CN104183545B - Method for manufacturing wire frame body and wire frame body - Google Patents
Method for manufacturing wire frame body and wire frame body Download PDFInfo
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- CN104183545B CN104183545B CN201410332290.XA CN201410332290A CN104183545B CN 104183545 B CN104183545 B CN 104183545B CN 201410332290 A CN201410332290 A CN 201410332290A CN 104183545 B CN104183545 B CN 104183545B
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- wire
- demarcation strip
- winding displacement
- lath
- lead frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
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Abstract
The invention discloses a wire frame body and a manufacturing method thereof. The method include the following key steps: preparing a bottom wire arrangement frame, a top fixing frame, separation plates and wires; carrying out a plate laying step: laying the separation plates at the two ends of the bottom wire arrangement frame; carrying out a wire arrangement step: arraying a layer of unidirectional wires on the separation plates according to a set interval; repeating the plate laying step and the wire arrangement step so that unidirectional wires of a set number of layers are manufactured; installing the top fixing frame so as to fix a wire pattern array manufactured through the plate laying step and the wire arrangement step in the two frames and thus the wire frame body is manufactured. The wire frame body can be used for further manufacturing a wire base material aggregate and a substrate which includes a conductive through hole.
Description
Technical field
This invention relates generally to IC semiconductor encapsulation technology, particularly manufactures the base comprising conductive through hole
The method of plate.Circuit and pad are made by the upper and lower surface in the substrate comprising conductive through hole, can be described comprising conduction
The substrate of through hole is further fabricated to the circuit substrate for IC semiconductor encapsulation.
Background technology
There is (the TSV of through hole:Through Silicon Via,TSV:Through Substrate Via and TGV:
Through Glass Via) silicon, glass, ceramic or organic material substrate has wide in IC semiconductor encapsulation technology
General application, is the key element in the encapsulation of 3D and 2.5D IC semiconductors.Based on electricity made by the substrate containing through hole
Base board is generally used in 3D and 2.5D IC semiconductor encapsulation technologies, is the element for integrating electronic product function.Contain
The substrate of through hole includes the silicon substrate containing through hole, glass substrate, ceramic substrate and organic material substrate.At present, what is used contains
The manufacture method for having the substrate of through hole can be divided into two classes：One class is that, based on the method for substrate, another kind of is based on the side of through hole
Method.Consisted essentially of based on the method for substrate：1) hole needed for first opening some on substrate, 2) and then with conductive material fills this
Some holes, so as to form a substrate containing conductive through hole.Consisted essentially of based on the method for through hole：1) first on a carrier
The little metal column of some point-like is made, 2) and then with a baseplate material the little metal column of these point-like is covered, then removes described
Carrier and upper and lower surface of polishing to expose the little metal column of point-like, so as to form a substrate containing conductive through hole.At present,
The use of the substrate containing through hole is that the substrate containing through hole is further made by being made in the circuit and pad of substrate surface
Be made the circuit substrate containing through hole, so as in encapsulating in IC semiconductor positioned at upper surface of base plate electronic component with
Other electron component or printed circuit board (PCB) below substrate is connected, and can also make positioned at the circuit of upper surface of base plate disposed thereon
Electronic component first directly communicated, be then connected with other electron component or circuit board below substrate again.
The essential characteristic of the substrate containing through hole in the prior art includes：1) upper and lower surface of substrate be it is smooth with
Just circuit and pad are further made thereon；2) through hole is a kind of conductive metal pillar, is embedded in a substrate and according to institute
The arrangement of the spacing formation rule for needing, 3) matrix material of substrate be used as to keep through hole and thereon further making circuit and weldering
A kind of carrier of disk.It should be noted that these substrates containing conductive through hole of the prior art have in manufacture and use
There is limitations.Due to its manufacturing process, some limitation include：1) its manufacture be it is very time-consuming and expensive, 2) wherein
Described metal pillar or through hole do not include insulating outer layer, 3) by then passing through etching, mechanical drill or laser beam drilling, through hole
Side is not that the diameter of very smooth 4) through hole can not be very little, and prior art manufacture through hole is less than 10 microns, and more than certain
The substrate of thickness (such as more than 100 microns) is very expensive, and 5) spacing of through hole can not be very little, (if prior art is 100
Manufacture on the substrate of micron above thickness is difficult and costliness less than the through hole of 50 micron pitch, 6) substrate containing through hole
Thickness is limited by clear size of opening and spacing, and through-hole spacing is less, and substrate must be thinner.
The content of the invention
Chinese invention patent application CN201310651705.5 that the applicant submitted on December 5th, 2013 discloses one
Plant and metal wire conglomerate is manufactured based on metal line pattern array, and further manufacture the side of the substrate containing graphic array through hole
Method.The method includes following committed step：Make a metal line pattern array；Between metal wire and around space make
Solid dielectric matrix, so as to form a metal wire conglomerate comprising metal line pattern array；The metal wire conglomerate
Segmentation is in blocks, so as to form multiple substrates containing graphic array through hole.The key of methods described is accurately to make a gold
Category line graph array simultaneously guarantees that metal wire therein does not bend and move in the technique of follow-up making metal wire conglomerate
Position.The present invention further discloses a kind of method of manufacture lead frame support body, and it can accurately make wire pattern array and guarantee
Metal wire therein is not susceptible to bend and shifts in the technique of follow-up making wire conglomerate.Described lead frame
Body, including：Bottom winding displacement framework, top fixed frame, demarcation strip and wire；Characterized in that, described bottom winding displacement framework
It is I-shaped structure with top fixed frame, it includes end lath and midfoot support post；Described demarcation strip is with the side of lamination
Formula is laid on the lath of end, and it is used for clamping and fixing wire and set spacing of the wire in stack direction, described wire
Uniaxially it is laid on demarcation strip by the spacing of setting in the way of lamination, by adjacent separation board clamping and is consolidated per layer conductor
It is fixed.
The method of the manufacture lead frame support body of the present invention, including following committed step：A) bottom winding displacement framework, top are prepared
Fixed frame, demarcation strip and wire；B) demarcation strip is laid at the two ends of bottom winding displacement framework；C) by between setting on demarcation strip
Away from one layer of unidirectional conductor of laying；D) repeating said steps b) and c), so as to make the unidirectional conductor of the setting number of plies；E) top is installed
Fixed frame, the wire pattern array of its unidirectional array by bed board step and made by winding displacement step is fixed via demarcation strip
In two described frameworks, so as to make the lead frame support body of a wire pattern array comprising unidirectional array.
The method of the manufacture lead frame support body of the present invention, it is characterised in that described bottom winding displacement framework and top is fixed
Framework is I-shaped structure, and it is made up of end lath and midfoot support post；Midfoot support post therein is by one, two or many
Individual column composition.The manufacture method, it is characterised in that described demarcation strip is laid on end lath in the way of lamination
On, and conductor separation layered structure, wherein wire is set in the spacing of stack direction by the thickness of demarcation strip.The manufacture
Method, it is characterised in that vertical guide post is contained at the two ends of the end lath of described bottom winding displacement framework, vertical guide post
Contain screw thread in end；Through hole is contained at the two ends of described demarcation strip, and it is enclosed within described vertical guide post, so as to avoid separating
Movement of the plate on the lath of end；Through hole is contained at the two ends of the end lath of described top fixed frame, and it is enclosed within described
On vertical guide post, and clamped by the screw thread and nut structure of vertical guide column end and fixed and be laid on bottom winding displacement framework
And the demarcation strip and conductor layer between the fixed frame of top.The manufacture method, it is characterised in that in described step c)
Each wire is welded on demarcation strip, such as two ends is made by welding wire device and is welded on demarcation strip and unidirectionally arranges by setting spacing
The wire of row.The manufacture method, it is characterised in that in the step c), via a polygon comprising frame mounting
Runner is laid on wire on each layer of demarcation strip of the frame mounting by way of winding wire.It is described via one
The method that polygonal runner lays wire by way of winding, it is characterised in that round and round winding is led on runner
Line and during making a layer conductor, the phase that the spacing between a circle wire and next circle wire passes through wire front end and runner
Mutually move to set；The spacing that described one is enclosed between wire and next circle wire needs not to be identical.The manufacture lead frame
The method of support body, includes a frame mounting, so as in each of the runner on each face of described polygon runner
A lead frame support body is made on individual face.The manufacture method of the lead frame support body, it is characterised in that after step e), it enters
One step is included：Step f) is solidificated in a matrix material the lead frame support body of the described wire pattern array containing unidirectional array
It is so as to make a wire base material conglomerate and further that described wire base material conglomerate segmentation is in blocks in material, so as to make
Contain the substrate of conductive through hole into multi-disc.
The frame mounting adopted in the method for the manufacture lead frame support body of the present invention, including：Bottom winding displacement framework, top are solid
Determine framework and demarcation strip；Characterized in that, described bottom winding displacement framework and top fixed frame are I-shaped structures, it includes
End lath and midfoot support post；Described demarcation strip is laid on the lath of end in the way of lamination, and it is used for clamping wire
And set spacing of the wire in stack direction.Described frame mounting, it is characterised in that the end of described bottom winding displacement framework
Vertical guide post is contained at the two ends of lath, and screw thread is contained in its end；Through hole is contained at the two ends of described demarcation strip, and it is enclosed within described
Vertical guide post on, so as to avoid movement of the demarcation strip on the lath of end；The end lath of described top fixed frame
Two ends contain through hole, it is enclosed within described vertical guide post, and the screw thread and nut structure for passing through vertical guide column end
Clamp and fix the demarcation strip and conductor layer being laid between bottom winding displacement framework and top fixed frame.
The rotary wheel device adopted in the method for the manufacture lead frame support body of the present invention, including：Polygon wheel members and frame
Frame member, it is characterised in that a set of framing component, described framing component bag are set on each face of polygon wheel members
The framework of winding displacement containing bottom, top fixed frame and demarcation strip；Winding displacement framework in bottom therein and top fixed frame are I shapes
Structure, it includes end lath and midfoot support post；Described demarcation strip is laid on the lath of end in the way of lamination, its use
To clamp wire and set spacing of the wire in stack direction.Described runner frame mounting, it is characterised in that described framework
Vertical guide post is contained at the two ends of the end lath of the bottom winding displacement framework that component is included, and screw thread is contained in its end；Described frame
Through hole is contained at the two ends of the demarcation strip that frame member is included, and it is enclosed within described vertical guide post, so as to avoid demarcation strip in institute
Movement on the frame end portion lath of the bottom winding displacement frame stated；The end lath of the top fixed frame that described framing component is included
Two ends contain through hole, it is enclosed within described vertical guide post, and the screw thread and nut structure for passing through vertical guide column end
Clamp and fix the demarcation strip and conductor layer being laid between bottom winding displacement framework and top fixed frame.
The lead frame support body of the present invention, including：Bottom winding displacement framework, top fixed frame, demarcation strip and wire；Its feature
It is that described bottom winding displacement framework and top fixed frame is I-shaped structure, and it includes end lath and midfoot support post；
Described demarcation strip is laid on the lath of end in the way of lamination, and it is used for clamping and fixing wire and set wire in lamination
The spacing in direction, described wire is uniaxially laid on demarcation strip in the way of lamination by the spacing of setting, per layer conductor by
Adjacent separation board clamping is simultaneously fixed.Described lead frame support body, it is characterised in that the end panel of described bottom winding displacement framework
Vertical guide post is contained at the two ends of bar, and screw thread is contained in its end；Through hole is contained at the two ends of described demarcation strip, and it is enclosed within described
On vertical guide post, so as to avoid movement of the demarcation strip on the frame end portion lath of described bottom winding displacement frame；Described top
Through hole is contained at the two ends of the end lath of fixed frame, and it is enclosed within described vertical guide post, and by vertical guide styletable
The screw thread and nut structure in portion clamps and fixes the demarcation strip that is laid between bottom winding displacement framework and top fixed frame and lead
Line layer.
In the present invention, crucial inventive concept is that the wire of unidirectional array is made and fixed by a frame mounting,
It includes welding the wire of unidirectional array on the direct demarcation strip in frame mounting, or described frame mounting is arranged on one
On individual polygon runner, a rotary wheel device is formed, unidirectional conductor is produced in each framework by the rotation of runner.This
The advantage of invention includes：1) unidirectional conductor by setting spacing arrangement can accurately and be quickly manufactured；2) frame mounting described in
It is wire tensioning and fixed so as to be not susceptible to bend and shift in the technique of follow-up making wire conglomerate.The present invention
In the inventive concepts of some other advantages, feature and correlation can illustrate being embodied as in of the invention with reference to figure below
Described in detail in mode.
Description of the drawings
Hereinafter the present invention will be described in more detail based on embodiment and refer to the attached drawing.
Fig. 1 is the bottom winding displacement framework in one embodiment of the invention and the schematic diagram for laying demarcation strip thereon；
Figure 1A is the schematic diagram of bed board step and winding displacement step in one embodiment of the invention；
The schematic diagram of Figure 1B lead frame support bodys made by one embodiment of the invention, including front view and side view,
Fig. 1 C are the cross-sectional view of the top view of the lead frame support body and the unidirectional array wire being fixed therein；
Fig. 2 is the schematic diagram of the bottom winding displacement framework that vertical guide post is contained at two ends in one embodiment of the invention, including
Front view and side view；
Fig. 2A is via the clamping of vertical guide post and the schematic diagram of fixed lead frame support body in one embodiment of the invention.
Fig. 3 be one embodiment of the invention in by wire is welded on demarcation strip make one layer by setting spacing arrangement
Unidirectional conductor schematic diagram；
Fig. 4 is via a polygonal runner wire to be laid on by way of winding in one embodiment of the invention
Schematic diagram on described demarcation strip；
Fig. 4 A are the schematic diagram in one embodiment of the invention via lead frame support body made by a polygonal runner,
Fig. 4 B illustrate the front view of the lead frame support body on each face of polygon runner；
Fig. 5 is that the lead frame support body made by is solidificated in a matrix material, so as to make in one embodiment of the invention
Into the schematic diagram of a wire base material conglomerate；
Fig. 6 is to split in flakes wire base material conglomerate made by lead frame body is passed through in one embodiment of the invention,
So as to make the schematic diagram of the substrate containing conductive through hole.
In the accompanying drawings, identical part uses identical reference.Accompanying drawing is not according to actual ratio.
Specific embodiment
, by referring to the specific embodiment of the description of the drawings present invention, the term that some are used is explained first for clearly
It is as follows：1) unidirectional conductor, it represents a branch of wire along a direction arrangement；2) wire pattern array, it represents a branch of list
To the arranged distribution of wire that the cross section of the wire of arrangement presents, it can be square, rectangle, triangle or other
Distribution pattern；3) lead frame support body, it represents a framework of the wire pattern array comprising unidirectional array, and wherein wire is consolidated
Among being scheduled on described framework；4) wire base material conglomerate, it represents a column base material comprising unidirectional conductor, list therein
Guiding line is by setting spacing arrangement；5) substrate, it represents a flaky material, such as a piece of ceramics, a sheet glass, a wafer,
Or a piece of polymeric material；6) conductive through hole, its represent it is embedding in a substrate and through substrate thickness direction conductive channel, such as post
Shape metal；7) substrate containing conductive through hole, conduction of its representative containing arranging by setting spacing or by pattern distribution is set is led to
The substrate in hole；8) circuit substrate containing conductive through hole, it represents and further makes containing for circuit and pad in upper and lower surface
There is the substrate of conductive through hole.It should be noted that the term of the above explains solely for the purpose of illustration, and the present invention is not limited
Scope and spirit.
Fig. 1, Figure 1A, Figure 1B and Fig. 1 C is the schematic diagram of the method that lead frame support body is manufactured in one embodiment of the invention.
1,100 one bottom winding displacement framework of signal in Fig. 1, it is an I-shaped structure, the end represented by numerical chracter 101 and 102
The midfoot support post composition that portion's lath and numerical chracter 103 and 104 are represented, midfoot support post therein can be one or more
Cylinder；1,200 one bed board step of signal in Fig. 1：It represents and is set point on the end lath upper berth of described bottom winding displacement framework
Dividing plate 121 and 122；1,300 one winding displacement step of signal in Figure 1A：It is represented on described demarcation strip by the spacing of setting
One layer of unidirectional conductor 131 of laying；The next bed board step of 1400 signals in Figure 1A：It is represented again in described end lath
The top laying demarcation strip 141 and 142 of position and the just unidirectional conductor of laying；Repeat described winding displacement step and bed board step,
Unidirectional conductor until making the setting number of plies；Finally, as shown in Figure 1B, in the demarcation strip and the top peace of conductor layer of refracting films
Dress top fixed frame, its middle part represented by the end lath sum character number 153 and 154 that numerical chracter 151 and 152 is represented
Support column is constituted.Described top fixed frame is together with described bottom winding displacement framework by bed board step and winding displacement step system
Into the wire pattern array of unidirectional array be fixed among two described frameworks via demarcation strip, include so as to make one
The lead frame support body of the wire pattern array of unidirectional array, as shown in Figure 1B, wherein 1500 and 1510 illustrate respectively described leading
The front view and side view of wire frame support body；The top view of the lead frame support body described in 1520 signals in Fig. 1 C, in Fig. 1 C
1501 illustrate the cross section from A to A in the lead frame support body 1500 in Figure 1B, and it shows a square wire pattern array
171。
It should be noted that the cross section of 1501 signals in Fig. 1 C is in addition to described square wire pattern array 171,
Also contains the cross section 103,104,153 and 154 of midfoot support post；The effect of midfoot support post is drawn in lead frame support body
The wire pattern array of tight unidirectional array so as to be not susceptible to bend and move in the technique of follow-up making wire conglomerate
Position.In addition, it is necessary to explanation, the square arrangement of the wire of 1501 presentations in Fig. 1 C is only the wire figure that the present invention can make
The schematic example of of shape array, due to setting on demand in winding displacement step per the spacing between two wires,
The thickness of demarcation strip can successively be set in bed board step on demand, between conductor layer and conductor layer may not necessarily consistency from top to bottom, and
Can be formed staggeredly, so the present invention can make the wire pattern array of various arranged distributions, such as square, rectangle, triangle
Deng.
Fig. 2 and Fig. 2A illustrates a spy of the frame mounting of the method and its employing of the manufacture lead frame support body of the present invention
Levy, 2000 in wherein Fig. 2 illustrate that the front view and side view of a bottom winding displacement framework and a demarcation strip, its signal
Contain vertical guide post 201,202,203 and 204 at the two ends of the end lath 101 and 102 of described bottom winding displacement framework, hang down
Contain screw thread in the end of straight guide post；Through hole 207 is contained at the two ends of described demarcation strip 206, and it can be enclosed within and described vertically draw
On guide pillar, so as to avoid movement of the demarcation strip on the lath of end, numerical chracter 103 and 104 from illustrating described bottom winding displacement frame
The midfoot support post of frame；In Fig. 2A 2100 illustrate that the front view of a top fixed frame and lead frame support body
Side view, numerical chracter 153 and 154 illustrates the midfoot support post of described top fixed frame, described top fixed frame
The two ends of end lath 151 and 152 contain through hole 211,212,213 and 214, it can be enclosed within described vertical guide post,
And the screw thread by vertical guide column end and nut structure 221/223 and 222/224 are clamped and fixation is laid on bottom winding displacement
Demarcation strip 270 and conductor layer 271 between framework and top fixed frame.
Fig. 3 illustrates a feature of the method for the manufacture lead frame support body of the present invention, numerical chracter therein 3000 to illustrate
The method of the laying wire in winding displacement step described in the method for the manufacture lead frame support body of the present invention is each wire
300 are welded on demarcation strip, and 301 and 302 represent pad of the wire 300 on demarcation strip, and numerical chracter 3100 illustrates welding
The layer conductor 310 by setting spacing unidirectional array on demarcation strip.Welding wire device be in semiconductor bonding wire encapsulation technology
Have instrument, its can between two pads of setting rapidly welding lead, therefore, it can by existing welding wire device or its change
Enter type making two ends to be welded on demarcation strip and by the wire of setting spacing unidirectional array.
Fig. 4 illustrates another feature of the method for the manufacture lead frame support body of the present invention, numerical chracter therein 4000 to show
The method of the laying wire being intended in the winding displacement step described in the method for the manufacture lead frame support body of the present invention is via one
Polygon runner comprising frame mounting is laid on wire on the demarcation strip of frame mounting by way of winding wire, wherein
Numerical chracter 400 and arrow represent the runner of a quadrangle, numerical chracter 450 represents a loop, and it provides winding
What the wire on runner, numerical chracter 451 and arrow were indicated is the contact point of the wire in loop 450 and runner, here
Referred to as wire front end, numerical chracter 401 represents the bottom winding displacement framework on each face of the quadrangle runner, and 402
The demarcation strip that sets on the end lath upper berth of each bottom winding displacement framework of representative, 403 are represented and are wrapped in point by the rotation of runner
A layer conductor on dividing plate 402,404 representatives re-lay demarcation strip 404 above the position of end lath and conductor layer 402,
Then again by the next layer conductor of rotation winding of runner, then the conductor layer until making the setting number of plies installs top fixed
Framework, so as to make a lead frame support body on each face of runner.It should be noted that the illustrated embodiment in Fig. 4 is one
The runner of quadrangle, it can also be a hexagon or other polygon runners.In addition, it is necessary to explanation, in runner
On around complete one circle wire after, prepare winding it is next circle wire when, numerical chracter 451 illustrate wire front end and runner between have one
Individual setting is mutually shifted, so as to next circle wire and upper one circle wire have the spacing of a setting, and, between this setting
Away from identical is needed not to be, such as some spacing are 200 microns, and other spacing are 100 microns.So, under winding round and round
Go, the laying until completing a layer conductor；Then, after demarcation strip has been laid, then the laying of next layer conductor is accomplished analogously,
Laying until completing to set number of plies wire；The last fixed frame at the top of the end installation of conductor layer, so as in the every of runner
A lead frame support body is made on one face.Fig. 4 A and Fig. 4 B illustrates via wire made by the runner winding displacement step shown in Fig. 4
Frame body, wherein 4100 represent on each face of runner comprising a He of so-formed lead frame support body 411,412,413
414,4110 top views for representing the lead frame support body 411 pulled down from the runner, each lead frame support body can quilt
In being further solidificated in a matrix material, so as to make a wire base material conglomerate.
Fig. 5 illustrates the making step that the method for the manufacture lead frame support body of the present invention is further included, digit therein
Numbers 5000 represent a lead frame support body 411 are solidificated in a matrix material 500, integrated so as to make a wire base material
Body, numerical chracter 5100 is represented to be split a wire base material conglomerate in flakes, so as to make multi-disc along the section from C to C
Substrate containing conductive through hole.
Fig. 6 illustrates the cross-sectional view of a wire base material conglomerate or a piece of substrate containing conductive through hole, and it illustrates bag
Matrix material 500 containing a lead frame support body 411 can be a square cylinder, rectangle cylinder 601 or circular cylinder
602, numerical chracter 603 represents the middle part of the frame structure in being included in wire base material conglomerate or the substrate containing conductive through hole
The cross section of support column, numerical chracter 605 represents the example of a wire pattern array, and it represents a wire base material conglomerate
In include multiple unidirectional conductor units, the substrate containing conductive through hole that it is further divided into is accordingly comprising multiple conductive logical
Hole unit, makes after circuit and pad thereon, and it can be further divided into multiple electricity containing conductive through hole along between unit
Roadbed Slab element, each described circuit board unit containing conductive through hole will be applied to an IC semiconductor encapsulation
In.
Following public is the example according to some specific applications of the embodiment.
First example be：Wire is less than 100 microns using diameter, and preferably less than 30 microns of fine copper wire makes frame
The material of rack device adopts identical copper material, and the spacing of wire is set smaller than about 500 microns, preferably less than about 200 microns,
It is organic material that lead frame support body is solidificated in matrix material therein, such as polymeric material, made by wire base material conglomerate
It is a diameter of 100 millimeters, 200 millimeters or 300 millimeters, length is greater than about 0.5 meter, preferably more than about 1 meter of cylinder, or
Made by wire base material conglomerate be that width is greater than about 0.5 meter, length is greater than about 0.5 meter, preferably more than about 1 meter of square column
Body or rectangle cylinder, described wire base material conglomerate can be further divided into the organic material substrate containing conductive through hole.
Second example be：Wire is less than 100 microns using diameter, preferably less than 30 microns, and arrives with about 5
The fine copper wire of the top ceramic layer of 20 microns of thickness, the material for making frame mounting adopts identical copper material, the spacing of wire to be set as
Less than about 500 microns, preferably less than about 200 microns, it is that fusing point is less than that lead frame support body is solidificated in matrix material therein
The aluminum or aluminum alloy of the fine copper wire, made by wire base material conglomerate be a diameter of 100 millimeters, 200 millimeters or 300 millimeters,
Length is greater than about 0.5 meter, preferably more than about 1 meter of cylinder, or made by wire base material conglomerate be that width is greater than about
0.5 meter, length is greater than about 0.5 meter, preferably more than about 1 meter of square cylinder or rectangle cylinder, described wire base material collection
Adult can be further divided into the aluminium base containing conductive through hole.
3rd example be：Wire is less than 100 microns using diameter, and preferably less than 30 microns of tungsten wire makes framework
The material of device adopts identical tungsten material, and the spacing of wire is set smaller than about 200 microns, preferably less than about 100 microns,
It is glass that lead frame support body is solidificated in matrix material therein, ceramics or silicon materials, made by wire base material conglomerate be diameter
For 100 millimeters, 200 millimeters or 300 millimeters, length is greater than about 0.5 meter, preferably more than about 1 meter of cylinder, or made by
Wire base material conglomerate is that width is greater than about 0.5 meter, and length is greater than about 0.5 meter, preferably more than about 1 meter of square cylinder or length
Square cylinder.Described wire base material conglomerate can be further divided into the glass substrate containing conductive through hole, ceramic substrate or
Silicon substrate.
It should be noted that, and not above by reference to embodiment and the description of the drawings description of this invention by way of example only
It is to limit the spirit and scope of the present invention, skilled person works as can accordingly modify and obtain Equivalent embodiments.
Claims (15)
1. a kind of method of manufacture lead frame support body, the method includes：
Step a) prepares bottom winding displacement framework, top fixed frame, demarcation strip and wire；
Step b) lays demarcation strip at the two ends of bottom winding displacement framework；
Step c) lays one layer of unidirectional conductor on demarcation strip by the spacing of setting；
Step d) repeating said steps b) and c), so as to make the unidirectional conductor of the setting number of plies；
Step e) installs top fixed frame, and it is by step b), the wire pattern array of unidirectional array made by c) and d)
It is fixed among the bottom winding displacement framework and top fixed frame via demarcation strip, so as to make one unidirectional array is included
The lead frame support body of wire pattern array.
2. the method for manufacture lead frame support body as claimed in claim 1, it is characterised in that described bottom winding displacement framework and top
Portion's fixed frame is I-shaped structure, and it is made up of end lath and midfoot support post；Midfoot support post therein by one or
Multiple column compositions.
3. the method for manufacturing lead frame support body as claimed in claim 1, it is characterised in that described demarcation strip is with the side of lamination
Formula is laid on the lath of end, and conductor separation layered structure, wherein wire in the spacing of stack direction by demarcation strip
Thickness sets.
4. the method for manufacturing lead frame support body as claimed in claim 1, it is characterised in that the end of described bottom winding displacement framework
Vertical guide post is contained at the two ends of portion's lath, and screw thread is contained in the end of vertical guide post；Contain logical in the two ends of described demarcation strip
Hole, it is enclosed within described vertical guide post, so as to avoid movement of the demarcation strip on the lath of end；Described top fixed frame
Through hole is contained at the two ends of the end lath of frame, and it is enclosed within described vertical guide post, and by the spiral shell of vertical guide column end
Line and nut structure clamp and fix the demarcation strip and conductor layer that are laid between bottom winding displacement framework and top fixed frame.
5. the method for manufacturing lead frame support body as claimed in claim 1, it is characterised in that per root in described step c)
Wire is welded on demarcation strip.
6. the method for manufacturing lead frame support body as claimed in claim 1, it is characterised in that in the step c), via
The individual polygon runner comprising frame mounting is laid on wire by way of winding wire on each layer of the frame mounting
On demarcation strip.
7. the method for manufacturing lead frame support body as claimed in claim 6, it is characterised in that wind round and round on runner
Wire and during making a layer conductor, the spacing between a circle wire and next circle wire is by wire front end and runner
It is mutually shifted to set；The spacing that described one is enclosed between wire and next circle wire is not identical.
8. the method for manufacture lead frame support body as claimed in claim 6, it is characterised in that described polygon runner it is each
A frame mounting is included on individual face, so as to make a lead frame support body on each face of the runner.
9. the method for manufacturing lead frame support body as claimed in claim 6, it is characterised in that：The polygon runner includes polygon
Shape wheel members and framing component, arrange a set of framing component, described framework structure on each face of polygon wheel members
Part includes bottom winding displacement framework, top fixed frame and demarcation strip；Winding displacement framework in bottom therein and top fixed frame are works
Font structure, it includes end lath and midfoot support post；Described demarcation strip is laid on the lath of end in the way of lamination,
It is used for clamping wire and sets spacing of the wire in stack direction.
10. the method for manufacturing lead frame support body as claimed in claim 9, it is characterised in that what described framing component was included
Vertical guide post is contained at the two ends of the end lath of bottom winding displacement framework, and screw thread is contained in its end；Described framing component is included
The two ends of demarcation strip contain through hole, it is enclosed within described vertical guide post, so as to avoid demarcation strip from arranging in described bottom
Movement on the end lath of wire frame；Contain at the two ends of the end lath of the top fixed frame that described framing component is included
Through hole, it is enclosed within described vertical guide post, and is clamped and fixed by the screw thread and nut structure of vertical guide column end
The demarcation strip and conductor layer being laid between bottom winding displacement framework and top fixed frame.
The method of 11. manufacture lead frame support bodys as claimed in claim 1, it is characterised in that after step e), its further bag
Contain：Step f) is solidificated in the lead frame support body of the described wire pattern array containing unidirectional array in one matrix material,
It is so as to make a wire base material conglomerate and further that described wire base material conglomerate segmentation is in blocks, it is many so as to make
Piece contains the substrate of conductive through hole.
A kind of 12. frame mountings adopted in the method for manufacture lead frame support body as claimed in claim 1, including：Bottom
Winding displacement framework, top fixed frame and demarcation strip；Characterized in that, described bottom winding displacement framework and top fixed frame are works
Font structure, it includes end lath and midfoot support post；Described demarcation strip is laid on the lath of end in the way of lamination,
It is used for clamping wire and sets spacing of the wire in stack direction.
13. frame mountings as claimed in claim 12, it is characterised in that the two of the end lath of described bottom winding displacement framework
Vertical guide post is contained at end, and screw thread is contained in its end；Through hole is contained at the two ends of described demarcation strip, and it is enclosed within and described vertically draws
On guide pillar, so as to avoid movement of the demarcation strip on the lath of end；The two ends of the end lath of described top fixed frame contain
There is through hole, it is enclosed within described vertical guide post, and is clamped and consolidated by the screw thread and nut structure of vertical guide column end
Surely the demarcation strip and conductor layer being laid between bottom winding displacement framework and top fixed frame.
A kind of 14. lead frame support bodys, including：Bottom winding displacement framework, top fixed frame, demarcation strip and wire；Characterized in that,
Described bottom winding displacement framework and top fixed frame is I-shaped structure, and it includes end lath and midfoot support post；It is described
Demarcation strip be laid in the way of lamination on the lath of end, it is used for clamping and fixed wire and sets wire in stack direction
Spacing, described wire is uniaxially laid on demarcation strip in the way of lamination by the spacing of setting, per layer conductor by adjacent
Separation board clamping and fixed.
15. lead frame support bodys as claimed in claim 14, it is characterised in that the end lath of described bottom winding displacement framework
Vertical guide post is contained at two ends, and screw thread is contained in its end；Through hole is contained at the two ends of described demarcation strip, and it is enclosed within described vertical
On guide post, so as to avoid movement of the demarcation strip on the frame end portion lath of described bottom winding displacement frame；Described top is fixed
Through hole is contained at the two ends of the end lath of framework, and it is enclosed within described vertical guide post, and by vertical guide column end
Screw thread and nut structure clamp and fix the demarcation strip and conductor layer that are laid between bottom winding displacement framework and top fixed frame.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410332290.XA CN104183545B (en) | 2014-07-14 | 2014-07-14 | Method for manufacturing wire frame body and wire frame body |
| PCT/CN2015/082696 WO2016008360A1 (en) | 2014-07-14 | 2015-06-29 | Method for manufacturing conducting wire frame body and conducting wire frame body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410332290.XA CN104183545B (en) | 2014-07-14 | 2014-07-14 | Method for manufacturing wire frame body and wire frame body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104183545A CN104183545A (en) | 2014-12-03 |
| CN104183545B true CN104183545B (en) | 2017-05-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410332290.XA Active CN104183545B (en) | 2014-07-14 | 2014-07-14 | Method for manufacturing wire frame body and wire frame body |
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| Country | Link |
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| CN (1) | CN104183545B (en) |
| WO (1) | WO2016008360A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104183545B (en) * | 2014-07-14 | 2017-05-17 | 申宇慈 | Method for manufacturing wire frame body and wire frame body |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1182283A (en) * | 1996-07-09 | 1998-05-20 | 松下电器产业株式会社 | Semiconductor element-mounting board, manufacturing method for board, semiconductor device and manufacturing method for device |
| CN1820368A (en) * | 2003-08-29 | 2006-08-16 | 株式会社瑞萨科技 | Lead frame and manufacture thereof |
| CN101232777A (en) * | 1999-09-02 | 2008-07-30 | 伊比登株式会社 | Printed circuit board and method for producing the printed circuit board |
| CN103745972A (en) * | 2013-12-27 | 2014-04-23 | 申宇慈 | One-way conductive plate and manufacturing method thereof |
| JP5490949B1 (en) * | 2013-08-08 | 2014-05-14 | 有限会社 ナプラ | Wiring board and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104183545B (en) * | 2014-07-14 | 2017-05-17 | 申宇慈 | Method for manufacturing wire frame body and wire frame body |
-
2014
- 2014-07-14 CN CN201410332290.XA patent/CN104183545B/en active Active
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2015
- 2015-06-29 WO PCT/CN2015/082696 patent/WO2016008360A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1182283A (en) * | 1996-07-09 | 1998-05-20 | 松下电器产业株式会社 | Semiconductor element-mounting board, manufacturing method for board, semiconductor device and manufacturing method for device |
| CN101232777A (en) * | 1999-09-02 | 2008-07-30 | 伊比登株式会社 | Printed circuit board and method for producing the printed circuit board |
| CN1820368A (en) * | 2003-08-29 | 2006-08-16 | 株式会社瑞萨科技 | Lead frame and manufacture thereof |
| JP5490949B1 (en) * | 2013-08-08 | 2014-05-14 | 有限会社 ナプラ | Wiring board and manufacturing method thereof |
| CN103745972A (en) * | 2013-12-27 | 2014-04-23 | 申宇慈 | One-way conductive plate and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104183545A (en) | 2014-12-03 |
| WO2016008360A1 (en) | 2016-01-21 |
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