CN104164593A - A highly-antirust aluminum-based composite heat dissipation material used for LEDs - Google Patents

A highly-antirust aluminum-based composite heat dissipation material used for LEDs Download PDF

Info

Publication number
CN104164593A
CN104164593A CN201410318111.7A CN201410318111A CN104164593A CN 104164593 A CN104164593 A CN 104164593A CN 201410318111 A CN201410318111 A CN 201410318111A CN 104164593 A CN104164593 A CN 104164593A
Authority
CN
China
Prior art keywords
parts
heat dissipation
dissipation material
aluminum
good
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410318111.7A
Other languages
Chinese (zh)
Inventor
张立安
魏明军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WANXIN CASTING CO Ltd MAANSHAN CITY
Original Assignee
WANXIN CASTING CO Ltd MAANSHAN CITY
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WANXIN CASTING CO Ltd MAANSHAN CITY filed Critical WANXIN CASTING CO Ltd MAANSHAN CITY
Priority to CN201410318111.7A priority Critical patent/CN104164593A/en
Publication of CN104164593A publication Critical patent/CN104164593A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Oxide Ceramics (AREA)

Abstract

The invention relates to the lamp heat dissipation materials, and particularly relates to a highly-antirust aluminum-based composite heat dissipation material used for LEDs and a producing method thereof. The heat dissipation material is prepared from following raw materials by weight: 60-65 parts of aluminum, 10-11 parts of iron, 5-8 parts of magnesium nitride, 1-1.5 parts of stannous pyrophosphate, 1-2 parts of zinc phosphate, 0.4-0.5 part of calcium phosphate, 0.1-0.2 part of strontium phosphate, 8-10 parts of clay, 12-15 parts of quartz sand, 10-12 parts of silicon carbide, 6-8 parts of aluminum-rich andalusite and 4-5 parts of auxiliary agents. The heat dissipation material integrates advantages of the aluminum, the iron, the magnesium nitride, the clay, the quartz sand, the silicon carbide, and the like and has good heat conducting and thermal insulation properties. The raw materials are fully mixed. Sintering effects are good. The prepared heat dissipation material has characteristics of compact structure, bright and clean surfaces, whether tolerance, water resistance, capability of being not liable to rust and durable in use, good heat dissipation capability, capability of protecting LED lamps and delaying the luminous decaying speed, good using properties and long service lifetime.

Description

High antirust aluminium base composite heat dissipation material for a kind of LED
Technical field
The present invention relates to light fixture heat sink material, be specifically related to high antirust aluminium base composite heat dissipation material and production method thereof for a kind of LED.
Background technology
LED be called as the 4th generation light source, there is the advantages such as energy-saving and environmental protection, safety, less energy-consumption, high brightness, be widely used in daily life, the heat dispersion of LED lamp body itself is most important, directly has influence on work-ing life and the illuminating effect of light fixture.Existing LED heat sink material is mainly to be made by metallic substance such as aluminium, copper, there is in actual use the shortcomings such as cost restriction, insulating property be inadequate, so formula of necessary improvement material, make material reach more good radiating effect, the use properties of improving light fixture, increases the service life.
Summary of the invention
The object of the invention is to, high antirust aluminium base composite heat dissipation material for a kind of LED is provided, to improve heat dispersion and the use properties of material, protect more efficiently LED light fixture, to achieve these goals, the technical solution used in the present invention is as follows:
High antirust aluminium base composite heat dissipation material for a kind of LED, it is characterized in that, material of the present invention is made by the raw material of following weight part: aluminium 60-65, iron 10-11, magnesium nitride 5-8, stannous pyrophosphate 1-1.5, zinc phosphate 1-2, calcium phosphate 0.4-0.5, strontium phosphate 0.1-0.2, clay 8-10, quartz sand 12-15, silicon carbide 10-12, mullite 6-8, auxiliary agent 4-5.
Described auxiliary agent is made by the raw material of following weight part: the fluorine carbon emulsion 2-3 of Zinic stearas 1-3, solid content 45%, magnesium salicylate 4-5, Sodium Tetraborate 1-2, inorganic Ge powder 5-8, four acicular type zinc oxide crystal whisker 12-15, preparation method is: first Sodium Tetraborate is dissolved in suitable quantity of water, be prepared into the aqueous solution that concentration is 8-10%, then drop into magnesium salicylate, four acicular type zinc oxide crystal whisker, mixing and ball milling 1-2h, subsequently gained slurry is dried, disperse to be dried after 2-3h with other remaining component mix and blend again, make 300-400 order fine powder, obtain.
High antirust aluminium base composite heat dissipation material for described a kind of LED, its manufacture craft comprises following steps:
(1) all the components mix and blend is disperseed, after 1-2h, drop into ball-milling processing in ball mill, make 10000-hole sieve surplus≤0.05% of gained material;
(2) material of step (1) gained is sent into compression moulding in mould, under nitrogen atmosphere, to naturally cool to room temperature after the temperature sintering 4-6h of 650-700 ℃, obtain.
The invention has the advantages that: the advantage that combines the compositions such as aluminium, iron, magnesium nitride, clay, quartz sand, silicon carbide compared with conventional aluminum heat exchanging material on raw material; have good heat conduction and insulating property concurrently; stock yard mixes fully; sintering effect is good; the heat sink material compact structure preparing; any surface finish; weather-proof water-fast; be difficult for corrosion; durable in use; good heat-sinking capability can be good at protecting LED light fixture, delays its light decay speed, thereby obtains good use properties and lasting work-ing life.
Embodiment
Embodiment
The present embodiment LED heat sink material is made by following weight part raw material: aluminium 65, iron 11, magnesium nitride 8, stannous pyrophosphate 1.5, zinc phosphate 2, calcium phosphate 0.5, strontium phosphate 0.1, clay 10, quartz sand 15, silicon carbide 12, mullite 8, auxiliary agent 5.
Described auxiliary agent is made by the raw material of following weight part: the fluorine carbon emulsion 3 of Zinic stearas 3, solid content 45%, magnesium salicylate 5, Sodium Tetraborate 1, inorganic Ge powder 8, four acicular type zinc oxide crystal whisker 15, preparation method is: first Sodium Tetraborate is dissolved in suitable quantity of water, be prepared into concentration and be 10% the aqueous solution, then drop into magnesium salicylate, four acicular type zinc oxide crystal whisker, mixing and ball milling 2h, dries gained slurry subsequently, then disperses to be dried after 3h with other remaining component mix and blend, make 400 order fine powders, obtain.
High antirust aluminium base composite heat dissipation material for described a kind of LED, its manufacture craft comprises following steps:
(1) all the components mix and blend is disperseed, after 2h, drop into ball-milling processing in ball mill, make 10000-hole sieve surplus≤0.05% of gained material;
(2) material of step (1) gained is sent into compression moulding in mould, under nitrogen atmosphere, to naturally cool to room temperature after the temperature sintering 6h of 650-700 ℃, obtain.
The more conventional LED of the prepared heat sink material of the present embodiment improves 18.4% by the intensity of heat sink material, and thermal conductivity improves 36.5%, and thermal diffusivity improves 31.1%, heat balance time shorten in average 160min, and light fixture improves 33.9% work-ing life.

Claims (2)

1. high antirust aluminium base composite heat dissipation material for a LED, it is characterized in that, this heat radiation is made by the raw material of following weight part: aluminium 60-65, iron 10-11, magnesium nitride 5-8, stannous pyrophosphate 1-1.5, zinc phosphate 1-2, calcium phosphate 0.4-0.5, strontium phosphate 0.1-0.2, clay 8-10, quartz sand 12-15, silicon carbide 10-12, mullite 6-8, auxiliary agent 4-5;
Described auxiliary agent is made by the raw material of following weight part: the fluorine carbon emulsion 2-3 of Zinic stearas 1-3, solid content 45%, magnesium salicylate 4-5, Sodium Tetraborate 1-2, inorganic Ge powder 5-8, four acicular type zinc oxide crystal whisker 12-15, preparation method is: first Sodium Tetraborate is dissolved in suitable quantity of water, be prepared into the aqueous solution that concentration is 8-10%, then drop into magnesium salicylate, four acicular type zinc oxide crystal whisker, mixing and ball milling 1-2h, subsequently gained slurry is dried, disperse to be dried after 2-3h with other remaining component mix and blend again, make 300-400 order fine powder, obtain.
2. high antirust aluminium base composite heat dissipation material for a kind of LED as claimed in claim 1, its production method is as follows:
(1) all the components mix and blend is disperseed, after 1-2h, drop into ball-milling processing in ball mill, make 10000-hole sieve surplus≤0.05% of gained material;
(2) material of step (1) gained is sent into compression moulding in mould, under nitrogen atmosphere, to naturally cool to room temperature after the temperature sintering 4-6h of 650-700 ℃, obtain.
CN201410318111.7A 2014-07-07 2014-07-07 A highly-antirust aluminum-based composite heat dissipation material used for LEDs Pending CN104164593A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410318111.7A CN104164593A (en) 2014-07-07 2014-07-07 A highly-antirust aluminum-based composite heat dissipation material used for LEDs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410318111.7A CN104164593A (en) 2014-07-07 2014-07-07 A highly-antirust aluminum-based composite heat dissipation material used for LEDs

Publications (1)

Publication Number Publication Date
CN104164593A true CN104164593A (en) 2014-11-26

Family

ID=51908574

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410318111.7A Pending CN104164593A (en) 2014-07-07 2014-07-07 A highly-antirust aluminum-based composite heat dissipation material used for LEDs

Country Status (1)

Country Link
CN (1) CN104164593A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106631081A (en) * 2016-11-28 2017-05-10 安徽省春谷3D打印智能装备产业技术研究院有限公司 Three-dimensional printed magnesium nitride ceramic material and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007146260A (en) * 2005-11-30 2007-06-14 Pooraito Kk Metallic sliding member including nitrogen-containing compound
CN102776431A (en) * 2012-08-20 2012-11-14 山东交通学院 Tri-iron aluminide intermetallic compound-titanium nitride ceramic composite and method for preparing same
CN102911535A (en) * 2012-10-31 2013-02-06 华南理工大学 Ceramic membrane cooling coating for LED radiator and preparation method of ceramic membrane cooling coating
US20130209308A1 (en) * 2012-02-15 2013-08-15 Baker Hughes Incorporated Method of making a metallic powder and powder compact and powder and powder compact made thereby

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007146260A (en) * 2005-11-30 2007-06-14 Pooraito Kk Metallic sliding member including nitrogen-containing compound
US20130209308A1 (en) * 2012-02-15 2013-08-15 Baker Hughes Incorporated Method of making a metallic powder and powder compact and powder and powder compact made thereby
CN102776431A (en) * 2012-08-20 2012-11-14 山东交通学院 Tri-iron aluminide intermetallic compound-titanium nitride ceramic composite and method for preparing same
CN102911535A (en) * 2012-10-31 2013-02-06 华南理工大学 Ceramic membrane cooling coating for LED radiator and preparation method of ceramic membrane cooling coating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106631081A (en) * 2016-11-28 2017-05-10 安徽省春谷3D打印智能装备产业技术研究院有限公司 Three-dimensional printed magnesium nitride ceramic material and preparation method thereof

Similar Documents

Publication Publication Date Title
CN104195378A (en) LED aluminum-base composite heat dissipation material with high thermal conductivity and high thermal stability
CN104141068A (en) Antistatic insulating aluminum-based composite heat sink material applied to LED
CN104164596A (en) LED aluminum-based composite heat-dissipating material containing modified fly ash
CN104195375B (en) A kind of LED aluminum-base composite heat sink material containing modified bamboo fiber
CN104152751A (en) Modified potassium titanate whisker contained aluminum-based composite heat radiating material for LED
CN104141069A (en) Aluminum-based composite heat radiating material with low heat resistance for LED (Light Emitting Diode)
CN104073696A (en) High-stability aluminum-base composite heat radiating material for LED
CN104195377A (en) Corrosion-resistant and abrasion-resistant aluminum base composite heat dissipating material for LED
CN104087793B (en) A kind of LED high heat transfer aluminum-base composite heat sink material
CN104073695B (en) The aluminum-base composite heat sink material of a kind of LED doping neodymium oxide
CN104087794B (en) A kind of LED enhanced activity aluminum-base composite heat sink material
CN104087792B (en) A kind of LED insulation heatproof aluminum-base composite heat sink material
CN104164593A (en) A highly-antirust aluminum-based composite heat dissipation material used for LEDs
CN104164595A (en) An aluminum-based composite heat dissipation material with good optical properties for LEDs
CN104073694A (en) High-heat conductivity temperature-resistant aluminum-based composite radiating material for LED (Light-Emitting Diode)
CN104711466A (en) Silver powder-containing aluminum-based composite heat dissipating material for high-thermal-conductivity LED
CN104152756A (en) Aluminum-based composite heat radiating material containing modified bentonite for LED (Light-emitting Diode)
CN104152752B (en) A kind of efficient aluminium base composite heat dissipation material of low bulk for LED
CN104073692A (en) Thermally conductive and insulating aluminum base compound radiating material for LED
CN104073693B (en) A kind of LED fine and close aluminum-base composite heat sink material of low cost
CN104164592A (en) A light temperature-resistant aluminum-based composite heat dissipation material used for LEDs
CN104141073A (en) Modified magnesium carbonate containing aluminum-based composite heat dissipating material for LED (Light Emitting Diode)
CN104988361A (en) Aluminum-base composite heat sink material for chitosan-contained LED (Light Emitting Diode)
CN104178708A (en) Aluminum-based composite heat dissipating material containing modified alkali-free glass fibers for LED
CN104141067A (en) Aluminum-based composite heat radiating material containing mesoporous molecular sieves for LED (Light Emitting Diode)

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20141126