastic casing.
As can be seen from Figure 3,, in the time there is no conductive metal layer, only have the ground level 100 of pcb board, common mode current can pass through the ground level of LISN, pcb board and the parasitic capacitance C2 of the earth, filter capacitor C1 and pre-process circuit R.
Embodiment bis-:
Referring to Fig. 4, this figure is device embodiment bis-schematic diagrames of raising circuit EMC provided by the invention.
So that one deck conductive metal layer to be set outside described pcb board, be specially below: the housing inner side that described conductive metal layer is arranged on controller is introduced for example.
The shell of the circuit shown in Fig. 4 is plastic casing 1000.
For one deck conductive metal layer 200 is set outside pcb board 500.
Be understandable that, this conductive metal layer 200 is positioned at the inner side of plastic casing 1000, and is electrically connected (not shown ground level) with the ground level on pcb board 500.
Embodiment tri-:
Referring to Fig. 5, this figure is device embodiment tri-schematic diagrames of raising circuit EMC provided by the invention.
It should be noted that, in the present invention, one deck conductive metal layer is set on described pcb board, specifically comprise:
In the time that described pcb board is individual layer pcb board, described conductive metal layer is positioned at the outermost layer of described pcb board;
In the time that described pcb board is multi-layer PCB board, described conductive metal layer is between adjacent two-layer pcb board.
Described conductive metal layer is electrically connected with the ground level of described pcb board, is specially:
On described conductive metal layer with the ground level of described pcb board on correspondence position all punch, and hole between on the ground level of conductive metal layer and described pcb board is electrically connected.
Be understandable that, in order to make to conduct electricity, the conductive effect of technological layer is better, and described conductive metal layer can preferentially be chosen as conductive copper layer.Certainly, can be also the metal level of other conductions.
When introducing pcb board in the present embodiment and being multilayer, the placement location of conductive metal layer can be the outermost layer at pcb board, also can be between adjacent two-layer pcb board.For example in the present embodiment, be introduced as an example of two-layer pcb board example, as shown in Figure 5.、
Wherein, pcb board comprises two-layer, is respectively ground floor pcb board 500a and second layer pcb board 500b.And conductive metal layer 200 is between ground floor pcb board 500a and second layer pcb board 500b.
Embodiment tetra-:
Referring to Fig. 6, this figure is device embodiment tetra-schematic diagrames of raising circuit EMC provided by the invention.
How introduce being electrically connected specifically between conductive metal layer and the ground level of pcb board below realizes.
In the present embodiment, described conductive metal layer 200 is electrically connected with the ground level 100 of described pcb board, is specially:
Between the ground level 100 of described conductive metal layer 200 and described pcb board, be electrically connected by resistance-capacitance network.
Conductive metal layer uses and is often connected with the earth, and some sensitive circuit in some circuit or the requirement based on safety, forbid that the ground level of pcb board is directly connected with the earth, generally adopts in this case resistance-capacitance network to connect.
It should be noted that, described resistance-capacitance network can be the series-parallel network of resistance and electric capacity.Introduce with the simplest resistance and a Capacitance parallel connection below.
As shown in Figure 6, described resistance-capacitance network comprises the first resistance R 1 and the 4th capacitor C 4;
Described the first resistance R 1 and the 4th capacitor C 4 parallel connections.
One end of R1 connects conductive metal layer 200, the ground level 100 of the other end connecting PCB board of R1.
One end of C4 connects conductive metal layer 200, the ground level 100 of the other end connecting PCB board of C4.
Embodiment five:
Referring to Fig. 7, this figure is device embodiment five schematic diagrames of raising circuit EMC provided by the invention.
Introduce below between conductive metal layer and the ground level of pcb board and be electrically connected by hole, in pcb board, these holes can be called guide hole, because conduct electricity.
Be specially:
On described conductive metal layer 200 with the ground level 100 of described pcb board on the correspondence position A that all punches, and hole A between on the ground level 100 of conductive metal layer 200 and described pcb board is electrically connected.
To be understandable that, in order conducting electricity better, multiple holes can be set, N hole is set on described conductive metal layer; N hole is set on the ground level of described pcb board; Described N is greater than 1 integer;
A described N hole is evenly arranged.For example, can on conductive metal layer 200, be evenly arranged a circle hole, on the ground level 100 of pcb board, also be evenly arranged a circle hole accordingly.
In Fig. 7, only illustrate with two holes.
The above, be only preferred embodiment of the present invention, not the present invention done to any pro forma restriction.Although the present invention discloses as above with preferred embodiment, but not in order to limit the present invention.Any those of ordinary skill in the art, do not departing from technical solution of the present invention scope situation, all can utilize method and the technology contents of above-mentioned announcement to make many possible variations and modification to technical solution of the present invention, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not depart from technical solution of the present invention,, all still belongs in the scope of technical solution of the present invention protection any simple modification made for any of the above embodiments, equivalent variations and modification according to technical spirit of the present invention.
Claims (10)
1. a device that improves circuit EMC, is characterized in that, whole circuit is positioned on printing board PCB plate;
The outside sheathed housing of described pcb board;
One deck conductive metal layer is set outside described pcb board;
Or,
One deck conductive metal layer is set on described pcb board;
Described conductive metal layer is electrically connected with the ground level of described pcb board.
2. the device of raising circuit EMC according to claim 1, is characterized in that, one deck conductive metal layer is set on described pcb board, specifically comprises:
In the time that described pcb board is individual layer pcb board, described conductive metal layer is positioned at the outermost layer of described pcb board;
In the time that described pcb board is multi-layer PCB board, described conductive metal layer is between adjacent two-layer pcb board.
3. the device of raising circuit EMC according to claim 2, is characterized in that, described conductive metal layer is electrically connected with the ground level of described pcb board, is specially:
On described conductive metal layer with the ground level of described pcb board on correspondence position all punch, and hole between on the ground level of conductive metal layer and described pcb board is electrically connected.
4. the device of raising circuit EMC according to claim 1, is characterized in that, one deck conductive metal layer is set outside described pcb board, is specially:
Described conductive metal layer is arranged on the inner side of described housing;
Or,
The bottom surface of described housing is conductive metal layer.
5. the device of raising circuit EMC according to claim 4, is characterized in that, described conductive metal layer is conductive copper layer.
6. the device of raising circuit EMC according to claim 5, is characterized in that, described conductive metal layer is electrically connected with the ground level of described pcb board, is specially:
Between described conductive metal layer and the ground level of described pcb board, be electrically connected by resistance-capacitance network.
7. the device of raising circuit EMC according to claim 6, is characterized in that, described resistance-capacitance network comprises the first resistance and the 4th electric capacity;
One end of described the first resistance connects described conductive metal layer, and the other end of described the first resistance connects the ground level of described pcb board;
One end of described the 4th electric capacity connects described conductive metal layer, and the other end of described the 4th electric capacity connects the ground level of described pcb board.
8. the device of raising circuit EMC according to claim 1, is characterized in that, the housing of described controller is plastic casing.
9. the device of raising circuit EMC according to claim 3, is characterized in that, N hole is set on described conductive metal layer; N hole is set on the ground level of described pcb board; Described N is greater than 1 integer;
A described N hole is evenly arranged.
10. the device of raising circuit EMC according to claim 1, is characterized in that, also comprises filter capacitor;
Described filter capacitor is connected to the connector place of circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410404628.8A CN104202955B (en) | 2014-08-15 | 2014-08-15 | A kind of device improving Electric Circuit Electromagnetic Compatibility |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410404628.8A CN104202955B (en) | 2014-08-15 | 2014-08-15 | A kind of device improving Electric Circuit Electromagnetic Compatibility |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104202955A true CN104202955A (en) | 2014-12-10 |
| CN104202955B CN104202955B (en) | 2019-05-28 |
Family
ID=52088156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410404628.8A Active CN104202955B (en) | 2014-08-15 | 2014-08-15 | A kind of device improving Electric Circuit Electromagnetic Compatibility |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104202955B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105140571A (en) * | 2015-08-13 | 2015-12-09 | 上海航天电源技术有限责任公司 | Lithium-ion battery pack system with high electromagnetic compatibility |
| CN105873384A (en) * | 2015-02-10 | 2016-08-17 | 罗伯特·博世有限公司 | Housing and control unit having a housing |
| CN114648867A (en) * | 2022-02-18 | 2022-06-21 | 广东逸动科技有限公司 | Remote control signal processing system of propeller, propeller and water vehicle |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010033478A1 (en) * | 2000-04-21 | 2001-10-25 | Shielding For Electronics, Inc. | EMI and RFI shielding for printed circuit boards |
| CN1946267A (en) * | 2006-08-26 | 2007-04-11 | 华为技术有限公司 | Embedding method for printed circuit board and printed circuit board |
| CN101313439A (en) * | 2005-12-02 | 2008-11-26 | 思科技术公司 | Method for fabricating a printed circuit board having a coaxial via |
| CN101626115A (en) * | 2008-06-10 | 2010-01-13 | 北电网络有限公司 | Improvements relating to antennas |
| CN202396081U (en) * | 2011-11-18 | 2012-08-22 | 陈佳宏 | Device for inhibiting EMC (Electro Magnetic Compatibility) device by using PCB (Printed Circuit Board) layout |
-
2014
- 2014-08-15 CN CN201410404628.8A patent/CN104202955B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010033478A1 (en) * | 2000-04-21 | 2001-10-25 | Shielding For Electronics, Inc. | EMI and RFI shielding for printed circuit boards |
| CN1442033A (en) * | 2000-04-21 | 2003-09-10 | 电子设备屏蔽公司 | EMI and RFI shielding for printed circuit boards |
| CN101313439A (en) * | 2005-12-02 | 2008-11-26 | 思科技术公司 | Method for fabricating a printed circuit board having a coaxial via |
| CN1946267A (en) * | 2006-08-26 | 2007-04-11 | 华为技术有限公司 | Embedding method for printed circuit board and printed circuit board |
| CN101626115A (en) * | 2008-06-10 | 2010-01-13 | 北电网络有限公司 | Improvements relating to antennas |
| CN202396081U (en) * | 2011-11-18 | 2012-08-22 | 陈佳宏 | Device for inhibiting EMC (Electro Magnetic Compatibility) device by using PCB (Printed Circuit Board) layout |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105873384A (en) * | 2015-02-10 | 2016-08-17 | 罗伯特·博世有限公司 | Housing and control unit having a housing |
| CN105140571A (en) * | 2015-08-13 | 2015-12-09 | 上海航天电源技术有限责任公司 | Lithium-ion battery pack system with high electromagnetic compatibility |
| CN105140571B (en) * | 2015-08-13 | 2017-11-28 | 上海航天电源技术有限责任公司 | A kind of lithium ion battery pack system with high electrical-magnetic compatibility energy |
| CN114648867A (en) * | 2022-02-18 | 2022-06-21 | 广东逸动科技有限公司 | Remote control signal processing system of propeller, propeller and water vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104202955B (en) | 2019-05-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9985600B2 (en) | Printed circuit board assembly for filtering noise of network signal transmission | |
| CN100583573C (en) | Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection | |
| US9077168B2 (en) | Differential mode signal transmission module | |
| CN100505995C (en) | Midspan patch panel with compensation circuit for data terminal equipment, power insertion and data collection | |
| CN104426007B (en) | transmission line and filter module | |
| US11050403B2 (en) | Circuit module, network module, and in-vehicle electronic device | |
| CN104202955A (en) | Device for improving EMC (Electro Magnetic Compatibility) of circuit | |
| CN104779974A (en) | Electromagnetic interference suppression device and method for network transmission | |
| CN106340761B (en) | Network interface circuit and apply its network interface connector | |
| US11711591B2 (en) | Common-mode filtering for high-speed cable interface | |
| CN209343306U (en) | Touch screen control plate and touch control display apparatus | |
| CN207265257U (en) | PCI E differential signals based on FPC connector extend external member | |
| US20130335103A1 (en) | Line impedance stabilization network | |
| CN207664394U (en) | Hard and soft printed board connects machine assembly formula switching interface | |
| JP6954472B2 (en) | Bias T circuit and signal transmission device | |
| CN210432055U (en) | Power filter and air conditioner | |
| CN106413234A (en) | Electrostatic discharge protection structure and electronic device | |
| CN106373713B (en) | Noise filter installation constitution | |
| CN202396081U (en) | Device for inhibiting EMC (Electro Magnetic Compatibility) device by using PCB (Printed Circuit Board) layout | |
| CN108834302A (en) | A kind of multi-layer PCB board and server | |
| CN206533123U (en) | Lightning protection device | |
| TWM480196U (en) | Lightning strike protection system of network signal processing circuit | |
| CN105789938B (en) | Rack internal power supply method, bus type power supply board and communication equipment | |
| US11737207B2 (en) | PCB RF noise grounding for shielded high-speed interface cable | |
| CN217936069U (en) | Special vehicle-mounted magnetic balance Hall current sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |