CN104169657B - Venting array and manufacturing method - Google Patents

Venting array and manufacturing method Download PDF

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Publication number
CN104169657B
CN104169657B CN201380013497.4A CN201380013497A CN104169657B CN 104169657 B CN104169657 B CN 104169657B CN 201380013497 A CN201380013497 A CN 201380013497A CN 104169657 B CN104169657 B CN 104169657B
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porous ptfe
aerofluxuss
substrate
array
host material
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CN104169657A (en
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A·J·霍利达
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WL Gore and Associates Inc
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WL Gore and Associates Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0041—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D69/00—Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor
    • B01D69/12—Composite membranes; Ultra-thin membranes
    • B01D69/1213—Laminated layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B3/00—General-purpose turning-machines or devices, e.g. centre lathes with feed rod and lead screw; Sets of turning-machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00293—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS maintaining a controlled atmosphere with processes not provided for in B81C1/00285
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/22—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by diffusion
    • B01D53/228—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by diffusion characterised by specific membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
    • B01D71/06—Organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0242—Gyroscopes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2460/00—Details of hearing devices, i.e. of ear- or headphones covered by H04R1/10 or H04R5/033 but not provided for in any of their subgroups, or of hearing aids covered by H04R25/00 but not provided for in any of its subgroups
    • H04R2460/11—Aspects relating to vents, e.g. shape, orientation, acoustic properties in ear tips of hearing devices to prevent occlusion
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/45—Prevention of acoustic reaction, i.e. acoustic oscillatory feedback
    • H04R25/456—Prevention of acoustic reaction, i.e. acoustic oscillatory feedback mechanically
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y10T428/24331—Composite web or sheet including nonapertured component

Abstract

The invention relates to a vent array comprising a plurality of venting regions comprising a porous PTFE matrix material and a nonporous material comprising a substrate material having a plurality of perforations, wherein the substrate material fills the pores of a porous PTFE matrix material to form nonporous regions, the nonporous regions interconnecting the plurality of venting regions.

Description

Aerofluxuss array and manufacture method
Related application
This application claims on March 13rd, 2012 submission, entitled " VENTING ARRAY AND MANUFACTURING The priority of the U.S. Provisional Patent Application the 61/610th, 254 of METHOED (aerofluxuss array and manufacture method) ", herein to join Square formula introduces the entire disclosure of which.
Background technology
Mechanical organ, sensor, actuator etc. and electronic device are integrated in by common silicon chip by micro-fabrication technology On be known as MEMS.Micro--electro-mechanical system sensor can be used for mike, user's pressure sensor application, wheel tire pressure Power monitoring system, gas flow sensor, accelerometer and gyroscope.
U.S. Patent No. 7,434, No. 305 describe silicon capacitance microphone MEMS package, and it includes sonic transducer harmony Port.Sound port also includes the ambient shield part as metal of such as PTFE or sintering, to protect the transducer against such as too The impact of sunlight, moisture, oil, foul and/or dust etc environmental element.
This shielding part is usually used adhesive layer and is sealed between conduction or layer of non-conductive material.Disclosed condenser type wheat Gram wind can be attached on circuit board using reflow solder technique.Reflow solder technique is carried out at relatively high temperatures.Therefore, this The thermostability planting adhesive layer is crucial.Under reflow soldering conditions, the high temperature of experience combines the low machinery of shielding part itself by force again Degree so that bring into extremely difficult in MEMS package in this way by ambient shield part.
As required by MEMS package, in the factor of thin type formula, however it remains to ambient shield part and pressure balance The needs of ability.Furthermore, it is necessary to manufacture little exhaust apparatus in an efficient way.Aerofluxuss array described herein achieve as This needs.
The brief description of accompanying drawing
Fig. 1 illustrates one embodiment of the present of invention, and it is the exhaust apparatus being attached to MEMS package.
Fig. 2 is the diagram of aerofluxuss array.
Fig. 3 illustrates exhaust apparatus.
Fig. 4 illustrates the sectional view of aerofluxuss array.
Fig. 5 is the another aspect of the MEMS package of description aerofluxuss.
Fig. 6 illustrates the SEM image of the section of aerofluxuss array.
Specific embodiment
In one embodiment, the present invention relates to the method manufacturing the exhaust apparatus for container.Especially it is adaptable to The exhaust apparatus of MEMS package can be by the technical process manufacture of the present invention.Fig. 1 illustrates container 18 so, and it has inner space 20 and make the hole 22 that inner space separated with environment space 24.The example of container may include but be not limited to：Pressure transducer, electronics Capsule, gas sensor, mike and auditory prosthesises.
Fig. 2 illustrates aerofluxuss array.This array includes the multiple air vents manufacturing with single technical process.Air vent can be in peace Separated by cutting or stripping and slicing before dress, or can be arranged on before separation on the array of MEMS package.
All exhaust apparatus as shown in Figure 3 26 can be placed in above the hole 22 in container.Exhaust apparatus is used for protecting appearance Device inner space exempts from the pollutant invasion and attack including dust, moisture and other liquid in Outdoor Space, allows to use simultaneously Air-flow in pressure balance or moisture transmission.Device 26 can be provided in the form of aerofluxuss array 28, if it include as shown in Figure 2 Dry exhaust apparatus.The host material 32 that aerofluxuss array can pass through porous polymer base material 30 and have multiple perforation 34 Combine and to construct.
Porous polymer base material is impenetrable liquid but the material of ventilation body.The polymeric base material of porous can be Fluoropolymer and their copolymer as PTFE, PVDF, PFA, FEP etc.These porous polymer base materials can There is provided with single or multiple lift structure, multiple structure includes voidage change and/or polymeric material change multilamellar.Each layer can To be symmetrical or asymmetrical layer.Teaching according to the U.S. Patent No. 3,953,566 authorizing Gore and the expansion that manufactures Type PTFE barrier film is particularly useful as porous material.These PTFE barrier films can uniaxially or biaxially expand.By using In row, well-known coating and method carry out coated polymer coating, and porous material can be made to be changed into oleophobic property.
The copolymer of PTFE can also be useful.As used herein, PTFE is included for technology in the art The copolymer of PTFE and intumescent PTFE copolymer that personnel understand.
Host material can be any polymeric material, this kind of material under heat and/or pressure act on, once being combined with Two groups of materials are so that it may flowing into and being filled in each hole of porous polymer substrate.For example, substrate can be thermoplastic.Substrate Material can be any insulant being made up of high temperature organic insulation host material, such material such as, but not limited to polyamides Imines, epoxy resin, are made up of PTFE at least in part, with or without filler.
Material is useful especially substrate.C semi-solid preparation material is With thermosetting resin impregnated intumescent sheet of PTFE.Air space in intumescent PTFE is replaced with resin, intumescent PTFE Barrier film becomes carrier or the delivery system of resin.In lamination process, resin is with the semi-solid preparation material phase based on glass with tradition Same mode flows, fills and bonds.
Host material may also include partially cured and completely crued material.Host material may include stage BFR4/BT And Tacpreg-Taconic.The thickness range of substrate can be from 15 microns to 200 microns.It is preferred that stromal thickness be Between 30 microns and 80 microns.
By means of methods such as laser drill, punch die or machine drillings, perforation is made to be formed on host material piece.Perforation Size, shape and position can determine according to the size and shape in the hole 22 of exhaust apparatus.Usually, the size range of perforation can To be from 0.3mm to 1.5mm.Perforation shape is not crucial, can be selected for circle, ellipse, square, rectangle etc. appoint What shape.
As shown in Figure 4, by stacking or calendering techniques by 44 groups of the substrate of porous polymer material substrate 42 and perforation It is combined and form aerofluxuss array 40.So technology can relate to heat or pressure or both.Perforation 38 generates for gas pressure The air vent of power simultaneously allows transfer voice.Substrate and base material combine and form composite.Host material is in some regions The interior space flowing into filling porous polymeric material.Generate complex thus include porous polymer material 43 region and Non-porous region 46, wherein, porous polymer material is substantially filled with host material.
As shown in Fig. 2 aerofluxuss array 28 may include multiple exhaust apparatus 26, each device includes at least one polymeric material The porous zone of material.The exhaust apparatus quantity of each array depends on the size of gas deflation assembly.Exhaust apparatus can by stripping and slicing or Cutting is separated with array, and uses the known like that method of such as binding agent, thermal weld or pass through matrix flow and be cured to Container and be attached to container.
In one aspect, the attachment feature of such as crown cap or thermal plasticity slice or resin sheet is provided to aerofluxuss array, with It is easy to exhaust apparatus is attached in encapsulation.On the other hand, each exhaust apparatus with attachment feature can use known method Cut out from aerofluxuss array, and this device and then the hole for covering container.
The method that another aspect of the present invention is related to manufacture the MEMS package of aerofluxuss.Fig. 5 illustrates the MEMS capacitive demonstrated Microphone package 50, it includes transducer unit 52 and amplifier 54.This encapsulation has sound port or hole 56, to allow sound wave to arrive Reach transducer.The manufacture method of the present invention is similarly constructed and contemplates the other MEMS package for other application, such as MEMS speaker.Hole is covered by exhaust apparatus 26, to allow sound wave or gas to pass through but prevention liquid pollutant, dust and moisture Enter this encapsulation, the content within this protection packaging.
Example：The method manufacturing aerofluxuss array
Semi-solid preparation material (GORETM C) it is used as substrate.Using CO2Laser instrument is in substrate (chi Very little take advantage of 15.2cm for 12.7cm) in get out the circular perforations of diameter 0.8mm.Substrate has sum and so holes for 1755, They are to each other away from opening 3.25mm.Intumescent PTFE barrier film is used as porous polymer base material, and the characteristic of barrier film is as follows：Thick Degree is about 35 microns, and average cell size is 0.5 micron, and in lattice, value (Gurley) is about 10 seconds.By with solvent system The solution of fluorinated acrylate polymer is coated, and thereafter by being dried to remove solvent, can make intumescent PTFE barrier film For oleophobic property.
Using manual Carver press, by perforation under 200 °F of temperature, 1600 pounds/square inch of pressure Substrate is pressed onto on the intumescent PTFE barrier film of this layer of oleophobic property and continues about 4 points 45 seconds, is consequently formed complex.Host material 32 Run through the full depth of oleophobic property barrier film 30, in the cross-section SEM images of complex as shown in FIG. 6 observed that Sample.Therefore, the complex of gained has：A () aporate area 60, there, host material passes through barrier film, and (b) corresponds to substrate material The ventilative porous zone 62 of the just oleophobic property barrier film of the perforation in material.

Claims (10)

1. a kind of aerofluxuss array, described aerofluxuss array includes：
A. multiple exhaust gas regions of porous PTFE substrate are included, and
B. include the non-porous substrate material with the host material of multiple perforation, wherein, base material filling porous PTFE substrate Hole, to form aporate area, described aporate area and the interconnection of multiple exhaust gas regions.
2. aerofluxuss array as claimed in claim 1 is it is characterised in that porous PTFE substrate is oleophobic property.
3. aerofluxuss array as claimed in claim 1 is it is characterised in that described host material is insulant.
4. aerofluxuss array as claimed in claim 1 is it is characterised in that described host material is epoxy resin.
5. aerofluxuss array as claimed in claim 1 is it is characterised in that described host material is polyimides.
6. aerofluxuss array as claimed in claim 1 is it is characterised in that the thickness of described aerofluxuss array is less than 200 microns.
7. aerofluxuss array as claimed in claim 1 is it is characterised in that also include attached layer.
8. a kind of method manufacturing the exhaust apparatus for container, described container forms inner space and environment space, and has Hole between described inner space and described environment space, described exhaust apparatus is adapted for placement on described hole, described side Method includes：
A. provide porous PTFE substrate,
B. provide the host material with multiple perforation,
C. described porous PTFE substrate and described host material are combined, so that the neighbouring porous PTFE of described host material filling Substrate, thus forming the complex in the region of PTFE substrate of the region with porous PTFE substrate and filling, and
D. described complex is divided into multiple exhaust apparatus, each exhaust apparatus includes at least one area of porous PTFE substrate Domain.
9. a kind of method of the MEMS package manufacturing aerofluxuss, methods described includes：
A. provide the MEMS package with container, described container forms inner space and environment space, and have between internal empty Between hole and described environment space between,
B. provide porous PTFE substrate,
C. provide the host material with multiple perforation,
D. described porous PTFE substrate and described host material are combined, so that the neighbouring porous PTFE of described host material filling Substrate, thus, forms the complex in the region of PTFE substrate of the region with porous PTFE substrate and filling,
E. described complex is divided into multiple exhaust apparatus, each exhaust apparatus includes at least one area of porous PTFE substrate Domain, and
F. described exhaust apparatus is attached on the hole of MEMS package.
10. a kind of method manufacturing aerofluxuss array, methods described includes：
A. provide porous PTFE substrate,
B. provide the host material with multiple perforation, and
C. described porous PTFE substrate and described host material are combined, so that the neighbouring porous PTFE of described host material filling Substrate, thus, forms the complex in the region of PTFE substrate of the region with porous PTFE substrate and filling.
CN201380013497.4A 2012-03-13 2013-03-12 Venting array and manufacturing method Active CN104169657B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261610254P 2012-03-13 2012-03-13
US61/610,254 2012-03-13
PCT/US2013/030401 WO2013138286A1 (en) 2012-03-13 2013-03-12 Venting array and manufacturing method

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Publication Number Publication Date
CN104169657A CN104169657A (en) 2014-11-26
CN104169657B true CN104169657B (en) 2017-02-22

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EP (1) EP2825825B1 (en)
JP (1) JP5922836B2 (en)
KR (1) KR101622864B1 (en)
CN (1) CN104169657B (en)
CA (1) CA2865425C (en)
WO (1) WO2013138286A1 (en)

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