CN104124331A - 一种led的散热装置 - Google Patents

一种led的散热装置 Download PDF

Info

Publication number
CN104124331A
CN104124331A CN201410317415.1A CN201410317415A CN104124331A CN 104124331 A CN104124331 A CN 104124331A CN 201410317415 A CN201410317415 A CN 201410317415A CN 104124331 A CN104124331 A CN 104124331A
Authority
CN
China
Prior art keywords
conduction material
heat conduction
heat
led
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410317415.1A
Other languages
English (en)
Inventor
张逸兴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201410317415.1A priority Critical patent/CN104124331A/zh
Publication of CN104124331A publication Critical patent/CN104124331A/zh
Priority to KR1020167036876A priority patent/KR101938466B1/ko
Priority to US15/320,837 priority patent/US20170162772A1/en
Priority to EP15815941.8A priority patent/EP3166153B1/en
Priority to PCT/CN2015/083294 priority patent/WO2016000662A1/zh
Priority to JP2016576040A priority patent/JP6587641B2/ja
Priority to US17/484,559 priority patent/US20220010952A1/en
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

本发明公开了一种LED的散热装置，该装置包含一束或几束导热材料丝，LED芯片的散热外壳通过导热材料或直接与所述导热材料丝的一端接触，把热量传递给这些导热材料丝，并通过这些导热材料丝加热周围的空气；所述导热材料丝被安置在能流通空气的管道里，靠空气的流动，带走热量，所述管道由绝缘材料构成。本发明可以在保证LED芯片适当的工作温度的条件下，成倍地减少LED散热装置的重量和体积，并确保整个散热装置对地的绝缘。

Description

一种LED的散热装置
技术领域
本发明属于照明电器领域，具体涉及一种LED的散热装置。
 
背景技术
作为绿色照明，LED有着一系列突出的优点。当前LED照明产业正处于爆发式增长的阶段。
但是我们看到，尽管LED相对别的光源有比较高的发光效率，它从电源得到的能量，一多半仍然是用来发热。对于LED来说，一个不大的LED芯片在发光的同时，总是产生大量的热量，而这个发热将会直接影响到LED的正常运行。
随着LED功率的增大，为了增加散热器的散热表面面积，如今的散热器是做得越来越庞大，越来越笨重，而收效却相对甚微。因此LED的散热问题，已经是一个必须优先考虑的问题。
 
发明内容
本发明的目的是提供一种LED的散热装置，能够使得在保证LED芯片适当的工作温度的条件下，可以成倍地减少LED散热装置的重量和体积，同时还能确保整个散热装置对地的绝缘。
本发明提供一种LED的散热装置，该装置包含大量由导热材料构成的柱状体，所述导热材料的柱状体的直径小于2毫米，最小直径大于0.01毫米； LED芯片的散热外壳通过导热材料或直接与所述导热材料构成的柱状体的一端接触，对柱状体周围的空气加热，热量通过空气的流动被带走。
本发明提供的LED的散热装置中，所述导热材料的柱状体的直径小于0.3毫米，从而所述由导热材料构成的柱状体成了一束或几束导热材料丝；LED芯片的散热外壳通过导热材料或直接与所述导热材料丝的一端接触，把热量传递给所述导热材料丝，加热所述导热材料丝周围的空气；热量通过这些空气的流动被带走。 
更进一步，可以把LED芯片的散热外壳直接与所述导热材料丝的一端融为一体；LED芯片直接通过它的散热外壳上的导热材料丝加热导热材料丝周围的空气，热量通过这些空气的流动被带走。
这里，所述导热材料可以是铜；所述导热材料的柱状体为铜柱，所述导热材料丝为铜丝。
所述导热材料的柱状体或所述导热材料丝的表面可以覆盖一层保护层，用以防止所述导热材料的柱状体或所述导热材料丝被氧化、腐蚀或污染。
具体地说，所述表面覆盖的一层保护层可以是一层银镀层，所述表面覆盖一层保护层的的导热材料的柱状体即为镀银铜柱，所述表面覆盖一层保护层的的导热材料丝为镀银铜丝。
本发明提供的LED的散热装置中，所述导热材料的柱状体或所述导热材料丝被安置在能流通空气的管道里；管道内接入风机，依靠风机推动空气流通，带走热量。 
本发明提供的LED的散热装置也可以不接入风机，而是将所述导热材料的柱状体或所述导热材料丝安置在能流通空气，而且管道的出口和入口之间存在一定的高度差的管道里，利用空气受热膨胀变轻，导致出口和入口之间产生的压差，推动空气流通，带走热量。
更进一步，该装置还可以包括一段专门流通空气的管道，用以储存被加热的空气；所述专门流通空气的管道的出口和入口之间存在一定的高度差，利用空气受热膨胀变轻，进一步形成压差，加速推动空气流通，带走热量。
前面所述管道，可以由绝缘材料构成，以确保整个散热装置对地的绝缘。
本发明将LED的散热装置由通常的庞大笨重的铝型材变成为一些可以装在塑料管道中的金属丝，这些金属丝的散热效果，通过以下的简单计算就不难看出。
我们知道，对于半径为r，高为h的圆柱体，它的体积 
V=πr2h       
而它的侧面积
S=2πrh
因此，对于同样体积的圆柱体，圆柱面的面积与半径成反比。这样，线径0.1毫米的铜丝的表面积是相同体积的一个直径1厘米的铜柱的侧面积100倍。
因此，我们只要用少量的铜丝就能得到足够的散热面积。这样，在保证LED芯片适当的工作温度的条件下，可以成倍地减少LED散热装置的重量和体积，同时还能确保整个散热装置对地的绝缘。这对于LED的散热装置来说，应该是一个根本的变革。
 
附图说明
图1为本发明LED芯片与焊接在LED芯片散热外壳上的多股铜丝。
图2为本发明一种LED的散热装置的示意图。
 
具体实施方式
如附图1所示，以多股铜丝作为一束导热材料丝，直接焊接在LED芯片的散热外壳上。散热外壳把热量传递给这些铜丝，对铜丝周围的空气加热；热量通过这些空气的流动被带走。
这些铜丝的表面覆盖一层保护层，用以防止所述导热材料的柱状体被氧化、腐蚀或污染。
LED芯片的散热外壳也可直接与铜丝的一端融为一体。
如附图2所示，以多个焊有多股铜丝的LED芯片集合在一起，并把它们适当排列，安置在一个流通空气的塑料管道中。
所述塑料管道的出口和入口之间存在一定的高度差，利用空气受热膨胀变轻，进一步形成压差，推动空气流通，带走热量。
所述管道由绝缘材料构成，以确保整个散热装置对地的绝缘。
适当连接LED芯片，并接通适当的驱动电源，就得到我们所需要的LED灯具。
 
本发明将LED的散热装置由通常的庞大笨重的铝型材变成为一些可以装在塑料管道中的金属丝，这使得在保证LED芯片适当的工作温度的条件下，可以成倍度地减少LED散热装置的重量和体积，同时还能确保整个散热装置对地的绝缘。 

Claims (10)

1.一种LED的散热装置，其特征在于：该装置包含大量由导热材料构成的柱状体，所述导热材料的柱状体的直径大于0.01毫米小于2毫米，LED芯片的散热外壳通过导热材料或直接与所述导热材料构成的柱状体的一端接触，对柱状体周围的空气加热，热量通过空气的流动被带走。
2.根据权利要求1所述的LED的散热装置，其特征在于：所述导热材料的柱状体的直径小于0.3毫米，从而所述由导热材料构成的的柱状体成了一束或几束导热材料丝；LED芯片的散热外壳通过导热材料或直接与所述导热材料丝的一端接触，把热量传递给所述导热材料丝，加热所述导热材料丝周围的空气；热量通过这些空气的流动被带走。
3.根据权利要求2所述的LED的散热装置，其特征在于：LED芯片的散热外壳直接与所述导热材料丝的一端融为一体；LED芯片直接通过它的散热外壳上的导热材料丝加热导热材料丝周围的空气，热量通过这些空气的流动被带走。
4.根据权利要求1、2、和3所述的LED的散热装置，其特征在于：所述导热材料为铜；所述导热材料的柱状体为铜柱，所述导热材料丝为铜丝。
5.根据权利要求1、2、3和4所述的LED的散热装置，其特征在于：所述导热材料的柱状体或所述导热材料丝的表面覆盖一层保护层，用以防止所述导热材料的柱状体或所述导热材料丝被氧化、腐蚀或污染。
6.根据权利要求5所述的LED的散热装置，其特征在于：所述表面覆盖的一层保护层为一层银镀层，所述表面覆盖一层保护层的的导热材料的柱状体为镀银铜柱，所述表面覆盖一层保护层的的导热材料丝为镀银铜丝。
7.根据权利要求1、2、3、4、5、和6所述的LED的散热装置，其特征在于：所述导热材料的柱状体或所述导热材料丝被安置在能流通空气的管道里；管道内接入风机，依靠风机推动空气流通，带走热量。
8.根据权利要求1、2、3、4、5、和6所述的LED的散热装置，其特征在于：所述导热材料的柱状体或所述导热材料丝被安置在能流通空气的管道里；所述管道的出口和入口之间存在一定的高度差，利用空气受热膨胀变轻，导致出口和入口之间产生的压差，推动空气流通，带走热量。
9.根据权利要求8所述的LED的散热装置，其特征在于：该装置还包括一段专门流通空气的管道，用以储存被加热的空气；所述专门流通空气的管道的出口和入口之间存在一定的高度差，利用空气受热膨胀变轻，进一步形成压差，加速推动空气流通，带走热量。
10.根据权利要求7、8、9所述的LED的散热装置，其特征在于：所述管道由绝缘材料构成，以确保整个散热装置对地的绝缘。
CN201410317415.1A 2014-07-04 2014-07-04 一种led的散热装置 Pending CN104124331A (zh)

Priority Applications (7)

Application Number Priority Date Filing Date Title
CN201410317415.1A CN104124331A (zh) 2014-07-04 2014-07-04 一种led的散热装置
KR1020167036876A KR101938466B1 (ko) 2014-07-04 2015-07-03 Led 방열 장치
US15/320,837 US20170162772A1 (en) 2014-07-04 2015-07-03 Heat-dissipation device of led
EP15815941.8A EP3166153B1 (en) 2014-07-04 2015-07-03 Heat-dissipation device of led
PCT/CN2015/083294 WO2016000662A1 (zh) 2014-07-04 2015-07-03 一种led的散热装置
JP2016576040A JP6587641B2 (ja) 2014-07-04 2015-07-03 Ｌｅｄの放熱装置
US17/484,559 US20220010952A1 (en) 2014-07-04 2021-09-24 Heat-dissipation device of led

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410317415.1A CN104124331A (zh) 2014-07-04 2014-07-04 一种led的散热装置

Publications (1)

Publication Number Publication Date
CN104124331A true CN104124331A (zh) 2014-10-29

Family

ID=51769672

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410317415.1A Pending CN104124331A (zh) 2014-07-04 2014-07-04 一种led的散热装置

Country Status (6)

Country Link
US (1) US20170162772A1 (zh)
EP (1) EP3166153B1 (zh)
JP (1) JP6587641B2 (zh)
KR (1) KR101938466B1 (zh)
CN (1) CN104124331A (zh)
WO (1) WO2016000662A1 (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104643899A (zh) * 2015-03-09 2015-05-27 王德普 灶具组合物及其用途
CN105114920A (zh) * 2015-09-17 2015-12-02 张逸兴 一种利用导热材料线材编织物换热的装置
WO2016000662A1 (zh) * 2014-07-04 2016-01-07 张逸兴 一种led的散热装置
CN106195951A (zh) * 2016-08-24 2016-12-07 佛山市南海领上照明有限公司 散热器
US11085626B2 (en) 2015-09-17 2021-08-10 Yixing ZHANG Apparatus for heat exchange by using braided fabric woven from thermally conductive wire material

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1655346A (zh) * 2004-02-13 2005-08-17 上海三思科技发展有限公司 一种改善led温升的散热针结构
US20130027947A1 (en) * 2011-07-29 2013-01-31 Villard Russell G Light emitting die (led) lamps, heat sinks and related methods
CN103574547A (zh) * 2012-07-18 2014-02-12 欧司朗股份有限公司 制造散热装置的方法和散热装置以及照明装置

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS512727Y2 (zh) * 1971-03-22 1976-01-27
US5083194A (en) * 1990-01-16 1992-01-21 Cray Research, Inc. Air jet impingement on miniature pin-fin heat sinks for cooling electronic components
JP3692437B2 (ja) * 1997-05-21 2005-09-07 昭和電工株式会社 ヒートシンクの製造方法
JP4221353B2 (ja) * 2004-11-19 2009-02-12 Ｎｅｃディスプレイソリューションズ株式会社 光源装置及び投写型表示装置
JP4872296B2 (ja) * 2005-09-30 2012-02-08 日亜化学工業株式会社 シリコーンゴム封止型発光装置、及び該発光装置の製造方法
JP2008053564A (ja) * 2006-08-25 2008-03-06 Matsushita Electric Ind Co Ltd 光半導体装置およびその製造方法
CN100572908C (zh) * 2006-11-17 2009-12-23 富准精密工业(深圳)有限公司 发光二极管灯具
CN101349519A (zh) * 2007-07-18 2009-01-21 富准精密工业(深圳)有限公司 热管
JP5207681B2 (ja) * 2007-07-27 2013-06-12 キヤノン株式会社 画像投射装置及び画像表示システム
US7628522B2 (en) * 2007-12-29 2009-12-08 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Light emitting diode lamp
CN201277525Y (zh) * 2008-08-08 2009-07-22 龙国庆 具有热管功能的大功率led灯散热器
CN102105980B (zh) * 2008-07-25 2013-07-24 皇家飞利浦电子股份有限公司 用于冷却半导体管芯的冷却装置
JP2010082636A (ja) * 2008-09-30 2010-04-15 Allied Material Corp 柱状部材の溶接方法、放熱部材の製造方法および放熱部材
JP4813582B2 (ja) * 2009-01-30 2011-11-09 株式会社 近藤工芸 Ｌｅｄランプ
US20110110095A1 (en) * 2009-10-09 2011-05-12 Intematix Corporation Solid-state lamps with passive cooling
JP2011155117A (ja) * 2010-01-27 2011-08-11 Fdk Corp コイルの放熱構造
US9810418B2 (en) * 2010-08-12 2017-11-07 Micron Technology, Inc. Solid state lights with cooling structures
US8858040B2 (en) * 2010-08-23 2014-10-14 Cooliance, Inc. Cooling methodology for high brightness light emitting diodes
US8415704B2 (en) * 2010-09-22 2013-04-09 Ut-Battelle, Llc Close-packed array of light emitting devices
KR101789825B1 (ko) * 2011-04-20 2017-11-20 엘지이노텍 주식회사 자외선 발광 다이오드를 이용한 발광소자 패키지
JP5756332B2 (ja) * 2011-04-26 2015-07-29 住友精密工業株式会社 ヒートシンク
CN102252300A (zh) * 2011-07-05 2011-11-23 广州光为照明科技有限公司 一种新型散热led路灯模组散热器
US20130062656A1 (en) * 2011-09-13 2013-03-14 Inpaq Technology Co., Ltd. Thermally enhanced optical package
EP2720265A1 (de) * 2012-10-12 2014-04-16 IDEA Korb AG Kühlkörper für Leuchtdiodenarray
FR3004787B1 (fr) * 2013-04-19 2017-09-08 Valeo Vision Organe de refroidissement et dispositif d'eclairage ou de signalisation de vehicule automobile comprenant un tel organe
US9374904B2 (en) * 2014-01-10 2016-06-21 i2C Solutions, LLC Thermal ground planes and light-emitting diodes
CN104124331A (zh) * 2014-07-04 2014-10-29 张逸兴 一种led的散热装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1655346A (zh) * 2004-02-13 2005-08-17 上海三思科技发展有限公司 一种改善led温升的散热针结构
US20130027947A1 (en) * 2011-07-29 2013-01-31 Villard Russell G Light emitting die (led) lamps, heat sinks and related methods
CN103574547A (zh) * 2012-07-18 2014-02-12 欧司朗股份有限公司 制造散热装置的方法和散热装置以及照明装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016000662A1 (zh) * 2014-07-04 2016-01-07 张逸兴 一种led的散热装置
CN104643899A (zh) * 2015-03-09 2015-05-27 王德普 灶具组合物及其用途
CN105114920A (zh) * 2015-09-17 2015-12-02 张逸兴 一种利用导热材料线材编织物换热的装置
WO2017045651A1 (zh) * 2015-09-17 2017-03-23 张逸兴 一种利用导热材料线材编织物换热的装置
JP2018538682A (ja) * 2015-09-17 2018-12-27 ヂャン イーシンＺＨＡＮＧ， Ｙｉｘｉｎｇ 熱伝導性ワイヤ編物を用いた熱交換装置
US10697624B2 (en) 2015-09-17 2020-06-30 Yixing ZHANG Apparatus for heat exchange by using braided fabric woven from thermally conductive wire material
US11085626B2 (en) 2015-09-17 2021-08-10 Yixing ZHANG Apparatus for heat exchange by using braided fabric woven from thermally conductive wire material
CN106195951A (zh) * 2016-08-24 2016-12-07 佛山市南海领上照明有限公司 散热器

Also Published As

Publication number Publication date
EP3166153A4 (en) 2017-05-10
KR20170013346A (ko) 2017-02-06
EP3166153B1 (en) 2018-10-24
US20170162772A1 (en) 2017-06-08
JP6587641B2 (ja) 2019-10-09
KR101938466B1 (ko) 2019-01-14
WO2016000662A1 (zh) 2016-01-07
EP3166153A1 (en) 2017-05-10
JP2017521863A (ja) 2017-08-03

Similar Documents

Publication Publication Date Title
CN104124331A (zh) 一种led的散热装置
CA2716832C (en) Heat removal system and method for light emitting diode lighting apparatus
CN102494317A (zh) 大型led灯具***的水冷装置及水冷却方法
JP2019525391A5 (zh)
CN201697084U (zh) 发光二极管灯具及其具卷绕式热管的散热器
CN105953191B (zh) 散热灯具
CN103388764A (zh) Led照明灯
CN206449428U (zh) 一种led灯散热结构
CN201069139Y (zh) 具有散热结构的led灯具装置
CN101109500A (zh) 耦合高效率均热/散热模块的高功率丛集发光二极管照明设备
CN103206696A (zh) 冷却装置和具有该冷却装置的照明装置和改型灯
CN203586153U (zh) 一种车用led灯散热器
CN106016206B (zh) Led照明设备
CN105423152A (zh) 一种led灯
CN203823529U (zh) 一种重力热管式集成led灯
CN204614815U (zh) 一种带有散热装置大功率led芯片
CN203948986U (zh) 一种含有散热型双头式led的发光装置
CN203068211U (zh) Led照明灯
CN104251402A (zh) 流体冷却式灯具
CN101691921A (zh) 灯泡式led散热结构
US20220010952A1 (en) Heat-dissipation device of led
CN203489218U (zh) 一种对流增强型led导轨射灯的散热结构
CN204756503U (zh) 一种用led灯芯与热管复合散热的均匀漫射点光源装置
CN203442763U (zh) Led灯灯壳散热结构
CN204164999U (zh) 一种液冷式led灯导热柱

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination