CN104105352B - 一种铝蚀刻柔性线路板的制造方法 - Google Patents
一种铝蚀刻柔性线路板的制造方法 Download PDFInfo
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- CN104105352B CN104105352B CN201410289176.3A CN201410289176A CN104105352B CN 104105352 B CN104105352 B CN 104105352B CN 201410289176 A CN201410289176 A CN 201410289176A CN 104105352 B CN104105352 B CN 104105352B
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000004411 aluminium Substances 0.000 title claims abstract description 18
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 49
- 238000010030 laminating Methods 0.000 claims abstract description 48
- 238000005530 etching Methods 0.000 claims abstract description 11
- 238000011161 development Methods 0.000 claims abstract description 5
- 230000008569 process Effects 0.000 claims abstract description 4
- 239000005030 aluminium foil Substances 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 3
- 230000003628 erosive effect Effects 0.000 claims 1
- 238000010301 surface-oxidation reaction Methods 0.000 claims 1
- 238000007493 shaping process Methods 0.000 abstract description 4
- 238000003384 imaging method Methods 0.000 abstract description 3
- 230000001788 irregular Effects 0.000 abstract description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 230000008901 benefit Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000002305 electric material Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- -1 (2) Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- Manufacturing Of Printed Circuit Boards (AREA)
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Application Number | Priority Date | Filing Date | Title |
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CN201410289176.3A CN104105352B (zh) | 2014-06-24 | 2014-06-24 | 一种铝蚀刻柔性线路板的制造方法 |
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CN201410289176.3A CN104105352B (zh) | 2014-06-24 | 2014-06-24 | 一种铝蚀刻柔性线路板的制造方法 |
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CN104105352A CN104105352A (zh) | 2014-10-15 |
CN104105352B true CN104105352B (zh) | 2017-07-18 |
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CN201410289176.3A Active CN104105352B (zh) | 2014-06-24 | 2014-06-24 | 一种铝蚀刻柔性线路板的制造方法 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106444286A (zh) * | 2016-08-31 | 2017-02-22 | 江门市阪桥电子材料有限公司 | 一种感光线路材料及其制备方法 |
CN110337189B (zh) * | 2019-06-28 | 2020-12-22 | 惠州市星之光科技有限公司 | 线路板蚀刻方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003215808A (ja) * | 2002-01-25 | 2003-07-30 | Pentax Corp | 多重露光描画装置およびその照明機構 |
CN103229105A (zh) * | 2010-11-23 | 2013-07-31 | 彩虹科技***有限公司 | 光学成像 |
CN103369451A (zh) * | 2013-07-08 | 2013-10-23 | 裘华见 | 带式高音膜片生产工艺 |
CN103400812A (zh) * | 2013-07-03 | 2013-11-20 | 华天科技(西安)有限公司 | 一种底填料填充的fcqfn封装件及其制作工艺 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000035677A (ja) * | 1998-07-17 | 2000-02-02 | Adtec Engineeng:Kk | 露光装置 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003215808A (ja) * | 2002-01-25 | 2003-07-30 | Pentax Corp | 多重露光描画装置およびその照明機構 |
CN103229105A (zh) * | 2010-11-23 | 2013-07-31 | 彩虹科技***有限公司 | 光学成像 |
CN103400812A (zh) * | 2013-07-03 | 2013-11-20 | 华天科技(西安)有限公司 | 一种底填料填充的fcqfn封装件及其制作工艺 |
CN103369451A (zh) * | 2013-07-08 | 2013-10-23 | 裘华见 | 带式高音膜片生产工艺 |
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CN104105352A (zh) | 2014-10-15 |
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Denomination of invention: Manufacturing method of aluminum etching flexible circuit board Effective date of registration: 20190827 Granted publication date: 20170718 Pledgee: Bank of Communications Ltd Shanghai Lingang Xincheng branch Pledgor: SHANGHAI INLAY LINK INC. Registration number: Y2019310000012 |
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Denomination of invention: A manufacturing method of aluminum etched flexible circuit board Effective date of registration: 20201225 Granted publication date: 20170718 Pledgee: Bank of Communications Limited Shanghai pilot Free Trade Zone Branch Pledgor: SHANGHAI INLAY LINK Inc. Registration number: Y2020310000049 |
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