CN104170101B - 制造发光装置的方法 - Google Patents
制造发光装置的方法 Download PDFInfo
- Publication number
- CN104170101B CN104170101B CN201280071700.9A CN201280071700A CN104170101B CN 104170101 B CN104170101 B CN 104170101B CN 201280071700 A CN201280071700 A CN 201280071700A CN 104170101 B CN104170101 B CN 104170101B
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- Prior art keywords
- cavity
- light
- fluorinated polymer
- stripping film
- emitting component
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 56
- 238000004519 manufacturing process Methods 0.000 title claims description 23
- 229920002313 fluoropolymer Polymers 0.000 claims abstract description 53
- 238000005538 encapsulation Methods 0.000 claims abstract description 19
- 230000009477 glass transition Effects 0.000 claims abstract description 15
- 229920001774 Perfluoroether Polymers 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 52
- 229920005989 resin Polymers 0.000 claims description 31
- 239000011347 resin Substances 0.000 claims description 31
- 239000000565 sealant Substances 0.000 claims description 13
- 238000009998 heat setting Methods 0.000 claims description 11
- 230000003746 surface roughness Effects 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 238000010276 construction Methods 0.000 claims description 9
- 238000007711 solidification Methods 0.000 claims description 8
- 230000008023 solidification Effects 0.000 claims description 8
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical compound FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 8
- BLTXWCKMNMYXEA-UHFFFAOYSA-N 1,1,2-trifluoro-2-(trifluoromethoxy)ethene Chemical compound FC(F)=C(F)OC(F)(F)F BLTXWCKMNMYXEA-UHFFFAOYSA-N 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000006116 polymerization reaction Methods 0.000 claims description 4
- 230000008859 change Effects 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 2
- 238000013007 heat curing Methods 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 11
- 238000000465 moulding Methods 0.000 abstract description 5
- 239000011159 matrix material Substances 0.000 description 9
- 230000008901 benefit Effects 0.000 description 7
- 230000007547 defect Effects 0.000 description 7
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 7
- 239000000203 mixture Substances 0.000 description 4
- 230000006870 function Effects 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- NPNPZTNLOVBDOC-UHFFFAOYSA-N 1,1-difluoroethane Chemical compound CC(F)F NPNPZTNLOVBDOC-UHFFFAOYSA-N 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003682 fluorination reaction Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241001270131 Agaricus moelleri Species 0.000 description 1
- -1 Allyl alkene Chemical class 0.000 description 1
- 241001227124 Dialytes Species 0.000 description 1
- 241000282326 Felis catus Species 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 235000013351 cheese Nutrition 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- QHSJIZLJUFMIFP-UHFFFAOYSA-N ethene;1,1,2,2-tetrafluoroethene Chemical group C=C.FC(F)=C(F)F QHSJIZLJUFMIFP-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000011022 opal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/68—Release sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/60—Releasing, lubricating or separating agents
- B29C33/62—Releasing, lubricating or separating agents based on polymers or oligomers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
- B29C37/0075—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other using release sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/003—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor characterised by the choice of material
- B29C39/006—Monomers or prepolymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14008—Inserting articles into the mould
- B29C45/14016—Intermittently feeding endless articles, e.g. transfer films, to the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
- B29D11/00807—Producing lenses combined with electronics, e.g. chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
- B29C2045/0075—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping curing or polymerising by irradiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C2045/14155—Positioning or centering articles in the mould using vacuum or suction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14754—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles being in movable or releasable engagement with the coating, e.g. bearing assemblies
- B29C2045/1477—Removable inserts, e.g. the insert being peeled off after moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
- B29L2011/0016—Lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08J2327/18—Homopolymers or copolymers of tetrafluoroethylene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08J2327/20—Homopolymers or copolymers of hexafluoropropene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2329/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Derivatives of such polymer
- C08J2329/10—Homopolymers or copolymers of unsaturated ethers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Abstract
本发明提供了一种制备封装发光装置的新型方法。可在LED芯片的封装过程中使用的一种优选的脱模膜具有弹性模量和与剥离膜紧密适形于用于形成围绕LED芯片的保护透镜的模制腔体的内部的所需模制温度相比足够低的玻璃化转变温度。根据本发明的实施例的优选剥离膜包含完全氟化的聚合物,如全氟烷氧基聚合物(包括MFA),或氟化乙烯丙烯。
Description
技术领域
本发明涉及制造发光装置,更特别地涉及在制造封装发光二极管的过程中使用脱模膜。
背景技术
发光二极管(LED)为相比于更常规的白炽灯泡和荧光灯具有多个优点的固态半导体光源。LED的优点中的一些包括低功率消耗、小尺寸、更快的开/关时间、低热辐射、长的可用寿命、耐冲击性和简单的制造过程。部分由在新应用中LED装置的使用所驱动,LED装置的制备随着增加的需求而持续增加。
常规LED通常包括半导体芯片、通常由环氧树脂或有机硅制得的密封剂,和电连接元件,所述电连接元件包括结合至触点并连接至从封套中出现的两个金属引线的两个细金线。半导体芯片被掺杂以产生p-n结,使得电流容易地从p侧或阳极流动至n侧或阴极,由此形成二极管。当电流流动经过二极管时,电子和电子空穴的移动导致光子形式的能量的释放。
图1为常规LED的图示,其包括具有上述结构的二极管102、两个外部电极104(连接至阴极)和106(连接至阳极),和安装于基材112上的密封剂110。所述密封剂用于数个功能,包括保护二极管和电连接免于氧化和水分、改进耐冲击性,并充当由LED产生的光的漫射元件或透镜。
典型的制造过程示于下述图2中,其中使用多腔模具以形成封装透镜,从而制得封装的LED装置。本申请人已发现,对于这种透镜的多种可能的制造缺陷,剥离膜为显著的部件。已知的是使用乙烯四氟乙烯(ETFE)膜作为用于LED封装的脱模膜。然而,ETFE膜仅可得自有限数量的供应商。此外,并非所有的ETFE膜适合用作脱模膜。
需要一种在LED封装和制造过程中使用的替代脱模膜。因此,本发明的实施例涉及一种脱模膜,其就产率和制造成本而言满足工业要求,同时也扩大了LED制造可得的产品范围。
发明内容
本发明的一个优选实施例涉及一种制备封装发光装置的新型方法。可在LED芯片的封装过程中使用的一种优选的脱模膜具有弹性模量和与剥离膜紧密适形于用于形成围绕LED芯片的保护透镜的模制腔体的内部的所需模制温度相比足够低的玻璃化转变温度。
前述相当宽泛地概述了本发明的特征和技术优点,以可更好地理解如下本发明的详细描述。本发明的另外的特征和优点将在下文描述。本领域技术人员应了解,所公开的概念和具体实施例可易于用作修改或设计用于进行本发明的相同目的的其他结构的基础。本领域技术人员也应认识到,这种等同构造不偏离如所附权利要求书所述的本发明的精神和范围。
附图说明
为了更完全地理解本发明及其优点,现在将参照结合所附附图的如下描述,其中:
图1为常规现有技术LED的图示;
图2显示了通过使用多腔模具形成封装透镜,从而形成封装LED装置的现有技术方法;
图3为显示了根据本发明的优选实施例的制备封装发光装置的方法中的步骤的流程图;且
图4显示了可用于实施本发明的实施例的现有技术模具。
所附附图不旨在按比例绘制。在附图中,在各个图中示出的每个相同或接近相同的部件由相同的数字表示。为了清楚的目的,在每个附图中并未标记每个组件。
具体实施方式
本发明的优选实施例涉及一种制备封装发光装置的新型方法。LED装置的典型制造过程包括将LED本身封装于环氧树脂或有机硅的圆顶形透镜内。封装材料(也称为灌封材料)不仅保护LED免于由水分、冲击等所导致的损坏,封装材料还必须充分传输所需波长的光。由密封剂(透镜)传输光的程度为选择封装材料的一个重要考虑。不幸地,由于材料的折射率和全内反射的程度,一定量的由LED芯片产生的光总是被捕获于封装材料内。所述被捕获的光不利地降低或者改变LED装置的光输出。
图2显示了通过使用多腔模具形成封装透镜,从而形成封装LED装置的现有技术方法。首先,现有技术方法包括提供安装于支撑结构202上的多个发光元件201,如安装于PCB基材上的LED芯片。也提供具有上表面205和下表面204的模具。下表面204优选具有多个腔体206,腔体的排列对应于LED芯片在基材上的排列。腔体的形状限定围绕对应的发光元件而形成的密封剂或透镜的形状。通常,腔体成形为制备圆顶形透镜,如图1所示的透镜。将基材(如PCB)固定至上模具表面上的适当位置(通常通过施加真空),且LED芯片面向模具的下半部中的腔体。
然后用柔性牺牲脱模膜208覆盖腔体206,所述柔性牺牲脱模膜208用于防止封装材料粘附至模具腔体的内部,由此允许再使用模具,也在分离透镜和模具时防止对透镜的损坏。通常通过每个腔体中的真空通道210施加真空,从而使剥离膜适形至腔体的内部。一旦施加真空,则剥离膜被拉入腔体中,以完全覆盖腔体的内表面。现有技术中使用的一种常见剥离膜由含氟聚合物ETFE形成。剥离膜可由未使用的剥离膜的辊212供应,且经使用的剥离膜缠绕至收带盘214上。
接着,将封装材料218(也称为灌封材料)引入腔体中。典型的封装材料包括环氧树脂和有机硅树脂。在部分真空下,随后将LED芯片或其他发光装置201压入封装材料中,使得封装材料218填充腔体206内部的所有空间。然后夹紧并加热(例如加热至100-150℃达3-10分钟)模具,以固化封装材料。然后分离模具,并从模具中移出封装的LED装置220。然后通常通过将经使用的膜缠绕至收带辊214而从腔体中去除经使用的剥离膜,并同时使未使用的膜208的连续部分在腔体上滚动,从而可重复封装过程。
适用于进行图2的过程的模制设备可得自例如日本京都的东和公司(TOWACorporation of Kyoto,Japan);高亮度LED芯片可得自例如台湾新竹的隆达电子公司(Lextar Electronics Corporation of Hsinchu,Taiwan),用作封装材料的合适的有机硅树脂可得自例如美国密歇根州米德兰的道康宁公司(Dow Corning of Midland,MI,US)。
申请人已发现,剥离膜在封装发光装置的制造中(尤其是关于减少制造故障并保持制造过程的商业可接受的产率)起到出乎意料的重要作用。与剥离膜相关的故障可包括在脱模之后透镜表面的剥离和/或破碎。在一些情况中,观察到的缺陷可包括透镜的变形(有时称为“猫眼”缺陷),因为扭曲的透镜形状通常类似于猫的眼睛而非预期的清晰圆顶形状。即使在现有技术ETFE剥离膜中也存在封装LED透镜中的这些类型的缺陷。这种缺陷影响封装LED的光透射,并可使封装LED无法使用。明显地,就商业角度而言,高收益率(低故障发生率)是非常希望的。
尽管在封装LED制造过程中长期观察到这种缺陷,但现在本申请人认为,这些缺陷的来源是剥离膜对模具腔体的适形不良。本申请人也已发现,诸如拉伸强度和尺寸稳定性的特性出乎意料地不显示为与观察到的透镜缺陷密切相关。相反,本申请人认为,弹性模量和玻璃化转变温度是更显著的因素。然而,本申请人注意到,尽管本文描述了本发明成功的理论基础,但无论所述理论的准确度如何,本发明已显示对如下描述的剥离膜聚合物起作用。
因此,根据本发明的一个优选的脱模膜在模具温度下具有弹性模量(E),所述模具温度足够低,以使优选的材料足够弹性而完全适形至腔体的内部。优选的脱模膜具有不超过50MPa,更优选不超过35MPa,甚至更优选不超过30MPa,还更优选不超过25MPa的在150℃下的弹性模量。另外,根据本发明的优选的脱模膜具有玻璃化转变温度(Tg),所述玻璃化转变温度足够低以使材料达到橡胶平顶,但不那么低而使材料达到其熔点。优选的脱模膜具有小于100℃,更优选小于90℃的玻璃化转变温度,但具有高于模具的最高操作温度的熔点,例如高于200℃。
另外,本申请人认为,与水的接触角也是优选的脱模膜的显著特性。一般而言,接触角越高,则剥离膜的表面能越低,且膜与密封剂相互作用的能力或粘附至密封剂的能力越低。优选的脱模膜具有至少93度,更优选至少95度的接触角。也通过使用具有更低表面能的膜而使剥离膜与密封剂之间的粘附力达到最小。ETFE(用于LED透镜制造的常用剥离膜)的表面能为大约25达因/cm。根据本发明的一些实施例的优选剥离膜具有小于25达因/cm,更优选小于20达因/cm的表面能。
尽管就解决之前不明的密封故障的问题而言不那么重要,但也存在根据本发明的剥离膜所需的多个其他特性。举例而言,根据本发明的脱模膜优选具有大于20MPa的拉伸强度和大于200%的在150℃下的断裂伸长。这提供给脱模膜足够量的强度和弹性,从而即使当膜变形时(当其适形至腔体的内部时),可防止裂化、撕裂和过度伸长。而且,由于相同的原因,优选的脱模膜足够厚,使得膜足够强,从而即使在拉伸强度和断裂伸长如上所述时也避免在制造过程中被不适当地损坏。合适的厚度的一个例子为至少3密耳。
最后,本申请人也已确定希望脱模膜具有尽可能平滑的表面,以制备具有尽可能平滑的表面的透镜。如上所述,LED透镜上的更粗糙的表面可有助于光散射,这可能降低LED光源的效力。优选的脱模膜具有0.20μm或更低,更优选0.15μm或更低,甚至更优选0.10μm或更低的平均表面粗糙度(Sa)。
匹配上述所需特性,并可成型为合适的脱模膜的示例性的一组材料包括某些完全氟化的热塑性聚合物,如全氟烷氧基聚合物,特别是全氟甲基烷氧基(MFA)。MFA包括由至少四氟乙烯(TFE)和全氟甲基乙烯基醚(PMVE)的聚合形成的全氟烷氧基聚合物。对于上述优选特性,MFA具有17.3MPa的在150℃下的弹性模量和大约86.7℃的玻璃化转变温度。基于由本申请人完成的测试,由MFA形成的优选脱模膜能够极紧密地适形至模具腔体的内部。
合适的完全氟化的热塑性聚合物的另一例子为氟化乙烯丙烯(FEP)。对于上述优选特性,取决于所测试的确切树脂,FEP具有48-50MPa的在150℃下的弹性模量和大约70℃至140℃的玻璃化转变温度。基于这些值,由FEP形成的优选脱模膜也能够极紧密地适形至模具腔体的内部。
下表总结了MFA和FEP的其他相关特性(尽管对于不同制造者或级别,测量值可一定程度地不同)。
图4为显示了根据本发明的优选实施例的制备封装发光装置的方法中的步骤的流程图。用于实施本发明的优选实施例的材料和步骤与图2中描述的现有技术过程相同,不同的是使用新型脱模膜。在图4的方法中,制造操作在步骤400中开始。接着,在步骤401中,提供安装于支撑结构上的多个未封装的发光元件。在本发明的优选实施例中,使用安装于PCB基材上的LED芯片。LED芯片可具有任何类型或颜色。本发明的实施例也适于使用高亮度LED。尽管所述方法可使用单个发光元件实施,但在大多数情况中,同时处理大量LED。
在步骤402中,提供具有多个腔体的模具,所述多个腔体限定围绕发光元件形成的密封剂的形状。通常,腔体将制得圆顶形透镜,如图1中所示的透镜,但可使用任何所需形状。正如如上图2,LED装置在基材上的排列应对应于模具下半部中的腔体的排列,使得每个LED可设置于分别的腔体中。然后在步骤403中将基材(如PCB)固定至上模具表面上的适当位置(通常通过施加真空),且LED芯片面向模具的下半部中的腔体。适用于本发明的实施例的模具504的下部的一个例子示于图5中。下模具部分504具有用于形成两个不同尺寸的LED透镜的腔体。例如,可使用更大的腔体550形成直径为2.5mm的透镜,而可使用更小的腔体552形成直径为1.8mm的透镜。
在步骤404中,提供剥离膜并将其设置于腔体上,根据本发明的实施例的优选剥离膜包含完全氟化的聚合物,例如全氟烷氧基聚合物(包括MFA),或氟化乙烯丙烯。在步骤406中,优选通过施加至每个腔体的真空压力而使脱模膜适形至腔体内部,所述真空压力将剥离膜下拉至腔体中的每一个中。接着,在步骤408中,将诸如树脂(灌封材料)的封装材料引入腔体中的每一个中。在一些优选实施例中,可从流道或喷嘴将封装材料注入模具的下半部的腔体中。适应至腔体的内壁的剥离膜防止封装材料接触腔体的内部。
在步骤410中,设置发光元件,使得发光元件在腔体内,并由封装材料围绕。这可通过关闭模具而实现,关闭模具使得发光元件(如LED芯片)被下压至封装材料中,因此使封装材料填充腔体。
在步骤412中,随后夹紧并加热(例如加热至100-150℃达3-10分钟)模具,以固化封装材料。一旦固化完成,则在步骤414中,可随后分离模具,并从模具中移出封装的LED装置。如果要封装另外的LED 416,则过程返回至步骤401;如果不,则制造过程在步骤418中终止。
因此,本发明的一个优选实施例涉及一种制备封装发光装置的方法,所述方法包括:
提供安装于支撑结构上的多个未封装的发光元件;
提供具有多个腔体的模具,所述多个腔体限定围绕所述发光元件形成的密封剂的形状;
提供覆盖所述腔体的剥离膜,所述剥离膜包含完全氟化的聚合物;
使所述剥离膜适形至所述腔体的内部;
将灌封材料引入腔体内的空间中,所述剥离膜防止所述灌封材料接触所述腔体的内部;
设置所述未封装的发光元件,使得所述未封装的发光元件在所述腔体内,并由所述灌封材料围绕;
固化所述腔体中的发光元件与剥离膜之间的空间中的灌封材料,以封装所述发光元件;以及
从所述模具和剥离膜释放封装的发光元件。
根据另一优选实施例,一种制造包括由树脂透镜封装的发光元件的发光装置的方法包括:
提供安装于支撑结构上的发光元件;
提供具有腔体的模具,所述腔体限定围绕所述发光元件形成的透镜的形状;
提供覆盖所述腔体的剥离膜,所述剥离膜包含全氟烷氧基聚合物或氟化乙烯丙烯;
使所述剥离膜适形至所述腔体的内部;
将树脂引入腔体内的空间中,所述剥离膜防止所述树脂接触所述腔体的内部;
设置所述发光元件,使得所述发光元件在所述腔体内,并由所述树脂围绕;
固化所述腔体中的发光元件与剥离膜之间的空间中的树脂,以形成封装所述发光元件的透镜;以及
从所述模具和剥离膜释放发光元件。
根据另一优选实施例,一种用于制造发光装置的设备包括:
具有多个腔体的模具,所述多个腔体限定透镜形状;
用于卷动所述多个腔体上的脱模膜的卷线筒;
用于将有机硅树脂引入所述多个腔体中的分配器;
用于将真空施加至所述多个腔体,以形成抵靠所述腔体的内部的剥离膜的真空***;和
脱模膜的供应,所述脱模膜包括完全氟化的聚合物膜的卷。
根据另一优选实施例,一种制备封装发光装置的方法包括:
提供安装于支撑结构上的多个未封装的发光元件;
提供具有多个腔体的模具,所述多个腔体限定由围绕所述发光元件的可热固化的树脂形成的密封剂的形状;
提供覆盖所述腔体的剥离膜,所述剥离膜选自氟化聚合物的组,所述氟化聚合物具有50 MPa或更低的在150℃下的弹性模量、低于所述可热固化的树脂的固化温度的玻璃化转变温度、至少95度的与水的接触角,和小于25达因/cm的表面能;
使所述剥离膜适形至所述腔体的内部;
将可热固化的树脂引入腔体内的空间中,所述剥离膜防止灌封材料接触所述腔体的内部;
设置所述未封装的发光元件,使得所述未封装的发光元件在所述腔体内,并由所可热固化的树脂围绕;
通过将所述模具加热至树脂的固化温度,从而固化所述腔体中的发光元件与剥离膜之间的空间中的可热固化的树脂;以及
从所述模具和剥离膜释放封装的发光元件。
在本发明的优选实施例中,发光装置可包括发光二极管(LED)、可见光LED、通孔LED、表面安装LED、高亮度LED或有机LED。而且,树脂或灌封材料可包括环氧树脂或有机硅。
在本发明的优选实施例中,使剥离膜适形至腔体内部可包括通过真空口将真空施加至腔体,以使剥离膜适应腔体的内部。
在本发明的优选实施例中,氟化聚合物可包括全氟甲基烷氧基(MFA)、氟化乙烯丙烯(FEP),和/或由至少四氟乙烯(TFE)和全氟甲基乙烯基醚(PMVE)的聚合形成的全氟烷氧基聚合物。而且,氟化聚合物可具有至少93度的与水的接触角,或至少95度的与水的接触角。氟化聚合物可具有不超过50MPa,不超过35MPa,不超过30MPa,或不超过25MPa的在150℃下的弹性模量。氟化聚合物具有小于100℃或小于90℃的玻璃化转变温度和小于25达因/cm或小于20达因/cm的表面能。
在本发明的优选实施例中,剥离膜包含氟化聚合物,所述氟化聚合物具有0.20μm或更小的平均表面粗糙度,0.15μm或更小的平均表面粗糙度,或0.10μm或更小的平均表面粗糙度。剥离膜也可包含完全氟化的聚合物膜的卷,所述完全氟化的聚合物具有大于200℃的熔融温度、20MPa或更大的拉伸强度,和大于300%的在150℃下的断裂伸长。在优选实施例中,剥离膜包含完全氟化的聚合物,所述完全氟化的聚合物具有不超过50MPa,不超过35MPa,不超过30MPa,或不超过25MPa的在150℃下的弹性模量。在优选实施例中,剥离膜包含玻璃化转变温度小于100℃或小于90℃的完全氟化的聚合物。剥离膜也可包含完全氟化的聚合物,所述完全氟化的聚合物具有0.20μm或更小的平均表面粗糙度,0.15μm或更小的平均表面粗糙度,或0.10μm或更小的平均表面粗糙度。剥离膜也可包含表面能小于25达因/cm,或小于20达因/cm的完全氟化的聚合物。在优选实施例中,完全氟化的聚合物包括MFA或FEP。
本发明的其他优选实施例涉及一种用于模制硅透镜以封装发光二极管的脱模膜,其中所述脱模膜包括氟化聚合物膜,所述氟化聚合物膜具有小于100℃的玻璃化转变温度、不超过50MPa的在150℃下的弹性模量,和0.20μm或更小的平均表面粗糙度。在优选实施例中,氟化聚合物膜具有小于90℃的玻璃化转变温度。氟化聚合物膜可具有不超过35MPa,不超过30MPa,或不超过25MPa的在150℃下的弹性模量。氟化聚合物膜可具有0.15μm或更小,或0.10μm或更小的平均表面粗糙度。氟化聚合物膜可包括完全氟化的热塑性聚合物膜。氟化聚合物膜具有至少93度,或至少95度的与水的接触角。
在上述实施例的任意者中,氟化聚合物膜可包括由至少四氟乙烯(TFE)和全氟甲基乙烯基醚(PMVE)的聚合形成的全氟烷氧基聚合物、全氟甲基烷氧基(MFA),和/或氟化乙烯丙烯(FEP)。在一些优选实施例中,在如上具体实施例的任意者中描述的剥离膜可具有不超过3密耳的厚度。
本发明的优选实施例也包括通过本文描述的方法中的任意者制得的发光装置。
本文描述的发明具有广泛的适用性,并可提供如上实例中描述和显示的许多益处。实施例取决于具体应用而极大不同,且并非每个实施例都提供所有益处并满足可由本发明获得的所有目的。适于进行本发明的剥离膜材料(如MFA)可购自例如本申请的受让人。
在以下讨论和权利要求书中,术语“包括”和“包含”以开放方式使用,因此应该被解释为意指“包括但不限于……”。就任意术语不在本说明书中特定限制而言,旨在提供术语其简单通常的含义。所附附图旨在协助理解本发明,且除非另外指出,所附附图不按比例绘制。
尽管详细描述了本发明及其优点,但应了解在不偏离由所附权利要求书所限定的本发明的精神和范围的情况下,可对本文描述的实施例进行各种改变、替换和变化。此外,本申请的范围不旨在限制至说明书中描述的过程、机器、制造、物质组成、装置、方法和步骤的特定实施例。根据本发明的公开内容,本领域技术人员易于了解,可根据本发明使用与本文描述的相应实施例具有基本上相同功能或实现基本上相同结果的目前存在的或之后开发的过程、机器、制造、物质组成、装置、方法或步骤。因此,所附权利要求书旨在在其范围内包括这些过程、机器、制造、物质组成、装置、方法或步骤。
Claims (22)
1.一种制备封装发光装置的方法,所述方法包括:
提供安装于支撑结构上的多个未封装的发光元件;
提供具有多个腔体的模具,所述多个腔体限定由围绕所述发光元件的灌封材料形成的密封剂的形状;
提供覆盖所述腔体的完全氟化的聚合物剥离膜,所述剥离膜选自氟化聚合物的组,所述氟化聚合物具有50MPa或更低的在150℃下的弹性模量、低于所述灌封材料的固化温度的玻璃化转变温度、至少95度的与水的接触角,和小于25达因/cm的表面能;
使所述剥离膜适形至所述腔体的内部;
将灌封材料引入腔体内的空间中,所述剥离膜防止所述灌封材料接触所述腔体的内部;
设置所述未封装的发光元件,使得所述未封装的发光元件在所述腔体内,并由所述灌封材料围绕;
固化腔体中的发光元件与剥离膜之间的空间中的灌封材料,以封装所述发光元件;以及
从所述模具和剥离膜释放封装的发光元件。
2.一种制造包括由树脂透镜封装的发光元件的发光装置的方法,所述方法包括:
提供安装于支撑结构上的发光元件;
提供具有腔体的模具,所述腔体限定由围绕所述发光元件的树脂形成的透镜的形状;
提供覆盖所述腔体的完全氟化的聚合物剥离膜,所述剥离膜包含全氟烷氧基聚合物或氟化乙烯丙烯,且所述剥离膜选自氟化聚合物的组,所述氟化聚合物具有50MPa或更低的在150℃下的弹性模量、低于所述树脂的固化温度的玻璃化转变温度、至少95度的与水的接触角,和小于25达因/cm的表面能;
使所述剥离膜适形至所述腔体的内部;
将树脂引入腔体内的空间中,所述剥离膜防止所述树脂接触所述腔体的内部;
设置所述发光元件,使得所述发光元件在所述腔体内,并由所述树脂围绕;
固化所述腔体中的发光元件与剥离膜之间的空间中的树脂,以形成封装所述发光元件的透镜;以及
从所述模具和剥离膜释放发光元件。
3.一种制备封装发光装置的方法,所述方法包括:
提供安装于支撑结构上的多个未封装的发光元件;
提供具有多个腔体的模具,所述多个腔体限定由围绕所述发光元件的可热固化的树脂形成的密封剂的形状;
提供覆盖所述腔体的完全氟化的聚合物剥离膜,所述剥离膜选自氟化聚合物的组,所述氟化聚合物具有50MPa或更低的在150℃下的弹性模量、低于所述可热固化的树脂的固化温度的玻璃化转变温度、至少95度的与水的接触角,和小于25达因/cm的表面能;
使所述剥离膜适形至所述腔体的内部;
将可热固化的树脂引入腔体内的空间中,所述剥离膜防止所述可热固化的树脂接触所述腔体的内部;
设置所述未封装的发光元件,使得所述未封装的发光元件在所述腔体内,并由所述可热固化的树脂围绕;
通过将所述模具加热至树脂的固化温度,从而固化所述腔体中的发光元件与剥离膜之间的空间中的可热固化的树脂;以及
从所述模具和剥离膜释放封装的发光元件。
4.根据权利要求1-3中任一项所述的方法,其中所述发光装置包括发光二极管(LED)。
5.根据权利要求1-3中任一项所述的方法,其中权利要求1中的所述灌封材料、或权利要求2中的所述树脂、或权利要求3中的所述可热固化的树脂包括环氧树脂或有机硅。
6.根据权利要求1-3中任一项所述的方法,其中使所述剥离膜适形至腔体内部包括通过真空口将真空施加至腔体,以使剥离膜适应腔体的内部。
7.根据权利要求1-3中任一项所述的方法,其中所述氟化聚合物包括由至少四氟乙烯(TFE)和全氟甲基乙烯基醚(PMVE)的聚合形成的全氟烷氧基聚合物。
8.根据权利要求1-3中任一项所述的方法,其中所述氟化聚合物包括全氟甲基烷氧基(MFA)。
9.根据权利要求1-3中任一项所述的方法,其中所述氟化聚合物包括氟化乙烯丙烯(FEP)。
10.根据权利要求1-3中任一项所述的方法,其中所述氟化聚合物具有至少93度的与水的接触角。
11.根据权利要求1-3中任一项所述的方法,其中所述氟化聚合物具有至少95度的与水的接触角。
12.根据权利要求1-3中任一项所述的方法,其中所述氟化聚合物具有不超过50MPa的在150℃下的弹性模量。
13.根据权利要求1-3中任一项所述的方法,其中所述氟化聚合物具有不超过35MPa的在150℃下的弹性模量。
14.根据权利要求1-3中任一项所述的方法,其中所述氟化聚合物具有不超过30MPa的在150℃下的弹性模量。
15.根据权利要求1-3中任一项所述的方法,其中所述氟化聚合物具有不超过25MPa的在150℃下的弹性模量。
16.根据权利要求1-3中任一项所述的方法,其中所述氟化聚合物具有小于100℃的玻璃化转变温度。
17.根据权利要求1-3中任一项所述的方法,其中所述氟化聚合物具有小于90℃的玻璃化转变温度。
18.根据权利要求1-3中任一项所述的方法,其中所述氟化聚合物具有小于25达因/cm的表面能。
19.根据权利要求1-3中任一项所述的方法,其中所述氟化聚合物具有小于20达因/cm的表面能。
20.根据权利要求1-3中任一项所述的方法,其中包含氟化聚合物的剥离膜具有0.20μm或更小的平均表面粗糙度。
21.根据权利要求1-3中任一项所述的方法,其中包含氟化聚合物的剥离膜具有0.10μm或更小的平均表面粗糙度。
22.一种通过权利要求1-3中任一项所述的方法制得的发光装置。
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- 2012-09-04 EP EP12874175.8A patent/EP2837040A4/en not_active Withdrawn
- 2012-09-04 KR KR20147029853A patent/KR20150001766A/ko active Application Filing
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- 2012-09-04 SG SG10201608345RA patent/SG10201608345RA/en unknown
- 2012-09-04 KR KR1020167036063A patent/KR20160150657A/ko active Search and Examination
- 2012-09-04 US US14/394,392 patent/US20150321387A1/en not_active Abandoned
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- 2012-09-04 WO PCT/US2012/053706 patent/WO2013154602A1/en active Application Filing
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EP2837040A1 (en) | 2015-02-18 |
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WO2013154602A1 (en) | 2013-10-17 |
KR20150001766A (ko) | 2015-01-06 |
US20150321387A1 (en) | 2015-11-12 |
SG10201608345RA (en) | 2016-11-29 |
JP2016201546A (ja) | 2016-12-01 |
KR20160150657A (ko) | 2016-12-30 |
CN104170101A (zh) | 2014-11-26 |
SG11201405896TA (en) | 2014-11-27 |
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