CN104198438A - Measuring system for expansion coefficient of material - Google Patents

Measuring system for expansion coefficient of material Download PDF

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Publication number
CN104198438A
CN104198438A CN201410468727.2A CN201410468727A CN104198438A CN 104198438 A CN104198438 A CN 104198438A CN 201410468727 A CN201410468727 A CN 201410468727A CN 104198438 A CN104198438 A CN 104198438A
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light
measurement
feedback
micro
laser
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张书练
郑发松
谈宜东
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Tsinghua University
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Tsinghua University
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Abstract

The invention relates to a measuring system for the expansion coefficient of a material. The measuring system is characterized by comprising two solid microchip laser feedback interferometer optical systems and an electrical logging and electric control system, wherein a heating furnace is arranged between the two solid microchip laser feedback interferometer optical systems and comprises a furnace chamber; a cavity is formed in the furnace chamber; a perforating hole is symmetrically formed in the two opposite sides of the cavity outward respectively; a perforating hole packaging structure is fixedly arranged at the outer end part of each perforating hole; a window plate is fixed outside each perforating hole packaging structure through a window plate clamping seat; a sample table device capable of accommodating a sample to be measured is further arranged in the cavity body; a heating element and a temperature sensor are fixedly arranged on the inner wall of the furnace chamber in a suspended mode. The measuring system for coefficient of liner expansion has the advantages of complete non-contact, high precision, large temperature measuring range and high resistance to shock, and is particularly suitable for a relatively low surface reflecting material. The measuring system can be widely applied to large temperature range and high precision measurement of expansion coefficient of various materials.

Description

A kind of measuring system of material expansion coefficient
Technical field
The present invention relates to a kind of measuring system of material expansion coefficient, particularly about a kind of measuring system of the material expansion coefficient based on solid microchip laser feedback interferometer.
Background technology
Material expansion coefficient is one of hot physical property of material, is the key character amount of exosyndrome material characteristic, significant in Practical Project and fundamental research to the measurement of material expansion coefficient.In recent years, the measurement of material expansion coefficient causes everybody interest in the application of some key areas, for example, precision photolithography technology, for other compound expansion meter (push rod or similar installation) provides Transfer Standards, and for special material provides high-temperature expansion coefficient technical standard etc., therefore, measuring method is had higher requirement.
The measuring method of the linear expansion coefficient to the sample of different materials and size in various temperature ranges has a lot, and common method has capacitance method, Mechanical Method and optical method.Yet capacitance method and Mechanical Method, due to the principle features of self-technique, have been introduced inevitable error, can not meet high-acruracy survey requirement; Optical method is mainly divided into optical imagery method, speckle interferometry and Through Optical Interference Spectra; Compared with capacitance method and Mechanical Method, although optical method is greatly improved in precision or error control, still there are some problems; Though as optical imagery method can realize non-contact measurement, self radioluminescence of material sample under specific high temperature can affect the quality of imaging, thereby limited the measuring accuracy under high temperature; Though speckle interferometry also can be realized non-contact measurement, its precision is not high; Through Optical Interference Spectra comprises Fizeau interferometric method, Fabry – Perot interferometric method, michelson interferometry, laser heterodyne interferometry plavini and phase shift technology etc., Through Optical Interference Spectra is than aforementioned other method, although improve a lot in resolution and precision, but also there is following not foot point: 1) testing sample only under lower temperature environments (sample surfaces is not oxidized or without phase transformation, makes it to have high surfaces reflectivity) could realize Entirely contactless formula and measure; 2) sample surfaces roughness and shape are had to specific (special) requirements, as testing sample surface needs special mirror finish, make it to have high surfaces reflectivity etc.; 3) to compared with the testing sample of low surface reflectivity or testing sample when higher temperature is measured, need to coordinate target (as sample surfaces plated film or need optical reference material etc.); 4) system needs very high earthquake-resistant condition to protect the light path system of destructible.
The Chinese invention patent application number of delivering before the applicant is that in 200710062859.5 " quasi-common path type feedback interferometer of laser in microchip ", as shown in Figure 1, it comprises some optical elements and Photoelectric Signal Processing system; Optical element comprises micro-slice laser 1, on the emitting light path of micro-slice laser 1, be disposed with spectroscope 2, first sound-optic modulator 3 and second sound-optic modulator 4, light through acousto-optic modulator shift frequency is measurement light, light without acousto-optic modulator shift frequency is reference light, and has an angle [alpha] between the rear reference light of modulation and measurement light; Measure light and reference light and be transmitted into lens 5 simultaneously, through lens 5, converge on reference mirror 6, measure light and through reference mirror 6, impinge perpendicularly on a side of testing sample 7, through the light of testing sample 7 one offside reflections, according to former optical path, return and enter micro-slice laser 1 and form and measure feedback light; Regulate the angle between reference mirror 6 and optical axis, make reference light return and enter micro-slice laser 1 formation with reference to feedback light according to the light path that is parallel to former measurement light; Micro-slice laser 1 is transmitted on spectroscope 2 with reference to feedback light and measurement feedback light, light through spectroscope 2 reflections enters Photoelectric Signal Processing system, and two ways of optical signals is converted to measurement electric signal with photodetector 8 and reference electrical signal is sent in the first quadrature phase-sensitive detector (PSD) 9 and the second quadrature phase-sensitive detector (PSD) 10; Reference electrical signal circuit for generating 11 occurs obtain standard sine reference electrical signal and measure electric signal and send in the first quadrature phase-sensitive detector (PSD) 9 and the second quadrature phase-sensitive detector (PSD) 10 source 12 and the second sinusoidal signal generation source 13 from the first sinusoidal signal; By the first quadrature phase-sensitive detector (PSD) 9 and the second quadrature phase-sensitive detector (PSD) 10, obtain the exocoel phase changing capacity with reference to feedback light and measurement feedback light, and then obtain displacement.
Above-mentioned quasi-common path type feedback interferometer of laser in microchip has utilized shift frequency light feedback effect, the heterodyne phase measuring method of micro-slice laser, and optical design makes to measure the most of technology overlapping of travel path of light and reference light, realized the contactless high-precision of the moving displacement of the very low or object that roughness is very high of reflectivity and measured.At present, for how utilizing quasi-common path type feedback interferometer of laser in microchip to measure the also not research of thermal expansivity of material.
Summary of the invention
For the problems referred to above, the object of this invention is to provide and a kind ofly there is Entirely contactless, high precision, larger measurement temperature range, be applicable to compared with the measuring system of the expansion coefficient of low surface reflectivity, material based on solid microchip laser feedback interferometer.
For achieving the above object, the present invention takes following technical scheme: a kind of measuring system of material expansion coefficient, it is characterized in that: it comprises first, second solid microchip laser feedback interferometer optical system and an electrical measurement and electric-control system, between described first, second solid microchip laser feedback interferometer optical system, a heating furnace is set; Described heating furnace comprises a burner hearth, described burner hearth inside arranges a cavity, described cavity two offsides are outwards symmetrical arranged respectively a perforation, the outer end of boring a hole described in each is fixedly installed a perforation encapsulating structure, the encapsulating structure outer end of boring a hole described in each arranges a window, in described cavity, be also provided with the sample table device that can place testing sample, in described burner hearth, be also fixedly installed heating element and temperature sensor; Described electrical measurement and electric-control system comprise that a computing machine and a heating furnace temperature acquisition show and control system, arrange a high-temperature control module and interference system measurement module in described computing machine; The Photoelectric Signal Processing system of described the first Solid State Laser feedback interferometer optical system sends to described interference system measurement module by the first exocoel phase changing capacity with reference to feedback light and the first measurement feedback light obtaining, the Photoelectric Signal Processing system of described the second solid microchip laser feedback interferometer optical system sends to described interference system measurement module by the second exocoel phase changing capacity with reference to feedback light and the second measurement feedback light obtaining simultaneously, and described interference system measurement module calculates the overall expansion amount of testing sample according to exocoel phase changing capacity; Described high-temperature control module is shown with control system the temperature variation of described heating element is controlled by described heating furnace temperature acquisition, simultaneously described heating furnace temperature acquisition demonstration and control system are by the temperature value in burner hearth described in described temperature sensor Real-time Collection and send it to described interference system measurement module, and described interference system measurement module calculates the average coefficient of linear expansion of testing sample within the scope of different temperatures according to the temperature value in the overall expansion amount of testing sample and described burner hearth.
Described interference system measurement module to the computing formula of average coefficient of linear expansion is:
α ( T 0 ; T 1 ) = 1 L 0 × S T 1 - T 0 ,
Wherein, T0 is initial temperature, and T1 is the temperature after heating up, and L0 is the length of temperature testing sample while being T0, and S is that testing sample is warmed up to the overall expansion amount of T1 from temperature T 0.
Described the second solid microchip laser feedback interferometer optical system comprises some optical device and Photoelectric Signal Processing system, optical element comprises the second micro-slice laser, is disposed with spectroscope, first sound-optic modulator, second sound-optic modulator, lens and reference mirror on the emitting light path of described the second micro-slice laser; The laser that described the second micro-slice laser sends is transmitted into described spectroscope, first sound-optic modulator and second sound-optic modulator successively, light through acousto-optic modulator shift frequency is measurement light, light without acousto-optic modulator shift frequency is reference light, described measurement light and reference light are transmitted into described lens simultaneously, through described lens, converge to described reference mirror; The light that described measurement light transmits through described reference mirror impinges perpendicularly on the another side of testing sample through the second window, the second perforation sealing structure and the second perforation, and the light reflecting through testing sample another side returns and enters described second micro-slice laser formation the second measurement feedback light according to former optical path; Described reference light returns and enters into described the second micro-slice laser formation second with reference to feedback light along being parallel to the light path of measuring light through the light of described reference mirror reflection; Described the second micro-slice laser is measured feedback light and second by described second and is transmitted on described spectroscope with reference to feedback light, light through described spectroscope reflection enters Photoelectric Signal Processing system, and Photoelectric Signal Processing system sends to described electrical measurement and electric-control system by second with reference to feedback light and the second exocoel phase changing capacity of measuring feedback light.
Described the first solid microchip laser feedback interferometer optical system comprises some optical elements and Photoelectric Signal Processing system, optical element includes the first micro-slice laser, is disposed with spectroscope, first sound-optic modulator, second sound-optic modulator, lens and catoptron on the emitting light path of described the first micro-slice laser, the laser that described the first micro-slice laser sends is transmitted into described spectroscope successively, first sound-optic modulator and second sound-optic modulator, light through acousto-optic modulator shift frequency is measurement light, light without acousto-optic modulator shift frequency is reference light, described measurement light and reference light are transmitted into described lens simultaneously, the measurement light of described lens outgoing is through the first window, the first perforation sealing structure and the first perforation impinge perpendicularly on a side of testing sample, light through testing sample one offside reflection returns and enters described first micro-slice laser formation the first measurement feedback light according to former optical path, the reference light of described lens outgoing is transmitted on the catoptron that is arranged on described the second window outside through described cavity and by the second perforation, the second perforation sealing structure and the second window through the first window, the first perforation sealing structure and the first perforation, through the light of described catoptron reflection, according to being parallel to the light path of measuring light, return, enter described the first micro-slice laser formation first with reference to feedback light, described the first micro-slice laser is measured feedback light and first by described first and is transmitted on described spectroscope with reference to feedback light, after described spectroscope reflection, enter described Photoelectric Signal Processing system, described Photoelectric Signal Processing system sends to described electrical measurement and electric-control system by described first with reference to feedback light and the first exocoel phase changing capacity of measuring feedback light.
Described the first solid microchip laser feedback interferometer optical system comprises some optical elements and Photoelectric Signal Processing system, optical element includes the first micro-slice laser, is disposed with spectroscope, first sound-optic modulator, second sound-optic modulator, lens and reference mirror on the emitting light path of described the first micro-slice laser, the laser that described the first micro-slice laser sends is transmitted into described spectroscope successively, first sound-optic modulator and second sound-optic modulator, light through acousto-optic modulator shift frequency is measurement light, light without acousto-optic modulator shift frequency is reference light, described measurement light and reference light converge on described reference mirror through described lens simultaneously, the light that described measurement light transmits through described reference mirror is through the first window, the first perforation sealing structure and the first perforation impinge perpendicularly on a side of testing sample, light through testing sample one offside reflection returns and enters into described first micro-slice laser formation the first measurement feedback light according to original optical path, described reference light returns according to being parallel to the light path of measuring light through the light of described reference mirror reflection, enters into described the first micro-slice laser formation first with reference to feedback light, described the first micro-slice laser is measured feedback light and first by described first and is transmitted on described spectroscope with reference to feedback light, light through described spectroscope reflection enters Photoelectric Signal Processing system, and Photoelectric Signal Processing system sends to described electrical measurement and electric-control system by first with reference to feedback light and the first exocoel phase changing capacity of measuring feedback light.
A kind of measuring system of material expansion coefficient, it is characterized in that: it comprises solid microchip laser feedback interferometer optical system and electrical measurement and an electric-control system, described solid microchip laser feedback interferometer optical system below arranges a heating furnace, described heating furnace comprises a burner hearth, one cavity is set in described burner hearth, described cavity top stretches out a perforation is set, described perforation outer end arranges a perforation sealing structure, described perforation sealing structure outer end arranges a window, in described cavity, be also provided with the sample table device that can place reference substance and testing sample, in described burner hearth, be also fixedly installed heating element and temperature sensor,
Described solid microchip laser feedback interferometer optical system comprises some optical elements and Photoelectric Signal Processing system, optical element includes micro-slice laser, is disposed with the first spectroscope on the emitting light path of described micro-slice laser, first sound-optic modulator, second sound-optic modulator, lens, the second spectroscope and catoptron, the laser that described micro-slice laser sends is transmitted into described the first spectroscope successively, first sound-optic modulator and second sound-optic modulator, light through acousto-optic modulator shift frequency is measurement light, light without acousto-optic modulator shift frequency is reference light, described measurement light and reference light are transmitted into described lens simultaneously, through described lens, converge to described the second spectroscope, described reference light through the light of described the second spectroscope transmission through described window, perforation encapsulating structure and perforation impinge perpendicularly on the upper surface of testing sample, light through the reflection of testing sample upper surface returns and enters into described micro-slice laser formation measurement feedback light according to original optical path, described reference light is mapped to described catoptron through the illumination of described the second spectroscope reflection, through described window, perforation encapsulating structure and perforation, impinge perpendicularly on the upper surface of reference substance, the light reflecting through reference substance upper surface returns and enters into described micro-slice laser formation with reference to feedback light according to the light path that is parallel to former described measurement light, described micro-slice laser is transmitted on described the first spectroscope with reference to feedback light and measurement feedback light described, and the light reflecting through described the first spectroscope enters described Photoelectric Signal Processing system, described Photoelectric Signal Processing system sends to described electrical measurement and electric-control system by the described exocoel phase changing capacity with reference to feedback light and measurement feedback light,
Described electrical measurement and electric-control system comprise that a computing machine and a heating furnace temperature acquisition show and control system, arrange a high-temperature control module and interference system measurement module in described computing machine; The Photoelectric Signal Processing system of described Solid State Laser feedback interferometer optical system sends to described interference system measurement module by the described exocoel phase changing capacity with reference to feedback light and measurement feedback light obtaining, and described interference system measurement module calculates the overall expansion amount of testing sample according to exocoel phase changing capacity; Described high-temperature control module is shown with control system the temperature variation of described heating element is controlled by described heating furnace temperature acquisition, simultaneously described heating furnace temperature acquisition demonstration and control system are by the temperature value in burner hearth described in described temperature sensor Real-time Collection and send it to described interference system measurement module, and described interference system measurement module calculates the average coefficient of linear expansion of testing sample within the scope of different temperatures according to the temperature value in the overall expansion amount of testing sample and described burner hearth.
Described interference system measurement module to the computing formula of average coefficient of linear expansion is:
α ( T 0 ; T 1 ) = 1 L 0 × S T 1 - T 0 ,
Wherein, T0 is initial temperature, and T1 is the temperature after heating up, and L0 is the length of temperature testing sample while being T0, and S is that testing sample is warmed up to the overall expansion amount of T1 from temperature T 0.
A kind of measuring system of material expansion coefficient, it is characterized in that: it comprises first, second solid microchip laser feedback interferometer optical system and an electrical measurement and electric-control system, the below of described the first solid microchip laser feedback interferometer optical system, a side of described the second solid microchip laser feedback interferometer optical system arranges a heating furnace; Described heating furnace comprises a burner hearth, one cavity is set in described burner hearth, described cavity top stretches out a perforation is set, described perforation outer end arranges a perforation sealing structure, described perforation sealing structure outer end arranges a window, is also provided with the sample table device that can place reference substance and testing sample in described cavity; In described burner hearth, be also fixedly installed heating element and temperature sensor; Described electrical measurement and electric-control system comprise that a computing machine and a heating furnace temperature acquisition show and control system, arrange a high-temperature control module and interference system measurement module in described computing machine; The Photoelectric Signal Processing system of described the first Solid State Laser feedback interferometer optical system sends to described interference system measurement module by the first exocoel phase changing capacity with reference to feedback light and the first measurement feedback light obtaining, the Photoelectric Signal Processing system of described the second solid microchip laser feedback interferometer optical system sends to described interference system measurement module by the second exocoel phase changing capacity with reference to feedback light and the second measurement feedback light obtaining simultaneously, and described interference system measurement module calculates the overall expansion amount of testing sample according to exocoel phase changing capacity; Described high-temperature control module is shown with control system the temperature variation of described heating element is controlled by described heating furnace temperature acquisition, simultaneously described heating furnace temperature acquisition demonstration and control system are by the temperature value in burner hearth described in described temperature sensor Real-time Collection and send it to described interference system measurement module, and described interference system measurement module calculates the average coefficient of linear expansion of testing sample within the scope of different temperatures according to the temperature value in the overall expansion amount of testing sample and described burner hearth.
Described interference system measurement module to the computing formula of average coefficient of linear expansion is:
α ( T 0 ; T 1 ) = 1 L 0 × S T 1 - T 0 ,
Wherein, T0 is initial temperature, and T1 is the temperature after heating up, and L0 is the length of temperature testing sample while being T0, and S is that testing sample is warmed up to the overall expansion amount of T1 from temperature T 0.
Described the first solid microchip laser feedback interferometer optical system comprises some optical elements and Photoelectric Signal Processing system, optical element comprises the first micro-slice laser, on the emitting light path of described the first micro-slice laser, is disposed with spectroscope, first sound-optic modulator, second sound-optic modulator, lens and the first reference mirror, the laser that described the first micro-slice laser sends is transmitted into described spectroscope successively, first sound-optic modulator and second sound-optic modulator, light through acousto-optic modulator shift frequency is measurement light, light without acousto-optic modulator shift frequency is reference light, described measurement light and reference light converge on described the first reference mirror through described lens simultaneously, described measurement light through the light of the first reference mirror transmission through described window, perforation sealing structure and perforation impinge perpendicularly on the upper surface of testing sample, light through the reflection of testing sample upper surface returns and enters into described first micro-slice laser formation the first measurement feedback light according to original optical path, described reference light returns and enters into described the first micro-slice laser formation first with reference to feedback light according to the light path that is parallel to former measurement light through the light of described the first reference mirror reflection, described the first micro-slice laser is measured feedback light by first with reference to feedback light and first and is transmitted on described spectroscope, and the light reflecting through described spectroscope enters described Photoelectric Signal Processing system, described Photoelectric Signal Processing system outputs to described electrical measurement and electric-control system by the described first exocoel phase changing capacity with reference to feedback light and the first measurement feedback light obtaining.
Described the second solid microchip laser feedback interferometer optical system comprises some optical elements and Photoelectric Signal Processing system, optical element includes the second micro-slice laser, on the emitting light path of described the second micro-slice laser, is disposed with spectroscope, first sound-optic modulator, second sound-optic modulator, lens, the second reference mirror and catoptron, the laser that described the second micro-slice laser sends is transmitted into described spectroscope successively, first sound-optic modulator and second sound-optic modulator, light through acousto-optic modulator shift frequency is measurement light, light without acousto-optic modulator shift frequency is reference light, described measurement light and reference light converge to described the second reference mirror through described lens simultaneously, described measurement light is mapped on described catoptron through the illumination of described the second reference mirror transmission, the light reflecting through described catoptron is through described window, perforation sealing structure and perforation impinge perpendicularly on the upper surface of reference substance, light through the reflection of reference substance upper surface returns and enters into described second micro-slice laser formation the second measurement feedback light according to original optical path, described reference light returns and enters into described the second micro-slice laser formation second with reference to feedback light according to the light path that is parallel to former described measurement light through the light of described the second reference mirror reflection, described the second micro-slice laser is measured feedback light by described second with reference to feedback light and second and is transmitted on described spectroscope, after described spectroscope reflection, enter described Photoelectric Signal Processing system, described Photoelectric Signal Processing system sends to electrical measurement and electric-control system by the described second exocoel phase changing capacity with reference to feedback light and the second measurement feedback light obtaining.
The present invention is owing to taking above technical scheme, it has the following advantages: 1, the present invention is owing to adopting the heating furnace device of special construction to be provided with sample stage, testing sample can be placed on sample stage, the swell increment can Measurement accuracy material two ends being caused by temperature variation, has realized Entirely contactless formula and has measured.2, the present invention, due to heating furnace device burner hearth bottom surface and sample stage smooth surface, can effectively eliminate the displacement of the sample being caused by sample stage or burner hearth vibrations etc., thereby improve the anti-environmental interference ability of system.3, the present invention is because heating furnace device and solid microchip laser feedback interferometer have formed heterodyne measurement system, can the border disturbance of effective compensation intensification burner hearth inner and outer rings, and allow system not need specific vacuum environment, system architecture is simple.4, the present invention, because temperature in the heating furnace device burner hearth adopting can be raised to 1600 ℃ from room temperature, has larger temperature measurement range, has further improved range of application of the present invention.5, the microchip laser feedback interferometer of the present invention's high feedback luminous sensitivity because employing has, even if sample surfaces when higher temperature (oxidation or phase transformation) is had compared with low surface reflectivity, still can realize Entirely contactless formula measures, therefore, the measurement temperature range for testing sample has greatly improved compared with conventional interference method.6 the present invention not only can be widely used in the non-cpntact measurement of various solid materials, also can realize the non-cpntact measurement of fluent material simultaneously.Therefore, the present invention can be widely used in various materials expansion coefficient compared with large-temperature range, high-acruracy survey.
Accompanying drawing explanation
Fig. 1 is that number of patent application is 200710062859.5 measuring system schematic diagrams,
Fig. 2 is the embodiment of the present invention 1 structural representation,
Fig. 3 is the computation model schematic diagram of the embodiment of the present invention 1,
Fig. 4 is the embodiment of the present invention 2 structural representations,
Fig. 5 is the computation model schematic diagram of the embodiment of the present invention 2,
Fig. 6 is the embodiment of the present invention 3 structural representations,
Fig. 7 is the computation model schematic diagram of the embodiment of the present invention 3,
Fig. 8 is the embodiment of the present invention 4 structural representations,
Fig. 9 is the computation model schematic diagram of the embodiment of the present invention 4,
Figure 10 is carbon fiber sample clamping structural drawing of the present invention, and wherein Figure 10 (a) is carbon fiber sample clamping structure side view, and Figure 10 (b) is carbon fiber sample clamping structure vertical view.
Embodiment
Below in conjunction with drawings and Examples, the present invention is described in detail.
The phenomenon that the volume of material or length increase with the rising of temperature is called thermal expansion.Thermal expansion represents by expansion coefficient, and usually said expansion coefficient refers to linear expansion coefficient, and the linear expansion coefficient of material refers to the raise relative elongation of material after 1 ℃ of temperature.In real work, the measurement of the linear expansion coefficient of material need to obtain temperature and two physical quantitys of swell increment, the acquisition of two physical quantitys is carried out to detailed description below.
Embodiment 1:
As shown in Figure 2, the embodiment of the present invention 1 comprises first, the second solid microchip laser feedback interferometer optical system 14, 15 and one electrical measurement and electric-control system 16, between two solid microchip laser feedback interferometer optical systems, a heating furnace 17 is set, heating furnace 17 comprises a burner hearth 171, burner hearth 171 inside arrange a cavity 172, 172 liang of offsides of cavity are outwards symmetrical arranged respectively a perforation 173, each 173 outer end of boring a hole is fixedly installed a perforation encapsulating structure 174, a window 176 is fixed by a window grip slipper 175 in each perforation encapsulating structure 174 outer end, in cavity, be also provided with the sample table device 177 that can place testing sample, in burner hearth 171, also fixing suspension is provided with heating element and temperature sensor (not shown).
The first solid microchip laser feedback interferometer optical system 14 is basic identical with existing system structure, and it comprises some optical elements and Photoelectric Signal Processing system; Optical element includes on the emitting light path of the first micro-slice laser 141, the first micro-slice lasers 141 and is disposed with spectroscope 142, first sound-optic modulator 143, second sound-optic modulator 144, lens 145 and catoptron 146; The laser that the first micro-slice laser 141 sends is transmitted into spectroscope 142, first sound-optic modulator 143 and second sound-optic modulator 144 successively, light through acousto-optic modulator shift frequency is measurement light, light without acousto-optic modulator shift frequency is reference light, measure light and reference light and be transmitted into lens 145 simultaneously, the measurement light of lens 145 outgoing impinges perpendicularly on a side of testing sample through the first window, the first perforation sealing structure and the first perforation, through the light of testing sample one offside reflection, according to former optical path, returns and enters the first micro-slice laser and form first and measure feedback light; The reference light of lens 145 outgoing is transmitted on the catoptron 146 that is arranged on the second window outside through cavity 172 and by the second perforation, the second perforation sealing structure and the second window through the first window, the first perforation sealing structure and the first perforation, angle between accommodation reflex mirror 146 and optical axis, makes reference light return and enter the first micro-slice laser 141 formation first with reference to feedback light according to the light path that is parallel to former measurement light; The first micro-slice laser 141 is measured feedback light by first with reference to feedback light and first and is transmitted on spectroscope 142, light through spectroscope 142 reflections enters Photoelectric Signal Processing system, Photoelectric Signal Processing system is for obtaining the first exocoel phase changing capacity with reference to feedback light and the first measurement feedback light, the structure of Photoelectric Signal Processing system is identical with structure and the principle of " quasi-common path type feedback interferometer of laser in microchip " mentioned in background technology with principle, does not repeat them here.
The second solid microchip laser feedback interferometer optical system 15 is also basic identical with existing system structure, it comprises some optical device and Photoelectric Signal Processing system, optical element includes on the emitting light path of the second micro-slice laser 151, the second micro-slice lasers 151 and is disposed with spectroscope 152, first sound-optic modulator 153, second sound-optic modulator 154, lens 155 and reference mirror 156; The laser that the second micro-slice laser 151 sends is transmitted into spectroscope 152, first sound-optic modulator 153 and second sound-optic modulator 154 successively, light through acousto-optic modulator shift frequency is measurement light, light without acousto-optic modulator shift frequency is reference light, measure light and reference light and be transmitted into lens 155 simultaneously, through lens 155, converge to reference mirror 156; Measurement light through reference mirror 156 transmissions impinges perpendicularly on the another side of testing sample through the second window, the second perforation sealing structure and the second perforation, and the light reflecting through testing sample another side returns and enters into second micro-slice laser 151 formation the second measurement feedback light according to original optical path; Regulate the angle between reference mirror 156 and optical axis, make to return and enter into the second micro-slice laser 151 formation second with reference to feedback light along the light path that is parallel to former measurement light through the reference light of reference mirror 156 reflections; The second micro-slice laser 151 is measured feedback light by second with reference to feedback light and second and is transmitted on spectroscope 152, light through spectroscope 152 reflections enters Photoelectric Signal Processing system, Photoelectric Signal Processing system is for obtaining the second exocoel phase changing capacity with reference to feedback light and the second measurement feedback light, the structure of the second Photoelectric Signal Processing system is identical with structure and the principle of " quasi-common path type feedback interferometer of laser in microchip " mentioned in background technology with principle, does not repeat them here.
Electrical measurement and electric-control system 16 comprise that a computing machine 161 and a heating furnace temperature acquisition show and control system 162, an interior high-temperature control module and the interference system measurement module of arranging of computing machine 161; The Photoelectric Signal Processing system of first, second solid microchip laser feedback interferometer optical system 14,15 sends to by the exocoel phase changing capacity signal of output the overall expansion amount that interference system measurement module calculates testing sample; High-temperature control module is shown with the temperature variation of 162 pairs of heating elements of control system and is controlled by heating furnace temperature acquisition, heating furnace temperature acquisition demonstration simultaneously and control system 162 are by the temperature value in temperature sensor Real-time Collection burner hearth 171 and send it to interference system measurement module, and interference system measurement module calculates the average coefficient of linear expansion of testing sample within the scope of different temperatures according to the temperature value in the overall expansion amount of testing sample and burner hearth 171.
In above-described embodiment, the specific works process of interference system measurement module is:
Suppose that first of first, second solid microchip laser feedback interferometer optical system 14,15 is respectively with reference to feedback light, the second displacement of measuring feedback light with reference to feedback light, the first measurement feedback light, second with :
S Ω 1 = c 2 nω ΔP r 1 = S L 5 + 2 S L 2 + S L 7 + S L 6 - - - ( 1 )
S 2 Ω 1 = c 2 nω ΔP m 1 = S L 5 + S L 2 + S 1 + S L 8 - S 3 - - - ( 2 )
S Ω 2 = c 2 nω ΔP r 2 = S L 9 - - - ( 3 )
S 2 Ω 2 = c 2 nω ΔP m 2 = S L 9 + S L 4 + S L 10 + S L 2 + S L 11 + S 2 + S 3 - - - ( 4 )
In formula, c is the light velocity in vacuum, and n is air refraction, and ω is the frequency from first, second micro-slice laser emitting laser, be respectively first, second and measure the exocoel phase changing capacity that feedback light causes, be respectively the exocoel phase changing capacity that first, second causes with reference to feedback light.
As shown in Figure 3, when temperature is T0, the position that testing sample is described in solid line, when temperature is T1, testing sample after fully expanding, the position in dotted line description.Each light path section is defined as: L0 is the length of temperature testing sample while being T0; L1 is that the chamber of cavity 172 is long; L2 is the thickness of window 176; L3 is the thickness of catoptron 146; L4 is the thickness of reference mirror 156; L5 is the distance on the first micro-slice laser 141 to first window surfaces; L6 be catoptron 146 surfaces to the distance between the second window surface, L7 is the light path of the first reference light in burner hearth 171; L8 is the distance between testing sample surface after fully expanding during to temperature T 1 in the first window 1761 surface; L9 is that the second micro-slice laser 151 is to the distance between reference mirror 156 surfaces; L10 is that reference mirror 156 surfaces are to the distance between the second window surface; L11 is the distance between testing sample another side after fully expanding during to temperature T 1 in the second window surface; S 1left side swell increment for testing sample; S 2right side swell increment for testing sample; S 3displacement for testing sample; S l2the displacement causing for the thermal effect of window 176; S l4the displacement causing for the thermal effect of reference mirror 156; S l5displacement and this L5 section gaseous environment of for the thermal effect of each optical element in L5 section light path, causing vary with temperature the displacement sum causing; S l6, S l7be respectively L6 section and L7 section gaseous environment varies with temperature the displacement causing; S l8for L8 section gaseous environment varies with temperature the displacement causing; S l9the displacement and this section of gaseous environment that for the thermal effect of each optical element in L9 section light path, cause vary with temperature the displacement sum causing; S l10, S l11be respectively L10 section and L11 section gaseous environment varies with temperature the displacement causing.
By formula (2) and (4), the overall expansion amount S that obtains testing sample is:
S = S 1 + S 2 = S 2 Ω 1 + S 2 Ω 2 - ( 2 S L 2 + S L 4 + S L 5 + S L 8 + S L 9 + S 10 + S L 11 ) - - - ( 5 )
Because thickness and the thermal expansivity of window 176, reference mirror 156 are very little, make S l2, S l4can ignore; Distance between catoptron 146, reference mirror 156 and the second window is very little, and L6, L10 are very little, and the temperature variation of residing environment is little, the displacement S that this part gaseous environment is varied with temperature cause l6, S l10can ignore, that is:
S L2≈S L4≈S L6≈S L10≈0 (6)
Each optical element and the gaseous environment of living in of first, second solid microchip laser feedback interferometer optical system 14,15 are basic identical, make:
S L9+S L4+S L10≈S L5 (7)
Due to the angle α very little (as shown in Figure 1) between reference light in the first solid microchip laser feedback interferometer optical system 14 and measurement light, catoptron 146 can compensate the interior environmental interference amount of cavity 172, making first, with reference to feedback light and first, to measure feedback light light path basic identical, makes L1=L8+L11+S 1+ S 2+ L0 ≈ L7, and cavity 172 is in approximate thermal equilibrium environment, S 1, S 2very little, have:
S L8+S L11≈S L7·[(L1-L0)/L1] (8)
S Ω 1 - S Ω 2 = S L 5 + 2 S L 2 + S L 7 + S L 6 - S L 9 = S L 7 - - - ( 9 )
By formula (3), (6), (7), (8), (9) substitution formula (5), obtain overall expansion amount S and be:
S ≈ S 2 Ω 1 - 2 S Ω 2 + S 2 Ω 2 - ( S Ω 1 - S Ω 2 ) · [ ( L 1 - L 0 ) / L 1 ] - - - ( 10 )
The average coefficient of linear expansion of testing sample in this section of temperature is:
α ( T 0 ; T 1 ) = 1 L 0 × S T 1 - T 0 - - - ( 11 )
Surfaceness take below as 0.8, the expansion coefficient of the cube sample piece aluminium that the length of side is 40mm be measured as example, the use procedure of the embodiment of the present invention 1 is described in detail.
1) testing sample is placed on sample table device 177, finely tune again testing sample and first, second solid microchip laser feedback interferometer optical system 14,15, make the laser that first, second micro-slice laser 141,151 output single longitudinal modes, linear polarization, wavelength are 1064nm;
2) regulate the level height of first, second solid microchip laser feedback interferometer optical system 14,15, the measurement light that makes two optical systems is through perforation 173 centers of heating furnace 17 and in same level height, and two measurement light optical axises overlapped substantially and vertical with testing sample surface;
3) high-temperature control module is shown with 162 pairs of burner hearth 171 temperature of control system and is controlled by heating furnace temperature acquisition, the temperature of cavity 172 is heated to more than 1000 ℃ from room temperature, temperature heating step-length is 150 ℃, this step-length heat time is half an hour, and keeps within 5 hours, making testing sample aluminium fully expand at each temperature value;
4) interference system measurement module, according to overall expansion amount and the temperature of the length of testing sample aluminium, testing sample aluminium, calculates the average coefficient of linear expansion of the testing sample aluminium within the scope of different temperatures.
Embodiment 2:
As shown in Figure 4, the structure of the structure of the embodiment of the present invention 2 and embodiment 1 is basic identical, it comprises first, the second solid microchip laser feedback interferometer optical system 18, 15 and electrical measurement and electric-control system 16, the structure of the first solid microchip laser feedback interferometer optical system 18 that the present embodiment adopts that different is is different, the first structure that solid microchip laser feedback interferometer optical system 18 adopts with in embodiment 1, the second solid microchip laser feedback interferometer optical system 15 is identical in the present embodiment, electrical measurement and electric-control system 16 are identical with principle with structure in embodiment 1, do not repeat them here.
The first solid microchip laser feedback interferometer optical system 18 of the present embodiment, comprises some optical elements and Photoelectric Signal Processing system, optical element comprises micro-slice laser 181, is disposed with spectroscope 182, first sound-optic modulator 183, second sound-optic modulator 184, lens 185 and reference mirror 186 on the emitting light path of micro-slice laser 181, the laser that micro-slice laser 181 sends is transmitted into spectroscope 182 successively, first sound-optic modulator 183 and second sound-optic modulator 184, light through acousto-optic modulator shift frequency is measurement light, light without acousto-optic modulator shift frequency is reference light, measure light and reference light converges on reference mirror 186 through lens 185 simultaneously, through the measurement light of reference mirror 186 transmissions through the first window, the first perforation sealing structure and the first perforation impinge perpendicularly on a side of testing sample, light through testing sample one offside reflection returns according to original optical path, enter into micro-slice laser 181 and form measurement feedback light, regulate the angle between reference mirror 186 and optical axis, the reflected light that is irradiated to the reference light on reference mirror 186 is returned according to the light path that is parallel to former measurement light, enter into micro-slice laser 181 and form with reference to feedback light, micro-slice laser 181 is transmitted on spectroscope 182 with reference to feedback light and measurement feedback light, light through spectroscope 182 reflections enters Photoelectric Signal Processing system, Photoelectric Signal Processing system is for obtaining the exocoel phase changing capacity with reference to feedback light and measurement feedback light, the structure of Photoelectric Signal Processing system is identical with structure and the principle of " quasi-common path type feedback interferometer of laser in microchip " mentioned in background technology with principle, does not repeat them here.
In this enforcement, as shown in Figure 5, the computation process of interference system measurement module and embodiment 1 is basic identical, different is that the present embodiment changes catoptron 146 in embodiment 1 into reference mirror 186, thereby adopt the thickness L4 of reference mirror 186 while calculating, concrete: in supposition the present embodiment, first of two solid microchip laser feedback interferometer optical systems measures feedback light, second with reference to feedback light, first and with reference to feedback light, second, measure the displacement that feedback light draws and be respectively with :
S Ω 1 = c 2 nω ΔP r 1 = S L 9 - - - ( 12 )
S 2 Ω 1 = c 2 nω ΔP m 1 = S L 9 + S L 4 + S L 10 + S L 2 + S 1 - S 3 - - - ( 13 )
S Ω 2 = c 2 nω ΔP r 2 = S L 9 - - - ( 14 )
S 2 Ω 2 = c 2 nω ΔP m 2 = S L 9 + S L 4 + S L 10 + S L 2 + S 2 + S 3 - - - ( 15 )
By formula (13) and (15), the overall expansion amount S that obtains testing sample is:
S = S 1 + S 2 = S 2 Ω 1 + S 2 Ω 2 - 2 ( S L 2 + S L 9 + S L 4 + S L 10 ) - - - ( 16 )
Same, ignore S l2, S l4, S l10after, temperature is raised to T1 from T0, and the overall expansion amount S of testing sample is:
S = S 1 + S 2 = S 2 Ω 1 + S 2 Ω 2 - S Ω 1 - S Ω 2 - - - ( 17 )
By formula (17) substitution (11), can obtain the average coefficient of linear expansion of testing sample in this section of temperature.
Embodiment 3
As shown in Figure 6, the embodiment of the present invention 3 comprises a microchip laser feedback interferometer optical system 19 and electrical measurement and electric-control system 16, and the below of solid microchip laser feedback interferometer optical system 19 arranges a heating furnace 20; Heating furnace 20 comprises a burner hearth 201, the interior cavity 202 that arranges of burner hearth 201, cavity 202 tops stretch out a perforation 203 are set, 203 outer ends of boring a hole are fixedly installed a perforation sealing structure 204, a window 206 is fixed by a window grip slipper 205 in perforation sealing structure 204 outer ends, in cavity 202, be also provided with the sample table device 207 that can place reference substance and testing sample, in burner hearth 201, also fixing suspension being provided with heating element and temperature sensor (not shown); The electrical measurement of the present embodiment and electric-control system 16 are identical with embodiment 1, and its concrete principle repeats no more.
Solid microchip laser feedback interferometer optical system 19 is basic identical with existing system structure, and it comprises some optical elements and Photoelectric Signal Processing system; Optical element comprises micro-slice laser 191, is disposed with the first spectroscope 192 on the emitting light path of micro-slice laser 191, first sound-optic modulator 193, second sound-optic modulator 194, lens 195, the second spectroscope 196 and catoptron 197.The laser that micro-slice laser 191 sends is transmitted into the first spectroscope 192 successively, first sound-optic modulator 193 and second sound-optic modulator 194, light through acousto-optic modulator shift frequency is measurement light, light without acousto-optic modulator shift frequency is reference light, measure light and reference light and be transmitted into lens 195 simultaneously, through lens 195, converge on the second spectroscope 196, through the measurement light of the second spectroscope 196 transmissions through window 206, perforation encapsulating structure 204 and perforation 203 impinge perpendicularly on the upper surface of testing sample, light through the reflection of testing sample upper surface returns and enters into micro-slice laser 191 formation measurement feedback light according to original optical path, reference light through the second spectroscope 196 reflections is irradiated on catoptron 197, angle between accommodation reflex mirror 197 and optical axis, make reference light impinge perpendicularly on the upper surface of reference substance through window 206, perforation encapsulating structure 204 and perforation 203, and make to return and enter into micro-slice laser 191 formation with reference to feedback light according to the light path that is parallel to former measurement light through the light of reference substance upper surface reflection, micro-slice laser 191 is transmitted into the first spectroscope 192 with reference to feedback light and measurement feedback light, and the light reflecting through the first spectroscope 192 enters Photoelectric Signal Processing system, Photoelectric Signal Processing system is for obtaining with reference to feedback light and measuring the exocoel phase changing capacity of feedback light and output to electrical measurement and electric-control system 16, the structure of Photoelectric Signal Processing system is identical with structure and the principle of " quasi-common path type feedback interferometer of laser in microchip " mentioned in background technology with principle, does not repeat them here.
In this enforcement, suppose that the reference feedback light of solid microchip laser feedback interferometer optical system 19 and the displacement of measurement feedback light are respectively S Ωand S 2 Ω:
S Ω = c 2 nω ΔP r = S L 2 Ω + S L 4 Ω + S 3 + S 4 - - - ( 18 )
S 2 Ω = c 2 nω ΔP m = S L 2 2 Ω + S L 3 2 Ω + S 1 + S 2 + S 3 + S 4 - - - ( 19 )
As shown in Figure 7, when temperature is T0, the position that testing sample and reference substance are described in solid line, when temperature is T1, testing sample and reference substance after fully expanding, the position in dotted line description.Each light path section is defined as: L0 is the length of temperature testing sample while being T0; L1 is that the chamber of cavity 202 is long; L2 is that micro-slice laser 191 is to the distance of window 206 lower surfaces; L3 is for measuring the light path of light in cavity 202; L4 is the light path of reference light in cavity 202; S 1upside swell increment for testing sample; S 2downside swell increment for testing sample; S 3overall expansion amount for reference substance; S 4swell increment for sample table device 207 and burner hearth 201 bottoms; with be respectively reference light and measure light each optical element in L2 section light path and vary with temperature with this L2 section gaseous environment the displacement sum causing; for measuring light, at L3 section gaseous environment, vary with temperature the displacement causing; for reference light varies with temperature at L4 section gaseous environment the displacement causing.
By formula (19), the overall expansion amount S that obtains testing sample is:
S = S 1 + S 2 = S 2 Ω - ( S L 2 2 Ω + S L 3 2 Ω + S 3 + S 4 ) - - - ( 20 )
Due to the distance between the second spectroscope 196 and catoptron 197 and the second spectroscope 196 thickness less, the reference path of L2 section and optical path are basic identical, make reference light in cavity 202 and the angle [alpha] of this reference light between the reflected light of reference substance upper surface are very little, and the thickness L0 of testing sample is less, and cavity 202 internal reference light paths and optical path are basic identical, make the overall expansion amount of testing sample is:
S＝S 2Ω-S Ω (21)
By formula (21) substitution (11), can obtain the average coefficient of linear expansion of testing sample in this section of temperature.
Embodiment 4
As shown in Figure 8, the embodiment of the present invention 4 comprises first, second solid microchip laser feedback interferometer optical system 21,22 and electrical measurement and electric-control system 16, the first solid microchip laser feedback interferometer optical system 21 belows, a side of the second solid microchip laser feedback interferometer optical system 22 arranges a heating furnace 20; Heating furnace 20 is identical with structure in embodiment 3, and electrical measurement and electric-control system 16 are identical with structure in embodiment 1, and its concrete principle repeats no more.
The first solid microchip laser feedback interferometer optical system 21 is basic identical with existing system structure, and it comprises some optical elements and Photoelectric Signal Processing system; Optical element comprises on the emitting light path of the first micro-slice laser 211, the first micro-slice lasers 211 and is disposed with spectroscope 212, first sound-optic modulator 213, second sound-optic modulator 214, lens 215 and reference mirror 216.The laser that the first micro-slice laser 211 sends is transmitted into spectroscope 212 successively, first sound-optic modulator 213 and second sound-optic modulator 214, light through acousto-optic modulator shift frequency is measurement light, light without acousto-optic modulator shift frequency is reference light, measuring light and reference light converges on reference mirror 216 through lens 215 simultaneously, through the measurement light of reference mirror 216 transmissions through window 206, perforation sealing structure 204 and perforation 203 impinge perpendicularly on the upper surface of testing sample, light through the reflection of testing sample upper surface returns and enters into first micro-slice laser 211 formation the first measurement feedback light according to original optical path, regulate the angle of reference mirror 216, make the reflected light that is irradiated to the reference light on reference mirror 216 return and enter into the first micro-slice laser 211 formation first with reference to feedback light according to the light path that is parallel to former measurement light, the first micro-slice laser 211 is measured feedback light by first with reference to feedback light and first and is transmitted on spectroscope 212, and the light reflecting through spectroscope 212 enters Photoelectric Signal Processing system, Photoelectric Signal Processing system is for obtaining the first exocoel phase changing capacity with reference to feedback light and the first measurement feedback light, the structure of Photoelectric Signal Processing system is identical with structure and the principle of " quasi-common path type feedback interferometer of laser in microchip " mentioned in background technology with principle, does not repeat them here.
The second solid microchip laser feedback interferometer optical system 22 is basic identical with existing system structure, and it comprises some optical elements and Photoelectric Signal Processing system; Optical element comprises on the emitting light path of the second micro-slice laser 221, the second micro-slice lasers 221 and is disposed with spectroscope 222, first sound-optic modulator 223, second sound-optic modulator 224, lens 225, reference mirror 226 and catoptron 227.The laser that the second micro-slice laser 221 sends is transmitted into spectroscope 222 successively, first sound-optic modulator 223 and second sound-optic modulator 224, light through two acousto-optic modulator shift frequencies is measurement light, light without acousto-optic modulator shift frequency is reference light, measuring light and reference light converges on reference mirror 226 through lens 225 simultaneously, measurement illumination through reference mirror 226 transmissions is mapped on catoptron 227, the measurement light reflecting through catoptron 227 is through window 206, perforation sealing structure 204 and perforation 203 impinge perpendicularly on the upper surface of reference substance, light through the reflection of reference substance upper surface returns and enters into second micro-slice laser formation the second measurement feedback light according to original optical path, regulate the angle of the second reference mirror 226, the reflected light that makes to be irradiated to the reference light on reference mirror 226 returns and enters into the second micro-slice laser 221 and form second with reference to feedback light according to being parallel to the light path of measuring light, the second micro-slice laser 221 is measured feedback light by second with reference to feedback light and second and is transmitted on spectroscope 222, light through spectroscope 222 reflections enters Photoelectric Signal Processing system, Photoelectric Signal Processing system is measured the exocoel phase changing capacity of feedback light and outputs to electrical measurement and electric-control system 16 with reference to feedback light and second for obtaining second, the structure of Photoelectric Signal Processing system is identical with structure and the principle of " quasi-common path type feedback interferometer of laser in microchip " mentioned in background technology with principle, does not repeat them here.
In the present embodiment, suppose that first of two solid microchip laser feedback interferometer optical systems in the present embodiment measure feedback light, second with reference to feedback light, first and with reference to feedback light, second, measure the displacement that feedback light draws and be respectively with :
S Ω 1 = c 2 nω ΔP r 1 = S L 3 - - - ( 22 )
S 2 Ω 1 = c 2 nω ΔP m 1 = S L 3 + S L 6 + S L 7 + S 1 + S 2 + S 3 + S 4 - - - ( 23 )
S Ω 2 = c 2 nω ΔP r 2 = S L 2 - - - ( 24 )
S 2 Ω 2 = c 2 nω ΔP m 2 = S L 2 + S L 4 + S L 5 + S L 8 + S 3 + S 4 - - - ( 25 )
As shown in Figure 9, when temperature is T0, the position that testing sample and reference substance are described in solid line, when temperature is T1, testing sample and reference substance after fully expanding, the position in dotted line description.Each light path section is defined as: L0 is the length of temperature testing sample while being T0; L1 is that the chamber of burner hearth 202 is long; L2 is the distance between micro-slice laser 221 to second reference mirror 226 surfaces; L3 is the distance between micro-slice laser 211 to first reference mirror 216 surfaces; L4 is that the second reference mirror 226 left surfaces are to the distance between catoptron 227 surfaces; L5 is that catoptron 227 surfaces are to the distance between the right surface of window 206; L6 is that reference mirror 216 upper surfaces are to the distance between window 206 lower surfaces; L7 is the light path of the first measurement light in cavity 202; L8 is the light path of the second measurement light in cavity 202; S 1upside swell increment for testing sample; S 2downside swell increment for testing sample; S 3overall expansion amount for reference substance; S 3swell increment for sample table device 207 and burner hearth 201 bottoms; S l2, S l3, S l4, S l5, S l6be respectively displacement and this correspondence section gaseous environment that the thermal effect of each optical element in L2, L3, L4, L5, L6 section light path causes and vary with temperature the displacement sum causing; S l7, S l8be respectively L7, L8 section gaseous environment varies with temperature the displacement causing.
By formula (23), the overall expansion amount S that obtains testing sample is:
S = S 1 + S 2 = S 2 Ω 1 - ( S L 3 + S L 6 + S L 7 + S 3 + S 4 ) - - - ( 26 )
Due to L4+L5 ≈ L6, and they are under similar environment, S l4+ S l5≈ S l6; The thickness L0 of testing sample is less, has S l7≈ S l8; Overall expansion amount can be reduced to:
S = S 2 Ω 1 - S Ω 1 - S 2 Ω 2 + S Ω 2 - - - ( 27 )
By formula (27) substitution (11), can obtain the average coefficient of linear expansion of testing sample in this section of temperature.
In the various embodiments described above, heating furnace 17 and 20 all can adopt 1600 ℃ of vertical experiment high temperature furnaces, burner hearth 171 and 201 all adopts pyroceram fibre material, heating element adopts Si-Mo rod, temperature sensor adopts thermistor, burner hearth 171 and 201 bottom surface levels and smooth, it makes them mutually vertical for convenient first, second measurement light that regulates with the angle on testing sample surface on the one hand, can reduce the vibrations that testing sample is caused by external environment on the other hand.
In the various embodiments described above, when testing sample is the dysoxidizable material of high temperature, cavity 172 and 202 interior employing air; When testing sample is the oxidizable material of high temperature, cavity 172 and 202 interior employing nitrogen.
In above-described embodiment 2, reference mirror 186 and 156 is arranged on window 176 outsides, and the path-length error of the measurement light that can not cause the interior hot environment of burner hearth 171 compensates, when measuring accuracy is had relatively high expectations, in cavity 172, also can vacuumize, to obtain high-precision requirement.
In the various embodiments described above, sample table device 177 and 207 adopts ceramic fibre material to process, and its smooth surface makes itself and testing sample contact to reduce the vibration that external environment causes completely.
In the various embodiments described above, window grip slipper 175 and 205 all can adopt the invar material that expansion coefficient is little.
In the various embodiments described above, window 176 and 206 all can adopt two sides plating 1064nm optical wavelength anti-reflection film, quartzy window that expansion coefficient is little.Window 176 and 206 shape all can adopt wedge shape, and while being irradiated to its surface to guarantee to measure light and reference light, reflected light can not enter each micro-slice laser.
In the various embodiments described above, when testing sample is quality and small volume or while being difficult to vertical placement, during as strip sample piece carbon fibre composite, adopt carbon fiber sample clamping structure to clamp.As shown in Figure 10 (a), Figure 10 (b), this sample clamping structure comprises a base 23, base 23 high one end, one end are low, and a groove 24 extending is along its length set at the middle part of the higher one end of base 23, and one end that base 23 is high is arranged side by side two threaded holes 25 to groove 24.During use, a pad 26 is placed in groove 24, with screw 27, withstands pad 26 testing sample is fixed in groove 24.Wherein, base 23 and pad 26 all adopt high temperature resistant large density material.
The various embodiments described above are only for illustrating the present invention, and wherein the structure of each parts, connected mode etc. all can change to some extent, and every equivalents of carrying out on the basis of technical solution of the present invention and improvement, all should not get rid of outside protection scope of the present invention.

Claims (11)

1. the measuring system of a material expansion coefficient, it is characterized in that: it comprises first, second solid microchip laser feedback interferometer optical system and an electrical measurement and electric-control system, between described first, second solid microchip laser feedback interferometer optical system, a heating furnace is set; Described heating furnace comprises a burner hearth, described burner hearth inside arranges a cavity, described cavity two offsides are outwards symmetrical arranged respectively a perforation, the outer end of boring a hole described in each is fixedly installed a perforation encapsulating structure, the encapsulating structure outer end of boring a hole described in each arranges a window, in described cavity, be also provided with the sample table device that can place testing sample, in described burner hearth, be also fixedly installed heating element and temperature sensor;
Described electrical measurement and electric-control system comprise that a computing machine and a heating furnace temperature acquisition show and control system, arrange a high-temperature control module and interference system measurement module in described computing machine; The Photoelectric Signal Processing system of described the first Solid State Laser feedback interferometer optical system sends to described interference system measurement module by the first exocoel phase changing capacity with reference to feedback light and the first measurement feedback light obtaining, the Photoelectric Signal Processing system of described the second solid microchip laser feedback interferometer optical system sends to described interference system measurement module by the second exocoel phase changing capacity with reference to feedback light and the second measurement feedback light obtaining simultaneously, and described interference system measurement module calculates the overall expansion amount of testing sample according to exocoel phase changing capacity; Described high-temperature control module is shown with control system the temperature variation of described heating element is controlled by described heating furnace temperature acquisition, simultaneously described heating furnace temperature acquisition demonstration and control system are by the temperature value in burner hearth described in described temperature sensor Real-time Collection and send it to described interference system measurement module, and described interference system measurement module calculates the average coefficient of linear expansion of testing sample within the scope of different temperatures according to the temperature value in the overall expansion amount of testing sample and described burner hearth.
2. the measuring system of a kind of material expansion coefficient as claimed in claim 1, is characterized in that: described interference system measurement module to the computing formula of average coefficient of linear expansion is:
α ( T 0 ; T 1 ) = 1 L 0 × S T 1 - T 0 ,
Wherein, T0 is initial temperature, and T1 is the temperature after heating up, and L0 is the length of temperature testing sample while being T0, and S is that testing sample is warmed up to the overall expansion amount of T1 from temperature T 0.
3. the measuring system of a kind of material expansion coefficient as claimed in claim 1 or 2, it is characterized in that: described the second solid microchip laser feedback interferometer optical system comprises some optical device and Photoelectric Signal Processing system, optical element comprises the second micro-slice laser, is disposed with spectroscope, first sound-optic modulator, second sound-optic modulator, lens and reference mirror on the emitting light path of described the second micro-slice laser; The laser that described the second micro-slice laser sends is transmitted into described spectroscope, first sound-optic modulator and second sound-optic modulator successively, light through acousto-optic modulator shift frequency is measurement light, light without acousto-optic modulator shift frequency is reference light, described measurement light and reference light are transmitted into described lens simultaneously, through described lens, converge to described reference mirror; The light that described measurement light transmits through described reference mirror impinges perpendicularly on the another side of testing sample through the second window, the second perforation sealing structure and the second perforation, and the light reflecting through testing sample another side returns and enters described second micro-slice laser formation the second measurement feedback light according to former optical path; Described reference light returns and enters into described the second micro-slice laser formation second with reference to feedback light along being parallel to the light path of measuring light through the light of described reference mirror reflection; Described the second micro-slice laser is measured feedback light and second by described second and is transmitted on described spectroscope with reference to feedback light, light through described spectroscope reflection enters Photoelectric Signal Processing system, and Photoelectric Signal Processing system sends to described electrical measurement and electric-control system by second with reference to feedback light and the second exocoel phase changing capacity of measuring feedback light.
4. the measuring system of a kind of material expansion coefficient as claimed in claim 1 or 2, is characterized in that: described the first solid microchip laser feedback interferometer optical system comprises some optical elements and Photoelectric Signal Processing system, optical element includes the first micro-slice laser, is disposed with spectroscope, first sound-optic modulator, second sound-optic modulator, lens and catoptron on the emitting light path of described the first micro-slice laser, the laser that described the first micro-slice laser sends is transmitted into described spectroscope successively, first sound-optic modulator and second sound-optic modulator, light through acousto-optic modulator shift frequency is measurement light, light without acousto-optic modulator shift frequency is reference light, described measurement light and reference light are transmitted into described lens simultaneously, the measurement light of described lens outgoing is through the first window, the first perforation sealing structure and the first perforation impinge perpendicularly on a side of testing sample, light through testing sample one offside reflection returns and enters described first micro-slice laser formation the first measurement feedback light according to former optical path, the reference light of described lens outgoing is transmitted on the catoptron that is arranged on described the second window outside through described cavity and by the second perforation, the second perforation sealing structure and the second window through the first window, the first perforation sealing structure and the first perforation, through the light of described catoptron reflection, according to being parallel to the light path of measuring light, return, enter described the first micro-slice laser formation first with reference to feedback light, described the first micro-slice laser is measured feedback light and first by described first and is transmitted on described spectroscope with reference to feedback light, after described spectroscope reflection, enter described Photoelectric Signal Processing system, described Photoelectric Signal Processing system sends to described electrical measurement and electric-control system by described first with reference to feedback light and the first exocoel phase changing capacity of measuring feedback light.
5. the measuring system of a kind of material expansion coefficient as claimed in claim 1 or 2, is characterized in that: described the first solid microchip laser feedback interferometer optical system comprises some optical elements and Photoelectric Signal Processing system, optical element includes the first micro-slice laser, is disposed with spectroscope, first sound-optic modulator, second sound-optic modulator, lens and reference mirror on the emitting light path of described the first micro-slice laser, the laser that described the first micro-slice laser sends is transmitted into described spectroscope successively, first sound-optic modulator and second sound-optic modulator, light through acousto-optic modulator shift frequency is measurement light, light without acousto-optic modulator shift frequency is reference light, described measurement light and reference light converge on described reference mirror through described lens simultaneously, the light that described measurement light transmits through described reference mirror is through the first window, the first perforation sealing structure and the first perforation impinge perpendicularly on a side of testing sample, light through testing sample one offside reflection returns and enters into described first micro-slice laser formation the first measurement feedback light according to original optical path, described reference light returns according to being parallel to the light path of measuring light through the light of described reference mirror reflection, enters into described the first micro-slice laser formation first with reference to feedback light, described the first micro-slice laser is measured feedback light and first by described first and is transmitted on described spectroscope with reference to feedback light, light through described spectroscope reflection enters Photoelectric Signal Processing system, and Photoelectric Signal Processing system sends to described electrical measurement and electric-control system by first with reference to feedback light and the first exocoel phase changing capacity of measuring feedback light.
6. the measuring system of a material expansion coefficient, it is characterized in that: it comprises solid microchip laser feedback interferometer optical system and electrical measurement and an electric-control system, described solid microchip laser feedback interferometer optical system below arranges a heating furnace, described heating furnace comprises a burner hearth, one cavity is set in described burner hearth, described cavity top stretches out a perforation is set, described perforation outer end arranges a perforation sealing structure, described perforation sealing structure outer end arranges a window, in described cavity, be also provided with the sample table device that can place reference substance and testing sample, in described burner hearth, be also fixedly installed heating element and temperature sensor,
Described solid microchip laser feedback interferometer optical system comprises some optical elements and Photoelectric Signal Processing system, optical element includes micro-slice laser, is disposed with the first spectroscope on the emitting light path of described micro-slice laser, first sound-optic modulator, second sound-optic modulator, lens, the second spectroscope and catoptron, the laser that described micro-slice laser sends is transmitted into described the first spectroscope successively, first sound-optic modulator and second sound-optic modulator, light through acousto-optic modulator shift frequency is measurement light, light without acousto-optic modulator shift frequency is reference light, described measurement light and reference light are transmitted into described lens simultaneously, through described lens, converge to described the second spectroscope, described measurement light through the light of described the second spectroscope transmission through described window, perforation encapsulating structure and perforation impinge perpendicularly on the upper surface of testing sample, light through the reflection of testing sample upper surface returns and enters into described micro-slice laser formation measurement feedback light according to original optical path, described reference light is mapped to described catoptron through the illumination of described the second spectroscope reflection, through described window, perforation encapsulating structure and perforation, impinge perpendicularly on the upper surface of reference substance, the light reflecting through reference substance upper surface returns and enters into described micro-slice laser formation with reference to feedback light according to the light path that is parallel to former described measurement light, described micro-slice laser is transmitted on described the first spectroscope with reference to feedback light and measurement feedback light described, and the light reflecting through described the first spectroscope enters described Photoelectric Signal Processing system, described Photoelectric Signal Processing system sends to described electrical measurement and electric-control system by the described exocoel phase changing capacity with reference to feedback light and measurement feedback light,
Described electrical measurement and electric-control system comprise that a computing machine and a heating furnace temperature acquisition show and control system, arrange a high-temperature control module and interference system measurement module in described computing machine; The Photoelectric Signal Processing system of described Solid State Laser feedback interferometer optical system sends to described interference system measurement module by the described exocoel phase changing capacity with reference to feedback light and measurement feedback light obtaining, and described interference system measurement module calculates the overall expansion amount of testing sample according to exocoel phase changing capacity; Described high-temperature control module is shown with control system the temperature variation of described heating element is controlled by described heating furnace temperature acquisition, simultaneously described heating furnace temperature acquisition demonstration and control system are by the temperature value in burner hearth described in described temperature sensor Real-time Collection and send it to described interference system measurement module, and described interference system measurement module calculates the average coefficient of linear expansion of testing sample within the scope of different temperatures according to the temperature value in the overall expansion amount of testing sample and described burner hearth.
7. the measuring system of a kind of material expansion coefficient as claimed in claim 6, is characterized in that: described interference system measurement module to the computing formula of average coefficient of linear expansion is:
α ( T 0 ; T 1 ) = 1 L 0 × S T 1 - T 0 ,
Wherein, T0 is initial temperature, and T1 is the temperature after heating up, and L0 is the length of temperature testing sample while being T0, and S is that testing sample is warmed up to the overall expansion amount of T1 from temperature T 0.
8. the measuring system of a material expansion coefficient, it is characterized in that: it comprises first, second solid microchip laser feedback interferometer optical system and an electrical measurement and electric-control system, the below of described the first solid microchip laser feedback interferometer optical system, a side of described the second solid microchip laser feedback interferometer optical system arranges a heating furnace; Described heating furnace comprises a burner hearth, one cavity is set in described burner hearth, described cavity top stretches out a perforation is set, described perforation outer end arranges a perforation sealing structure, described perforation sealing structure outer end arranges a window, is also provided with the sample table device that can place reference substance and testing sample in described cavity; In described burner hearth, be also fixedly installed heating element and temperature sensor;
Described electrical measurement and electric-control system comprise that a computing machine and a heating furnace temperature acquisition show and control system, arrange a high-temperature control module and interference system measurement module in described computing machine; The Photoelectric Signal Processing system of described the first Solid State Laser feedback interferometer optical system sends to described interference system measurement module by the first exocoel phase changing capacity with reference to feedback light and the first measurement feedback light obtaining, the Photoelectric Signal Processing system of described the second solid microchip laser feedback interferometer optical system sends to described interference system measurement module by the second exocoel phase changing capacity with reference to feedback light and the second measurement feedback light obtaining simultaneously, and described interference system measurement module calculates the overall expansion amount of testing sample according to exocoel phase changing capacity; Described high-temperature control module is shown with control system the temperature variation of described heating element is controlled by described heating furnace temperature acquisition, simultaneously described heating furnace temperature acquisition demonstration and control system are by the temperature value in burner hearth described in described temperature sensor Real-time Collection and send it to described interference system measurement module, and described interference system measurement module calculates the average coefficient of linear expansion of testing sample within the scope of different temperatures according to the temperature value in the overall expansion amount of testing sample and described burner hearth.
9. the measuring system of a kind of material expansion coefficient as claimed in claim 8, is characterized in that: described interference system measurement module to the computing formula of average coefficient of linear expansion is:
α ( T 0 ; T 1 ) = 1 L 0 × S T 1 - T 0 ,
Wherein, T0 is initial temperature, and T1 is the temperature after heating up, and L0 is the length of temperature testing sample while being T0, and S is that testing sample is warmed up to the overall expansion amount of T1 from temperature T 0.
10. a kind of measuring system of material expansion coefficient as claimed in claim 8 or 9, is characterized in that: described the first solid microchip laser feedback interferometer optical system comprises some optical elements and Photoelectric Signal Processing system, optical element comprises the first micro-slice laser, on the emitting light path of described the first micro-slice laser, is disposed with spectroscope, first sound-optic modulator, second sound-optic modulator, lens and the first reference mirror, the laser that described the first micro-slice laser sends is transmitted into described spectroscope successively, first sound-optic modulator and second sound-optic modulator, light through acousto-optic modulator shift frequency is measurement light, light without acousto-optic modulator shift frequency is reference light, described measurement light and reference light converge on described the first reference mirror through described lens simultaneously, described measurement light through the light of the first reference mirror transmission through described window, perforation sealing structure and perforation impinge perpendicularly on the upper surface of testing sample, light through the reflection of testing sample upper surface returns and enters into described first micro-slice laser formation the first measurement feedback light according to original optical path, described reference light returns and enters into described the first micro-slice laser formation first with reference to feedback light according to the light path that is parallel to former measurement light through the light of described the first reference mirror reflection, described the first micro-slice laser is measured feedback light by first with reference to feedback light and first and is transmitted on described spectroscope, and the light reflecting through described spectroscope enters described Photoelectric Signal Processing system, described Photoelectric Signal Processing system outputs to described electrical measurement and electric-control system by the described first exocoel phase changing capacity with reference to feedback light and the first measurement feedback light obtaining.
11. a kind of measuring systems of material expansion coefficient as claimed in claim 8 or 9, is characterized in that: described the second solid microchip laser feedback interferometer optical system comprises some optical elements and Photoelectric Signal Processing system, optical element includes the second micro-slice laser, on the emitting light path of described the second micro-slice laser, is disposed with spectroscope, first sound-optic modulator, second sound-optic modulator, lens, the second reference mirror and catoptron, the laser that described the second micro-slice laser sends is transmitted into described spectroscope successively, first sound-optic modulator and second sound-optic modulator, light through acousto-optic modulator shift frequency is measurement light, light without acousto-optic modulator shift frequency is reference light, described measurement light and reference light converge to described the second reference mirror through described lens simultaneously, described measurement light is mapped on described catoptron through the illumination of described the second reference mirror transmission, the light reflecting through described catoptron is through described window, perforation sealing structure and perforation impinge perpendicularly on the upper surface of reference substance, light through the reflection of reference substance upper surface returns and enters into described second micro-slice laser formation the second measurement feedback light according to original optical path, described reference light returns and enters into described the second micro-slice laser formation second with reference to feedback light according to the light path that is parallel to former described measurement light through the light of described the second reference mirror reflection, described the second micro-slice laser is measured feedback light by described second with reference to feedback light and second and is transmitted on described spectroscope, after described spectroscope reflection, enter described Photoelectric Signal Processing system, described Photoelectric Signal Processing system sends to electrical measurement and electric-control system by the described second exocoel phase changing capacity with reference to feedback light and the second measurement feedback light obtaining.
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CN106918619A (en) * 2017-03-28 2017-07-04 哈尔滨工业大学 A kind of solid material linear expansion coefficient test device
CN107655931A (en) * 2017-08-09 2018-02-02 北京空间机电研究所 A kind of high-precision cylinder linear expansion coefficient measurement apparatus and method
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CN109115826A (en) * 2018-08-24 2019-01-01 合肥工业大学 A kind of expansion indicator and application method
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CN109470735A (en) * 2018-12-05 2019-03-15 中国科学院长春光学精密机械与物理研究所 Rod piece thermal expansion coefficient measuring device and its measurement method
CN109470735B (en) * 2018-12-05 2020-06-12 中国科学院长春光学精密机械与物理研究所 Rod piece thermal expansion coefficient measuring device and measuring method thereof
CN109827735A (en) * 2019-04-02 2019-05-31 湘潭大学 A kind of high-temperature vibrating analog machine
CN111189876A (en) * 2020-01-17 2020-05-22 中国科学院长春光学精密机械与物理研究所 Non-contact large-size rod piece thermal expansion coefficient measuring equipment and method thereof
RU2735489C1 (en) * 2020-04-03 2020-11-03 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт метрологии им. Д.И. Менделеева" Method of scanning dilatometry and dilatometer for its implementation
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