CN104200867A - Copper-clad aluminum composite wire - Google Patents
Copper-clad aluminum composite wire Download PDFInfo
- Publication number
- CN104200867A CN104200867A CN201410451145.3A CN201410451145A CN104200867A CN 104200867 A CN104200867 A CN 104200867A CN 201410451145 A CN201410451145 A CN 201410451145A CN 104200867 A CN104200867 A CN 104200867A
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- copper
- aluminum
- wire
- conductor
- layer
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Abstract
The invention discloses a copper-clad aluminum composite wire comprising a wire body of a two-layer structure. The wire body sequentially comprises a wire layer and an aluminum oxide layer from inside to outside. The wire layer comprises a plurality of copper-clad aluminum wire core sets and an aluminum copper wire core. The center of the aluminum copper wire core is an aluminum conductor, and a copper conductor is arranged on the outer layer of the aluminum conductor. The outer layer of the aluminum copper wire core is cladded with a stannum layer. The stannum layer is composited to the outer surface of the aluminum copper wire core by metal composition technology. The aluminum copper wire core and the wire body are arranged coaxially. The copper-clad aluminum wire core sets are evenly distributed along the circumference of the aluminum copper wire core. The outer surface of the wire body is cladded with the aluminum oxide layer. The wire body comprises, by weight, 15-20% of nickel, 3.5-5.5% of Sn (stannum), 3-8% of Zn (zinc), 4-6% of Pb (plumbum) and 63-67% of Cu (copper).
Description
Technical field
The present invention relates to a kind of plain conductor, particularly a kind of copper-coated aluminum complex lead.
Background technology
In the market with the pure copper wire that is generally of wire, this not only makes enterprise face the cost pressure of continuous rising because copper valency is high, simultaneously, what work is only conductive line surfaces because of actual in current delivery, the electric conductivity quality of the material of wire inside is insignificant, therefore actual as wire with fine copper is a kind of waste, and fine copper is done conductor material easily fracture in braiding process, welding difficulty between wire, thus fine copper easily with cable in the stability that the impact of sulphur chemically reactive conducts electricity of dissociating.Therefore market is in the urgent need to a kind of more economical, better conductor material.
Summary of the invention
The problem existing for above-mentioned prior art, the invention provides a kind of copper-coated aluminum complex lead.
To achieve these goals, the technical solution used in the present invention is: a kind of copper-coated aluminum complex lead, comprise wire body, described wire body is double-layer structure, be followed successively by from inside to outside conductor layer and alumina layer, described conductor layer comprises array copper cover aluminum conductor wire core group and an aluminum bronze wire stylet, and the center of described aluminum bronze wire stylet is aluminium conductor, and the skin of aluminium conductor is copper conductor.
The coated one deck tin layer of skin of described aluminum bronze wire stylet, described tin layer is compound to the outer surface of aluminum bronze wire stylet by metal composite technology, described aluminum bronze wire stylet and wire body coaxially arrange, described copper aluminum conductor core group is circumferentially uniformly distributed along aluminum bronze wire stylet, has one deck alumina layer at the outer surface of wire body.
Described copper conductor composition percentage by weight is: nickel 15～20%, tin Sn3.5～5.5%, zinc Zn3～8%, plumbous Pb4～6%, copper Cu63～67%.
Compared with prior art, the invention has the advantages that: wire body is double-layer structure, between wire body and conventional copper cable, or with the positions such as switch contacts, allow electric current in transmitting procedure, have a transfer process, avoided heating, short circuit, the generation of the unfavorable phenomenons such as fracture.
Brief description of the drawings
Fig. 1 is the structural representation of invention
1, conductor layer; 2, alumina layer; 3, copper cover aluminum conductor wire core group; 4, aluminium conductor; 5, copper conductor; 6, tin layer.
Embodiment
Embodiment 1
A kind of copper-coated aluminum complex lead, comprise wire body, described wire body is double-layer structure, be conductor layer 1 and alumina layer 2 from inside to outside, described conductor layer 1 comprises array copper cover aluminum conductor wire core group 3 and an aluminum bronze wire stylet, the center of described aluminum bronze wire stylet is aluminium conductor 4, and the skin of aluminium conductor 4 is copper conductor 5.The coated one deck tin layer 6 of skin of described aluminum bronze wire stylet, described tin layer 6 is compound to the outer surface of aluminum bronze wire stylet by metal composite technology, described aluminum bronze wire stylet and wire body coaxially arrange, described copper aluminum conductor core group 3 is circumferentially uniformly distributed along aluminum bronze wire stylet, has one deck alumina layer 2 at the outer surface of wire body.
Described copper conductor composition percentage by weight is: nickel 18～20%, tin Sn4～5%, zinc Zn3～8%, plumbous Pb4～6%, copper Cu65～67%.
Embodiment 2
A kind of copper-coated aluminum complex lead, comprise wire body, described wire body is double-layer structure, be conductor layer 1 and alumina layer 2 from inside to outside, described conductor layer 1 comprises array copper cover aluminum conductor wire core group 3 and an aluminum bronze wire stylet, the center of described aluminum bronze wire stylet is aluminium conductor 4, and the skin of aluminium conductor 4 is copper conductor 5.The coated one deck tin layer 6 of skin of described aluminum bronze wire stylet, described tin layer 6 is compound to the outer surface of aluminum bronze wire stylet by metal composite technology, described aluminum bronze wire stylet and wire body coaxially arrange, described copper aluminum conductor core group 3 is circumferentially uniformly distributed along aluminum bronze wire stylet, has one deck alumina layer 2 at the outer surface of wire body.
Described copper conductor composition percentage by weight is: nickel 17～20%, tin Sn3.5～5%, zinc Zn3～8%, plumbous Pb4～5%, copper Cu63～67%.
Embodiment 3
A kind of copper-coated aluminum complex lead, comprise wire body, described wire body is double-layer structure, be conductor layer 1 and alumina layer 2 from inside to outside, described conductor layer 1 comprises array copper cover aluminum conductor wire core group 3 and an aluminum bronze wire stylet, the center of described aluminum bronze wire stylet is aluminium conductor 4, and the skin of aluminium conductor 4 is copper conductor 5.The coated one deck tin layer 6 of skin of described aluminum bronze wire stylet, described tin layer 6 is compound to the outer surface of aluminum bronze wire stylet by metal composite technology, described aluminum bronze wire stylet and wire body coaxially arrange, described copper aluminum conductor core group 3 is circumferentially uniformly distributed along aluminum bronze wire stylet, has one deck alumina layer 2 at the outer surface of wire body.
Described copper conductor composition percentage by weight is: nickel 15～20%, tin Sn5～5.5%, zinc Zn3～8%, plumbous Pb4～6%, copper Cu63～65%.
Claims (1)
1. a copper-coated aluminum complex lead, it is characterized in that comprising wire body, described wire body is double-layer structure, be followed successively by from inside to outside conductor layer and alumina layer, described conductor layer comprises array copper cover aluminum conductor wire core group and an aluminum bronze wire stylet, the center of described aluminum bronze wire stylet is aluminium conductor, and the skin of aluminium conductor is copper conductor, and described copper conductor composition percentage by weight is: nickel 15～20%, tin Sn3.5～5.5%, zinc Zn3～8%, plumbous Pb4～6%, copper Cu63～67%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410451145.3A CN104200867A (en) | 2014-09-06 | 2014-09-06 | Copper-clad aluminum composite wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410451145.3A CN104200867A (en) | 2014-09-06 | 2014-09-06 | Copper-clad aluminum composite wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104200867A true CN104200867A (en) | 2014-12-10 |
Family
ID=52086143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410451145.3A Pending CN104200867A (en) | 2014-09-06 | 2014-09-06 | Copper-clad aluminum composite wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104200867A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050279074A1 (en) * | 2004-06-17 | 2005-12-22 | Johnson Douglas E | Cable and method of making the same |
| JP2009152141A (en) * | 2007-12-21 | 2009-07-09 | Yazaki Corp | Composite cable |
| CN101728011A (en) * | 2010-01-17 | 2010-06-09 | 大连海事大学 | Copper wire with insulating layer and manufacture method thereof |
| CN201518234U (en) * | 2009-10-29 | 2010-06-30 | 江苏华旺科技有限公司 | Tin-coated copper-clad aluminum conductor material |
| CN102690974A (en) * | 2011-03-24 | 2012-09-26 | 福州永锭铸业有限公司 | Copper alloy |
-
2014
- 2014-09-06 CN CN201410451145.3A patent/CN104200867A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050279074A1 (en) * | 2004-06-17 | 2005-12-22 | Johnson Douglas E | Cable and method of making the same |
| JP2009152141A (en) * | 2007-12-21 | 2009-07-09 | Yazaki Corp | Composite cable |
| CN201518234U (en) * | 2009-10-29 | 2010-06-30 | 江苏华旺科技有限公司 | Tin-coated copper-clad aluminum conductor material |
| CN101728011A (en) * | 2010-01-17 | 2010-06-09 | 大连海事大学 | Copper wire with insulating layer and manufacture method thereof |
| CN102690974A (en) * | 2011-03-24 | 2012-09-26 | 福州永锭铸业有限公司 | Copper alloy |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141210 |