CN104159180B - Loud speaker module - Google Patents
Loud speaker module Download PDFInfo
- Publication number
- CN104159180B CN104159180B CN201410438119.7A CN201410438119A CN104159180B CN 104159180 B CN104159180 B CN 104159180B CN 201410438119 A CN201410438119 A CN 201410438119A CN 104159180 B CN104159180 B CN 104159180B
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- module
- antenna
- side wall
- shell
- upper shell
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 35
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 6
- 241000463219 Epitheca Species 0.000 claims description 21
- 238000003466 welding Methods 0.000 claims description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 4
- 239000000178 monomer Substances 0.000 abstract description 10
- 238000005299 abrasion Methods 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 description 11
- 230000000694 effects Effects 0.000 description 3
- 210000003205 muscle Anatomy 0.000 description 3
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Abstract
Loud speaker module provided by the invention includes the module casing of antenna, loudspeaker monomer and the fixed loudspeaker monomer of corresponding receiving；Module casing includes module lower casing and module upper casing, wherein, antenna is arranged on the madial wall of module upper casing, with on module upper casing madial wall not in contact with being equipped with metal screen layer in the corresponding outer side wall surface of antenna part, and, it is formed in the junction of module upper casing and module lower casing fluted, the combined scolding tin of metal screen layer made on metal screen layer and module lower casing lateral wall on module upper casing lateral wall is coated in groove.It can prevent antenna from touching other accessories according to loud speaker module provided by the invention using above-mentioned, to be effectively reduced the abrasion of antenna, prevent antenna from being aoxidized, moreover it is possible to prevent antenna from being interfered by outer signals.
Description
Technical Field
The invention relates to the technical field of speakers, in particular to a speaker module.
Background
With the progress of society and the rapid development of science and technology, the portable multifunctional mobile phone is convenient to carry and comprehensive in function, and can meet the requirements of people on the internet, communication, entertainment and the like, and is popular, such as mobile phones, ipads and the like. The speaker module, which is an important acoustic component in portable electronic products, has a wide demand, and along with the improvement of the requirements of people on portable electronic products, the acoustic performance of the speaker module is also receiving more and more attention from people.
The antenna setting that links to each other with the speaker module under the normal conditions is in the speaker module outside, and the antenna easily contacts with other accessories during the equipment, causes wearing and tearing, and in addition, the antenna that exposes outside the speaker module receives external signal's interference easily, utilizes other part shielding, then can waste the space of speaker module to, shielding effect is not good.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a speaker module to solve the problem that an antenna disposed outside the speaker module is susceptible to signal interference.
The invention provides a loudspeaker module, which comprises an antenna, a loudspeaker monomer and a module shell for correspondingly accommodating and fixing the loudspeaker monomer; the module shell comprises a module lower shell and a module upper shell, wherein the antenna is arranged on the inner side wall of the module upper shell, a metal shielding layer is arranged on the surface of the outer side wall, corresponding to the part, which is not in contact with the antenna, on the inner side wall of the module upper shell, and the metal shielding layer is also arranged on the surface of the outer side wall of the module lower shell; and
the combination department at module epitheca and module inferior valve is formed with the recess, scribbles in the recess and makes the metal shielding layer that sets up on the module epitheca lateral wall surface and set up the soldering tin that the metal shielding layer on the module inferior valve lateral wall surface combines together.
Wherein, be provided with the welding muscle on module epitheca and/or module inferior valve, welding muscle and module epitheca and/or module inferior valve integrated into one piece utilize ultrasonic bonding to melt the welding muscle and make module epitheca and module inferior valve combine together.
In addition, the loudspeaker module further comprises a cable wire, one end of the cable wire is electrically connected with the antenna, and the other end of the cable wire is connected with an external circuit of the loudspeaker module.
Moreover, the loudspeaker monomer comprises a vibration system and a magnetic circuit system; the vibration system comprises a vibrating diaphragm and a voice coil combined on one side of the vibrating diaphragm; the magnetic circuit system comprises a washer, a magnet and a basin frame which are combined in sequence, a magnetic gap is formed by a gap between the outer side surface of the washer and the magnet and the side wall of the basin frame, and the voice coil is contained in the magnetic gap.
Wherein, the speaker monomer still includes the monomer shell, and the space between monomer shell, basin frame and the module casing forms the back acoustic cavity.
In addition, the number of the speaker units is two.
Furthermore, the antenna is a metal layer plated on the inner side wall of the module upper shell.
Arc chamfers are respectively arranged on the outer sides of the edges of the module upper shell and the module lower shell; at the combination department of module epitheca and module inferior valve, the space between the arc chamfer that the module epitheca set up and the arc chamfer that the module inferior valve set up forms the recess.
In addition, the metal shielding layer is a gold layer, and the gold layer is plated on the outer side wall surface corresponding to the antenna part which is not contacted with the inner surface of the side wall of the module upper shell and the outer side wall surface of the module lower shell.
By utilizing the loudspeaker module provided by the invention, the antenna is arranged on the inner side wall of the upper shell of the module, the antenna can be prevented from touching other accessories, so that the abrasion of the antenna is effectively reduced, the antenna can be prevented from being oxidized, and the antenna is prevented from being interfered by external signals by arranging the metal shielding layer on the surface of the outer side wall of the part, which is not in contact with the antenna, of the upper shell of the model.
To the accomplishment of the foregoing and related ends, one or more aspects of the invention comprise the features hereinafter fully described and particularly pointed out in the claims. The following description and the annexed drawings set forth in detail certain illustrative aspects of the invention. These aspects are indicative, however, of but a few of the various ways in which the principles of the invention may be employed. Further, the present invention is intended to include all such aspects and their equivalents.
Drawings
Other objects and results of the present invention will become more apparent and more readily appreciated as the same becomes better understood by reference to the following description and appended claims, taken in conjunction with the accompanying drawings. In the drawings:
fig. 1 is a schematic overall structure diagram of a speaker module according to an embodiment of the invention;
FIG. 2 is a schematic view of a part of the assembly of the speaker module according to the embodiment of the present invention;
fig. 3 is a rear view of the whole structure of the speaker module according to the embodiment of the invention;
FIG. 4 is a cross-sectional view taken along line A-A of FIG. 3;
fig. 5a and 5b are partially enlarged views of fig. 4, respectively.
The same reference numbers in all figures indicate similar or corresponding features or functions.
Wherein the reference numerals include: speaker monomer 1, module epitheca 2, module inferior valve 3, vibrating diaphragm 4, voice coil loudspeaker voice coil 5, china department 6, magnet 7, basin frame 8, shell fragment 9, antenna 10, metallic shield 11, cable line 12, back acoustic cavity 13, soldering tin 14, monomer shell 15.
Detailed Description
In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that such embodiment(s) may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing one or more embodiments.
Specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
In the prior art, the antenna is arranged outside the speaker module and is easily worn by touching other accessories, and the antenna exposed outside the speaker module is easily interfered by external signals.
Fig. 1 shows an overall structure of a speaker module according to an embodiment of the present invention.
As shown in fig. 1, the speaker module provided in the embodiment of the present invention includes a speaker unit 1, a module housing, and an antenna 10; the loudspeaker single body 1 is correspondingly accommodated and fixed in the module shell; the module casing includes module inferior valve 3 and module epitheca 2, and antenna 10 is provided with metallic shield 11 respectively for the structure setting of buckling on the internal surface of a lateral wall of module epitheca 2 and the internal surface of module epitheca 2 bottom on the lateral wall surface that does not touch antenna 10 part and on the diapire surface that does not touch antenna 10 part and correspond with 2 diapire internal surfaces of module epitheca on the lateral wall surface that does not touch antenna 10 part and correspond with module epitheca 2.
Arc chamfers are respectively arranged on the outer sides of the edges of the module upper shell 2 and the module lower shell 3; after the combination of module epitheca 2 and module inferior valve 3, the arc chamfer that module epitheca 2 set up and the arc chamfer that module inferior valve 3 set up between the space form the recess, be scribbled soldering tin 14 (refer to fig. 4) in this recess, after the combination of module epitheca 2 and module inferior valve 3, make the metal shielding layer 11 of module epitheca 2 and module inferior valve 3 link together, can also play the effect of sealed module epitheca 2 and module inferior valve 3.
The edge outer sides of the module upper shell 2 and the module lower shell 3 can also be provided with chamfers with other shapes, and at the joint of the module upper shell 2 and the module lower shell 3, a groove can be formed by a gap between the two chamfers.
The loudspeaker unit 1 comprises a vibration system and a magnetic circuit system, wherein the vibration system comprises a vibrating diaphragm and a voice coil, and the magnetic circuit system comprises a washer, a magnet and a basin frame.
The loudspeaker module also comprises a cable wire 12 and an elastic sheet 9; the elastic sheet plays a role in communicating with the outside of the loudspeaker module, specifically, tin is plated on the elastic sheet 9, a lead of a voice coil wire is welded on the elastic sheet, and then an FPCB (not shown) is welded with the elastic sheet 9 and is connected to the outside of the loudspeaker module through the FPCB; and cable lines are used to connect the antenna 10.
It should be noted that the number of the speaker units 1 may be one or two, and the embodiment of the present invention will take two speaker units as an example.
Fig. 2 shows a structure in which parts of the speaker module according to an embodiment of the present invention are combined together.
As shown in fig. 2, the antenna 10 is disposed on the inner surface of the module top case 2 and the inner surface of the bottom wall of the module top case 2 in the case that the module top case 2, the antenna 10 and the cable wire 12 are combined together, one end of the cable wire 12 is connected to the antenna 10 on the bottom surface of the module top case 2, and the other end is connected to the external circuit of the speaker module.
It should be noted that, in order to prevent the antenna 10 from being oxidized and touched by other accessories, the antenna 10 is disposed on the inner surface of the side wall of the module upper case 2 and the inner surface of the bottom wall of the module upper case 2, specifically, the antenna 10 is a metal layer plated on the inner surface of the side wall of the module upper case 2 and the inner surface of the bottom wall of the module upper case 2, the metal layer may be made of metal such as gold, silver, copper, etc., the antenna 10 receives and transmits signals through a cable wire 12, in order to enable the antenna 10 to receive and transmit signals, the metal shielding layer 11 is not disposed on the surface outside the outer side wall corresponding to the inner side wall where the antenna 10 is located, and in order to prevent external signals from interfering with the antenna 10, the metal shielding layer 11 is disposed on the outer surface of the side.
Fig. 3 shows the back of the structural entirety of the speaker module according to the embodiment of the present invention.
As can be seen from fig. 3, the speaker module includes two speaker units 1 respectively disposed on two sides of the module upper case 2, and one end of the cable 12 is connected to an external circuit of the speaker module.
Fig. 4 is a sectional view taken along line a-a in fig. 3, and in conjunction with fig. 1 and 4, the speaker unit 1 includes a vibration system including a diaphragm 4 and a voice coil 5 coupled to one side of the diaphragm 4, and a magnetic circuit system; the magnetic circuit system comprises a washer 6, a magnet 7 and a basin frame 8 which are combined in sequence, a magnetic gap is formed by a gap between the outer side surfaces of the washer 6 and the magnet 7 and the side wall of the basin frame 8, the voice coil 5 is contained in the magnetic gap, and magnetic lines of force formed by the magnetic circuit system penetrate through the voice coil 5. The voice coil 5 is usually formed by winding a conductive metal wire, such as a copper-clad aluminum wire, and after the voice coil is connected with an electric signal, an ampere force is applied to a magnetic field formed by a magnetic circuit system, and because the voice coil is connected with an alternating signal, the magnitude and the direction of the applied ampere force are changed corresponding to the signal; receive the effect of ampere force, voice coil loudspeaker voice coil 5 vibrates from top to bottom in the magnetic gap, because voice coil loudspeaker voice coil 5 is fixed combination as an organic whole with vibrating diaphragm 4, drives vibrating diaphragm 4 vibration by voice coil loudspeaker voice coil 5's vibration to produce sound.
As can be seen from fig. 1 and 4, the speaker unit 1 further includes a unit housing 15, a rear acoustic cavity 13 is formed by the unit housing 15, the frame 8, and a space between the module housing upper shell 2 and the module housing lower shell 3, and the rear acoustic cavity 13 is a closed space.
Fig. 5a is a partial enlarged view of fig. 4, and referring to fig. 5a, fig. 2 and fig. 4, the metal shielding layer 11 is a metal layer plated on the outer surface of the side wall of the module case, specifically, the metal shielding layer 11 is plated on the outer surface of the side wall corresponding to the inner surface of the side wall of the module upper case 2 not contacting the antenna 10, and is also plated on the outer surface of the bottom wall corresponding to the portion of the inner surface of the bottom wall of the module upper case 2 not contacting the antenna 10, and the outer surface of the outer side wall of the module lower case 3, that is, the outer surface of the side wall on the left side of the module upper case 2 and the model lower case 3.
Fig. 5a is an enlarged view of the junction of the side walls of the module upper case 2 and the module lower case 3 plated with the metal shielding layer 11, and it can be seen from fig. 5a that the module upper case 2 and the module lower case 3 have characteristic shapes, the outer sides of the edges of the module upper case 2 and the module lower case 3 are both arc chamfers, and after the module upper case 2 and the module lower case 3 are assembled together, the two arc chamfers form a groove at the junction of the module upper case 2 and the module lower case 3, and fig. 5a shows only one position of the groove, and in combination with fig. 1, the groove is not formed at a certain position of the junction but a circle around the junction, and the junction of the module upper case 2 and the module lower case 3 is designed as a groove for storing solder paste, and since the solder paste is not cured at normal temperature, the outer sides of the edges of the conventional module upper case and the module lower case are not in a chamfered shape, and naturally there is no groove formed by chamfers at the junction of the module upper case and, the solder paste at normal temperature cannot be stored without the groove, and the solder paste flows to four positions, so the embodiment of the invention designs the module upper shell and the module lower shell with the outer sides of the edges in the shape of the arc-shaped chamfer.
The solder paste is melted at a high temperature of about 200 ℃, and the melted solder paste is solidified into the solder 14 (the solder formed after the solder paste is solidified in fig. 4, 5a, and 5 b).
On the other hand, the solder 14 is coated in the groove formed at the joint of the module upper shell 2 and the module lower shell 3 in order to connect the metal shielding layers 11 respectively coated on the outer surface of the module upper shell 2 and the outer surface of the module lower shell 3 together to form an integral shielding case, and also play a role in sealing the module upper shell 2 and the module lower shell 3.
In addition, welding ribs (not shown) are arranged at the edges of the module upper shell 2 and/or the module lower shell 3, and the welding ribs and the module upper shell 2 and/or the module lower shell 3 are integrally formed, and the module upper shell 2 and the module lower shell 3 are combined together by melting the welding ribs through ultrasonic welding in the embodiment of the invention, but the welding ribs can be melted in other modes to combine the module upper shell 2 and the module lower shell 3 together.
Fig. 5b is another enlarged view of a portion of fig. 4, and referring to fig. 5b, fig. 2 and fig. 4, since the antenna 10 is plated on the inner surface of the sidewall on the right side of the upper housing of the module in fig. 4, the outer surface of the sidewall on the right side of the upper housing of the module in fig. 4 is not plated with the metal shielding layer 11.
As can also be seen in fig. 5b, the antenna 10 is plated on the inner surface of the side wall of the module upper case 2, and the solder 14 is applied in the groove formed at the junction of the module upper case 2 and the module lower case 3.
The metal shielding layer 11 is preferably made of gold, which can protect the antenna 10 from oxidation, but other metals may be used as the material of the metal shielding layer 11, and the metal shielding layer 11 is disposed outside the module housing to prevent short circuit caused by contact between other structures inside the speaker module and the metal shielding layer 11.
The speaker module according to the embodiment of the present invention is described in detail above, because the antenna is plated on the inner side of the module housing, the antenna can be prevented from touching other accessories, the loss of the antenna can be reduced, the antenna can also be prevented from being oxidized, and meanwhile, the metal shielding layer is disposed on the outer side of the module housing, which is not in contact with the antenna, so as to better shield the interference of external signals to the antenna.
The loudspeaker module proposed according to the invention is described above by way of example with reference to the accompanying drawings. However, it will be understood by those skilled in the art that various modifications in details of the implementation of the speaker module set forth in the above description may be made without departing from the spirit of the invention. Therefore, the scope of the present invention should be determined by the contents of the appended claims.
Claims (9)
1. A loudspeaker module comprises an antenna, a loudspeaker single body and a module shell correspondingly accommodating and fixing the loudspeaker single body; the module casing includes module inferior valve and module epitheca that the combination is in the same place, its characterized in that:
the antenna is arranged on the inner side wall of the module upper shell, a metal shielding layer is arranged on the surface of the outer side wall, corresponding to the antenna part which is not contacted with the inner side wall of the module upper shell, of the outer side wall, and a metal shielding layer is also arranged on the surface of the outer side wall of the module lower shell; and
and a groove is formed at the joint of the module upper shell and the module lower shell, and soldering tin which enables the metal shielding layer arranged on the surface of the outer side wall of the module upper shell and the metal shielding layer arranged on the surface of the outer side wall of the module lower shell to be combined together and seals the module upper shell and the module lower shell is coated in the groove.
2. The speaker module of claim 1,
the module upper shell and/or the module lower shell are/is provided with welding ribs, the welding ribs and the module upper shell and/or the module lower shell are/is integrally formed, and the welding ribs are melted by ultrasonic welding to enable the module upper shell and the module lower shell to be combined together.
3. The speaker module of claim 1,
the loudspeaker module further comprises a cable wire, one end of the cable wire is electrically connected with the antenna, and the other end of the cable wire is connected with an external circuit of the loudspeaker module.
4. The speaker module of claim 1,
the loudspeaker single body comprises a vibration system and a magnetic circuit system; wherein,
the vibration system comprises a vibrating diaphragm and a voice coil combined on one side of the vibrating diaphragm;
the magnetic circuit system comprises a washer, a magnet and a basin frame which are combined in sequence, a magnetic gap is formed by a gap between the washer, the outer side surface of the magnet and the side wall of the basin frame, and the voice coil is contained in the magnetic gap.
5. The speaker module of claim 4,
the loudspeaker unit further comprises a unit shell, and a rear sound cavity is formed in the space between the unit shell and the basin frame and between the module shells.
6. The speaker module of claim 1,
the number of the loudspeaker single bodies is two.
7. The speaker module of claim 1,
the antenna is a metal layer plated on the inner side wall of the module upper shell.
8. The speaker module of claim 1,
arc chamfers are respectively arranged on the outer sides of the edges of the module upper shell and the module lower shell; the joint of module epitheca with the module inferior valve, the arc chamfer that the module epitheca set up with the space between the arc chamfer that the module inferior valve set up forms the recess.
9. The speaker module of any one of claims 1-8,
the metal shielding layer is a gold layer, and the gold layer is plated on the outer side wall surface corresponding to the inner side wall of the module upper shell which is not in contact with the antenna part and the outer side wall surface of the module lower shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410438119.7A CN104159180B (en) | 2014-08-29 | 2014-08-29 | Loud speaker module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410438119.7A CN104159180B (en) | 2014-08-29 | 2014-08-29 | Loud speaker module |
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| Publication Number | Publication Date |
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| CN104159180A CN104159180A (en) | 2014-11-19 |
| CN104159180B true CN104159180B (en) | 2018-07-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410438119.7A Active CN104159180B (en) | 2014-08-29 | 2014-08-29 | Loud speaker module |
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| Country | Link |
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| CN (1) | CN104159180B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101633856B1 (en) * | 2015-04-20 | 2016-07-21 | 주식회사 에이치시티엠 | Coil type loop antenna for mobile device |
| CN107637096A (en) * | 2015-06-17 | 2018-01-26 | 奥音科技（北京）有限公司 | Integrated acoustic receiver and antenna equipment and operating method |
| CN204929249U (en) * | 2015-08-31 | 2015-12-30 | 歌尔声学股份有限公司 | Miniature sounder |
| CN114268686A (en) * | 2021-12-31 | 2022-04-01 | 深圳市安卫普科技有限公司 | Shell of interference device |
| CN115674614B (en) * | 2022-12-30 | 2023-04-14 | 广东美的制冷设备有限公司 | Mould subassembly and injection molding machine |
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| CN101080876A (en) * | 2004-12-15 | 2007-11-28 | 京瓷无线公司 | Stack-up configuration for a wireless communication device |
| CN101360137A (en) * | 2007-07-30 | 2009-02-04 | 京瓷株式会社 | Portable wireless apparauts |
| CN103856864A (en) * | 2012-12-04 | 2014-06-11 | 深圳富泰宏精密工业有限公司 | Portable electronic device with loudspeaker assembly |
| CN103868542A (en) * | 2012-12-10 | 2014-06-18 | 北京普源精电科技有限公司 | Measurement device with sealed interface |
| CN203690480U (en) * | 2014-01-14 | 2014-07-02 | 歌尔声学股份有限公司 | LDS antenna structure of electronic product |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101431175A (en) * | 2007-11-06 | 2009-05-13 | 台达电子工业股份有限公司 | Radio communication device |
| CN203387655U (en) * | 2013-06-29 | 2014-01-08 | 歌尔声学股份有限公司 | Loudspeaker module group |
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- 2014-08-29 CN CN201410438119.7A patent/CN104159180B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101080876A (en) * | 2004-12-15 | 2007-11-28 | 京瓷无线公司 | Stack-up configuration for a wireless communication device |
| CN101360137A (en) * | 2007-07-30 | 2009-02-04 | 京瓷株式会社 | Portable wireless apparauts |
| CN103856864A (en) * | 2012-12-04 | 2014-06-11 | 深圳富泰宏精密工业有限公司 | Portable electronic device with loudspeaker assembly |
| CN103868542A (en) * | 2012-12-10 | 2014-06-18 | 北京普源精电科技有限公司 | Measurement device with sealed interface |
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| CN104159180A (en) | 2014-11-19 |
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Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Applicant after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Applicant before: Goertek Inc. |
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