CN104097138A - 轴承套圈金相研磨装置 - Google Patents

轴承套圈金相研磨装置 Download PDF

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Publication number
CN104097138A
CN104097138A CN201410325738.5A CN201410325738A CN104097138A CN 104097138 A CN104097138 A CN 104097138A CN 201410325738 A CN201410325738 A CN 201410325738A CN 104097138 A CN104097138 A CN 104097138A
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CN
China
Prior art keywords
metallographic
bearing ring
grinding
vertical platform
lapping device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410325738.5A
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English (en)
Inventor
李青云
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anhui Kang Cheng Design Of Industrial Product Co Ltd
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Anhui Kang Cheng Design Of Industrial Product Co Ltd
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Filing date
Publication date
Application filed by Anhui Kang Cheng Design Of Industrial Product Co Ltd filed Critical Anhui Kang Cheng Design Of Industrial Product Co Ltd
Priority to CN201410325738.5A priority Critical patent/CN104097138A/zh
Publication of CN104097138A publication Critical patent/CN104097138A/zh
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/12Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

轴承套圈金相研磨装置,包括一个机架(1),在机架上设置一个圆盘形的立台(2),立台为盒体结构,在立台上设置电机(3),电机上设置砂轮(4),在机架上设置固定装置(5),使用时将轴承套圈固定于固定装置(5),进行金相研磨;固定装置(5)采用抓取式设计进行轴承套圈的固定;在立台(2)下沿设置积尘槽,集纳金属粉末;设置提示装置(6),提示研磨进程与注意事项;能机械固定轴承套圈,在进行金相研磨时无需人工把握轴承套圈,提高金相研磨成品的质量。

Description

轴承套圈金相研磨装置
技术领域
本发明涉及一种轴承检验辅助机械。
背景技术
在轴承行业,需要对轴承套圈进行金相检验。在进行显微镜分析前需要对套圈进行研磨。目前的研磨操作一般采用人工方式,效率低,研磨的质量具有不稳定性。
发明内容
本发明的目的就在于提供一种轴承套圈的检验辅助机械。
本发明是这样实现的。轴承套圈金相研磨装置,包括一个机架,在机架上设置一个圆盘形的立台,立台为盒体结构,在立台上设置电机,电机上设置砂轮,在机架上设置固定装置,使用时将轴承套圈固定于固定装置,进行金相研磨。
轴承套圈金相研磨装置,固定装置采用抓取式设计进行轴承套圈的固定。
轴承套圈金相研磨装置,在立台下沿设置积尘槽,集纳金属粉末。
轴承套圈金相研磨装置,设置提示装置,提示研磨进程与注意事项。
轴承套圈金相研磨装置,提示信息的方式为声音或LED灯光显示。
上述轴承套圈金相研磨装置,能机械固定轴承套圈,在进行金相研磨时无需人工把握轴承套圈,提高金相研磨成品的质量。
附图说明
附图为轴承套圈金相研磨装置的结构示意图。
图中标号分别为:1-机架、2-立台、3-电机、4-砂轮、5-固定装置、6-提示装置。
具体实施方式
实施例:如附图所示。轴承套圈金相研磨装置,包括一个机架(1),在机架上设置一个圆盘形的立台(2),立台为盒体结构,在立台上设置电机(3),电机上设置砂轮(4),在机架上设置固定装置(5),使用时将轴承套圈固定于固定装置(5),进行金相研磨。
轴承套圈金相研磨装置,固定装置(5)采用抓取式设计进行轴承套圈的固定。
轴承套圈金相研磨装置,在立台(2)下沿设置积尘槽,集纳金属粉末。
轴承套圈金相研磨装置,设置提示装置(6),提示研磨进程与注意事项。
轴承套圈金相研磨装置,提示信息的方式为声音或LED灯光显示。
上述轴承套圈金相研磨装置,能机械固定轴承套圈,在进行金相研磨时无需人工把握轴承套圈,提高金相研磨成品的质量。

Claims (5)

1.轴承套圈金相研磨装置,其特征在于包括一个机架(1),在机架上设置一个圆盘形的立台(2),立台为盒体结构,在立台上设置电机(3),电机上设置砂轮(4),在机架上设置固定装置(5),使用时将轴承套圈固定于固定装置(5),进行金相研磨。
2.根据权利要求1所述的轴承套圈金相研磨装置,其特征在于固定装置(5)采用抓取式设计进行轴承套圈的固定。
3.根据权利要求1所述的轴承套圈金相研磨装置,其特征在于在立台(2)下沿设置积尘槽,集纳金属粉末。
4.根据权利要求1所述的轴承套圈金相研磨装置,其特征在于设置提示装置(6),提示研磨进程与注意事项。
5.根据权利要求4所述的轴承套圈金相研磨装置,其特征在于提示信息的方式为声音或LED灯光显示。
CN201410325738.5A 2014-07-09 2014-07-09 轴承套圈金相研磨装置 Pending CN104097138A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410325738.5A CN104097138A (zh) 2014-07-09 2014-07-09 轴承套圈金相研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410325738.5A CN104097138A (zh) 2014-07-09 2014-07-09 轴承套圈金相研磨装置

Publications (1)

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CN104097138A true CN104097138A (zh) 2014-10-15

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Country Status (1)

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CN (1) CN104097138A (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07112361A (ja) * 1993-10-20 1995-05-02 Ebara Corp ポリシング装置
US6071180A (en) * 1999-01-19 2000-06-06 Ernst Thielenhaus Gmbh & Co. Kg Method of surface grinding a flange surface of a wheel hub for an automotive vehicle
CN2657857Y (zh) * 2003-11-14 2004-11-24 顾印利 平面磨样机
CN101708590A (zh) * 2009-11-26 2010-05-19 上海大学 金相试样自动磨抛机
CN201604071U (zh) * 2010-03-31 2010-10-13 南京白鹿科技有限公司 金相磨抛机
CN103639883A (zh) * 2013-11-25 2014-03-19 银川博聚工业产品设计有限公司 轴承金相分析研磨机

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07112361A (ja) * 1993-10-20 1995-05-02 Ebara Corp ポリシング装置
US6071180A (en) * 1999-01-19 2000-06-06 Ernst Thielenhaus Gmbh & Co. Kg Method of surface grinding a flange surface of a wheel hub for an automotive vehicle
CN2657857Y (zh) * 2003-11-14 2004-11-24 顾印利 平面磨样机
CN101708590A (zh) * 2009-11-26 2010-05-19 上海大学 金相试样自动磨抛机
CN201604071U (zh) * 2010-03-31 2010-10-13 南京白鹿科技有限公司 金相磨抛机
CN103639883A (zh) * 2013-11-25 2014-03-19 银川博聚工业产品设计有限公司 轴承金相分析研磨机

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Application publication date: 20141015