CN104118843B - Nano-structure array material and preparation method thereof - Google Patents

Nano-structure array material and preparation method thereof Download PDF

Info

Publication number
CN104118843B
CN104118843B CN201410356646.3A CN201410356646A CN104118843B CN 104118843 B CN104118843 B CN 104118843B CN 201410356646 A CN201410356646 A CN 201410356646A CN 104118843 B CN104118843 B CN 104118843B
Authority
CN
China
Prior art keywords
nano
sic
preparation
array
heavy doping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201410356646.3A
Other languages
Chinese (zh)
Other versions
CN104118843A (en
Inventor
谈嘉慧
陈之战
石旺舟
何鸿
张永平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Normal University
Original Assignee
Shanghai Normal University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Normal University filed Critical Shanghai Normal University
Priority to CN201410356646.3A priority Critical patent/CN104118843B/en
Publication of CN104118843A publication Critical patent/CN104118843A/en
Application granted granted Critical
Publication of CN104118843B publication Critical patent/CN104118843B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

Nano-structure array material of the present invention and preparation method thereof, a kind of high temperature resistant, wide bandgap semiconductor 4H crystal formation carbofrax materials that are anticorrosive, possessing nano-wire array and preparation method thereof are referred specifically to, is related to nano-structure array field of material technology.The present invention includes the SiC nanowire of different crystal forms, such as the SiC nanowire of 3C, 4H and 6H crystal formation, such as it is based on n-type heavy doping 4H SiC substrates, even mesoporous array is obtained by selecting appropriate pulse frequency and residence time to apply permanent pulse current to the two poles of the earth, then suitably increase electric current forward direction accounts for width than causing base apertures to depart from substrate with current density, and the nano-wire array is obtained by stripping means.It has the advantages that simple and reliable, repetitive rate is high, and nano-wire array density is high, and saving prepares cost.For power electronics and field of aerospace, using high carrier mobility, thermal conductivity is anticorrosive, it is high pressure resistant the advantages that silicon carbide products, there is provided solid technology material base.

Description

Nano-structure array material and preparation method thereof
Technical field
The present invention relates to nano-structure array field of material technology, refer specifically to a kind of high temperature resistant, it is anticorrosive, possess nano wire Wide bandgap semiconductor 4H crystal formation carbofrax materials of array and preparation method thereof.
Background technology
As the carbofrax material of third generation semiconductor, possesses high carrier mobility, thermal conductivity is anticorrosive, high pressure resistant Etc. the multinomial advantage better than first generation semiconductor, the carborundum of same nanostructured also possesses above advantage, makes it be expected to challenge Status of the first generation nanostructured silicon materials on sensor, feds and energy storage device.At present, 3C-SiC and 6H-SiC Nano wire can be prepared by vapor phase method, liquid phase method, solid phase method, but the carborundum of this kind of crystal formation is in most performances It is difficult to obtained 4H crystal formations, high quality, silicon carbide nanometer line not as good as 4H-SiC, and by such method.4H- is prepared so exploring The method of SiC nanowire has great importance.Such method is also applied to the preparation of other materials nano-structure array material, The especially preparation of the SiC nanowire of different crystal forms, such as the SiC nanowire of 3C, 4H and 6H crystal formation.
The content of the invention
It is an object of the invention to overcome in the prior art 4H crystal formations SiC nanowire array be difficult to the present situation prepared, propose A kind of method being combined by electrochemical etching and simple stripping means obtains 4H crystal formation SiC nanowire arrays.The method It is equally applicable to the preparation of the nano-structure array material of other materials.
A kind of nano-structure array material of the present invention, its feature, received comprising means are peeled off again through nanostructured modulation Rice material structure array.Such as a kind of 4H crystal formations SiC nanowire array material, its feature, comprising based on n-type heavy doping 4H-SiC linings Bottom, thickness are 300~500 μm, twin polishing, the 4H crystal formation SiC nanowires for peeling off to obtain in C faces are prepared into through electrochemical etching Array.
Wherein, the nano wire wire range is 10-20nm, and nanometer length scope is 3-5 μm, and single nano-wire structure is Calabash shaped nano thread structure, it is 5nm often to tie cucurbit structure longitudinal length, and nano-wire array area is 1cm2Circular array.
The n-type heavy doping 4H-SiC wafers are that the crystal ingot by the growth of PVT methods is oriented, cut, twin polishing, double The industrialization chip that face CMP planarization obtains, area 100cm2
The n-type heavy doping 4H-SiC substrate thickness is 320 μm, and optimal nano wire line footpath often ties cucurbit in 15nm or so For the nanowire length of shape part in 5nm or so, nanowire length is about 5 μm, etching area about 1cm2Circular etched surface.
The preparation method of nano-array material of the present invention, embodiment comprise the following steps:
Step 1, highly doped n-type 4H-SiC samples are prepared.
Step 2, by it is double lead copper foil and be cut into area be slightly less than the square of sample, then uniform adhesion is in sample Si faces.Will Sample is fixed on etching cell body anode position, by platinum guaze negative electrode as 2cm directly over anode at.Configure hydrofluoric acid 49%:Ethanol 99%:Hydrogen peroxide 30%=3:6:The mixed liquor of 1 volume ratio is as electrolyte.Setpoint frequency is 2500Hz forward current, just To electric current 100%, current density 40mA/cm2, forward direction accounts for the wide constant-current pulse than for 50%, and power-on, the time is 3min, then forward direction accounted for wide than being promoted to 100% or current density being promoted into 80mA/cm2, time 30s.
Step 3, take out sample and be soaked in 2min in the solution of ethanol 99%, be then placed into air and treat that ethanol is waved completely Hair, skin layer is peeled off by peeling off means, the present embodiment leads copper foil to peel off the layer using double, that is, obtains described 4H crystal formations SiC nanowire array.
As described above, a kind of preparation method of nano-structure array material of the present invention, is such as served as a contrast based on n-type heavy doping 4H-SiC The preparation method of bottom nano-wire array, obtained by selecting appropriate pulse frequency and residence time to apply permanent pulse current to the two poles of the earth To even mesoporous array, then suitably increase electric current forward direction accounts for wide than causing base apertures to depart from substrate with current density, hole wall As nano wire, then obtain the nano-wire array by stripping means.The characteristics of material, is compared to the material prepared more in the past For material feature, there is nano-wire array density height, nano wire crystal formation is 4H crystal formations etc., and the array preparation is compared to more conventional Preparation technology for, there is simple and reliable, the advantages that repetitive rate is high.The preparation for deriving device for its high-performance is brought just Profit.
Embodiment
The present invention is described in further detail with reference to embodiments
A kind of preparation flow of 4H crystal formations SiC nanowire described in the embodiment of the present invention, comprises the following steps:
Step 1, highly doped n-type 4H-SiC pre-etching samples are prepared.The sample is wafer, size 100cm2, inclined 4 ° Cutting, twin polishing, by strict semiconductor technology clean after obtain and through pre-etching sample by wafer cut into 1.2cm × 1.2cm square plates, then by volume ratio be 1:1 hydrofluoric acid (49%) and ethanol (99%) solution immersion removes surface oxidation Layer.
Step 2, to lead copper foil to be cut into area be 1cm by double2Square, then uniform adhesion is in sample Si faces.Sample is consolidated Due to etching cell body anode position, by gauze platinum electrode (negative electrode) as 2cm directly over anode at.Configure hydrofluoric acid (49%):Second Alcohol (99%):Hydrogen peroxide (30%)=3:6:1 volume ratio mixed liquor is as electrolyte.The forward direction electricity that setpoint frequency is 2500Hz Stream, forward current 100%, current density 40mA/cm2, it is positive to account for the wide constant-current pulse than for 50%, power-on, time For 3min, then forward direction accounted for wide than being promoted to 100% or current density being promoted into 80mA/cm2, time 30s.
Step 3, take out sample and be soaked in 2min in the solution of ethanol 99%, be then placed into air and treat that ethanol is waved completely Hair, skin layer is peeled off by peeling off means, this experiment leads copper foil to peel off the layer using double, that is, obtains described 4H crystal formations SiC nanowire array.
In summary, a kind of preparation method of nano structural material array of the present invention, refers specifically to 4H crystal formation nanometer silicon carbides Linear array material and preparation method thereof, overcome 4H crystal formations SiC nanowire in the prior art be difficult to prepare it is close with nano-wire array The problem of low is spent, the array preparation method is simple and reliable.Preparation technology repeatability is strong, high yield rate, spreads out for its high-performance The preparation of raw device brings facility.Its more existing vapor phase method, liquid phase method, solid phase method, simplify and prepare utensil, save and prepare Cost.For power electronics and field of aerospace, using high carrier mobility, thermal conductivity is anticorrosive, it is high pressure resistant the advantages that Third generation semiconductor silicon carbide products, there is provided solid technology material base.

Claims (4)

1. a kind of preparation method of nano-structure array material, it is characterised in that comprise the following steps:
Step 1, n-type heavy doping 4H-SiC liner oxidations layer and cutting process are cleaned;
Step 2, to lead copper foil to be cut into area be 1cm by double2It is square, then uniform adhesion is in n-type heavy doping 4H-SiC substrate Sis Face, by n-type heavy doping 4H-SiC substrates, etching cell body anode position is fixed on, by platinum guaze negative electrode as 2cm directly over anode Place;
Configure hydrofluoric acid 49%:Ethanol 99%:Hydrogen peroxide 30%=3:6:The mixed liquor of 1 volume ratio is as electrolyte;
Setpoint frequency be 2500Hz forward current, forward current 100%, current density 40mA/cm2, forward direction accounts for wide ratio and is 50% constant-current pulse, power-on, time 3min, then forward direction accounted for wide than being promoted to 100% or putting forward current density Rise to 80mA/cm2, time 30s;
Step 3, n-type heavy doping 4H-SiC substrates are taken out, 2min in the solution of ethanol 99% is soaked in, is then placed into air Treat that ethanol volatilizees completely, peel off skin layer by peeling off means, that is, obtain 4H crystal formation SiC nanowire arrays.
2. the preparation method of nano-structure array material as claimed in claim 1, it is characterised in that the nano-structure array Material, n-type heavy doping 4H-SiC substrates, thickness are 300~500 μm, twin polishing, are obtained through electrochemical etching method, stripping means The 4H crystal formation SiC nanowire arrays arrived.
3. the preparation method of nano-structure array material as claimed in claim 1, it is characterised in that the n-type heavy doping 4H- SiC substrate, for the crystal ingot by the growth of PVT methods is oriented, cutting, the obtained industrialization chip of two-sided CMP planarization, area is 100㎝2
4. the preparation method of nano-structure array material as claimed in claim 1, it is characterised in that the nano wire crystal formation is 4H, nano wire wire range are 10-20nm, and nanowire length scope is 3-5 μm, and single nano-wire structure is calabash shaped structure, Longitudinal length is 5nm, and array area is 1 ㎝2Circular array.
CN201410356646.3A 2014-07-24 2014-07-24 Nano-structure array material and preparation method thereof Expired - Fee Related CN104118843B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410356646.3A CN104118843B (en) 2014-07-24 2014-07-24 Nano-structure array material and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410356646.3A CN104118843B (en) 2014-07-24 2014-07-24 Nano-structure array material and preparation method thereof

Publications (2)

Publication Number Publication Date
CN104118843A CN104118843A (en) 2014-10-29
CN104118843B true CN104118843B (en) 2017-12-01

Family

ID=51764517

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410356646.3A Expired - Fee Related CN104118843B (en) 2014-07-24 2014-07-24 Nano-structure array material and preparation method thereof

Country Status (1)

Country Link
CN (1) CN104118843B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104876179B (en) * 2015-04-16 2017-01-11 华中科技大学 Large-area assembling method for non-contact type one-dimensional nano material
CN105133018B (en) * 2015-07-08 2016-08-24 宁波工程学院 SiC nano-array
CN105926026A (en) * 2016-04-19 2016-09-07 宁波工程学院 Preparation method for highly-oriented SiC nano-arrays
CN107680705A (en) * 2017-09-19 2018-02-09 壹号元素(广州)科技有限公司 A kind of isotope battery of the wide forbidden region semi-conductor nano tube/linear of ordered arrangement
CN108251888B (en) * 2017-11-29 2020-01-31 宁波工程学院 Preparation method of transparent 4H-SiC nanopore arrays
CN109904004B (en) * 2019-01-30 2020-10-09 宁波工程学院 Preparation method of SiC nanowire array film and application of SiC nanowire array film in supercapacitor electrode
CN110739880B (en) * 2019-10-28 2021-04-02 北京科技大学 Preparation method of silicon carbide nanowire array-based piezoelectric nano-generator
CN113497361B (en) * 2021-07-07 2023-10-13 东莞理工学院 Patterned SiC microstructure and application thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101536187A (en) * 2006-10-05 2009-09-16 日立化成工业株式会社 Well-aligned, high aspect-ratio, high-density silicon nanowires and methods of making the same
US7977798B2 (en) * 2007-07-26 2011-07-12 Infineon Technologies Ag Integrated circuit having a semiconductor substrate with a barrier layer
CN101845661B (en) * 2010-05-19 2012-07-11 中国科学院理化技术研究所 Monocrystalline silicon slice with ultra-hydrophobicity nano silicone linear arrays on surface and preparation method thereof
US9240328B2 (en) * 2010-11-19 2016-01-19 Alphabet Energy, Inc. Arrays of long nanostructures in semiconductor materials and methods thereof
JP2014525651A (en) * 2011-08-19 2014-09-29 ウィリアム・マーシュ・ライス・ユニバーシティ Anode battery material and manufacturing method thereof
CN103288087B (en) * 2013-05-28 2014-09-03 浙江大学 Surface modification process for improving luminance and dispersity of porous silicon
CN103343382A (en) * 2013-05-28 2013-10-09 浙江大学 Down-conversion luminescent porous silicon material, preparation and application thereof
CN103342337B (en) * 2013-07-11 2016-01-20 昆明理工大学 Metal nanoparticle auxiliary etch legal system is for the method for nanometer line

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
n型Si侧蚀的电学机理研究;谈嘉慧;《功能材料与器件学报》;20140228;第20卷(第1期);第31-36页 *
氢气泡动态模板电沉积和电势脉冲氧化还原法制备多孔铋膜;陈欣;《材料工程》;20081031(第10期);第243-250页 *

Also Published As

Publication number Publication date
CN104118843A (en) 2014-10-29

Similar Documents

Publication Publication Date Title
CN104118843B (en) Nano-structure array material and preparation method thereof
CN103400865B (en) GaN Schottky diode based on polarization doping
TWI565092B (en) Photovoltaic cell with porous semiconductor regions for anchoring contact terminals, electrolitic and etching modules, and related production line
EP2690198B1 (en) Apparatus and graphene device manufacturing method using the apparatus
JP2020107890A (en) Selective, electrochemical etching of semiconductor
CN105000552A (en) Preparation method for graphene oxide
CN104118842B (en) Silicon carbide mesoporous array material and manufacturing method of silicon carbide mesoporous array material
CN104835872A (en) Flexible heterojunction film solar cell and preparation method thereof
CN105331948A (en) Manufacturing method for surface type-P conductive diamond heat sink material
CN104651899A (en) Anodizing process of metal substrate for carbon nanotube growth
CN104773725A (en) Method for preparing graphene by using low-temperature plasmas
Zhang et al. Metal-assisted photochemical etching of gallium nitride using electrodeposited noble metal nanoparticles as catalysts
CN103484889B (en) A kind of method preparing the few layer graphene powder of high quality in a large number
CN103824898A (en) Copper indium gallium selenide (CIGS) three-dimensional nano structure array prepared by self-assembled electrodeposition-free mode based on solution method
CN105845552A (en) Photoelectrochemical etching method for removing SiC substrate epitaxial graphene buffer layer
CN113134784B (en) Method and device for wireless photoelectric chemical mechanical polishing of semiconductor wafer
CN105118821A (en) On-chip inductor based on graphene/metal composite wire and preparation method
Zulkifle et al. High-efficiency wafer-scale finishing of 4H-SiC (0001) surface using chemical-free electrochemical mechanical method with a solid polymer electrolyte
CN107867681A (en) A kind of method of electrochemical gas bubbling transfer large-area graphene
CN102856141A (en) Method for improving field emission performance of silicon nanowire array through in-situ oxidation
CN208077984U (en) Gallium oxide thin film field effect transistor with top-gated and bottom grating structure
CN111020673A (en) Preparation and stripping method of silicon carbide nano-structure film
Wang et al. Selective fabrication of Cu/Cu2O nanowires using porous alumina membranes in acidic solution
CN203351609U (en) Polarized doping-based GaN Schottky diode
CN204558500U (en) Flexible hetero-junction thin-film solar cell

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20171201

Termination date: 20210724

CF01 Termination of patent right due to non-payment of annual fee