CN104201271B - Led灯丝 - Google Patents
Led灯丝 Download PDFInfo
- Publication number
- CN104201271B CN104201271B CN201410255603.6A CN201410255603A CN104201271B CN 104201271 B CN104201271 B CN 104201271B CN 201410255603 A CN201410255603 A CN 201410255603A CN 104201271 B CN104201271 B CN 104201271B
- Authority
- CN
- China
- Prior art keywords
- substrate
- described substrate
- electrode pin
- insulator
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410255603.6A CN104201271B (zh) | 2014-06-10 | 2014-06-10 | Led灯丝 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410255603.6A CN104201271B (zh) | 2014-06-10 | 2014-06-10 | Led灯丝 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104201271A CN104201271A (zh) | 2014-12-10 |
CN104201271B true CN104201271B (zh) | 2017-02-08 |
Family
ID=52086536
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410255603.6A Active CN104201271B (zh) | 2014-06-10 | 2014-06-10 | Led灯丝 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104201271B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104600174B (zh) * | 2014-12-17 | 2017-05-24 | 东莞市日为电子有限公司 | 一种led灯丝及其制作方法 |
CN105098032B (zh) * | 2015-07-17 | 2018-10-16 | 开发晶照明(厦门)有限公司 | Led灯丝及具有该led灯丝的led灯泡 |
CN109838702B (zh) * | 2017-11-29 | 2020-10-20 | 东莞市恩瑞精密电子有限公司 | 立体光源及线性光源的制作方法 |
CN116612714A (zh) * | 2022-03-27 | 2023-08-18 | 深圳市美矽微半导体有限公司 | 一种led载板及其显示设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201536111U (zh) * | 2009-07-03 | 2010-07-28 | 福建中科万邦光电股份有限公司 | 一种高性能的大功率led的封装结构 |
CN103322525A (zh) * | 2013-06-17 | 2013-09-25 | 深圳市源磊科技有限公司 | Led灯及其灯丝 |
CN203628400U (zh) * | 2013-09-24 | 2014-06-04 | 王志根 | 一种全角度发光灯丝 |
CN203895497U (zh) * | 2014-06-10 | 2014-10-22 | 广东长盈精密技术有限公司 | Led灯丝 |
-
2014
- 2014-06-10 CN CN201410255603.6A patent/CN104201271B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201536111U (zh) * | 2009-07-03 | 2010-07-28 | 福建中科万邦光电股份有限公司 | 一种高性能的大功率led的封装结构 |
CN103322525A (zh) * | 2013-06-17 | 2013-09-25 | 深圳市源磊科技有限公司 | Led灯及其灯丝 |
CN203628400U (zh) * | 2013-09-24 | 2014-06-04 | 王志根 | 一种全角度发光灯丝 |
CN203895497U (zh) * | 2014-06-10 | 2014-10-22 | 广东长盈精密技术有限公司 | Led灯丝 |
Also Published As
Publication number | Publication date |
---|---|
CN104201271A (zh) | 2014-12-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180119 Address after: 523000 Industrial Development Zone of Songshan Lake in Dongguan, Guangdong Province, No. 4 factory building, No. 1 Industrial North Patentee after: Dongguan wisdom Photoelectric Technology Co., Ltd. Address before: 523808, No. 4, No. 1, industrial North Road, Songshan hi tech Industrial Development Zone, Guangdong, Dongguan Patentee before: Guangdong Changying Precision Technology Co., Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190730 Address after: 523000 First Floor of No.4 Factory Building of Industrial North Road, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Co-patentee after: Guangdong Changying Precision Technology Co., Ltd. Patentee after: Dongguan wisdom Photoelectric Technology Co., Ltd. Address before: 523000 First Floor of No.4 Factory Building of Industrial North Road, Dongguan Songshan Lake High-tech Industrial Development Zone, Guangdong Province Patentee before: Dongguan wisdom Photoelectric Technology Co., Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201112 Address after: 523808 First Floor, No. 4 Industrial North Road, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee after: DONGGUAN ZHIHAO PHOTOELECTRIC TECHNOLOGY Co.,Ltd. Address before: 523000 First Floor of No.4 Factory Building of Industrial North Road, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee before: DONGGUAN ZHIHAO PHOTOELECTRIC TECHNOLOGY Co.,Ltd. Patentee before: GUANGDONG EVERWIN PRECISION TECHNOLOGY Co.,Ltd. |